CN202998655U - Metal-base printed circuit board - Google Patents
Metal-base printed circuit board Download PDFInfo
- Publication number
- CN202998655U CN202998655U CN 201220181860 CN201220181860U CN202998655U CN 202998655 U CN202998655 U CN 202998655U CN 201220181860 CN201220181860 CN 201220181860 CN 201220181860 U CN201220181860 U CN 201220181860U CN 202998655 U CN202998655 U CN 202998655U
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- China
- Prior art keywords
- circuit board
- printed circuit
- pcb
- metal substrate
- metal
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Abstract
The utility model relates to a metal-base printed circuit board, comprising a metal substrate with a roughened surface; a printed circuit board; and a bonding layer, which is sandwiched between the metal substrate and the printed circuit board and bonds the printed circuit board on the roughened surface of the metal substrate. The metal-base printed circuit board of the utility model has the advantages of rapid heat dissipation and good mechanical properties.
Description
Technical field
The utility model relates to a kind of metal base printed circuit board, relates in particular to a kind of metal base printed circuit board that has coarse surface with metal substrate.
Background technology
Printed circuit board (PCB) (Printed Circuit Board, PCB) be almost the basis of any electronic product, appear at almost in each electronic equipment, in general, if in some equipment, electronic devices and components are arranged, they are all also to be integrated on the printed circuit board (PCB) of different sizes so.
Along with the function of electronic product strengthens day by day, its popularity is more and more higher, for the requirement that is applied in the printed circuit board (PCB) in electronic product also corresponding raising.
In prior art, a kind of printed circuit board (PCB) that relies on metal substrate has appearred, the printed circuit board (PCB) of Metal Substrate is large at some packaging density, heat radiation requires high and electronic product that mechanicalness is strong in be well used.
Yet, because metal material is difficult to carry out combination with common printed circuit board (PCB), the phenomenons such as Metal Substrate is become flexible, come off, loose contact often appear in the bonding metal base printed circuit board of general jointing material, have had a strong impact on electric, heat radiation and the mechanical performance of metal-based circuit board.
In view of this, be necessary the defective of above-mentioned existence is improved.
The utility model content
The metal base printed circuit board that the utility model provides that a kind of manufacture craft is simple, heat radiation and mechanical performance can be high.
A kind of metal base printed circuit board is provided, comprises: metal substrate, it has coarse surface; Printed circuit board (PCB); Adhesive layer, it is located between described metal substrate and described printed circuit board (PCB), and described printed circuit board (PCB) is bonded on the coarse surface of described metal substrate.
According to a preferred embodiment of the present utility model, the alligatoring of described metallic substrate surfaces is to adopt sand-blast to form, and the sandblast that described sand-blast adopts is any one in copper ore, quartz sand, diamond dust, iron sand, SEMEN AMOMI LONGILIGULA, plastic pellet.
According to a preferred embodiment of the present utility model, the roughness of the coarse surface of described metal substrate is 100 microns-150 microns.
According to a preferred embodiment of the present utility model, described sand-blast adopts 120 purpose sandblasts.
According to a preferred embodiment of the present utility model, described metal substrate is aluminium base or copper base, and described printed circuit board (PCB) is any one or the multiple combination in individual layer, multilayer, single face, double-sided printed-circuit board.
According to a preferred embodiment of the present utility model, described adhesive layer is prepreg.
According to a preferred embodiment of the present utility model, described printed circuit board (PCB) is the printed circuit board (PCB) of glass-fiber-plate base.
Compared to prior art, the utility model metal base printed circuit board has following advantage:
Heat conductivility is good: adopt the metals such as aluminium, copper as substrate, have good thermal conductivity, the dissipation of heat that can well printed circuit board (PCB) be produced is avoided printed circuit board (PCB) Yin Gaowen and is damaged.
Good mechanical property: the metal materials such as aluminium, copper have good mechanical properties, are suitable for the conventional mechanical processing such as boring, punching and cutting.
