CN103429013A - Multi-layer printed wiring board and manufacturing method thereof - Google Patents
Multi-layer printed wiring board and manufacturing method thereof Download PDFInfo
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- CN103429013A CN103429013A CN2012101527107A CN201210152710A CN103429013A CN 103429013 A CN103429013 A CN 103429013A CN 2012101527107 A CN2012101527107 A CN 2012101527107A CN 201210152710 A CN201210152710 A CN 201210152710A CN 103429013 A CN103429013 A CN 103429013A
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Abstract
The invention discloses a manufacturing method of a multi-layer printed wiring board. The multi-layer printed wiring board comprises core boards and insulation layer plates, wherein the core boards and the insulation layer plates are arranged in a spaced mode. The method includes the steps of firstly, determining the structural difference between the two layers of core boards symmetrical about a point in terms of the layer number of the multi-layer printed wiring board to be manufactured; secondly, conducting selection of the composition of the two layers of insulation layer plates adjacent to the two layers of core boards respectively according to the structural difference between the two layers of core boards; thirdly, manufacturing the multi-layer printed wiring board through the core boards and the selected insulation layer plates. According to the method, the structural difference and the stress difference between the core boards caused by partially-mixed high-frequency materials and the like are balanced through the difference between asymmetrical insulation layers, therefore, the plate warping problem of the multi-layer printed wring board caused by the structural difference and the stress difference is solved, and the quality of the multi-layer printed wiring layer is improved.
Description
Technical field
The present invention relates to the multilayer printed wiring board technical field, particularly a kind of manufacture method of multilayer printed wiring board and multilayer printed wiring board.
Background technology
Making for multilayer printed wiring board, need to do symmetric design for joining this structure in industry at present, the type that is prepreg (claiming again PP sheet or prepreg) in upper and lower central layer consistency of thickness and corresponding insulating laminated plate is consistent, below consult Fig. 1 the design philosophy of symmetric design is described, figure 1 illustrates the wiring board that the total number of plies of line layer is the n layer, wherein, L1 refers to the 1st sandwich circuit layer, Ln refers to ground n sandwich circuit layer, layer between line layer and line layer is central layer or insulating laminated plate, for example, the L1/2 layer is the central layer between the 1st sandwich circuit layer and the 2nd sandwich circuit layer, the L2/3 layer is the insulating laminated plate between the 2nd sandwich circuit layer and the 3rd sandwich circuit layer.According to the symmetric design requirement, the L1/2 layer is identical with the thickness of Ln-1/n layer central layer (core).Be all for example 0.2mm, the L2/3 layer is identical with thickness with prepreg type in Ln-2/n-1 layer insulating plate.For example, all adopt the prepreg of two-layer 2116 types, the rest may be inferred, the consistency of thickness (wherein i is odd number) of Li/ (i+1) layer and L (n-i)/(n+1-i) layer of central layer, and the type consistent (wherein i is even number) of L (i+1)/(i+2) layer and L (n-i-1)/(n-i) layer insulating plate, by such design, make upper and lower central layer and insulating laminated plate to join this structure symmetrical.If upper and lower central layer variable thickness causes or the Type-Inconsistencies of insulating laminated plate, the situation that there will be so plate to stick up.Current being defined as angularity and need meeting and be less than or equal to 7.5% in industry.
In general, for common FR-4 multi-layer sheet, can meet the requirement of angularity by above-mentioned symmetric design.Yet, for local mixed pressure printed wiring board, be difficult to use above-mentioned symmetric design to meet the requirement of angularity.Local mixed pressure printed wiring board is to use high frequency material at multiple-plate certain one deck of common FR-4 or which floor part as required, to reach purpose cost-saving when realizing high-frequency transmission.As shown in Figure 2, partly having used high frequency material RO4350, the material in the central layer of other layers in the L1/2 of the superiors central layer is common FR-4 material.The mixed pressure plate is used the material of at least two kinds of different resins systems, and due to the intensity difference of material own and architectural difference, the whole plate stress of the printed wiring board after mixed pressure can not be offset fully, and the plate that can produce in various degree after lamination sticks up.To the joining after this structure carries out symmetric design of the printed wiring board of local mixed pressure, join this angularity and be greater than 7.5% as stated above, do not meet quality requirements in industry.
