CN106034378A - Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof - Google Patents
Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof Download PDFInfo
- Publication number
- CN106034378A CN106034378A CN201510106085.6A CN201510106085A CN106034378A CN 106034378 A CN106034378 A CN 106034378A CN 201510106085 A CN201510106085 A CN 201510106085A CN 106034378 A CN106034378 A CN 106034378A
- Authority
- CN
- China
- Prior art keywords
- layer
- circuit board
- flexible circuit
- volume
- metal level
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a reel-to-reel flexible circuit board made of a novel material and a manufacturing method thereof. The method has advantages of simpleness, high efficiency, low cost, reduced workers, saved power and water, and good energy conservation and environment protection effects. The flexible circuit board comprises a PET base material layer made from a polyethylene glycol terephthalate material; a binding layer is fixed on the surface of the PET base material layer; a metal layer is fixed on the surface of the binding layer; and a circuit graph layer is fixed on the surface of the metal layer. In addition, the method includes: a metal copper foil or aluminum foil is pasted to a PET base material layer by a reel-to-reel gluing combination machine with resin glue and then baking is carried out to form a double-faced composite circuit board or a multi-layer flexible circuit board is formed by using the method; reel-to-reel intaglio printing is carried out to form an ink-printing circuit graph layer; UV ultraviolet light curing is carried out on the circuit graph layer; the manufactured flexible circuit board with the circuit graph is processed by acidic etching; and then a conducting layer conducing the line graph layers at two sides is manufactured.
Description
[technical field]
The present invention relates to wiring board and preparation method thereof field, the volume to volume particularly relating to a kind of New Type Material is soft
Property wiring board and preparation method thereof.
[background technology]
Currently mainly with the higher polyimides of price for base material composition metal Copper Foil processing sheet-like flexible line
Road plate, this mode of production cost is high, and production efficiency is relatively low, and the personnel of needs are the most more, certainly produce
The flexible circuit board price come is the highest；Produce now two-sided or multilamellar flexible circuit board to need by electricity
Plated hole mode connects metal level, in addition it is also necessary to a series of numerous and diverse works such as boring, electroless copper plating, electroless plating
Sequence, inadequate environmental protection, the production cycle, long efficiency was low.
[summary of the invention]
It is an object of the invention to effectively overcome the deficiency of above-mentioned technology, it is provided that the volume of a kind of New Type Material is right
Volume flexible circuit board, the material cost of this flexible circuit board is relatively low.
A further object of the present invention is effectively to overcome the deficiency of above-mentioned technology, it is provided that a kind of New Type Material
The manufacture method of volume to volume flexible circuit board, the method is simple, and in hgher efficiency, cost is lower, needs personnel
Few, water and electric saving simultaneously, it is not necessary to by plating, more energy-conserving and environment-protective.
The object of the present invention is achieved like this: the volume to volume flexible circuit board of a kind of New Type Material, it includes
PET base material layer, it thes improvement is that, the material of described PET base material layer is polyethylene terephthalate,
The surface of described PET base material layer is being fixed with adhesive linkage by volume to volume gluing compound machine, described adhesive linkage
Surface is fixed with metal level, and the surface of described metal level is fixed with line pattern layer.
In said structure, the material of described metal level is Copper Foil or aluminium foil, and described metal level is divided into metal
Layer and lower metal layer, described upper metal level is fixed on above described PET base material layer, described lower metal
Layer is fixed on below described PET base material layer, is electrically connected with between described upper metal level and lower metal layer
Conductting layer.
In said structure, described adhesive linkage is divided into resin adhesive layer and lower resin adhesive layer, described upper resin
Glue-line is fixed on described PET base material layer and the centre of upper metal level, and described lower resin adhesive layer is fixed on institute
The PET base material layer stated and the centre of lower metal layer.
In said structure, described line pattern layer is divided into circuit graph layer and lower circuit graph layer, described
Upper circuit shape figure layer be fixed on the upper surface of described upper metal level, described lower circuit graph layer is fixed on institute
State the lower surface of lower metal layer.