In conjunction with tight: the metal substrate of roughening treatment can carry out comprehensive combination with adhesive layer, bond area between greatly having increased both, thereby guaranteed the strong bonded of printed circuit board (PCB) and metal substrate, occur becoming flexible between preventing both, come off, the phenomenon such as loose contact, improved the quality of printed circuit board (PCB).
Technique is simple: with respect to existing manufacture craft, only need to get final product by metallic substrate surfaces is carried out roughening treatment, need not complicated manufacture craft, be convenient to the batch production of product and reduce costs.
Description of drawings
Fig. 1 is a kind of cross-sectional view of the metal base printed circuit board relevant to the utility model.
Fig. 2 is the schematic flow sheet of the manufacture method of metal base printed circuit board shown in Figure 1.
Fig. 3 a-Fig. 3 e is the cross-sectional view of each step of metal base printed circuit board manufacture method shown in Figure 2.
Embodiment
Describe embodiment of the present utility model in detail below in conjunction with accompanying drawing.
See also Fig. 1, Fig. 1 is the cross-sectional view of the utility model metal base printed circuit board (Printed Circuit Board, PCB).Described metal base printed circuit board 100 comprises metal substrate 1, is arranged on the printed circuit board (PCB) 2 on metal substrate 1, and is used for described metal substrate 1 and described printed circuit board (PCB) 2 are bonded in together adhesive layer 3.
Concrete, described metal substrate 1 has a coarse surface 11, forms the roughness of 100 microns to 150 microns on described coarse surface 11, is conducive to described printed circuit board (PCB) 2 and combines closely with it, occurs coming off between preventing both, the phenomenon such as perk.General, described metal substrate 1 be that aluminium or copper become, and is certain, according to the different demands of product, can also be that the other materials such as silver-colored, golden is made, and do not do concrete restriction at this.Described metal substrate 1 thickness can optionally be set to as required tens microns to several millimeters and not wait.
Described printed circuit board (PCB) 2 can be the single or double printed circuit board (PCB), can be also the single or multiple lift printed circuit board (PCB), does not do concrete restriction at this.
Further, the substrate 2 of described printed circuit board (PCB) can be that the materials such as glass-fiber-plate (FR-4), pottery, PS polystyrene are made, and does not also limit at this.
Described adhesive layer 3 is generally that prepreg material commonly used in manufacturing process for printed circuit board is made, and can also be other jointing materials such as TPUE certainly, will not enumerate at this.
It should be noted that in embodiment shown in Figure 1, printed circuit board (PCB) 2 has adopted the circuit board of glass-fiber-plate (FR-4) base in order more clearly to explain the utility model, it is that example is introduced in detail that adhesive layer 3 has adopted prepreg.
Please consult simultaneously Fig. 2, Fig. 3 a-Fig. 3 e, Fig. 2 is the schematic flow sheet of the manufacture method of printed circuit board (PCB) 100 shown in Figure 1, Fig. 3 a-Fig. 3 e is the cross-sectional view of each step of the manufacture method of printed circuit board (PCB) 100 shown in Figure 2, and the manufacture method of described printed circuit board (PCB) 100 specifically comprises:
Step S1 provides a metal substrate;
See also Fig. 3 a, described metal substrate 1 is laminated structure, can select as required the thickness of tens microns to several millimeters, and the surface of general metal substrate 1 is smooth surface, and foreign object is difficult to firm attachment on its surface.