In addition, method for current normally used minimizing warpage, comprise the hot pressing drying-plate or manually break straight mode, eliminating plate by the release internal stress in the process that the hot pressing drying-plate dries in heat sticks up, manually breaking straight mode eliminates plate and sticks up by applying external force, can reduce to a certain extent warpage degree, but by the hot pressing drying-plate or manually break the printed wiring board after the Nogata formula is processed, difference due to the wiring board internal structure, in the process of being heated such as wave-soldering etc., thereby the phenomenon that stress difference causes plate to stick up can appear again, therefore, above-mentioned by the hot pressing drying-plate or manually break straight method and can't solve the problem that plate stick up from root.
Summary of the invention
The invention provides a kind of manufacture method and multilayer printed wiring board of multilayer printed wiring board, for the plate that solves the multilayer printed wiring board that prior art causes due to the reason such as the mixed high frequency material processed in part, stick up problem.
For achieving the above object, the invention provides a kind of manufacture method of multilayer printed wiring board, described multilayer printed wiring board comprises spaced central layer and insulating laminated plate, and described method comprises:
1) multilayer printed wiring board of determining required making on the number of plies about the architectural difference between centrosymmetric two-layer central layer;
2) according to the architectural difference between described two-layer central layer, formation to adjacent with described two-layer central layer respectively dielectric layers plate is selected so that because of the stress that produces on the multilayer printed wiring board of architectural difference after making between described two-layer central layer can partial offset or all offset;
3) utilize described central layer and selected insulating laminated plate to make multilayer printed wiring board.
Preferably, in step 1), the architectural difference between two-layer central layer comprises:
The difference of two-layer central layer on material; And/or,
Difference on the type of the prepreg adopted in two-layer central layer; And/or,
The difference of two-layer central layer on thickness; And/or,
Fluting and unslotted on another central layer on a central layer in two-layer central layer; And/or,
The difference of two-layer central layer on the size of fluting; And/or,
Chimeric on a central layer in two-layer central layer have the abaculus different from this central layer material, and not chimeric abaculus on another central layer; And/or,
Difference on two-layer central layer on the size of chimeric abaculus; And/or,
Difference on two-layer central layer on the material of chimeric abaculus.
Preferably, described two-layer central layer is respectively the first central layer and the second central layer, and described dielectric layers plate is respectively first insulating laminated plate adjacent with the first central layer, and second insulating laminated plate adjacent with the second central layer,
In step 2) in, according to the architectural difference between described two-layer central layer, the method that the formation of adjacent with described two-layer central layer respectively dielectric layers plate is selected is as follows:
According to the architectural difference between the first central layer and the second central layer, make between the first insulating laminated plate and the second insulating laminated plate and there is identical architectural difference; Or,
Judge the magnitude relationship of intensity between two-layer central layer according to the architectural difference between the first central layer and the second central layer, if the intensity of the first central layer is greater than the intensity of the second central layer, the formation of dielectric layers plate is selected so that the intensity of the first insulating laminated plate is greater than the intensity of the second insulating laminated plate; If the intensity of the first central layer is less than the intensity of the second central layer, the formation of dielectric layers plate is selected so that the intensity of first insulating laminated plate adjacent with the first central layer is less than the intensity of second insulating laminated plate adjacent with the second central layer.
Preferably, the described formation to the dielectric layers plate is selected to be specially: the prepreg that the dielectric layers plate is adopted is selected; Thereby make the difference between the first difference and the second difference be less than predetermined value; Wherein, the first difference is the difference between the intensity of the intensity of the first central layer and the second central layer, and the second difference is the difference between the intensity of the intensity of the first insulating laminated plate and the second insulating laminated plate.
Preferably, prepreg is selected to comprise the type of selecting prepreg and/or the resin content of definite prepreg.
Preferably, the insulating laminated plate adjacent with two-layer central layer is specially respectively:
Adjacent with two-layer central layer and near the insulating laminated plate of multilayer printed wiring board center one side respectively;
Or, adjacent with two-layer central layer and near the insulating laminated plate of multilayer printed wiring board surface one side respectively.
Preferably, after step 3), also comprise, according to the angularity of the test plate (panel) of the multilayer printed wiring board of making, adjust the formation of the insulating laminated plate adjacent with two-layer central layer.
For achieving the above object, the present invention also provides a kind of multilayer printed wiring board, it is characterized in that, if on the number of plies about between centrosymmetric two-layer central layer, having architectural difference, have corresponding architectural difference between the dielectric layers plate adjacent with two-layer central layer respectively.
Preferably, described two-layer central layer is respectively the first central layer and the second central layer, wherein, the intensity of the first central layer is greater than the intensity of the second central layer, and the intensity of first insulating laminated plate adjacent with the first central layer is greater than the intensity of second insulating laminated plate adjacent with the second central layer; Or the intensity of the first central layer is less than the intensity of the second central layer, and the intensity of first insulating laminated plate adjacent with the first central layer is less than the intensity of second insulating laminated plate adjacent with the second central layer.