A kind of manufacture method of the flexible circuit board of New Type Material, it comprises the following steps:
(1). choose polyethylene terephthalate and make PET base material layer, in described PET base material layer
Be respectively coated with last layer resin glue on surface down through volume to volume gluing compound machine, form upper resin adhesive layer respectively
With lower resin adhesive layer；
(2). each by volume to volume gluing compound machine on the surface of described upper resin adhesive layer and lower resin adhesive layer
Cover last layer Copper Foil or aluminium foil, form upper metal level and lower metal layer respectively, after completing two-sided being combined, enter
The long-time baking of row, forms the flexible circuitry plate substrate of double-metal layer；
(3). carry out the making of plate making, then flexible circuit board described in step (2) the most in advance
The upper and lower surface volume to volume gravure-printing techniques of base material carries out ink printing, is printed as required line pattern
Layer, then by UV UV curable ink, make the ink on flexible circuit board substrate surface dry, formed double
The flexible circuit board of metal level；
(4). the flexible circuit board being printed on line pattern layer in step (3) is etched by acid solution, makes circuit
The outer unnecessary copper of graph layer or aluminum etching are removed, and then remove circuit by the way of Sodium Hydroxide Alkaline demoulding
Ink unnecessary on graph layer；
(5). the mould red needle needed for making by line pattern layer, by the way of mould red needle or cross cutting
Position to be connected to upper strata metal and lower metal layer is carried out gravitational pressing and extruding, makes metal level and lower gold
Belong to layer realize short circuit and connect conducting, form the conductting layer of conducting two sides line pattern layer；Or lead at needs
Lead to the position that the connects temperature by single-point more than 200 degree, under the action of heat PET base material layer is carried out soft
Change and produce contractile response, simultaneously under the effect of gravity extruding, form conducting two sides line pattern layer
Conductting layer；
(6). by computer light eye scan mode, the line pattern layer in step (5) opened short circuit optics
Inspection, forms the flexible circuit board that web-like is double-deck.
Preferably, it is further comprising the steps of:
The surface etching the upper metal level after moving back film and lower metal layer in described step (4) is by step
(1) technique and in (2) forms the flexible circuitry plate substrate of four metal levels, then by step (3) (4) (5)
(6) technique in forms the flexible circuit board of web-like four layers, and the rest may be inferred, the upper gold of described flexible circuit board
If belonging to layer and lower metal layer having dried layer.
Preferably, in described step (4), the composition of acid solution includes: hydrochloric acid, sodium chlorate, additive, water.
The beneficial effects of the present invention is: the PET base material base material polyethylene terephthalate valency of the present invention
Lattice are relatively low, low cost.Material cost needed for the manufacture method of the present invention is lower, and producers are relatively
Few, water and electric saving simultaneously, provide cost savings；The present invention need not by electroplating technology, more energy-saving ring
Protect；The present invention needs not move through a series of numerous and diverse operations such as boring, electroless copper plating, electroless plating, produces week
Phase is short, efficiency is high.
[accompanying drawing explanation]
Fig. 1 is the planar structure schematic diagram of the flexible circuit board of double-metal layer of the present invention；
Fig. 2 is the planar structure schematic diagram of the flexible circuit board of the present invention four metal level；
Fig. 3 is the artwork that the present invention makes conductting layer.
In figure: 3. times resin adhesive layer of resin adhesive layer on 1.PET substrate layer 2.
4. go up metal level 5. lower metal layer 6. conductting layer
7. go up 8. times circuit graph layer 9. mould red needle of circuit pattern layer
10. flexible circuit board
[detailed description of the invention]
The invention will be further described with embodiment below in conjunction with the accompanying drawings.
With reference to shown in Fig. 1, the flexible circuit board of the double-metal layer that the present invention discloses, it includes PET base material layer 1,
The material of described PET base material layer 1 is polyethylene terephthalate, the surface of described PET base material layer 1
Being fixed with adhesive linkage, the surface of described adhesive linkage is fixed with metal level, the material of described metal level be Copper Foil or
Aluminium foil, described metal level is divided into metal level 4 and lower metal layer 5, described upper metal level 4 to be fixed on institute
Stating above PET base material layer 1, described lower metal layer 5 is fixed on below described PET base material layer 1,
It is electrically connected with conductting layer 6 between described upper metal level 4 and lower metal layer 5；Described adhesive linkage is divided into
Resin adhesive layer 2 and lower resin adhesive layer 3, described upper resin adhesive layer 2 is fixed on described PET base material layer 1 He
The centre of upper metal level 4, described lower resin adhesive layer 3 is fixed on described PET base material layer 1 and lower metal
The centre of layer 5；The surface of described metal level is fixed with line pattern layer, and described line pattern layer is divided into
Line pattern layer 7 and lower circuit graph layer 8, described upper circuit shape figure layer 7 is fixed on described upper metal level 4
Upper surface, described lower circuit graph layer 8 is fixed on the lower surface of described lower metal layer 5.