Step S2 carries out roughening treatment to the surface of described metal substrate;
See also Fig. 3 b, by sand-blast, roughening treatment is carried out on the surface of described metal substrate 1, form the metal substrate 1 with coarse surface 11.Sand-blast can adopt dry abrasive blasting or vapour blasting technique, does not specifically limit.In the present embodiment, blasting craft is that employing compressed air is the dry abrasive blasting technique of power, form the high velocity jet bundle with the surface of material spray high velocity jet to described metal substrate 1, its appearance is changed, and described material spray is a kind of in copper ore, quartz sand, diamond dust, iron sand, SEMEN AMOMI LONGILIGULA.Due to impact and the shear action of material spray to described metal substrate 1 surface, make the surface of described metal substrate 1 obtain certain cleannes and roughness, thereby the mechanical performance on the surface of described metal substrate 1 is improved, increase simultaneously the adhesive force between the surface of metal substrate 1 and coating, coating, thereby formed the metal substrate 1 of satisfactory mechanical property.Wherein, can adopt the material spray of different size according to the difference of roughness, in the present embodiment, the sandblast material spray adopts 120 purpose particles, gets the roughness of 100um to 150um on the surface of metal substrate 1.
Certainly, if the needs of roughness can be satisfied in the surface of the metal substrate 1 that provides in step S1, step S2 can omit.
Step S3 provides adhesive layer and printed circuit board (PCB);
See also Fig. 3 c, suitable adhesive layer 3 and printed circuit board (PCB) 2 is provided.Wherein said adhesive layer 3 can be prepreg commonly used in manufacturing process for printed circuit board or the adhesive layer of other types, described adhesive layer 3 generally has insulation, good heat conduction, the characteristic such as high temperature resistant, corrosion-resistant, can select according to the actual needs of product; Described printed circuit board (PCB) 2 can be the single or double printed circuit board (PCB), can be also the single or multiple lift printed circuit board (PCB), does not do concrete demonstration at this.Describe take adhesive layer 3 as prepreg as example in the present embodiment.
Step S4 sequentially is superimposed on described adhesive layer and described printed circuit board (PCB) the coarse surface of described metal substrate;
See also Fig. 3 d, described adhesive layer 3 and described printed circuit board (PCB) 2 sequentially are superimposed on the coarse surface 11 of described metal substrate 1, described adhesive layer 3 is used for described printed circuit board (PCB) 2 is bonded in securely the coarse surface of described metal substrate 1.
Step S5 carries out hot pressing to superimposed metal substrate, adhesive layer and printed circuit board (PCB), makes described printed circuit board (PCB) be bonded in the coarse surface of described metal substrate by described adhesive layer.
See also Fig. 3 e, by hot pressing technique, the iterative structure of described metal substrate 1, adhesive layer 3 and printed circuit board (PCB) 2 is added hot pressing.Heating process can make the adhesive layer 3 of prepreg material be fused into liquid, fully the coarse surface 11 of described metal substrate 1 and the space between described printed circuit board (PCB) 2 are also filled up in infiltration, by adding strong pressure, described metal substrate 1 and described printed circuit board (PCB) 2 are closely linked, when temperature is reduced to room temperature, described printed circuit board (PCB) 2 namely has been bonded in the coarse surface 11 of described metal substrate 1 securely by described adhesive layer, thereby forms described printed circuit board (PCB) 100.
After completing above-mentioned manufacture craft, can also carry out common post-production technique to described printed circuit board (PCB) 100, as boring, cutting, purification etc., not repeat them here.
Compared to prior art, the utility model printed circuit board (PCB) 100 adopts metal material as baseplate material, thereby and roughening treatment has been carried out on the surface of metal substrate 1 carried out hot pressing technique, it has following advantage:
1, heat conductivility is good: adopt the metals such as aluminium, copper as substrate, have good thermal conductivity, the dissipation of heat that can well printed circuit board (PCB) be produced is avoided printed circuit board (PCB) Yin Gaowen and is damaged.
2, good mechanical property: the metal materials such as aluminium, copper have good mechanical properties, are suitable for the conventional mechanical processing such as boring, punching and cutting.
3, in conjunction with tight: the metal substrate of roughening treatment can carry out comprehensive combination with adhesive layer, bond area between greatly having increased both, thereby guaranteed the strong bonded of printed circuit board (PCB) and metal substrate, occur becoming flexible between preventing both, come off, the phenomenon such as loose contact, improved the quality of printed circuit board (PCB).
