CN2902689Y - Flexible composite board - Google Patents
Flexible composite board Download PDFInfo
- Publication number
- CN2902689Y CN2902689Y CN 200620050023 CN200620050023U CN2902689Y CN 2902689 Y CN2902689 Y CN 2902689Y CN 200620050023 CN200620050023 CN 200620050023 CN 200620050023 U CN200620050023 U CN 200620050023U CN 2902689 Y CN2902689 Y CN 2902689Y
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- layer
- soft
- flexible substrate
- stamen
- heartwood
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Abstract
The utility model discloses a soft clad plate, a heartwood layer material comprising a pistil material layer fomed by reinforcement material of fiberglass fabric impregnated with the epoxy resin adhesive arranged on the soft base material layer, which improves the problems of weak restoring force, holding power and size stability after the soft plate is ruptured as well as lowers manufacturing and material cost. In particular, the utility model is applicable to the soft multi-layer sheets without high rupturing frequency, dimensional stable products needed by, reinforcement materials and dimensional soft plates and soft or hard clad plates.
Description
Technical field:
The utility model relates to a kind of soft composite plate, particularly about a kind of after improving soft board and destroying or force to yield restoring force and the soft composite plate of problems such as support force and dimensional stability difference.
Background technology:
Traditional F PCB comprises plastic insulation counterdie, conductor, solid, surperficial cuticula, main application be for example to use the multilayer soft board in PDA, take the photograph that projector etc. is small-sized, high density, light-weighted product.Conventional art is with soft PI (poly imide, polyimides) or PET (polyethyleneTerephthalate, polyethylene terephthalic acid (TPA) fat) film is that substrate is made alligatoring and cleaning with its surface, to adhere with accurate coating method again and be applied in substrate surface as soft board coating film or the PCB that fits again (printed circuit board with epoxy resin, printed circuit board (PCB)) soft board is used as the usefulness that thickens the reinforcement material, or the substrate of single or double gluing and Copper Foil or aluminium foil fitted make the flexible copper foil substrate (FCCL of single or double, flexible copper claded laminate), with supply soft board PCB making material.Because of the used soft PI film of prior art cost an arm and a leg and to the carrying electronic original part support force and restoring force deficiency and dimensional stability after the deflection poor, often need to use the film adhered usefulness of thicker PI, therefore more increase the complexity and repeatability of cost and processing procedure for reinforcement.
The utility model content:
Technical problem to be solved in the utility model is: at the above-mentioned deficiency of prior art, propose a kind of after improving soft board and destroying or force to yield restoring force and the soft composite plate of problems such as support force and dimensional stability difference.In order to solve the problems of the technologies described above, the technical scheme that the utility model adopted is: a kind of soft composite plate, comprise flexible substrate layer and adhesive layer, be characterized in: comprise that also one has the stamen heartwood layer that reinforcement material that glass fabric mixes with epoxy resin constitutes, described flexible substrate layer is arranged at about this stamen heartwood layer, and described adhesive layer is located at this stamen heartwood layer and flexible substrate interlayer.
The another kind of technical scheme that the utility model adopts is: a kind of soft composite plate, it comprises flexible substrate layer and adhesive layer, be characterized in: also comprise one and have the stamen heartwood layer that reinforcement material that glass fabric mixes with epoxy resin constitutes, described flexible substrate layer is arranged at about this stamen heartwood layer, the flexible substrate layer is provided with copper foil layer outward, and described adhesive layer is located between flexible substrate layer and copper foil layer.
Wherein, in the such scheme: the adhesive agent of described adhesive layer is made of epoxy resin.Described flexible substrate layer can be a kind of in PI, PET, the LCP macromolecule membrane.The thickness range 25 μ m～200 μ m of described stamen heartwood layer, the thickness range 12 μ m～50 μ m of adhesive layer, the thickness range 10 μ m～80 μ m of this flexible substrate layer.Described adhesive layer and stamen heartwood layer are epoxy resin bonding glue and glass fabric bonding sheet for Halogen and the non-halogen that uses the FR-4 grade.