Wherein polyethylene terephthalate is milky or light yellow, the polymer of highly crystalline, surface
Smooth glossy.Having excellent physical and mechanical properties within the scope of wider temperature, life-time service temperature can
Reaching 120 DEG C, electrical insulating property is excellent, and even under high-temperature high-frequency, its electrical property is still preferable, but corona resistance
Poor, creep resistance, fatigue durability, rub resistance, dimensional stability are the most fine.
A kind of manufacture method of the volume to volume flexible circuit board of New Type Material, it comprises the following steps:
(1). choose polyethylene terephthalate and make PET base material layer 1, in described PET base material layer
The upper and lower surface of 1 at each painting last layer resin glue, forms upper resin adhesive layer by volume to volume gluing compound machine respectively
2 and lower resin adhesive layer 3；
(2). it is combined by volume to volume gluing on the surface of described upper resin adhesive layer 2 and lower resin adhesive layer 3
Machine is respectively covering last layer Copper Foil or aluminium foil, forms upper metal level 4 and lower metal layer 5 respectively, completes two-sided multiple
After conjunction, toast for a long time, form the flexible circuitry plate substrate of web-like double-metal layer；
(3). carry out the making of plate making, then flexible circuit board described in step (2) the most in advance
The upper and lower surface printer of base material carries out volume to volume gravure printing ink printing, is printed as required layout
Shape layer, then by UV UV curable ink, make the ink on flexible circuit board substrate surface dry, formed
The flexible circuit board 10 of double-metal layer；
(4). the flexible circuit board 10 being printed on line pattern layer in step (3) is etched by acid solution, makes
The outer unnecessary copper of line pattern layer or aluminum etching are removed, and then the mode of Sodium Hydroxide Alkaline demoulding removes circuit
Ink unnecessary on graph layer, the composition of described acid solution includes: hydrochloric acid, sodium chlorate, additive, water, its
The chemical reaction of middle generation is Cu+CuCl2-=Cu2Cl2；
(5). the mould red needle 9 needed for making by line pattern layer, as it is shown on figure 3, by mould red needle 9
Or position to be connected to upper strata metal 4 and lower metal layer 5 is carried out gravity extruding by the mode of cross cutting, makes
Metal level 4 and lower metal layer 5 realize short circuit and connect, and form the conductting layer 6 of conducting two sides line pattern layer；
Or the temperature by single-point more than 200 degree in the position needing conducting to connect, under the action of heat by PET
Substrate layer 1 carries out softening and producing contractile response, simultaneously under the effect of gravity extruding, forms conducting two
The conductting layer 6 of upper thread road graph layer；
(6). by computer light eye scan mode, the line pattern layer in step (5) opened short circuit optics
Inspection, to ensure the qualification rate of finished product, forms the flexible circuit board 10 that web-like is double-deck.
With reference to shown in Fig. 2, it is also possible to step (4) etches the upper metal level 4 after moving back film and lower metal
The surface of layer 5 is formed the flexible circuitry plate substrate of four metal levels by the technique in step (1) and (2), then
Form the flexible circuitry 10 of web-like four layers by the technique in step (3) (4) (5) (6), the rest may be inferred, just
If the flexible circuit board 10 of dried layer metal level can be produced.
The manufacture method of the present invention uses the mode of production of volume to volume, and shipment mode is delivered goods with web-like, and shipment is long
Spending and the longest can accomplish 2000 meters, width can accomplish 600 millimeters, is greatly improved production efficiency, reduces
Producers, save material, water and electric saving.
Described above is only presently preferred embodiments of the present invention, and above-mentioned specific embodiment is not to the present invention
Limit.In the technological thought category of the present invention, various deformation and amendment can occur, all this areas general
Retouching, amendment or the equivalent that logical technical staff is made as described above, belongs to the present invention and is protected
Scope.
