CN113891584A - Manufacturing method of copper block-embedded PCB - Google Patents
Manufacturing method of copper block-embedded PCB Download PDFInfo
- Publication number
- CN113891584A CN113891584A CN202111148994.8A CN202111148994A CN113891584A CN 113891584 A CN113891584 A CN 113891584A CN 202111148994 A CN202111148994 A CN 202111148994A CN 113891584 A CN113891584 A CN 113891584A
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- China
- Prior art keywords
- film
- placing
- substrate
- steel plate
- aluminum sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 28
- 239000010949 copper Substances 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 28
- 239000010959 steel Substances 0.000 claims abstract description 28
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 24
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000002655 kraft paper Substances 0.000 claims abstract description 16
- 238000003825 pressing Methods 0.000 claims abstract description 13
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 4
- 230000007480 spreading Effects 0.000 claims description 3
- 238000003892 spreading Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 11
- 230000008569 process Effects 0.000 abstract description 11
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a method for manufacturing a PCB (printed circuit board) with a copper block embedded, which comprises the following steps of: placing a plurality of first kraft papers on a tray of a press; horizontally placing a first steel plate on a plurality of first kraft papers; horizontally placing a first aluminum sheet on a first steel plate; flatly paving a first PI film on a first aluminum sheet; placing the riveted substrate on a first PI film; placing the browned copper blocks into a preset groove on a substrate; placing a second PI film on the substrate; a second aluminum sheet is horizontally placed on the second PI film; a second steel plate is horizontally placed on the second aluminum sheet; placing a plurality of second kraft papers on the second steel plate; and pressing through a press. According to the manufacturing method of the PCB with the embedded copper blocks, the PI film can completely seal the gap between the copper blocks and the substrate due to the self-covering property in the laminating process, so that pp glue is prevented from overflowing outwards, and the product reliability risk caused by the fact that the pp glue flows out and remains on the board surface is avoided.
Description
Technical Field
The invention relates to the technical field of PCB manufacturing, in particular to a method for manufacturing a PCB with a copper block embedded.
Background
The production process of the multilayer circuit board needs a pressing process, namely an inner core board and an outer copper foil which are provided with inner circuits are pressed into a whole through a prepreg (also called a PP sheet, which is a sheet-shaped bonding material formed by combining resin and glass fiber cloth) to form a production board with a multilayer structure, and then the production board with the multilayer structure is sequentially subjected to processes of drilling, copper deposition, full-board electroplating, outer circuits, silk-screen solder mask, surface treatment, molding and the like, so that the production of the multilayer circuit board is completed. In the pressing process, generally, a proper core board is selected first to complete the circuit manufacturing of the inner core board, then the copper foil, the PP sheet, the inner core board, the PP sheet and the copper foil are sequentially overlapped and riveted to form a substrate, and then the substrate is pressed by a press.
Along with the continuous promotion of customer to PCB board heat dissipation demand, the circuit board of built-in copper billet receives PCB board manufacturer's more and more attention, and more PCB manufacturers develop the copper product of burying of different grade type. However, in the conventional method for manufacturing the PCB with the copper block embedded therein, the flowing property of the prepreg under high temperature is limited in the pressing process, and after the copper block is embedded and pressed, a layer of pp resin adhesive covers the periphery of the copper block, which cannot be removed in the subsequent process, and the residual resin adhesive affects the reliability of the product. Therefore, a more reliable method for manufacturing the buried copper block PCB is needed.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art. Therefore, the invention provides a manufacturing method of a PCB with a copper block embedded, which can avoid the condition that PP glue overflows in a pressing process.
The manufacturing method of the PCB with the embedded copper blocks comprises the following steps: placing a plurality of first kraft papers on a tray of a press; a first steel plate is horizontally placed on a plurality of first kraft papers; horizontally placing a first aluminum sheet on the first steel plate; spreading a first PI film on the first aluminum sheet; placing the riveted substrate on the first PI film; placing the browned copper blocks into a groove preset on the substrate; placing a second PI film on the substrate; a second aluminum sheet is flatly placed on the second PI film; a second steel plate is horizontally placed on the second aluminum sheet; placing a plurality of second kraft papers on the second steel plate; and pressing through the press.
