CN111818726A - Multilayer flexible circuit board and manufacturing method thereof - Google Patents
Multilayer flexible circuit board and manufacturing method thereof Download PDFInfo
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- CN111818726A CN111818726A CN202010693009.0A CN202010693009A CN111818726A CN 111818726 A CN111818726 A CN 111818726A CN 202010693009 A CN202010693009 A CN 202010693009A CN 111818726 A CN111818726 A CN 111818726A
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- 238000004519 manufacturing process Methods 0.000 title claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 201
- 239000011889 copper foil Substances 0.000 claims abstract description 201
- 239000010410 layer Substances 0.000 claims abstract description 184
- 239000000758 substrate Substances 0.000 claims abstract description 119
- 239000004642 Polyimide Substances 0.000 claims abstract description 62
- 229920001721 polyimide Polymers 0.000 claims abstract description 62
- 239000012790 adhesive layer Substances 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 20
- 238000010030 laminating Methods 0.000 claims description 62
- 229920002799 BoPET Polymers 0.000 claims description 51
- 239000011248 coating agent Substances 0.000 claims description 27
- 238000000576 coating method Methods 0.000 claims description 27
- 239000000853 adhesive Substances 0.000 claims description 16
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 238000004026 adhesive bonding Methods 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 4
- 239000005020 polyethylene terephthalate Substances 0.000 abstract 2
- -1 polyethylene terephthalate Polymers 0.000 abstract 1
- 239000003292 glue Substances 0.000 description 12
- 238000012360 testing method Methods 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004061 bleaching Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention relates to a multilayer flexible circuit board which comprises a double-sided adhesive-free copper foil substrate and at least one single-sided adhesive-free copper foil substrate, wherein the double-sided adhesive-free copper foil substrate and the single-sided adhesive-free copper foil substrate are bonded through an adhesive layer, the single-sided adhesive-free copper foil substrate comprises a first copper foil layer and a first polyimide layer which are sequentially arranged, a PET (polyethylene terephthalate) film is attached to one surface of the first copper foil layer, which is far away from the first polyimide layer, the double-sided adhesive-free copper foil substrate comprises a second copper foil layer, a second polyimide layer and a second copper foil layer which are sequentially arranged, and the single-sided adhesive-free copper foil substrate and the double-sided adhesive-free copper foil substrate are directly pressed and combined through roll. The single-sided board and the double-sided board are directly rolled and pressed into a shape by the pressing machine, so that a plurality of cutting processes, sheet pressing and curing processes and the like are omitted, the working process is simplified, and the working efficiency is improved.
Description
Technical Field
The invention relates to a flexible circuit board, in particular to a multilayer flexible circuit board and a manufacturing method thereof.
Background
At present, the single-sided board or the double-sided copper foil substrate is etched to form a circuit, the single-sided board or the double-sided circuit is cut into sheets, pure glue is cut, and the single-sided board or the double-sided board is combined through the pure glue by means of quick pressing or pressure transmission to form a required multilayer board. The multilayer board has multiple manufacturing methods and processes, can only be pressed and cured in a sheet shape, and has low efficiency and yield.
Disclosure of Invention
In order to overcome the defects, the invention provides a multilayer flexible circuit board, in the manufacturing process of the circuit board, a single-sided board or a double-sided board is etched into a circuit in a roll-to-roll mode, a coating and laminating machine is used for directly coating glue on the circuit, and the required multilayer board is laminated, so that a plurality of procedures of cutting, sheet laminating and curing and the like are omitted, the manufacturing procedure is simplified, the cost is saved, and the yield is improved.
