CN107493650A - A kind of automotive electronics high-frequency multi-layer circuit board laminated construction and process for pressing - Google Patents

A kind of automotive electronics high-frequency multi-layer circuit board laminated construction and process for pressing Download PDF

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Publication number
CN107493650A
CN107493650A CN201710725772.5A CN201710725772A CN107493650A CN 107493650 A CN107493650 A CN 107493650A CN 201710725772 A CN201710725772 A CN 201710725772A CN 107493650 A CN107493650 A CN 107493650A
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CN
China
Prior art keywords
layer circuit
pressing
circuit board
layer
automotive electronics
Prior art date
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Pending
Application number
CN201710725772.5A
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Chinese (zh)
Inventor
柯勇
李梦龙
李秋梅
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Kinwong Electronic Technology Longchuan Co Ltd
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Kinwong Electronic Technology Longchuan Co Ltd
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Priority to CN201710725772.5A priority Critical patent/CN107493650A/en
Publication of CN107493650A publication Critical patent/CN107493650A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention discloses a kind of automotive electronics high-frequency multi-layer circuit board laminated construction and process for pressing, core material L6 L7 layer internal layer circuits, is pressed into the daughter boards of L5 8, the daughter boards of L5 8 for the first time, and secondary outer-layer circuit makes, and is pressed into L1 L8 laminates, product test for the second time.Automotive electronics provided by the invention designs simple science with high-frequency multi-layer circuit board laminated construction and process for pressing, the pre- folded mode being combined with hot melt with rivet, improves pressing interlayer Aligning degree；The filler amount of interlayer is improved, improves the reliability of product；Solve the problems, such as the reliability failures such as resin cavity, crack, layering, foaming, improve heat resistance, the insulating properties of product.