The manufacturing method of the PCB with the embedded copper blocks, provided by the embodiment of the invention, at least has the following beneficial effects: the PI film can completely seal the gap between the copper block and the substrate due to the self-covering property in the pressing process, and the pp glue is prevented from overflowing outwards, so that the product reliability risk caused by the fact that the pp glue flows out and remains on the plate surface is avoided.
According to some embodiments of the invention, the step of spreading a first PI film on the first aluminum sheet comprises: and after the protective film on the surface of the first PI film is torn off, the PI film is laid on the first aluminum sheet, and the membrane removing surface of the first PI film faces the substrate.
According to some embodiments of the present invention, the placing of the second PI film on the substrate specifically includes: and after the protective film on the surface of the second PI film is torn off, the protective film is flatly paved on the substrate, and the membrane removing surface of the second PI film faces the substrate.
According to some embodiments of the invention, the first PI film and/or the second PI film has a thickness of 48 μm to 52 μm.
According to some embodiments of the invention, the first PI film and/or the second PI film has a thickness of 50 μm.
According to some embodiments of the invention, the first steel plate and/or the second steel plate is a mirror steel plate.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic diagram of a method for manufacturing a copper block-embedded PCB according to an embodiment of the invention;
reference numerals:
the first aluminum sheet 100, the first aluminum sheet 200, the first PI film 300, the substrate 400, the second PI film 500, the second aluminum sheet 600, and the second steel sheet 700.
Detailed Description
Reference will now be made in detail to the present preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.
In the description of the present invention, it should be understood that the orientation or positional relationship referred to in the description of the orientation, such as the upper, lower, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the meaning of a plurality of means is one or more, the meaning of a plurality of means is two or more, and larger, smaller, larger, etc. are understood as excluding the number, and larger, smaller, inner, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present invention, unless otherwise explicitly limited, terms such as arrangement, installation, connection and the like should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific contents of the technical solutions.
As shown in fig. 1, the method for manufacturing a copper-embedded PCB according to an embodiment of the present invention includes the following steps:
(1) a first plurality of kraft papers (not shown) are placed on the pallet of the press.
The specific quantity of the first kraft paper can be set according to actual requirements. The kraft paper plays roles in heat preservation, water absorption, pressure reduction, buffering, heat transfer and the like in the process of pressing the plate, and has the advantages of good hot-pressing elasticity, high smoothness, capability of obviously improving the pressing quality, improving the yield of products and the like.
(2) The first steel plate 100 is laid flat on a plurality of first kraft papers.
After a plurality of first kraft papers are placed, the first steel plate 100 is placed on the first kraft papers, and the first steel plate 100 may be a mirror surface steel plate.
(3) The first aluminum sheet 200 is laid flat on the first steel sheet 100.
(4) A first PI film 300 was laid on the first aluminum sheet 200.
Specifically, the thickness of the first PI film 300 may be in the range of 48 μm to 52 μm, for example, 50 μm. Of course, the thickness of the first PI film 300 may be selected according to actual needs. Among them, the PI film is also called a polyimide film, and has excellent properties of high and low temperature resistance, electrical insulation, adhesion, radiation resistance, dielectric resistance, and the like.
(5) The substrate 400 formed by riveting the core sheet and the PP sheet is placed on the first PI film 300.
Specifically, the first PI film 300 is peeled off the protective film on the surface, and then placed on the first aluminum sheet 200, and then the substrate 400 is placed on the first PI film 300 with the peeled surface of the first PI film 300 facing the substrate 400. The riveting process of the core plate and the PP sheet is well known to those skilled in the art, and therefore, is not described herein.
(6) And placing the browned copper blocks into a preset groove on the substrate 400.
It is understood that the browning of the copper block and the milling of the groove in the substrate 400 for placing the copper block are well known to those skilled in the art, and therefore will not be described herein.
(7) A second PI film 500 is placed on the substrate 400.
Specifically, the protective film on the surface of the second PI film 500 is peeled off and then is laid on the substrate 400, and the peeled surface of the second PI film 500 faces the substrate 400.
(8) A second aluminum sheet 600 was laid flat on the second PI film 500.
(9) The second steel plate 700 is laid flat on the second aluminum sheet 600. The second steel plate 700 may be a mirror-surface steel plate.