The technical scheme adopted by the invention for solving the technical problem is as follows:
the utility model provides a multilayer flexible line way board, includes a two-sided no gluey copper foil base plate and an at least one single face no gluey copper foil base plate, bond through the adhesive layer between two-sided no gluey copper foil base plate and the single face no gluey copper foil base plate, the single face no gluey copper foil base plate is including the first copper foil layer and the first polyimide layer that set gradually, the PET membrane of laminating of the one side on keeping away from first polyimide layer on first copper foil layer is drawn together to the first copper foil layer that sets gradually, two-sided no gluey copper foil base plate is including the second copper foil layer, second polyimide layer and the second copper foil layer that set gradually, the both sides on adhesive layer are first polyimide layer and second copper foil layer respectively, it forms through the direct pressfitting of roll-to-roll between single face no gluey copper foil.
Preferably, the first and second copper foil layers are rolled copper foil layers, electrolytic copper foil layers or high-ductility copper foil layers, and the thickness of the first and second copper foil layers is 5 μm to 50 μm.
Preferably, the thickness of the first and second polyimide layers is 5 to 50 μm.
Preferably, the adhesive layer is an epoxy resin adhesive layer or an acrylic resin adhesive layer, and the thickness of the adhesive layer is 5-50 μm.
Preferably, the thickness of the PET film is 30-200 μm, and the release force of the PET film is 5-30G.
Preferably, the circuit board comprises a double-sided adhesive-free copper foil substrate and a single-sided adhesive-free copper foil substrate, and the circuit board sequentially comprises from top to bottom: the adhesive comprises a PET film, a first copper foil layer, a first polyimide layer, an adhesive layer, a second copper foil layer, a second polyimide layer and a second copper foil layer.
Preferably, the circuit board comprises a double-sided adhesive-free copper foil substrate and two single-sided adhesive-free copper foil substrates, and the circuit board sequentially comprises from top to bottom: the adhesive comprises a PET film, a first copper foil layer, a first polyimide layer, an adhesive layer, a second copper foil layer, a second polyimide layer, a second copper foil layer, an adhesive layer, a first polyimide layer, a first copper foil layer and a PET film.
The invention also provides a manufacturing method of the multilayer flexible circuit board, which comprises the following steps:
the method comprises the following steps: taking a single-sided adhesive-free copper foil substrate, and laminating a PET film on one side of the first copper foil layer far away from the first polyimide layer, wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm;
step two: etching the double-sided adhesive-free copper foil substrate into a double-sided circuit in a roll-to-roll manner to obtain the etched double-sided adhesive-free copper foil substrate;
step three: coating an adhesive layer on a first polyimide layer of the single-sided adhesive-free copper foil substrate laminated with the PET film, and pre-baking the first polyimide layer in a coating oven for a short time to obtain the single-sided copper foil substrate coated with the adhesive;
step four: and pressing the single-sided copper foil substrate after gluing and the etched double-sided adhesive-free copper foil substrate, and bonding the single-sided copper foil substrate and the double-sided copper foil substrate through the adhesive layer in the middle through the gap between the rollers of the pressing machine and the pressure given by the rollers to form the three-layer flexible circuit board.
Preferably, the method further comprises the following steps:
step five: and baking the three-layer flexible circuit board to enable the adhesive layer to be cured to form a roll-shaped finished product three-layer flexible circuit board.
Preferably, the method further comprises the following steps:
step six: taking the other single-sided adhesive-free copper foil substrate, and laminating a PET film on one side of the first copper foil layer, which is far away from the first polyimide layer, wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm;
step seven: coating an adhesive layer on a first polyimide layer of the single-sided adhesive-free copper foil substrate laminated with the PET film, and pre-baking the first polyimide layer in a coating oven for a short time to obtain the single-sided copper foil substrate coated with the adhesive;
step eight: pressing the single-sided copper foil substrate and the three-layer flexible circuit board after gluing, and bonding the single-sided copper foil substrate and the three-layer flexible circuit board through a middle adhesive layer through a gap between rollers of a pressing machine and pressure given by the rollers to form a four-layer flexible circuit board;
step nine: and baking the four-layer flexible circuit board to enable the adhesive layer to be cured to form a rolled finished product, namely the four-layer flexible circuit board.