For achieving the above object, the present invention also provides the multilayer printed wiring board of making according to above-mentioned arbitrary described method.
The present invention has following beneficial effect:
In technical scheme of the present invention, according to the difference between central layer, select the prepreg of adjacent insulating laminated plate, thereby the characteristic based on prepreg, by selecting different prepregs to form asymmetrical insulating barrier, thereby utilize difference between asymmetrical insulating barrier to come structure between central layer that balance brings due to reasons such as the mixed high frequency material processed in part and the difference of stress, stick up problem thereby overcome in the multilayer printed wiring board plate caused due to said structure and stress difference, improved the quality of multilayer printed wiring board.
The accompanying drawing explanation
Fig. 1 carries out the schematic diagram of symmetric design to multilayer printed wiring board in prior art;
Fig. 2 is the mixed structural representation of having made the multilayer printed wiring board of high frequency material in prior art;
The flow chart of the manufacture method of the multilayer printed wiring board that Fig. 3 provides for the embodiment of the present invention one;
The flow chart of the manufacture method of the multilayer printed wiring board that Fig. 4 provides for the embodiment of the present invention two.
Embodiment
For making those skilled in the art understand better technical scheme of the present invention, below in conjunction with accompanying drawing, multilayer printed wiring board manufacture method provided by the invention and multilayer printed wiring board are described in detail.
At first prepreg is simply introduced, prepreg claims again " PP sheet " or " prepreg ", be one of main material during multilayer printed wiring board is produced, mainly be comprised of resin and reinforcing material, reinforcing material is divided into again the several types such as glass-fiber-fabric, paper substrate, composite material.The prepreg that multilayer printed wiring board is used adopts glass fabric to do reinforcing material mostly, resin adhesive liquid on treated glass fabric dipping, the sheeting of making through the heat treatment preliminary drying again is called prepreg, the material that now resin in prepreg is semi-harden B-stage, it adds in heating, and depress can be softening, can reaction be cured as the material of C-stage after cooling.Prepreg is for the connection-core flaggy and insulation is provided, to form a basic multilayer printed wiring board.In forming the process of multilayer printed wiring board, the type that thickness of insulating layer, internal layer copper are thick by considering, resin content, each layer of remaining copper area of internal layer and the factor such as symmetrical are selected prepreg.Three kinds of main character of prepreg are flow adhesive (Resin Flow), gel time (Gel time) and glue content (Resin Content) (being resin content).According to the model of glass-fiber-fabric in prepreg, distinguish, the modal model of prepreg has respectively 7628,1506,2116,1080,106 etc.The prepreg of each type has different thickness and resin content.
One of core idea of the present invention is, for multilayer printed wiring board, the present invention no longer adopts of the prior art after carrying out symmetric design, utilize the hot pressing drying-plate or manually break straight mode and reduce the mode that plate sticks up, and be based on the characteristic of prepreg, by selecting different prepregs to form asymmetrical insulating barrier, utilize difference between insulating barrier to come structure between central layer that balance brings due to reasons such as the mixed high frequency material processed in part and the difference of stress, thereby overcome in the multilayer printed wiring board plate caused due to the stress difference produced such as the mixed reason of having made high frequency material in part and stuck up problem, improved the quality of multilayer printed wiring board.
Embodiment mono-
The present invention proposes a kind of manufacture method of multilayer printed wiring board.
As shown in Figure 3, show the manufacture method of a kind of multilayer printed wiring board that the embodiment of the present invention one provides, be applied in the design and production process of multilayer printed wiring board, thereby the plate of controlling multilayer printed wiring board sticks up problem, the method comprises:
In embodiments of the present invention, according on the number of plies about the architectural difference on centrosymmetric central layer, form asymmetrical insulating barrier, asymmetrical insulating barrier can produce different shrinkage stresses in the process of hot curing, thereby the different shrinkage stress that balance causes due to the architectural difference of central layer, utilize different insulating barriers come core plate structure that balance is different and and the difference of stress, stick up problem thereby overcome the plate that causes stress difference due to reasons such as the mixed high frequency material processed in part in the multilayer printed wiring board and cause, improved the quality of multilayer printed wiring board.
Embodiment bis-
Illustrate that below by a more detailed embodiment the present invention proposes the manufacture method of multilayer printed wiring board.