Description

A kind of automotive electronics high-frequency multi-layer circuit board laminated construction and process for pressing
Technical field
The invention belongs to multilayer circuit board technical field, more particularly to a kind of high-frequency multi-layer circuit board for automotive electronics Laminated construction and process for pressing.
Background technology
As China's motor vehicles are increasing, while being offered convenience to people's trip, many traffic are also triggered Problem, intelligent transportation system are arisen at the historic moment in this context.Research shows, if driver, which shifts to an earlier date 0.5s~1s, finds danger simultaneously Take measures, the generation of 50%~70% rear-end collision can be avoided.Therefore, developing car crass radar system can be effective The generation of traffic accident is reduced or avoided, has caused major automobile vendor and the concern of consumers in general.Car collision avoidance System The main front, side and rear for monitoring vehicle in real time using long distance radar detector and low coverage radar detector, when dangerous Target occurs, and radar system sends alarm to driver in advance, driver is reacted in time, central microprocessor passes through IC buses Output signal reaches automotive control system, according to circumstances carries out sound and light alarm, self-actuating brake or deceleration, prevents the generation of collision.
Automotive electronics is using specific high frequency base material (mainly polytetrafluoroethylene (PTFE) material with the production technology of high-frequency circuit board Material), the high-frequency microwave electronic component by multilayer circuit board fabrication process.High-frequency circuit board due to material particularity, The process characteristics such as laminated construction design, product reliability, therefore very big technology hardly possible in engineering design and production and processing be present Topic.Especially in pressing working procedure, including the side such as laminated construction design, material selection, pressing program, matching of technological parameter Face, influence product quality and reliability.
Based on industry technology limitation, exist in production polytetrafluoroethylene (PTFE) base material and epoxy resin base material, prepreg, The adhesion of copper foil is poor；Easily occur the reliability failures such as interlayer dislocation, resin cavity, crack, layering, foaming after pressing to ask Topic.
The content of the invention
It is an object of the invention to provide a kind of reliability for improving product, heat resistance, the insulating properties of product are improved Automotive electronics high-frequency multi-layer circuit board laminated construction and process for pressing.
In order to overcome the above-mentioned base material of polytetrafluoroethylene (PTFE) in the prior art that there is flexibility, the technical problem of non-stick；Interlayer The defects of reliability failures problems such as dislocation, resin cavity, crack, layering, foaming, the present invention adopted the following technical scheme that：
A kind of automotive electronics high-frequency multi-layer circuit board lamination process for pressing：
(1) L6-L7 layers internal layer circuit makes；
(2) press for the first time, L6-L7 sandwich circuit boards are after brown is handled, by L6-L7 sandwich circuit boards, 2 semi-solid preparations Piece, outer copper foil are superimposed together by laminated construction order, by being pressed into L5-L8 straton plates in the presence of high pressure, high temperature；
(3) secondary outer-layer circuit makes：A, L5-L8 stratons plate subtracts copper；B, secondary outer-layer circuit makes；
(4) second press, after the processing of L5-L8 straton plate wiring boards brown, by L5-L8 sandwich circuit boards, several are half solid Change piece, copper foil are superimposed together by laminated construction order, by being pressed into L1-L8 layer multi-layer plates in the presence of high pressure, high temperature.
Further, the L6-L7 layers internal layer circuit make include substrate cut, the roughening of substrate microetch, internal layer circuit it is oily Ink coating, inner figure imaging, internal layer development and acid etching, striping, form internal layer circuit.
Further, 2 prepregs in described (2) are 2113R/C 60%.
Further, use level brown line subtracts copper in a, and copper thickness is controlled at 8 μm~10 μm after subtracting copper, uses 600# With 800# adhesive-bonded fabrics polish-brush three times.
Further, time outer-layer circuit is made in the b, and plated-through-hole technique is carried out to L5-L8 stratons plate.
Further, the plated-through-hole technique includes digital control hole drilling, removes drilling glue residue and burr；Then time outer layer is made Image shifts：L5-L8 straton plates cross the roughening of volcano ashing plate, L5-L8 stratons plate patch dry film, the imaging of figure circuit, development acidity Etching, striping, form time outer-layer circuit.
Further, several prepregs are 3 in described (2), 1 prepreg for 2113R/C 60%, separately Two prepregs for 1080R/C 68%.
Further, heating rate control is pressed in 1.5 DEG C/min~2.2/ DEG C/min, curing time control 75min~ 90min；The harmomegathus amount of L5-L8 straton plates is measured after pressing for the first time, is provided again second according to the harmomegathus amount of L5-L8 straton plates The pre- harmomegathus coefficient of pressing, the pre- folded mode being combined using hot melt with rivet.
Further, including L1-L8 layers, L1-L8 layers respectively be copper foil, 2 1080R/C 68% prepreg, 1 2113R/C 60% prepreg, L3-L4 layers core material and L5-L8 straton plates.L3-L4 layers core material is by poly- four PVF substrate and epoxy resin base plate composition.
Further, the L5-L8 stratons plate includes L6-L7 layer internal layer circuit plates and outer copper foil, layer line in L6-L7 layers Road plate is provided with substrate and internal layer circuit, the prepreg and L6-L7 layer internal layer circuits that outer copper foil passes through 2 2113R/C 60% Plate presses.