The invention has the beneficial effects that:
1) according to the invention, the single-sided board or the double-sided board is etched in a roll-to-roll manner to form a circuit, then a coating and laminating machine is utilized to directly glue on the circuit, and finally the single-sided board and the double-sided board are directly laminated into the required multilayer board in a roll-to-roll manner through the laminating machine, so that a plurality of cutting procedures, a very time-consuming sheet pressing and curing procedure and the like are omitted, the manufacturing procedure is simplified, the production efficiency is improved, the cost is saved, and the yield is improved;
2) according to the invention, the single-sided adhesive-free copper foil substrate is bonded with the PET film, the PET film can be a transparent or colored film, and the PET film is laminated on the copper foil surface of the single-sided adhesive-free copper foil substrate, so that the substrate has good smoothness and stiffness and good processing performance, the production yield is improved, the cost is saved, the PET film can be directly peeled off in the rear-end operation, and the operation is convenient; different from the traditional PET film which plays a role in protecting the substrate, the PET film needs to be peeled off during processing, and the PET film in the invention is not peeled off during the pressing process, so that the substrate has better processing performance.
Drawings
FIG. 1 is a schematic structural view of a three-layer plate according to the present invention;
FIG. 2 is a schematic view of a four-layer plate according to the present invention;
FIG. 3 is a simplified diagram of the lamination process of the present invention;
in the figure: 10-single-sided adhesive-free copper foil substrate, 11-first copper foil layer, 12-first polyimide layer, 13-PET film, 20-adhesive layer, 30-double-sided adhesive-free copper foil substrate, 31-second copper foil layer, 32-second polyimide layer, 41-adhesive coating head, 42-coating oven, 43-laminating machine roller and 50-three-layer plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The utility model provides a multilayer flexible circuit board, includes a two-sided no glue copper foil base plate 30 and an at least single face no glue copper foil base plate 10, bond through adhesive layer 20 between two-sided no glue copper foil base plate 30 and the single face no glue copper foil base plate 10, single face no glue copper foil base plate 10 is including first copper foil layer 11 and the first polyimide layer 12 that sets gradually, first copper foil layer 11 is in the one side laminating PET membrane 13 of keeping away from first polyimide layer 12, two-sided no glue copper foil base plate 30 is including the second copper foil layer 31, second polyimide layer 32 and the second copper foil layer 31 that set gradually, the both sides of adhesive layer 20 are first polyimide layer 12 and second copper foil layer 31 respectively, it forms through the direct pressfitting of roll-to-roll between single face no glue copper foil base plate 10 and the two-sided no glue copper foil base plate 30. The single-sided adhesive-free copper foil substrate and the double-sided adhesive-free copper foil substrate in the multilayer circuit board are directly rolled and pressed into a shape by a pressing machine, so that a plurality of cutting processes, a very time-consuming sheet pressing and curing process and the like are omitted; a layer of PET film is laminated on the single-side adhesive-free copper foil substrate, so that the substrate has local flatness, good stiffness and good processability, the reject ratio of finished products is reduced, and the cost is saved.
The first and second copper foil layers are rolled copper foil layers, electrolytic copper foil layers or high-ductility copper foil layers, the thickness of the first and second copper foil layers is 5-50 μm, and preferably, the thickness of the first and second copper foil layers is 12-35 μm. The thickness of the first and second polyimide layers is 5 to 50 μm, and preferably, the thickness of the first and second polyimide layers is 12 to 25 μm. The adhesive layer 20 is an epoxy resin adhesive layer or an acrylic resin adhesive layer, the thickness of the adhesive layer is 5 μm to 50 μm, and preferably, the thickness of the adhesive layer is 12 μm to 25 μm. The thickness of the PET film is 30-200 μm, the release force of the PET film is 5-30G, and preferably, the thickness of the PET film is 50-150 μm.