Compared with prior art, the utility model has the advantages that: the stamen heartwood layer of this soft composite plate is to have the reinforcement material that glass fabric mixes with epoxy resin, the adhesive agent that itself and this flexible substrate interlayer uses epoxy resin to constitute adheres to, thereby can make composite plate have pliability and recovery concurrently, and the tool support force, thereby can improve existing soft printed circuit board (Flexible Printed Circuit Board) or soft-hard composite board (Rigid-Flex PCB) difficulty that in processing procedure, is produced and the shortcoming that yield is low, cost is high.
Description of drawings:
Fig. 1 is the schematic diagram of the utility model one embodiment.
Fig. 2 is the schematic diagram of another embodiment of the utility model.
Label declaration:
The specific embodiment:
In order to allow the purpose of this utility model, feature and advantage understand by clearer and more definite quilt, hereinafter will be with preferred embodiments, and cooperate appended graphicly, elaborate.
See also Fig. 1, schematic diagram for first embodiment of the soft composite plate of the utility model, this soft composite plate comprises one and has reinforcement material that glass fabric mixes with epoxy resin as stamen heartwood layer 1, and flexible substrate layer 2 is arranged in this stamen heartwood layer 1 upper and lower settings, preferably, this stamen heartwood layer 1 and 2 on flexible substrate layer stick together with adhesive agent.This adhesive agent is an epoxy resin.And this flexible substrate layer 2 is a macromolecule membrane, and this macromolecule membrane can be selected from one of PI, PET, LCP (liquid crystal polymer, liquid crystal polymer).Therefore can form and have pliability and recovery concurrently, and the soft composite plate of tool support force.
See also Fig. 2, schematic diagram for second embodiment of the soft composite plate of the utility model, this soft composite plate comprises one and has reinforcement material that glass fabric mixes with epoxy resin as stamen heartwood layer 1, and flexible substrate layer 2 is arranged in this stamen heartwood layer 1 upper and lower settings, flexible substrate layer 2 is respectively equipped with Copper Foil 4 up and down, is provided with adhesive layer 3 between flexible substrate layer 2 and the copper foil layer 4.Flexible substrate layer 2 is adhered on the stamen heartwood layer with hot pressing mode and reaction is finished, completed flexible substrate layer 2 is soft composite base material, coat the usefulness that adhesive agent is used as cover material or reinforcement material then on the surface, again that Copper Foil 4 is single or two-sidedly stick in set, and be used as flexible copper foil substrate, can form and have pliability and recovery concurrently, and the soft composite plate of tool support force.So the utility model can improve existing soft printed circuit board (FlexiblePrinted Circuit Board) or soft-hard composite board (Rigid-Flex PCB) difficulty that is produced and the shortcoming that yield is low, cost is high in processing procedure.The soft composite plate of the utility model can be used as the usefulness of soft substrate, reinforcement material and single face, two-sided soft copper clad laminate (FCCL), and existing three-layer type PI soft board is all significantly improved in the yield and the processing cost of substrate cost, function and PCB processing procedure.
Preferably, the thickness range 25 μ m～200 μ m of this stamen heartwood layer 1, and the thickness range 12 μ m～50 μ m of this adhesive layer 3, this is used in flexible substrate layer 2 thickness range up and down is 10 μ m～80 μ m.Wherein employed adhesive layer 3 is epoxy resin bonding glue and glass fabric bonding sheet with stamen heartwood layer 1 for Halogen and the non-halogen that uses FR-4 (rigid copper clad laminate) grade in this soft composite plate.The utility model utilizes soft composite plate institute's tool restoring force and advantages such as support force and dimensional stability, can be applied to be engaged in a large amount of productions in the general hardboard PCB manufacturing process, be beyond one's reach by existing traditional soft board support force is not enough, so more can effectively reduce the FPCB manufacturing cost and improve yield and reduce material cost.The utility model significantly dwindles hardboard and soft board PCB manufacturing technology and capacity of equipment difference by this, has the advantage that cost savings and functional characteristic are taken into account, and significantly promotes FPCB and hardboard PCB industrial competitiveness.Be specially adapted to the required high dimensional stability product of manufacturings such as multilayer soft board PCB and golden finger or replace the complexity of making recombinant respectively of existing traditional soft/hard compound pcb board, fraction defective is reduced and manufacturing process simplification etc. has very big contribution.