Automotive electronics provided by the invention designs simple science, knot with high-frequency multi-layer circuit board laminated construction and process for pressing Structure is reliable and stable：
1st, high-frequency mixed-compression board laminated construction (ptfe substrate-high resin content prepreg combination-epoxy resin-matrix Plate), prepreg is 2113R/C 60% and 1080R/C 68% Combination Design, improves the filler amount of interlayer, improves The reliability of product.
2nd, process for pressing, pressing heating rate control exist in 1.5 DEG C/min~2.2/ DEG C/min, curing time control twice 75min~90min, heating rate is reduced, extend the hot setting time, resin is fully flowed and is solidified, efficiently solve tree The reliability failures problems such as fat cavity, crack, layering, foaming, improve heat resistance, the insulating properties of product.
3rd, L5-L8 straton plate harmomegathus amounts are measured after pressing for the first time, then provide pre- the rising of second of pressing (L1-L8 laminates) Contracting coefficient；The pre- folded mode being combined using hot melt with rivet, improve pressing interlayer Aligning degree.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing There is the required accompanying drawing used in technology description to be briefly described, it should be apparent that, drawings in the following description are only this Some embodiments of invention, for those of ordinary skill in the art, without having to pay creative labor, may be used also To obtain other accompanying drawings according to these accompanying drawings：
Fig. 1 is a kind of automotive electronics high-frequency multi-layer circuit board laminated construction of the present invention and the signal of process for pressing embodiment Figure；
Fig. 2 is the schematic diagram of automotive electronics high-frequency multi-layer circuit board laminated construction.
Embodiment
The present invention is described in detail below in conjunction with accompanying drawing and specific embodiment, herein with the schematic implementation of the present invention Example and explanation are used for explaining the present invention, but not as a limitation of the invention.
As depicted in figs. 1 and 2, a kind of automotive electronics high-frequency multi-layer circuit board lamination process for pressing,
(1) L6-L7 layers internal layer circuit makes.Substrate is cut, substrate microetch is roughened, internal layer circuit ink is coated with, internal layer figure Picture, internal layer development and acid etching, striping are formed, forms internal layer circuit.
(2) press for the first time.L6-L7 sandwich circuit boards are after brown is handled, by L6-L7 sandwich circuit boards and prepreg (2113R/C 60%) 2, outer copper foil are superimposed together by laminated construction order, by being pressed in the presence of high pressure, high temperature Into L5-L8 straton plates.
(3) L5-8 daughter boards (secondary outer-layer circuit making)：
A, L5-L8 stratons plate subtracts copper, and use level brown line subtracts copper, and the thick control of copper is at 8 μm~10 μm after subtracting copper.Use 600# and 800# adhesive-bonded fabrics polish-brush is three times, it is ensured that copper thickness uniformity.
B, secondary outer-layer circuit is made, and plated-through-hole technique, including digital control hole drilling are carried out to L5-L8 stratons plate, removes drilling glue Slag and burr；Then time outer layer image transfer is made：L5-L8 straton plates cross the roughening of volcano ashing plate, L5-L8 stratons plate patch is done Film, the imaging of figure circuit, development acid etching, striping, form time outer-layer circuit.
(4) second of pressing.After the processing of L5-L8 straton plate wiring boards brown, by L5-L8 sandwich circuit boards, prepreg (2113R/C 60%1 opens, 1080R/C 68%2 opens), copper foil are superimposed together by laminated construction order, by high pressure, high temperature In the presence of be pressed into L1-L8 layer multi-layer plates.
(5) key technology and technological parameter are pressed：
Heating rate control is pressed in 1.5 DEG C/min~2.2 DEG C/min, curing time control 75min~90min, reduction Heating rate is pressed, extends the hot setting time, resin fully flowed, solidified, improves the heat-resisting of tack coat and internal substrate Property.
Process for pressing twice is designed based on laminated construction, because polytetrafluoroethylene (PTFE) base material and epoxy resin base material harmomegathus amount are poor The opposite sex, therefore the harmomegathus amount of L5-L8 straton plates is measured after pressing for the first time, the is provided again according to the harmomegathus amount of L5-L8 straton plates The pre- harmomegathus coefficient of second pressing.The pre- folded mode being combined using hot melt with rivet, to improve level to level alignment degree.
Press laminated construction design：
(1) outer copper foil design thickness (H/H OZ) 2.
(2) prepreg designs：2113R/C 60%3 opens, and 1080R/C 68%2 opens.
(3) core material designs：Ptfe substrate thickness is 0.13 ㎜ (not cupric H/H OZ) 1, epoxy resin Substrate thickness is 0.70 ㎜ (not cupric H/H OZ) 1, the ㎜ of epoxy resin-matrix plate thickness 0.20 (not cupric H/H OZ) 1.
(4) laser blind hole structure：L2 layers are got into from L1 layers, L7 layers are got into from L8 layers.
(5) first time pressing structure：Internal layer circuit plate L6-L7 layers, 2113R/C 60%2 open, L5 layers (copper foil layer), L8 layers (copper foil layer) material is pressed into L5-L8 Rotating fields.
(6) second of pressing structure：L5-L8 layers (daughter board after pressing for the first time), core material L3-L4 layers, 2113R/C 60%1,1080R/C 68%2 opens, L1 layers (copper foil layer) material is pressed into L1-L8 veneer structures.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention God any modification, equivalent substitution and improvements made etc., should be included in the scope of the protection with principle.