As shown in Figure 4, show the manufacture method of a kind of multilayer printed wiring board that the embodiment of the present invention two provides, be applied to, in the design and production process of multilayer printed wiring board, stick up with control board, the method comprises:
Wherein, on the number of plies, about centrosymmetric central layer, refer in multilayer printed wiring board, its number of plies is about the centrosymmetric central layer of multilayer printed wiring board, for example, wiring board for 8 layers, its L1/2 layer, L3/4 layer, L5/6 layer, L7/8 layer are central layer, and wherein L1/2 layer central layer and L7/8 layer central layer are central layers symmetrical on the number of plies, and L3/4 layer central layer and L5/6 layer central layer are central layers symmetrical on the number of plies.
Architectural difference between central layer comprises the architectural difference that makes central layer produce Strength Changes.Architectural difference between two-layer central layer includes but not limited to: the difference of two-layer central layer on material; And/or the difference on the type of the prepreg adopted in two-layer central layer; And/or the difference of two-layer central layer on thickness; And/or fluting and unslotted on another central layer on a central layer in two-layer central layer; And/or the difference of two-layer central layer on the size of fluting; And/or chimeric on a central layer in two-layer central layer the abaculus different from this central layer material arranged, and not chimeric abaculus on another central layer; And/or the difference on the size of chimeric abaculus on two-layer central layer; And/or the difference on the material of chimeric abaculus on two-layer central layer.
In the making of multilayer printed wiring board, due to the difference on each layer of central layer intensity, cause in the process of hot curing and produce different stress, the imbalance between each ply stress will cause plate to stick up.For example, when central layer is provided with groove milling, the intensity of central layer reduces along with the increase of groove milling opening on central layer, and/or increases along with the increase of the resin content in the prepreg that forms central layer, and/or increases along with the increase of central layer thickness.The factor that affects central layer intensity is not limited to the above-mentioned factor listed, and also can use other to make central layer produce the factor of Strength Changes.
Therefore, can be according to the type of the prepreg that forms central layer and/or the resin content in sheet number and/or prepreg, determine the difference between central layer symmetrical on the number of plies, for example, in 8 layers of printed wiring board, if L1/2 layer central layer is comprised of 2 2116 type prepregs, L7/8 layer central layer is by 3 1080 type prepregs, and the resin content of above-mentioned 2116 type prepregs and 1080 type prepregs is respectively A or B, the parameter such as the above-mentioned type and resin content all can cause the difference of central layer intensity, therefore can use above-mentioned parameter to be used as the architectural difference between L1/2 layer central layer and L7/8 layer central layer.In addition, if one or two mixed pressure on the number of plies in symmetrical central layer high frequency material, described high frequency material embeds in this central layer by the groove milling of offering on central layer, and the intensity of central layer can be along with mixed pressure in central layer high frequency material groove milling opening increase and reduce, thereby can consider the architectural difference between two central layers according to the size of the opening of groove milling on central layer.Said structure difference can be definite parameter, the type of prepreg for example, and resin content, sheet numbers etc., can be also the determined difference affected on intensity of factor according to openings of sizes as groove milling and so on.
Required prepreg is selected.
Wherein, the dielectric layers plate adjacent with central layer on the number of plies about Central Symmetry, and the dielectric layers plate is adjacent with two-layer central layer and near the insulating laminated plate of multilayer printed wiring board center one side respectively, can be also perhaps adjacent with two-layer central layer and near the insulating laminated plate of multilayer printed wiring board surface one side respectively, or respectively near center one side with near the dielectric layers plate of a surperficial side.For example, for the L1/2 layer central layer in 8 layers of printed wiring board and L7/8 layer central layer, its adjacent insulating laminated plate is respectively L2/3 layer insulating plate and L6/7 layer insulating plate.The dielectric layers plate adjacent with central layer preferably adopts the dielectric layers plate near multilayer printed wiring board center one side.Yet, in some cases, in the situation of the dielectric layers plate that can't select simultaneously close center one side, can select the dielectric layers plate of adjacent with a two-layer central layer and close surperficial side respectively.For example, for the L3/4 layer central layer in 8 layers of printed wiring board and L5/6 layer central layer, due to adjacent with this two-layer central layer and be only one deck near the insulating laminated plate of center one side, be the L4/5 layer, can select L2/3 insulating laminated plate and L6/7 layer insulating plate as adjacent with L5/6 layer central layer with L3/4 layer central layer respectively dielectric layers plate.
