CN109699126A - A kind of interior arrangement and manufacturing method applied to flexible circuit board - Google Patents
A kind of interior arrangement and manufacturing method applied to flexible circuit board Download PDFInfo
- Publication number
- CN109699126A CN109699126A CN201910065717.7A CN201910065717A CN109699126A CN 109699126 A CN109699126 A CN 109699126A CN 201910065717 A CN201910065717 A CN 201910065717A CN 109699126 A CN109699126 A CN 109699126A
- Authority
- CN
- China
- Prior art keywords
- colloid
- colloids
- release layer
- route
- pet film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 239000000084 colloidal system Substances 0.000 claims abstract description 75
- 229920002799 BoPET Polymers 0.000 claims abstract description 30
- 230000001680 brushing effect Effects 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 7
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 3
- 239000002657 fibrous material Substances 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 230000001737 promoting effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Abstract
The invention discloses a kind of interior arrangements and manufacturing method applied to flexible circuit board, comprising: No.1 route film, No.1 colloid, PET film, No. two colloids and No. two route films；In the upper end brushing No.1 colloid of the PET film；The No.1 route film is pasted in the upper end of No.1 colloid；No. two colloids are pasted in the bottom end of the PET film；No. two route films are pasted in the bottom end of No. two colloids.This product structure is simple, and rationally, by utilizing full-automatic board operation, promoting productivity, and route product has huge promotion to waterproof this respect for design.
Description
Technical field
The present invention relates to electronics industry flexible circuit board technical fields, more particularly, to a kind of applied in flexible circuit board
Part device and manufacturing method.
Background technique
Glue is applied in PET material, the operation by the way of artificial by traditional industries using printing, to production capacity, manpower and
Function etc. all Shortcomings.
Summary of the invention
The purpose of the present invention is to provide a kind of interior arrangements and manufacturing method applied to flexible circuit board.
To achieve the above object, the present invention uses the following contents:
A kind of interior arrangement applied to flexible circuit board, comprising: No.1 route film, No.1 colloid, PET film, No. two glue
Body and No. two route films；In the upper end brushing No.1 colloid of the PET film；The No.1 route film is pasted in the upper of No.1 colloid
End；No. two colloids are pasted in the bottom end of the PET film；No. two route films are pasted in the bottom end of No. two colloids.
It preferably, further include release layer；The release layer is attached to the two sides up and down of No. two colloids.
Preferably, the No.1 colloid and No. two colloids are pressure sensitive adhesive；The No.1 colloid with a thickness of 0.02~
0.028mm, and No.1 colloid is half seep through.
Preferably, the PET film is made of PET material；The PET film with a thickness of 0.012~0.075mm；It is described
The color of PET film is transparent, white, black, blue or yellow.
Preferably, the release layer is made of PET material or fibrous material；The release layer with a thickness of 0.02~
0.1mm, and the color of release layer is transparent, white or blue.
A kind of manufacturing method applied to flexible circuit board, based on upper end paste release layer No.1 colloid and upper and lower two sides
No. two colloids for pasting release layer are realized comprising:
1) upper No.1 colloid is pasted in the upper end of PET film；
2) release layer of No.1 colloid upper end is thrown off；
3) No.1 route film is pasted in the upper end of No.1 colloid；
4) release layer on the upside of No. two colloids is thrown off, pastes No. two colloids in the bottom side of PET film；
5) release layer of No. two colloid bottom sides is taken off；
6) finally No. two route films are pasted on No. two colloids.
The invention has the following advantages that
This product structure is simple, and rationally, by utilizing full-automatic board operation, promoting productivity, and route produces for design
Product have huge promotion to waterproof this respect.
Detailed description of the invention
Specific embodiments of the present invention will be described in further detail with reference to the accompanying drawing.
Fig. 1 is a kind of interior arrangement schematic diagram applied to flexible circuit board of the invention.
Fig. 2 is the structural schematic diagram of release layer of the present invention.
In figure, each appended drawing reference are as follows:
1- No.1 route film, 2- No.1 colloid, 3-PET film, No. bis- colloids of 4-, No. bis- route films of 5-, 6- release layer.
Specific embodiment
In order to illustrate more clearly of the present invention, below with reference to preferred embodiment, the present invention is described further.Ability
Field technique personnel should be appreciated that following specifically described content is illustrative and be not restrictive, this should not be limited with this
The protection scope of invention.
As illustrated in fig. 1 and 2, a kind of interior arrangement applied to flexible circuit board includes: No.1 route film 1, No.1 colloid
2,3, No. two colloids 4 of PET film and No. two route films 5；In the upper end brushing No.1 colloid 1 of the PET film 3；The No.1 route
Film 1 is pasted in the upper end of No.1 colloid 2；No. two colloids 4 are pasted in the bottom end of the PET film 3；No. two route films 5 are pasted
In the bottom end of No. two colloids 4.
Further, the present apparatus further includes release layer 6；The release layer 6 is attached to the two sides up and down and one of No. two colloids
The upper end of number colloid 2；When in use, release layer 6 is thrown off again, being beneficial to prevent colloid contamination dust.
Further, the No.1 colloid 2 and No. two colloids 4 are pressure sensitive adhesive；The No.1 colloid 2 with a thickness of 0.02
~0.028mm, and No.1 colloid 2 is half seep through.
Further, the PET film 3 is made of PET material；The PET film 3 with a thickness of 0.012~0.075mm；Institute
The color for stating PET film 3 is transparent, white, black, blue or yellow.