As shown in fig. 1, the circuit board includes a double-sided adhesive-free copper foil substrate 30 and a single-sided adhesive-free copper foil substrate 10, and the circuit board sequentially includes, from top to bottom: a PET film 13, a first copper foil layer 11, a first polyimide layer 12, an adhesive layer 20, a second copper foil layer 31, a second polyimide layer 32, and a second copper foil layer 31.
As shown in fig. 2, the circuit board includes a double-sided adhesive-free copper foil substrate 30 and two single-sided adhesive-free copper foil substrates 10, and the circuit board sequentially includes, from top to bottom: a PET film 13, a first copper foil layer 11, a first polyimide layer 12, an adhesive layer 20, a second copper foil layer 31, a second polyimide layer 32, a second copper foil layer 31, an adhesive layer 20, a first polyimide layer 12, a first copper foil layer 11, and a PET film 13.
A manufacturing method of a three-layer flexible circuit board comprises the following steps:
the method comprises the following steps: taking a single-sided adhesive-free copper foil substrate 10, and laminating a PET film on one side of a first copper foil layer 11 far away from a first polyimide layer 12, wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm; the PET film can be transparent or colored, and a layer of PET film is laminated on the copper foil surface of the single-sided adhesive-free copper foil substrate, so that the substrate has good stiffness in smoothness and good processing performance, the yield of production is improved, the cost is saved, the PET film can be directly peeled off in subsequent operation, and the operation is convenient;
step two: etching the double-sided adhesive-free copper foil substrate 30 into a double-sided circuit in a roll-to-roll manner to obtain an etched double-sided adhesive-free copper foil substrate;
step three: coating an adhesive layer 20 on a first polyimide layer 12 of a single-sided adhesive-free copper foil substrate 10 laminated with a PET film, and pre-baking in a coating oven for a short time to obtain a single-sided copper foil substrate coated with adhesive;
step four: laminating the single-sided copper foil substrate after gluing and the etched double-sided adhesive-free copper foil substrate, and bonding the single-sided copper foil substrate and the double-sided copper foil substrate through an adhesive layer 20 in the middle through a gap between rollers of a laminating machine and pressure given by the rollers to form a three-layer flexible circuit board;
step five: baking the three-layer flexible circuit board to enable the adhesive layer to be cured to form a roll-shaped finished three-layer flexible circuit board, and obtaining the three-layer flexible circuit board, wherein the three-layer flexible circuit board is provided with a single-sided PET film, as shown in figure 3, the single-sided adhesive-free copper foil substrate 10 is coated with a layer of adhesive layer 20 through an adhesive coating head 41, and is baked through a coating oven 42, and then is laminated with the etched double-sided adhesive-free copper foil substrate 30 into a three-layer board 50 through a laminating machine roller 43.
A manufacturing method of a four-layer flexible circuit board comprises the following steps:
the method comprises the following steps: taking a single-sided adhesive-free copper foil substrate 10, and laminating a PET film on one side of a first copper foil layer 11 far away from a first polyimide layer 12, wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm;
step two: etching the double-sided adhesive-free copper foil substrate 30 into a double-sided circuit in a roll-to-roll manner to obtain an etched double-sided adhesive-free copper foil substrate;
step three: coating an adhesive layer 20 on a first polyimide layer 12 of a single-sided adhesive-free copper foil substrate 10 laminated with a PET film, and pre-baking in a coating oven for a short time to obtain a single-sided copper foil substrate coated with adhesive;
step four: laminating the single-sided copper foil substrate after gluing and the etched double-sided adhesive-free copper foil substrate, and bonding the single-sided copper foil substrate and the double-sided copper foil substrate through an adhesive layer 20 in the middle through a gap between rollers of a laminating machine and pressure given by the rollers to form a three-layer flexible circuit board;
step five: taking the other single-sided adhesive-free copper foil substrate 10, and laminating a PET film on one side of the first copper foil layer 11 far away from the first polyimide layer 12, wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm;
step six: coating an adhesive layer 20 on a first polyimide layer of the single-sided adhesive-free copper foil substrate 10 laminated with the PET film, and pre-baking the first polyimide layer in a coating oven for a short time to obtain the single-sided copper foil substrate coated with the adhesive;
step seven: pressing the single-sided copper foil substrate and the three-layer flexible circuit board after gluing, and bonding the single-sided copper foil substrate and the three-layer flexible circuit board through a middle adhesive layer through a gap between rollers of a pressing machine and pressure given by the rollers to form a four-layer flexible circuit board;
step eight: and baking the four-layer flexible circuit board, so that the adhesive layer is cured to form a rolled finished product, namely the four-layer flexible circuit board, thereby obtaining the four-layer flexible circuit board, wherein the upper surface and the lower surface of the four-layer flexible circuit board are both provided with PET films.