Claims (7)
1. the volume to volume flexible circuit board of a New Type Material, it is characterised in that: it includes PET base material layer,
The material of described PET base material layer is polyethylene terephthalate, and the surface of described PET base material layer is fixed
Having adhesive linkage, the surface of described adhesive linkage to be fixed with metal level, the surface of described metal level is fixed with layout
Shape layer.
The volume to volume flexible circuit board of a kind of New Type Material the most according to claim 1, it is characterised in that:
The material of described metal level is Copper Foil or aluminium foil, and described metal level is divided into metal level and lower metal layer, institute
The upper metal level stated is fixed on above described PET base material layer, and described lower metal layer is fixed on described PET
Below substrate layer, between described upper metal level and lower metal layer, it is electrically connected with conductting layer.
The volume to volume flexible circuit board of a kind of New Type Material the most according to claim 2, it is characterised in that:
Described adhesive linkage is divided into resin adhesive layer and lower resin adhesive layer, and described upper resin adhesive layer is fixed on described
PET base material layer and the centre of upper metal level, described lower resin adhesive layer be fixed on described PET base material layer and under
The centre of metal level.
The volume to volume flexible circuit board of a kind of New Type Material the most according to claim 2, it is characterised in that:
Described line pattern layer is divided into circuit graph layer and lower circuit graph layer, and described upper circuit shape figure layer is solid
Being scheduled on the upper surface of described upper metal level, described lower circuit graph layer is fixed on the following table of described lower metal layer
Face.
5. the manufacture method of the volume to volume flexible circuit board of a New Type Material, it is characterised in that it include with
Lower step:
(1). choose polyethylene terephthalate and make PET base material layer, in described PET base material layer
Upper and lower surface be respectively coated with last layer resin glue, form upper resin adhesive layer and lower resin adhesive layer respectively；
(2). respectively cover last layer Copper Foil or aluminum on the surface of described upper resin adhesive layer and lower resin adhesive layer
Paper tinsel, forms upper metal level and lower metal layer respectively, after completing two-sided being combined, toasts for a long time, is formed
The flexible circuitry plate substrate of double-metal layer；
(3). carry out the making of volume to volume gravure application plate making the most in advance, then in step (2)
Described in the upper and lower surface printer of flexible circuit board plate substrate carry out ink printing, be printed as required line
Road graph layer, then by UV UV curable ink, make the ink on flexible circuit board substrate surface dry,
Form the flexible circuit board of double-metal layer；
(4). the flexible circuit board being printed on line pattern layer in step (3) is etched by acid solution, makes circuit
The outer unnecessary copper of graph layer or aluminum etching are removed, and then remove layout by the mode of Sodium Hydroxide Alkaline demoulding
Ink unnecessary on shape layer；
(5). the mould red needle needed for making by line pattern layer, by the way of mould red needle or cross cutting
Position to be connected to upper strata metal and lower metal layer is carried out gravitational pressing or extruding, makes metal level and lower gold
Belong to layer realize short circuit and connect conducting, form the conductting layer of conducting two sides line pattern layer；Or lead at needs
Lead to the position that the connects temperature by single-point more than 200 degree, under the action of heat PET base material layer is carried out soft
Change and produce contractile response, simultaneously under the effect of gravity extruding, form conducting two sides line pattern layer
Conductting layer；
(6). by computer light eye scan mode, the line pattern layer in step (5) opened short circuit optics
Inspection, forms the flexible circuit board that web-like is double-deck.
6. according to the manufacture method of the volume to volume flexible circuit board of a kind of New Type Material described in claim 5,
It is characterized in that, it is further comprising the steps of:
(1). the surface etching the upper metal level after moving back film and lower metal layer in described step (4) is by step
Suddenly the technique in (1) and (2) forms the flexible circuitry plate substrate of four metal levels, then by step (3) (4)
(5) technique in (6) forms the flexible circuit board of web-like four metal level, and the rest may be inferred, described flexible circuitry
If the upper metal level of plate and lower metal layer have dried layer.