Claims (10)

  1. A kind of 1. automotive electronics high-frequency multi-layer circuit board lamination process for pressing, it is characterised in that：
    (1) L6-L7 layers internal layer circuit makes；
    (2) press for the first time, L6-L7 sandwich circuit boards are after brown is handled, by L6-L7 sandwich circuit boards, 2 prepregs, outer Layer copper foil is superimposed together by laminated construction order, by being pressed into L5-L8 straton plates in the presence of high pressure, high temperature；
    (3) secondary outer-layer circuit makes：A, L5-L8 stratons plate subtracts copper；B, secondary outer-layer circuit makes；
    (4) second press, after the processing of L5-L8 straton plate wiring boards brown, by L5-L8 sandwich circuit boards, several prepregs, Copper foil is superimposed together by laminated construction order, by being pressed into L1-L8 layer multi-layer plates in the presence of high pressure, high temperature.
  2. 2. automotive electronics according to claim 1 high-frequency multi-layer circuit board lamination process for pressing, it is characterised in that：
    The L6-L7 layers internal layer circuit, which makes, includes that substrate is cut, the roughening of substrate microetch, internal layer circuit ink are coated with, internal layer figure Picture, internal layer development and acid etching, striping are formed, forms internal layer circuit.
  3. 3. automotive electronics according to claim 1 high-frequency multi-layer circuit board lamination process for pressing, it is characterised in that：
    2 prepregs in (2) are 2113R/C 60%.
  4. 4. automotive electronics according to claim 1 high-frequency multi-layer circuit board lamination process for pressing, it is characterised in that：
    Use level brown line subtracts copper in a, and copper thickness is controlled at 8 μm~10 μm after subtracting copper, uses 600# and 800# adhesive-bonded fabrics Polish-brush is three times.
  5. 5. automotive electronics according to claim 1 high-frequency multi-layer circuit board lamination process for pressing, it is characterised in that：
    Time outer-layer circuit is made in the b, and plated-through-hole technique is carried out to L5-L8 stratons plate.
  6. 6. automotive electronics according to claim 5 high-frequency multi-layer circuit board lamination process for pressing, it is characterised in that：
    The plated-through-hole technique includes digital control hole drilling, removes drilling glue residue and burr；Then time outer layer image transfer is made：L5- L8 straton plates cross the roughening of volcano ashing plate, L5-L8 stratons plate patch dry film, the imaging of figure circuit, development acid etching, striping, shape Into secondary outer-layer circuit.
  7. 7. automotive electronics according to claim 1 high-frequency multi-layer circuit board lamination process for pressing, it is characterised in that：
    Several prepregs are 3 in (2), and 1 prepreg for 2113R/C 60%, another two are 1080R/C 68% prepreg.
  8. 8. automotive electronics according to claim 1 high-frequency multi-layer circuit board lamination process for pressing, it is characterised in that：
    Heating rate control is pressed in 1.5 DEG C/min~2.2/ DEG C/min, curing time control 75min~90min；Press for the first time The harmomegathus amount of L5-L8 straton plates is measured after conjunction, provides the pre- harmomegathus system of second of pressing again according to the harmomegathus amount of L5-L8 straton plates Number, the pre- folded mode being combined using hot melt with rivet.
  9. A kind of 9. automotive electronics high-frequency multi-layer circuit board laminated construction, it is characterised in that：
    Including L1-L8 layers, L1-L8 layers respectively are copper foil, 2 1080R/C 68% prepreg, 1 2113R/C 60% prepreg, L3-L4 layers core material and L5-L8 straton plates.
  10. 10. automotive electronics according to claim 9 high-frequency multi-layer circuit board laminated construction, it is characterised in that
    The L5-L8 stratons plate includes L6-L7 layer internal layer circuit plates and outer copper foil, and L6-L7 layer internal layer circuits plate is provided with substrate And internal layer circuit, outer copper foil are pressed by 2 2113R/C 60% prepreg with L6-L7 layer internal layer circuits plate.
CN201710725772.5A 2017-08-22 2017-08-22 A kind of automotive electronics high-frequency multi-layer circuit board laminated construction and process for pressing Pending CN107493650A (en)

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CN201710725772.5A CN107493650A (en) 2017-08-22 2017-08-22 A kind of automotive electronics high-frequency multi-layer circuit board laminated construction and process for pressing

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110505769A (en) * 2019-09-17 2019-11-26 四川深北电路科技有限公司 A kind of positioning compression method of mixed-compression board production
CN112770551A (en) * 2021-04-07 2021-05-07 四川英创力电子科技股份有限公司 Laminating and riveting method of multilayer foam printed circuit board and printed circuit board

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102946698A (en) * 2012-10-30 2013-02-27 无锡江南计算技术研究所 Method for preventing lamination deviation in plate superposing method
CN103491732A (en) * 2013-10-08 2014-01-01 华进半导体封装先导技术研发中心有限公司 Method for manufacturing circuit board layer-adding structure
CN106341939A (en) * 2016-08-31 2017-01-18 景旺电子科技(龙川)有限公司 Multi-layer line board structure and manufacturing method thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102946698A (en) * 2012-10-30 2013-02-27 无锡江南计算技术研究所 Method for preventing lamination deviation in plate superposing method
CN103491732A (en) * 2013-10-08 2014-01-01 华进半导体封装先导技术研发中心有限公司 Method for manufacturing circuit board layer-adding structure
CN106341939A (en) * 2016-08-31 2017-01-18 景旺电子科技(龙川)有限公司 Multi-layer line board structure and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110505769A (en) * 2019-09-17 2019-11-26 四川深北电路科技有限公司 A kind of positioning compression method of mixed-compression board production
CN110505769B (en) * 2019-09-17 2020-07-10 四川深北电路科技有限公司 Positioning and pressing method for manufacturing mixed pressing plate
CN112770551A (en) * 2021-04-07 2021-05-07 四川英创力电子科技股份有限公司 Laminating and riveting method of multilayer foam printed circuit board and printed circuit board

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Application publication date: 20171219