Example (b): the following are specific examples and comparative examples of the present invention, and test results thereof, as shown in tables 1 and 2, in which the thickness units of the respective layers are μm:
table 1:
TABLE 2
Examples 1-5 are four-layer plates prepared as follows:
the method comprises the following steps: taking a single-sided adhesive-free copper foil substrate 10, and laminating a PET film on one side of a first copper foil layer 11 far away from a first polyimide layer 12, wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm;
step two: etching the double-sided adhesive-free copper foil substrate 30 into a double-sided circuit in a roll-to-roll manner to obtain an etched double-sided adhesive-free copper foil substrate;
step three: coating an adhesive layer 20 on a first polyimide layer 12 of a single-sided adhesive-free copper foil substrate 10 laminated with a PET film, and pre-baking in a coating oven for a short time to obtain a single-sided copper foil substrate coated with adhesive;
step four: pressing the single-sided copper foil substrate after gluing and the etched double-sided adhesive-free copper foil substrate, and bonding the single-sided copper foil substrate and the double-sided copper foil substrate through the middle adhesive layer through the gap between the rollers and the pressure given by the rollers to form a three-layer flexible circuit board;
step five: taking the other single-sided adhesive-free copper foil substrate 10, and laminating a PET film on one side of the first copper foil layer 11 far away from the first polyimide layer 12, wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm;
step six: coating an adhesive layer 20 on a first polyimide layer of the single-sided adhesive-free copper foil substrate 10 laminated with the PET film, and pre-baking the first polyimide layer in a coating oven for a short time to obtain the single-sided copper foil substrate coated with the adhesive;
step seven: pressing the single-sided copper foil substrate after gluing with the three-layer flexible circuit board, and bonding the single-sided copper foil substrate with the three-layer flexible circuit board through a middle adhesive layer through a gap between the rollers and pressure given by the rollers to form the four-layer flexible circuit board;
step eight: and baking the four-layer flexible circuit board to enable the adhesive layer to be cured to form a rolled finished product, namely the four-layer flexible circuit board.
Examples 6-8 are three-layer plates prepared as follows:
the method comprises the following steps: taking a single-sided adhesive-free copper foil substrate 10, and laminating a PET film on one side of a first copper foil layer 11 far away from a first polyimide layer 12, wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm;
step two: etching the double-sided adhesive-free copper foil substrate 30 into a double-sided circuit in a roll-to-roll manner to obtain an etched double-sided adhesive-free copper foil substrate;
step three: coating an adhesive layer 20 on a first polyimide layer 12 of a single-sided adhesive-free copper foil substrate 10 laminated with a PET film, and pre-baking in a coating oven for a short time to obtain a single-sided copper foil substrate coated with adhesive;
step four: pressing the single-sided copper foil substrate after gluing and the etched double-sided adhesive-free copper foil substrate, and bonding the single-sided copper foil substrate and the double-sided copper foil substrate through the middle adhesive layer through the gap between the rollers and the pressure given by the rollers to form a three-layer flexible circuit board;
step five: and baking the three-layer flexible circuit board to enable the adhesive layer to be cured to form a roll-shaped finished product three-layer flexible circuit board.