Wherein, it can be specifically that prepreg to forming insulating laminated plate is selected that the formation of dielectric layers plate is selected, can to the prepreg that forms insulating laminated plate, be selected according to following principle, wherein, setting is called the first central layer and the second central layer about centrosymmetric two-layer central layer, with the first central layer and the second central layer respectively adjacent dielectric layers plate be called the first insulating laminated plate and the second insulating laminated plate, , if the intensity of the first central layer is greater than the intensity of the second central layer, prepreg is selected so that the intensity of first insulating laminated plate adjacent with the first central layer is greater than the intensity of second insulating laminated plate adjacent with the second central layer, if the intensity of the first central layer is less than the intensity of the second central layer, prepreg is selected so that the intensity of first insulating laminated plate adjacent with the first central layer is less than the intensity of second insulating laminated plate adjacent with the second central layer.
Optionally, for the degree of proof stress balance and make stress reach as much as possible balance, need to make the strength difference between the first insulating laminated plate and the second insulating laminated plate approach as much as possible the strength difference between the first central layer and the second central layer.For example, degree for the proof stress balance, can set a predetermined value delta, for the first insulating laminated plate of making selection with the difference delta2 between the second insulating laminated plate equals as much as possible or close to the difference delta1 between the first central layer and the second central layer, the dielectric layers plate is selected, made its absolute value that meets delta1-delta2 be less than or equal to predetermined value delta.Therefore by the setting of predetermined value delta, precision that can the proof stress balance, it is less that predetermined value delta arranges, and the effect of stress equilibrium is better.
Below can to said process, describe by two concrete examples:
Example 1:
In 8 layers of printed wiring board, if L1/2 layer central layer is comprised of 2 2116 type prepregs, L7/8 layer central layer is comprised of 3 1080 type prepregs, and the resin content of above-mentioned 2116 type prepregs and 108 type prepregs is respectively A and B, A is not equal to B, so, for the L2/3 insulating laminated plate adjacent with L1/2 layer central layer, 2 2116 type prepregs that can to select by resin content be A form, for the L6/7 insulating laminated plate adjacent with L7/8 layer central layer, 3 1080 type prepregs that can to select by resin content be B form.By such selection, make strength difference between insulating laminated plate equal or two-layer central layer between strength difference, thereby reach the balance of stress.
Example 2:
Take 8 sandwich circuit boards equally as example, and L1/2 layer central layer and L7/8 layer central layer are formed by identical prepreg, but on L1/2 layer central layer in 1/3 area mixed pressure high frequency material.According to the architectural difference between L1/2 layer central layer and L7/8 layer central layer, can determine that the intensity of L1/2 layer central layer is less than the intensity of L7/8 layer central layer, therefore need to make the intensity of L2/3 layer insulating plate be less than the intensity of L6/7 layer insulating plate.Therefore, can at first for the dielectric layers plate, select the type of prepreg, then select the resin content of prepreg, to meet above-mentioned requirement of strength.Selection course below with reference to the parameter list prepreg of the prepreg shown in table 1 describes.Wherein in table 1, take resin content and the pressing thickness of prepreg as having exemplified dissimilar prepreg of S0401 of 100% residual copper rate.
Table 1 is about the resin content of dissimilar prepreg and the parameter list of pressing thickness
For the intensity that meets L2/3 layer insulating plate is less than the intensity of L6/7 layer insulating plate, need to select the prepreg that resin content is lower to form the L2/3 layer insulating, select the prepreg that resin content is higher to form the L6/7 layer insulating, because there is higher intensity than the prepreg of high resin content, the shrinkage stress of prepreg determines according to its resin content simultaneously, resin content is higher, and its shrinkage stress produced when hot curing is just larger.Therefore, the resin content in reference table 1, for L2/3 layer insulating plate, 2 2116 type prepregs can be adopted, for L6/7 layer insulating plate, 3 1080 type prepregs can be adopted, when meeting requirement of strength, make the thickness of dielectric layers plate more consistent like this.After determining the type of prepreg, can further adjust as required the resin content of prepreg, the intensity of the higher prepreg of resin content is larger.For example, account for 1/3 o'clock of area of whole core version in the high frequency material of the local mixed pressure of L1/2 layer central layer, can so that the resin content correlation formula of the prepreg in L2/3 layer and L6/7 layer insulating plate be: the resin content of the prepreg of B >=A+12(A:L2/3 layer, the resin content of the prepreg of B:L6/7 layer).By such selection, make difference between insulating laminated plate equal or two-layer central layer between difference, thereby reach the balance of stress.Concrete, for the relation between the prepreg resin content difference in the difference of the high frequency material of mixed pressure in the two-layer central layer difference of groove milling openings of sizes (or in two-layer central layer) and two kinds of insulating barriers, can determine according to the test plate (panel) process in making, and form empirical value.In the embodiment of the present invention, select 2116 type prepregs and 1080 type prepregs to form insulating laminated plate only as the example explanation, also can select the prepreg of other types, as long as meet the requirement of above-mentioned intensity.In addition, table 1 is only as example, and the parameter of the prepreg of each type is along with the different prepreg products that different manufacturers provides can change.