(10) A plurality of second kraft papers (not shown) are placed on the second steel plate 700.
(11) And pressing through a press.
After all the materials are placed, the pressing is performed by the normal pressing procedure of the press.
According to the manufacturing method of the PCB with the embedded copper blocks, disclosed by the embodiment of the invention, due to the self-covering property of the PI film in the laminating process, the gap between the copper block and the substrate 400 can be completely closed, and the pp glue is prevented from overflowing outwards, so that the product reliability risk caused by the fact that the pp glue flows out and remains on the board surface is avoided.
The quality of the PCB with the embedded copper blocks depends on the glue overflowing amount of the copper-embedded area after lamination to a great extent, and the PI film is adopted, so that the glue overflowing situation can be greatly reduced. After the PI film is used, the glue overflow of the copper-embedded area can be controlled within 10 mils, and a special glue removing flow is not required to be newly added.
In the description herein, references to the description of "one embodiment," "a further embodiment," "some specific embodiments," or "some examples," etc., mean that a particular feature, structure, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (6)
1. A manufacturing method of a PCB with a copper block embedded is characterized by comprising the following steps:
placing a plurality of first kraft papers on a tray of a press;
a first steel plate is horizontally placed on a plurality of first kraft papers;
horizontally placing a first aluminum sheet on the first steel plate;
spreading a first PI film on the first aluminum sheet;
placing the riveted substrate on the first PI film;
placing the browned copper blocks into a groove preset on the substrate;
placing a second PI film on the substrate;
a second aluminum sheet is flatly placed on the second PI film;
a second steel plate is horizontally placed on the second aluminum sheet;
placing a plurality of second kraft papers on the second steel plate;
and pressing through the press.
2. The method for manufacturing the copper-embedded PCB according to claim 1, wherein the first PI film is laid on the first aluminum sheet, specifically:
and after the protective film on the surface of the first PI film is torn off, the PI film is laid on the first aluminum sheet, and the membrane removing surface of the first PI film faces the substrate.
3. The method for manufacturing the copper-embedded PCB according to claim 2, wherein the second PI film is placed on the substrate, and specifically comprises:
and after the protective film on the surface of the second PI film is torn off, the protective film is flatly paved on the substrate, and the membrane removing surface of the second PI film faces the substrate.
4. The method of fabricating the copper-buried block PCB according to claim 1, 2 or 3, wherein the thickness of the first PI film and/or the second PI film is 48 μm to 52 μm.
5. The method of claim 4, wherein the thickness of the first PI film and/or the second PI film is 50 μm.
6. The method of claim 1, wherein the first steel plate and/or the second steel plate is a mirror steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111148994.8A CN113891584A (en) | 2021-09-28 | 2021-09-28 | Manufacturing method of copper block-embedded PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111148994.8A CN113891584A (en) | 2021-09-28 | 2021-09-28 | Manufacturing method of copper block-embedded PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113891584A true CN113891584A (en) | 2022-01-04 |
Family
ID=79007933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202111148994.8A Pending CN113891584A (en) | 2021-09-28 | 2021-09-28 | Manufacturing method of copper block-embedded PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113891584A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104010453A (en) * | 2014-06-05 | 2014-08-27 | 浙江远大电子开发有限公司 | Vacuum press-fit structure for metal base plate resin hole plugging and resin hole plugging technology of vacuum press-fit structure |
| CN106255350A (en) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | Bury copper coin manufacture method |
| CN110678011A (en) * | 2019-11-12 | 2020-01-10 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex printed circuit board |
-
2021
- 2021-09-28 CN CN202111148994.8A patent/CN113891584A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104010453A (en) * | 2014-06-05 | 2014-08-27 | 浙江远大电子开发有限公司 | Vacuum press-fit structure for metal base plate resin hole plugging and resin hole plugging technology of vacuum press-fit structure |
| CN106255350A (en) * | 2016-08-18 | 2016-12-21 | 东莞市五株电子科技有限公司 | Bury copper coin manufacture method |
| CN110678011A (en) * | 2019-11-12 | 2020-01-10 | 江门崇达电路技术有限公司 | Manufacturing method of rigid-flex printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 莫欣满: "快压覆盖膜填胶过程研究", 印制电路信息 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20220104 |
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| RJ01 | Rejection of invention patent application after publication |