Comparative examples 1 and 2 were obtained by a conventional wiring board manufacturing method.
Peel strength:
the measurement is carried out by IPC-TM-650-2.4.9 standard method;
solder heat resistance:
according to the method specified by IPC-TM-6502.4.13, the sample is cut into test pieces with the size of 5cm x 5cm, and after being baked at 135 ℃ for 1 hour at 10 ℃, the test pieces are immersed in a tin-lead liquid with constant temperature and high temperature of 288 ℃, and each test piece is immersed in the tin-lead liquid with constant temperature and high temperature for 10 seconds for tin bleaching. The appearance of the sample substrate was visually observed to see if it changed after immersion in the tin furnace. The evaluation was carried out by the following method:
PASS: the appearance is not changed at all;
NG: the appearance is blistered, patterned or melted.
As can be seen from the test results in tables 1 and 2, the product properties of comparative examples 1-2 obtained by the conventional process were achieved by examples 1-8 obtained by the present manufacturing method.
It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A multilayer flexible wiring board characterized in that: comprises a double-sided adhesive-free copper foil substrate (30) and at least one single-sided adhesive-free copper foil substrate (10), the double-sided adhesive-free copper foil substrate (30) and the single-sided adhesive-free copper foil substrate (10) are bonded through an adhesive layer (20), the single-sided adhesive-free copper foil substrate (10) comprises a first copper foil layer (11) and a first polyimide layer (12) which are sequentially arranged, the first copper foil layer (11) is bonded with a PET film (13) on one surface far away from the first polyimide layer (12), the double-sided adhesive-free copper foil substrate (30) comprises a second copper foil layer (31), a second polyimide layer (32) and a second copper foil layer (31) which are sequentially arranged, a first polyimide layer (12) and a second copper foil layer (31) are respectively arranged on two sides of the adhesive layer (20), the single-sided adhesive-free copper foil substrate (10) and the double-sided adhesive-free copper foil substrate (30) are directly laminated through roll-to-roll.
2. The multilayer flexible wiring board of claim 1, wherein: the first copper foil layer and the second copper foil layer are rolled copper foil layers, electrolytic copper foil layers or high-extension copper foil layers, and the thickness of the first copper foil layer and the thickness of the second copper foil layer are 5-50 mu m.
3. The multilayer flexible wiring board of claim 1, wherein: the thickness of the first and second polyimide layers is 5-50 μm.
4. The multilayer flexible wiring board of claim 1, wherein: the adhesive layer (20) is an epoxy resin adhesive layer or an acrylic resin adhesive layer, and the thickness of the adhesive layer is 5-50 mu m.
5. The multilayer flexible wiring board of claim 1, wherein: the thickness of the PET film is 30-200 mu m, and the release force of the PET film is 5-30G.
6. The multilayer flexible wiring board of claim 1, wherein: the circuit board comprises a double-sided adhesive-free copper foil substrate (30) and a single-sided adhesive-free copper foil substrate (10), and the circuit board sequentially comprises the following components from top to bottom: the adhesive comprises a PET film (13), a first copper foil layer (11), a first polyimide layer (12), an adhesive layer (20), a second copper foil layer (31), a second polyimide layer (32) and a second copper foil layer (31).
7. The multilayer flexible wiring board of claim 1, wherein: the circuit board comprises a double-sided adhesive-free copper foil substrate (30) and two single-sided adhesive-free copper foil substrates (10), and the circuit board sequentially comprises the following components from top to bottom: the adhesive comprises a PET film (13), a first copper foil layer (11), a first polyimide layer (12), an adhesive layer (20), a second copper foil layer (31), a second polyimide layer (32), a second copper foil layer (31), an adhesive layer (20), a first polyimide layer (12), a first copper foil layer (11) and a PET film (13).