Further, the release layer 6 is made of PET material or fibrous material；The release layer 6 with a thickness of 0.02
~0.1mm, and the color of release layer is transparent, white or blue.
A method of applied to flexible circuit board, the No.1 colloid of release layer is pasted based on upper end and upper and lower two sides are pasted
No. two colloids of release layer are realized comprising:
1) upper No.1 colloid 2 is pasted in the upper end of PET film 3；
2) release layer 6 of 2 upper end of No.1 colloid is thrown off；
3) No.1 route film 1 is pasted in the upper end of No.1 colloid 2；
4) release layer 6 of No. two 4 upsides of colloid is thrown off, pastes No. two colloids 4 in the bottom side of PET film 3；
5) release layer 6 of No. two 4 bottom sides of colloid is taken off；
6) finally No. two route films 4 are pasted on No. two colloids 4.
The present apparatus pastes one layer of No.1 colloid 2 in the upside of PET film 3 first in production；Then on No.1 colloid 2
The release layer 6 at end is thrown off, and No.1 route film 1 is attached on No.1 colloid 2；Then the release layer of 4 upside of No. two colloids is taken off
6, it is bonded together the upside of No. two colloids 4 and the bottom side of PET film 3；The release layer 6 for finally taking No. two 4 bottom sides of colloid off,
No. two route moulds 5 are attached to the bottom side of No. two colloids 4.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention may be used also on the basis of the above description for those of ordinary skill in the art
To make other variations or changes in different ways, all embodiments can not be exhaustive here, it is all to belong to this hair
The obvious changes or variations that bright technical solution is extended out are still in the scope of protection of the present invention.
Claims (6)
1. a kind of interior arrangement applied to flexible circuit board characterized by comprising No.1 route film, No.1 colloid, PET
Film, No. two colloids and No. two route films；In the upper end brushing No.1 colloid of the PET film；The No.1 route film is pasted one
The upper end of number colloid；No. two colloids are pasted in the bottom end of the PET film；No. two route films are pasted at the bottom of No. two colloids
End.
2. a kind of interior arrangement applied to flexible circuit board according to claim 1, which is characterized in that further include release
Layer；The release layer is attached to the two sides up and down of No. two colloids.
3. a kind of interior arrangement applied to flexible circuit board according to claim 1, which is characterized in that the No.1 glue
Body and No. two colloids are pressure sensitive adhesive；The No.1 colloid with a thickness of 0.02~0.028mm, and No.1 colloid is half seep through.
4. a kind of interior arrangement applied to flexible circuit board according to claim 1, which is characterized in that the PET film
It is made of PET material；The PET film with a thickness of 0.012~0.075mm；The color of the PET film is transparent, white, black
Color, blue or yellow.
5. a kind of interior arrangement applied to flexible circuit board according to claim 2, which is characterized in that the release layer
It is made of PET material or fibrous material；The release layer with a thickness of 0.02~0.1mm, and the color of release layer be it is transparent,
White or blue.
6. a kind of manufacturing method applied to flexible circuit board pastes the No.1 colloid of release layer based on upper end and upper and lower two sides sticks
No. two colloids for pasting release layer are realized comprising:
1) upper No.1 colloid is pasted in the upper end of PET film；
2) release layer of No.1 colloid upper end is thrown off；
3) No.1 route film is pasted in the upper end of No.1 colloid；
4) release layer on the upside of No. two colloids is thrown off, pastes No. two colloids in the bottom side of PET film；
5) release layer of No. two colloid bottom sides is taken off；
6) finally No. two route films are pasted on No. two colloids.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910065717.7A CN109699126A (en) | 2019-01-25 | 2019-01-25 | A kind of interior arrangement and manufacturing method applied to flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910065717.7A CN109699126A (en) | 2019-01-25 | 2019-01-25 | A kind of interior arrangement and manufacturing method applied to flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109699126A true CN109699126A (en) | 2019-04-30 |
Family
ID=66234289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910065717.7A Pending CN109699126A (en) | 2019-01-25 | 2019-01-25 | A kind of interior arrangement and manufacturing method applied to flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109699126A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007194341A (en) * | 2006-01-18 | 2007-08-02 | Kyocera Chemical Corp | Flexible printed wiring board and manufacturing method thereof |
| CN103260360A (en) * | 2012-02-17 | 2013-08-21 | 宏达国际电子股份有限公司 | Circuit board, and structure unit of and manufacturing process for the same |
| CN107911939A (en) * | 2017-11-24 | 2018-04-13 | 惠州市鹏程电子科技有限公司 | A kind of flexible printed circuit board |
| CN209748922U (en) * | 2019-01-25 | 2019-12-06 | 昆山珀利铭新材料科技有限公司 | Internal device applied to flexible circuit board |
-
2019
- 2019-01-25 CN CN201910065717.7A patent/CN109699126A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007194341A (en) * | 2006-01-18 | 2007-08-02 | Kyocera Chemical Corp | Flexible printed wiring board and manufacturing method thereof |
| CN103260360A (en) * | 2012-02-17 | 2013-08-21 | 宏达国际电子股份有限公司 | Circuit board, and structure unit of and manufacturing process for the same |
| CN107911939A (en) * | 2017-11-24 | 2018-04-13 | 惠州市鹏程电子科技有限公司 | A kind of flexible printed circuit board |
| CN209748922U (en) * | 2019-01-25 | 2019-12-06 | 昆山珀利铭新材料科技有限公司 | Internal device applied to flexible circuit board |
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