Claims (10)
1. soft composite plate, comprise flexible substrate layer and adhesive layer, it is characterized in that: comprise that also one has the stamen heartwood layer that reinforcement material that glass fabric mixes with epoxy resin constitutes, described flexible substrate layer is arranged at about this stamen heartwood layer, and described adhesive layer is located at this stamen heartwood layer and flexible substrate interlayer.
2. soft composite plate according to claim 1 is characterized in that: the adhesive agent of described adhesive layer is an epoxy resin.
3. soft composite plate according to claim 1 is characterized in that: described flexible substrate layer can be a kind of in PI, PET, the LCP macromolecule membrane.
4. soft composite plate according to claim 1, it is characterized in that: the thickness range 25 μ m～200 μ m of described stamen heartwood layer, and the thickness range 12 μ m～50 μ m of this adhesive layer, the thickness range 10 μ m of this flexible substrate layer～80 μ m macromolecule membranes.
5. soft composite plate according to claim 1 is characterized in that: described adhesive layer and stamen heartwood layer are epoxy resin bonding glue and glass fabric bonding sheet for Halogen and the non-halogen that uses the FR-4 grade.
6. soft composite plate, it comprises flexible substrate layer and adhesive layer, it is characterized in that: also comprise one and have the stamen heartwood layer that reinforcement material that glass fabric mixes with epoxy resin constitutes, described flexible substrate layer is arranged at about this stamen heartwood layer, the flexible substrate layer is provided with copper foil layer outward, and described adhesive layer is located between flexible substrate layer and copper foil layer.
7. soft composite plate according to claim 6 is characterized in that: the adhesive agent of described adhesive layer is made of epoxy resin.
8. soft composite plate according to claim 6 is characterized in that: described flexible substrate layer can be a kind of in PI, PET, the LCP macromolecule membrane.
9. soft composite plate according to claim 6 is characterized in that: the thickness range 25 μ m～200 μ m of described stamen heartwood layer, the thickness range 12 μ m～50 μ m of adhesive layer, the thickness range 10 μ m～80 μ m of this flexible substrate layer.
10. soft composite plate according to claim 6 is characterized in that: described adhesive layer and stamen heartwood layer are epoxy resin bonding glue and glass fabric bonding sheet for Halogen and the non-halogen that uses the FR-4 grade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620050023 CN2902689Y (en) | 2006-02-15 | 2006-02-15 | Flexible composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620050023 CN2902689Y (en) | 2006-02-15 | 2006-02-15 | Flexible composite board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2902689Y true CN2902689Y (en) | 2007-05-23 |
Family
ID=38078094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620050023 Expired - Fee Related CN2902689Y (en) | 2006-02-15 | 2006-02-15 | Flexible composite board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2902689Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102173112A (en) * | 2011-02-16 | 2011-09-07 | 珠海元盛电子科技股份有限公司 | Soft and hard combined plate structure capable of avoiding fracture of soft plate |
| CN102922809A (en) * | 2012-11-01 | 2013-02-13 | 广东生益科技股份有限公司 | Liquid crystal polymer glass fiber bonding sheet copper-clad plate and preparation method thereof |
| CN111976246A (en) * | 2020-09-01 | 2020-11-24 | 无锡睿龙新材料科技有限公司 | High-flame-retardant intelligent coating high-frequency copper-clad plate and preparation method thereof |
-
2006
- 2006-02-15 CN CN 200620050023 patent/CN2902689Y/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102173112A (en) * | 2011-02-16 | 2011-09-07 | 珠海元盛电子科技股份有限公司 | Soft and hard combined plate structure capable of avoiding fracture of soft plate |
| CN102922809A (en) * | 2012-11-01 | 2013-02-13 | 广东生益科技股份有限公司 | Liquid crystal polymer glass fiber bonding sheet copper-clad plate and preparation method thereof |
| CN102922809B (en) * | 2012-11-01 | 2016-08-10 | 广东生益科技股份有限公司 | A kind of liquid crystal polymer glass fibre bonding sheet, copper-clad plate and preparation method thereof |
| CN111976246A (en) * | 2020-09-01 | 2020-11-24 | 无锡睿龙新材料科技有限公司 | High-flame-retardant intelligent coating high-frequency copper-clad plate and preparation method thereof |
| CN111976246B (en) * | 2020-09-01 | 2021-03-12 | 无锡睿龙新材料科技有限公司 | High-flame-retardant intelligent coating high-frequency copper-clad plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070523 |