7. according to the manufacture method of the volume to volume flexible circuit board of a kind of New Type Material described in claim 5,
It is characterized in that, in described step (4), the composition of acid solution includes: hydrochloric acid, sodium chlorate, additive, water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510106085.6A CN106034378A (en) | 2015-03-11 | 2015-03-11 | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510106085.6A CN106034378A (en) | 2015-03-11 | 2015-03-11 | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106034378A true CN106034378A (en) | 2016-10-19 |
Family
ID=57151176
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510106085.6A Pending CN106034378A (en) | 2015-03-11 | 2015-03-11 | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106034378A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107911939A (en) * | 2017-11-24 | 2018-04-13 | 惠州市鹏程电子科技有限公司 | A kind of flexible printed circuit board |
| CN108882549A (en) * | 2018-08-27 | 2018-11-23 | 江西省木林森光电科技有限公司 | A kind of screen printing device and production method of single-sided flexible circuit board |
| CN110099522A (en) * | 2018-01-31 | 2019-08-06 | 嘉联益电子(昆山)有限公司 | Roll-to-roll flexible circuit board and its fast processing method |
| CN111818726A (en) * | 2020-07-17 | 2020-10-23 | 松扬电子材料(昆山)有限公司 | Multilayer flexible circuit board and manufacturing method thereof |
| CN113905543A (en) * | 2021-10-11 | 2022-01-07 | 湖北永创鑫电子有限公司 | Production process of flexible combined circuit board |
| CN114025500A (en) * | 2021-09-23 | 2022-02-08 | 佛山市竞国电子有限公司 | Flexible circuit board and preparation method thereof |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5131141A (en) * | 1988-08-31 | 1992-07-21 | Shin-Etsu Polymer Co., Ltd. | Method for preparing a double-sided flexible circuit board with electrical connection at a through-hole |
| WO1997008925A1 (en) * | 1995-08-30 | 1997-03-06 | Siemens Aktiengesellschaft | Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate |
| CN1565150A (en) * | 2002-05-21 | 2005-01-12 | 株式会社大和工业 | Interlayer connection structure and its building method |
| CN101023395A (en) * | 2004-09-17 | 2007-08-22 | Lg化学株式会社 | Ink composition for etching resist, method of forming etching resist pattern using the same, and method of formng microchannel using the ink composition |
| CN101621895A (en) * | 2008-06-30 | 2010-01-06 | 比亚迪股份有限公司 | Manufacture method of soft circuit board |
| CN102378482A (en) * | 2010-08-27 | 2012-03-14 | 富葵精密组件(深圳)有限公司 | Circuit board substrate and manufacturing method thereof |
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN102902389A (en) * | 2011-07-27 | 2013-01-30 | 比亚迪股份有限公司 | Method for manufacturing touch sensor |
| CN202841684U (en) * | 2012-08-24 | 2013-03-27 | 安徽格林开思茂光电科技股份有限公司 | Flexible printed circuit board |
| CN103068151A (en) * | 2011-10-21 | 2013-04-24 | 松扬电子材料(昆山)有限公司 | Heat dissipation base material |
| CN103096612A (en) * | 2011-11-01 | 2013-05-08 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure |
| CN203027599U (en) * | 2012-12-04 | 2013-06-26 | 苏州市新广益电子有限公司 | High-flexibility double-sided FPC (flexible printed circuit) |
-
2015
- 2015-03-11 CN CN201510106085.6A patent/CN106034378A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5131141A (en) * | 1988-08-31 | 1992-07-21 | Shin-Etsu Polymer Co., Ltd. | Method for preparing a double-sided flexible circuit board with electrical connection at a through-hole |
| WO1997008925A1 (en) * | 1995-08-30 | 1997-03-06 | Siemens Aktiengesellschaft | Method of establishing a connection between at least two electrical conductors, one of which is mounted on a supporting substrate |
| CN1565150A (en) * | 2002-05-21 | 2005-01-12 | 株式会社大和工业 | Interlayer connection structure and its building method |
| CN101023395A (en) * | 2004-09-17 | 2007-08-22 | Lg化学株式会社 | Ink composition for etching resist, method of forming etching resist pattern using the same, and method of formng microchannel using the ink composition |
| CN101621895A (en) * | 2008-06-30 | 2010-01-06 | 比亚迪股份有限公司 | Manufacture method of soft circuit board |
| CN102378482A (en) * | 2010-08-27 | 2012-03-14 | 富葵精密组件(深圳)有限公司 | Circuit board substrate and manufacturing method thereof |