In above-mentioned two concrete examples, by the selection to the insulating laminated plate prepreg, the stress that makes the prepreg of L2/3 layer produce in curing process and the stress equilibrium of L1/2 layer central layer, the stress equilibrium of the stress that the prepreg of L6/7 layer produces in curing process and L7/8 layer central layer, thereby reach the balance of stress on the whole, from root, solve the problem that plate sticks up.
By above-mentioned steps 401 and step 402, to about Central Symmetry and the two-layer central layer that there are differences, having carried out the processing of equilibrium stress.Optionally, above-mentioned selection course is a preliminary definite process, in actual production, can tentatively make test plate (panel) according to the result of initial option and follow-up correlation step, and, according to the warpage situation of test plate (panel), proceeds further adjustment.
Optionally, comprise step 403, whether judgement also has other about there are differences between centrosymmetric two-layer central layer in multilayer printed wiring board, if having, repeating step 401 to 402; If there is no other about there are differences between centrosymmetric two-layer central layer, continue next step.
Preferably, step 405, according to the angularity of the test plate (panel) of the multilayer printed wiring board of making, further adjust prepreg in insulating laminated plate.
If the angularity of the multilayer printed wiring board of making is still larger, can adjusts prepreg type and/or resin content, thereby complete further adjustment.
In the present embodiment, can be for carry out the balance of stress all about Central Symmetry and the two-layer central layer that there are differences, namely for this two-layer central layer, for example carry out in step 401 and step 402, but also can carry out a judgement to the difference of two-layer central layer, when it differs greatly, it is carried out to the equilibrium stress processing, when its difference hour, skip stress equilibrium and process.
In sum, the outstanding feature that this method is different from prior art is, no longer adopt of the prior art after carrying out symmetric design, utilize the hot pressing drying-plate or manually break straight mode and reduce the mode that plate sticks up, but according on the number of plies about the difference of intensity on centrosymmetric central layer, select different prepregs to form asymmetrical insulating barrier, utilize different insulating barriers come core plate structure that balance is different and and the difference of stress, thereby overcome the plate that causes stress difference due to reasons such as the mixed high frequency material processed in part in the multilayer printed wiring board and cause and stuck up problem, improved the quality of multilayer printed wiring board.
Below in conjunction with concrete application scenarios, the multilayer printed wiring board making flow process that the embodiment of the present invention provides is described.Total number of plies of supposing the printed wiring layer of printed wiring board is n, n for example is more than or equal to 5(, if n is 4, between two-layer central layer, only has one deck insulating laminated plate, therefore can not carry out the difference between balance L1/2 layer central layer and L3/4 layer central layer by the difference of insulating laminated plate), the method for the present embodiment comprises:
Step 1: determine the intensity of L1/2 layer central layer and the difference between Ln-1/n layer central layer.
In general, in order to guarantee as far as possible the symmetry of L1/2 layer central layer and Ln-1/n layer central layer, can select the central layer of consistency of thickness, if variable thickness causes, can be by empirical value or the impact that intensity is produced of the difference of measuring by experiment the thickness between L1/2 layer central layer and Ln-1/n layer central layer.Same, can determine the strength difference that the fluting size of L1/2 layer central layer and the groove milling of Ln-1/n layer central layer causes by empirical value or concrete method for measuring.Its assay method is that those skilled in the art can both know, and is not described in detail here.And, according to the strength difference between definite central layer, determine the difference size between the formation of dielectric layers version, thereby the above-mentioned strength difference of balance.For the architectural difference little to intensity effect, can be not considered, if there is in addition various structures difference, the impact that can produce intensity according to it considers.
Step 2: according to the difference between the intensity of the intensity of L1/2 layer central layer and Ln-1/n layer central layer, to L2/3 layer insulating plate and Ln-2/Ln-1 layer insulating plate in prepreg selected.