4, technique is simple: with respect to existing manufacture craft, only need to get final product by metallic substrate surfaces is carried out roughening treatment, need not complicated manufacture craft, be convenient to the batch production of product and reduce costs.
The above is only better embodiment of the present utility model; protection range of the present utility model is not limited with above-mentioned execution mode; in every case the equivalence done according to the utility model institute disclosure of those of ordinary skills is modified or changes, and all should include in the protection range of putting down in writing in claims.
Claims (7)
1. metal base printed circuit board comprises:
Metal substrate, it has coarse surface;
Printed circuit board (PCB);
Adhesive layer, it is located between described metal substrate and described printed circuit board (PCB), and described printed circuit board (PCB) is bonded on the coarse surface of described metal substrate.
2. metal base printed circuit board according to claim 1, it is characterized in that, the alligatoring of described metallic substrate surfaces is to adopt sand-blast to form, and the sandblast that described sand-blast adopts is any one in copper ore, quartz sand, diamond dust, iron sand, SEMEN AMOMI LONGILIGULA, plastic pellet.
3. metal base printed circuit board according to claim 1, is characterized in that, the roughness of the coarse surface of described metal substrate is 100 microns-150 microns.
4. metal base printed circuit board according to claim 2, is characterized in that, described sand-blast adopts 12080,100,120,150 purpose sandblasts.
5. metal base printed circuit board according to claim 1, is characterized in that, described metal substrate is aluminium base or copper base, and described printed circuit board (PCB) is any one or the multiple combination in individual layer, multilayer, single face, double-sided printed-circuit board.
6. metal base printed circuit board according to claim 1, is characterized in that, described adhesive layer is prepreg.
7. metal base printed circuit board according to claim 1, is characterized in that, described printed circuit board (PCB) is the printed circuit board (PCB) of glass-fiber-plate base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220181860 CN202998655U (en) | 2012-04-25 | 2012-04-25 | Metal-base printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220181860 CN202998655U (en) | 2012-04-25 | 2012-04-25 | Metal-base printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202998655U true CN202998655U (en) | 2013-06-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220181860 Expired - Lifetime CN202998655U (en) | 2012-04-25 | 2012-04-25 | Metal-base printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202998655U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647861A (en) * | 2012-04-25 | 2012-08-22 | 梅州市志浩电子科技有限公司 | Metal-core printed circuit board and manufacturing method thereof |
| CN105925982A (en) * | 2016-05-30 | 2016-09-07 | 苏州安洁科技股份有限公司 | Etching solution used for preparing aluminum double-sided special-shaped circuit board |
| CN117241496A (en) * | 2023-11-15 | 2023-12-15 | 东莞市智杰电子科技有限公司 | PCB soft board processing thermosetting equipment |
-
2012
- 2012-04-25 CN CN 201220181860 patent/CN202998655U/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102647861A (en) * | 2012-04-25 | 2012-08-22 | 梅州市志浩电子科技有限公司 | Metal-core printed circuit board and manufacturing method thereof |
| CN105925982A (en) * | 2016-05-30 | 2016-09-07 | 苏州安洁科技股份有限公司 | Etching solution used for preparing aluminum double-sided special-shaped circuit board |
| CN105925982B (en) * | 2016-05-30 | 2018-07-06 | 苏州安洁科技股份有限公司 | A kind of etching solution for being used to prepare the two-sided Special-shaped circuit board of aluminium |
| CN117241496A (en) * | 2023-11-15 | 2023-12-15 | 东莞市智杰电子科技有限公司 | PCB soft board processing thermosetting equipment |
| CN117241496B (en) * | 2023-11-15 | 2024-02-20 | 东莞市智杰电子科技有限公司 | PCB soft board processing thermosetting equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130612 |