| CN102902389A (en) * | 2011-07-27 | 2013-01-30 | 比亚迪股份有限公司 | Method for manufacturing touch sensor |
| CN103068151A (en) * | 2011-10-21 | 2013-04-24 | 松扬电子材料(昆山)有限公司 | Heat dissipation base material |
| CN103096612A (en) * | 2011-11-01 | 2013-05-08 | 昆山雅森电子材料科技有限公司 | High-frequency substrate structure |
| CN202841684U (en) * | 2012-08-24 | 2013-03-27 | 安徽格林开思茂光电科技股份有限公司 | Flexible printed circuit board |
| CN102858087A (en) * | 2012-08-27 | 2013-01-02 | 吴祖 | Blind-hole-conduction double-sided circuit board and processing method thereof |
| CN203027599U (en) * | 2012-12-04 | 2013-06-26 | 苏州市新广益电子有限公司 | High-flexibility double-sided FPC (flexible printed circuit) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107911939A (en) * | 2017-11-24 | 2018-04-13 | 惠州市鹏程电子科技有限公司 | A kind of flexible printed circuit board |
| CN107911939B (en) * | 2017-11-24 | 2024-05-10 | 惠州市鹏程电子科技有限公司 | Flexible printed circuit board |
| CN110099522A (en) * | 2018-01-31 | 2019-08-06 | 嘉联益电子(昆山)有限公司 | Roll-to-roll flexible circuit board and its fast processing method |
| CN108882549A (en) * | 2018-08-27 | 2018-11-23 | 江西省木林森光电科技有限公司 | A kind of screen printing device and production method of single-sided flexible circuit board |
| CN108882549B (en) * | 2018-08-27 | 2024-01-30 | 新余木林森电子有限公司 | Silk screen printing equipment of single-sided flexible circuit board and manufacturing method |
| CN111818726A (en) * | 2020-07-17 | 2020-10-23 | 松扬电子材料(昆山)有限公司 | Multilayer flexible circuit board and manufacturing method thereof |
| CN114025500A (en) * | 2021-09-23 | 2022-02-08 | 佛山市竞国电子有限公司 | Flexible circuit board and preparation method thereof |
| CN113905543A (en) * | 2021-10-11 | 2022-01-07 | 湖北永创鑫电子有限公司 | Production process of flexible combined circuit board |
| CN113905543B (en) * | 2021-10-11 | 2024-05-28 | 湖北永创鑫电子有限公司 | Production process of flexible combined circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106034378A (en) | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof | |
| CN202986235U (en) | Double-faced flexible copper-clad plate | |
| CN108235594A (en) | A kind of combined type folds structure release film and preparation method thereof | |
| CN103906344B (en) | Heat-conducting type double-sided PCB | |
| CN204634154U (en) | Two-sided heat-conducting substrate | |
| CN103279786B (en) | The manufacture method of RFID electric tag antenna, its product and application | |
| CN103898498B (en) | The making method of melanism liquid medicine and transparent printed circuit board (PCB) | |
| CN204160830U (en) | The specific complex layer making card or packaging material and the product made thereof | |
| CN105338735B (en) | A kind of mixing material printed wiring board new producing method | |
| CN204206600U (en) | copper foil composite base material for circuit board | |
| CN203831880U (en) | Card or radio frequency identification class manufacturing composite material and card or radio frequency identification | |
| CN105916291A (en) | Method for manufacturing high-density interconnected printed circuit board | |
| CN201854501U (en) | Circuit board | |
| CN205179499U (en) | Polyimide is high, and heat dissipation covers membrane | |
| JP2008262981A (en) | Flexible printed board and its production process | |
| CN107480753A (en) | A kind of printed antenna label and preparation method thereof | |
| CN206674296U (en) | A kind of high heat conduction heat radiating type bilateral structure FPC aluminium bases | |
| CN103415153A (en) | Steel disc ground production method of FPC silver paste pouring hole | |
| CN203126052U (en) | Composite double-sided copper foil substrate | |
| CN204090296U (en) | Blind buried via hole printed circuit board (PCB) | |
| CN108076581A (en) | Multi-layer flexible circuit board and preparation method thereof | |
| CN103029375B (en) | Composite double-face copper foil substrate and manufacture method thereof | |
| CN207252000U (en) | A kind of new light and thin type pcb board | |
| CN202121872U (en) | Copper foil for printed circuit board | |
| CN203446098U (en) | Wireless communication antenna board stacking structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161019 |
|
| RJ01 | Rejection of invention patent application after publication |