Step 3: the difference between the intensity of the definite L3/4 layer central layer of continuation and the intensity of Ln-3/n-2 layer central layer, if not there are differences between two-layer central layer, can select so to make L4/5 layer insulating plate and Ln-4/Ln-3 layer insulating plate by the prepreg of same type and resin content.If there are differences between two-layer central layer, so according to the difference between central layer, the prepreg in L4/5 layer insulating plate and Ln-4/Ln-3 layer insulating plate is selected.
Step 4, if also have other about there are differences between centrosymmetric two-layer central layer, the prepreg of the insulating laminated plate that continuation is adjacent to it is selected, until, by the selection of adjacent insulating laminated plate, make all central layers symmetrical on the number of plies reach the balance of stress.
Step 5: according to the prepreg that each insulating laminated plate is selected, form test plate (panel), and, according to the evenness result of test plate (panel), the resin content of prepreg is adjusted.
In the present embodiment, according on the number of plies about the difference of intensity on centrosymmetric central layer, select different prepregs to form asymmetrical insulating laminated plate, utilize different insulating laminated plates come core plate structure that balance is different and and the difference of stress, stick up problem thereby overcome the plate that causes stress difference due to reasons such as the mixed high frequency material processed in part in the multilayer printed wiring board and cause, improved the quality of multilayer printed wiring board.
In the present invention, can select as the case may be the insulating laminated plate adjacent with central layer, for example, in 8 layers of central layer, if any one in L1/2 layer central layer and L7/8 layer central layer has groove milling, the selection of the prepreg of L2/3 layer insulating plate and L6/7 layer insulating plate adjusted accordingly, thus the stress difference between balance L1/2 layer central layer and L7/8 layer central layer.If L1/2 layer central layer and L7/8 layer core plate structure are identical, but any one in L3/4 layer central layer and L5/6 layer central layer has groove milling, owing between L3/4 layer central layer and L5/6 layer central layer, only having one deck insulating laminated plate, therefore can select respectively the insulating laminated plate insulating laminated plate adjacent as it in L3/4 layer central layer and the L5/6 layer central layer outside, still the prepreg of L2/3 layer insulating plate and L6/7 layer insulating plate is designed, with the stress difference of balance L3/4 layer central layer and L5/6 layer central layer.
Embodiment tri-
Design based on identical or similar with said method embodiment, the embodiment of the present invention three provides a kind of multilayer printed wiring board, in this multilayer printed wiring board, if about there are differences between centrosymmetric two-layer central layer, have corresponding difference between the dielectric layers plate adjacent with two-layer central layer respectively on the number of plies.
Wherein, for the first central layer and the second central layer symmetrical on the number of plies, if the intensity of the first central layer is greater than the intensity of the second central layer, prepreg is selected so that the intensity of first insulating laminated plate adjacent with the first central layer is greater than the intensity of second insulating laminated plate adjacent with the second central layer; If the intensity of the first central layer is less than the intensity of the second central layer, prepreg is selected so that the intensity of first insulating laminated plate adjacent with the first central layer is less than the intensity of second insulating laminated plate adjacent with the second central layer.
Wherein, if the difference between the intensity of the intensity of the first central layer and the second central layer is the first difference, difference between the intensity of the intensity of the first insulating laminated plate and the second insulating laminated plate is the second difference, and so, the absolute value of the difference between the first difference and the second difference is less than predetermined value.
Wherein, the dielectric layers plate adjacent with two-layer central layer can be adjacent with two-layer central layer and near the insulating laminated plate of multilayer printed wiring board center one side respectively; Or, adjacent with two-layer central layer and near the insulating laminated plate of multilayer printed wiring board surface one side respectively.
The multilayer printed wiring board that the embodiment of the present invention provides can be the multilayer printed wiring board of making according to the multilayer printed wiring board manufacture method in said method embodiment.
Be understandable that, above execution mode is only the illustrative embodiments adopted for principle of the present invention is described, yet the present invention is not limited thereto.For those skilled in the art, without departing from the spirit and substance in the present invention, can make various modification and improvement, these modification and improvement also are considered as protection scope of the present invention.
Claims (10)
1. the manufacture method of a multilayer printed wiring board, described multilayer printed wiring board comprises spaced central layer and insulating laminated plate, it is characterized in that, described method comprises:
1) multilayer printed wiring board of determining required making on the number of plies about the architectural difference between centrosymmetric two-layer central layer;
2) according to the architectural difference between described two-layer central layer, formation to adjacent with described two-layer central layer respectively dielectric layers plate is selected so that because of the stress that produces on the multilayer printed wiring board of architectural difference after making between described two-layer central layer can partial offset or all offset;
3) utilize described central layer and selected insulating laminated plate to make multilayer printed wiring board.