8. A method of manufacturing a multilayer flexible wiring board according to any one of claims 1 to 7, characterized in that: the method comprises the following steps:
the method comprises the following steps: taking a single-sided adhesive-free copper foil substrate (10), and laminating a PET film on one side of the first copper foil layer (11) far away from the first polyimide layer (12), wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm;
step two: etching the double-sided adhesive-free copper foil substrate (30) into a double-sided circuit in a roll-to-roll manner to obtain the etched double-sided adhesive-free copper foil substrate;
step three: coating a layer of adhesive layer (20) on a first polyimide layer (12) of a single-sided adhesive-free copper foil substrate (10) laminated with a PET film, and pre-baking the first polyimide layer in a coating oven for a short time to obtain the single-sided copper foil substrate coated with adhesive;
step four: and pressing the single-sided copper foil substrate after gluing and the etched double-sided adhesive-free copper foil substrate, and bonding the single-sided copper foil substrate and the double-sided copper foil substrate through an adhesive layer (20) in the middle through a gap between rollers of a pressing machine and the pressure given by the rollers to form the three-layer flexible circuit board.
9. The method of manufacturing a multilayer flexible wiring board according to claim 8, characterized in that: also comprises the following steps:
step five: and baking the three-layer flexible circuit board to enable the adhesive layer to be cured to form a roll-shaped finished product three-layer flexible circuit board.
10. The method of manufacturing a multilayer flexible wiring board according to claim 8, characterized in that: also comprises the following steps:
step six: taking the other single-sided adhesive-free copper foil substrate (10), and laminating a PET film on one side of the first copper foil layer (11) far away from the first polyimide layer (12), wherein the laminating conditions are that the laminating temperature is 50-120 ℃, the laminating pressure is 1-2kg and the laminating speed is 3-20 rpm;
step seven: coating an adhesive layer (20) on a first polyimide layer of a single-sided adhesive-free copper foil substrate (10) laminated with a PET film, and pre-baking the first polyimide layer in a coating oven for a short time to obtain the single-sided copper foil substrate coated with adhesive;
step eight: pressing the single-sided copper foil substrate and the three-layer flexible circuit board after gluing, and bonding the single-sided copper foil substrate and the three-layer flexible circuit board through a middle adhesive layer through a gap between rollers of a pressing machine and pressure given by the rollers to form a four-layer flexible circuit board;
step nine: and baking the four-layer flexible circuit board to enable the adhesive layer to be cured to form a rolled finished product, namely the four-layer flexible circuit board.
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|---|---|---|---|---|
| TW200601908A (en) * | 2004-06-30 | 2006-01-01 | Flexium Interconnect Inc | Method for pressing thin film wire on two sides of soft PCB by using compound polyethylene film |
| CN106034378A (en) * | 2015-03-11 | 2016-10-19 | 深圳市英内尔科技有限公司 | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof |
| CN206389630U (en) * | 2017-01-04 | 2017-08-08 | 嘉联益电子(昆山)有限公司 | Volume to volume circuit board pressing equipment |
| CN212573103U (en) * | 2020-07-17 | 2021-02-19 | 松扬电子材料(昆山)有限公司 | Multilayer flexible circuit board |
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2020
- 2020-07-17 CN CN202010693009.0A patent/CN111818726A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200601908A (en) * | 2004-06-30 | 2006-01-01 | Flexium Interconnect Inc | Method for pressing thin film wire on two sides of soft PCB by using compound polyethylene film |
| CN106034378A (en) * | 2015-03-11 | 2016-10-19 | 深圳市英内尔科技有限公司 | Reel-to-reel flexible circuit board made of novel material and manufacturing method thereof |
| CN206389630U (en) * | 2017-01-04 | 2017-08-08 | 嘉联益电子(昆山)有限公司 | Volume to volume circuit board pressing equipment |
| CN212573103U (en) * | 2020-07-17 | 2021-02-19 | 松扬电子材料(昆山)有限公司 | Multilayer flexible circuit board |
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