2. method according to claim 1, is characterized in that, in step 1), the architectural difference between two-layer central layer comprises:
The difference of two-layer central layer on material; And/or,
Difference on the type of the prepreg adopted in two-layer central layer; And/or,
The difference of two-layer central layer on thickness; And/or,
Fluting and unslotted on another central layer on a central layer in two-layer central layer; And/or,
The difference of two-layer central layer on the size of fluting; And/or,
Chimeric on a central layer in two-layer central layer have the abaculus different from this central layer material, and not chimeric abaculus on another central layer; And/or,
Difference on two-layer central layer on the size of chimeric abaculus; And/or,
Difference on two-layer central layer on the material of chimeric abaculus.
3. according to the method described in claim 1, it is characterized in that, described two-layer central layer is respectively the first central layer and the second central layer, and described dielectric layers plate is respectively first insulating laminated plate adjacent with the first central layer, and second insulating laminated plate adjacent with the second central layer
In step 2) in, according to the architectural difference between described two-layer central layer, the method that the formation of adjacent with described two-layer central layer respectively dielectric layers plate is selected is as follows:
According to the architectural difference between the first central layer and the second central layer, make between the first insulating laminated plate and the second insulating laminated plate and there is identical architectural difference; Or,
Judge the magnitude relationship of intensity between two-layer central layer according to the architectural difference between the first central layer and the second central layer, if the intensity of the first central layer is greater than the intensity of the second central layer, the formation of dielectric layers plate is selected so that the intensity of the first insulating laminated plate is greater than the intensity of the second insulating laminated plate; If the intensity of the first central layer is less than the intensity of the second central layer, the formation of dielectric layers plate is selected so that the intensity of first insulating laminated plate adjacent with the first central layer is less than the intensity of second insulating laminated plate adjacent with the second central layer.
4. method according to claim 3, is characterized in that, the described formation to the dielectric layers plate is selected to be specially: the prepreg that the dielectric layers plate is adopted is selected; Thereby make the difference between the first difference and the second difference be less than predetermined value; Wherein, the first difference is the difference between the intensity of the intensity of the first central layer and the second central layer, and the second difference is the difference between the intensity of the intensity of the first insulating laminated plate and the second insulating laminated plate.
5. method according to claim 4, is characterized in that, prepreg is selected to comprise the type of selecting prepreg and/or the resin content of definite prepreg.
6. according to the described method of any one in claim 1 to 5, it is characterized in that, the insulating laminated plate adjacent with two-layer central layer is specially respectively:
Adjacent with two-layer central layer and near the insulating laminated plate of multilayer printed wiring board center one side respectively;
Or, adjacent with two-layer central layer and near the insulating laminated plate of multilayer printed wiring board surface one side respectively.
7. according to the described method of claim 1 to 5 any one, it is characterized in that, also comprise after step 3), according to the angularity of the test plate (panel) of the multilayer printed wiring board of making, adjust the formation of the insulating laminated plate adjacent with two-layer central layer.
8. a multilayer printed wiring board, is characterized in that, if on the number of plies about between centrosymmetric two-layer central layer, having architectural difference, have corresponding architectural difference between the dielectric layers plate adjacent with two-layer central layer respectively.
9. multilayer printed wiring board according to claim 8, is characterized in that,
Described two-layer central layer is respectively the first central layer and the second central layer,
Wherein, the intensity of the first central layer is greater than the intensity of the second central layer, and the intensity of first insulating laminated plate adjacent with the first central layer is greater than the intensity of second insulating laminated plate adjacent with the second central layer; Or the intensity of the first central layer is less than the intensity of the second central layer, and the intensity of first insulating laminated plate adjacent with the first central layer is less than the intensity of second insulating laminated plate adjacent with the second central layer.
10. according to method is made as described in any one in claim 1 to 7 multilayer printed wiring board.
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| CN201210152710.7A CN103429013B (en) | 2012-05-16 | 2012-05-16 | Multilayer printed wiring board and preparation method thereof |
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| CN109041460A (en) * | 2018-10-18 | 2018-12-18 | 莆田市涵江区依吨多层电路有限公司 | A kind of control method that multi-layer PCB board module product plate is stuck up |
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| CN103429013B (en) | 2016-05-18 |
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Effective date of registration: 20220621 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. Address before: 100871, Beijing, Haidian District, Cheng Fu Road, No. 298, Zhongguancun Fangzheng building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. MULTILAYER PCB Co.,Ltd. |
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