CN104582326B - The manufacturing method of printed circuit board - Google Patents
The manufacturing method of printed circuit board Download PDFInfo
- Publication number
- CN104582326B CN104582326B CN201410566475.7A CN201410566475A CN104582326B CN 104582326 B CN104582326 B CN 104582326B CN 201410566475 A CN201410566475 A CN 201410566475A CN 104582326 B CN104582326 B CN 104582326B
- Authority
- CN
- China
- Prior art keywords
- insulating layer
- circuit board
- printed circuit
- manufacturing
- prime coat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to a kind of manufacturing methods of printed circuit board.The manufacturing method of printed circuit board of the invention includes: the substrate that preparation includes the steps that the prime coat being formed with the first insulating layer of first circuit layer, the second insulating layer of the covering first circuit layer and the first insulating layer, formation over the second dielectric and the film layer being formed on prime coat；The step of prime coat is solidified；The step of removing film layer；And the step of solidifying second insulating layer.
Description
Technical field
The present invention relates to the manufacturing methods of printed circuit board.
Background technique
In recent years, along with the high performance of electronic instrument and miniaturization, demand improves signal and conveys the slim of speed
Package substrate.
For complying with the substrate of the market demand, it is necessary to reduce in process or encapsulation (Packaging) process in generate
Buckling deformation (warpage).
The main reason for buckling deformation of printed circuit board, is the thermal expansion coefficient that storeroom is different in defined structure
(CTE)。
There is about 17ppm/ DEG C of intrinsic thermal expansion coefficient as the copper (Copper) of main circuit constituent material.For
The mismatch (mismatch) for reducing thermal expansion coefficient, needs the low thermal expansion of increasing layer (Build-up) material other than copper removal
Coefficient (Low CTE) is changed, and carries out research thus.
Increasing layer material selects the mixed system of resin and filler, by the content of filler in control composite material, to embody
The characteristic of increasing layer material as mixed system.
Common low coefficient of thermal expansion materials increases the amount of filler shared by unit volume.
In this way, when the amount of filler increases, in existing membrane structure, the decline of surface bonding value.Therefore, it is necessary to new layers
Laminated structure needs the technology for making the mobile minimum of resin in increasing layer material solidification.
Existing technical literature
Patent document
Patent document 1: KR published patent 2012-0021243 bulletin
Summary of the invention
According to one embodiment of present invention, the purpose of the present invention is to provide a kind of deformations for substrate to have height resistance to
The manufacturing method of the printed circuit board of long property.
In addition, the object of the invention is also to provide a kind of, increase copper unrelated with the amount of filler contained in insulating layer
The manufacturing method of the printed circuit board of the peel strength of foil and insulating layer.
In addition, the object of the invention is also to provide the uniformitys for being able to maintain that thickness when one kind solidifies on the surface of the substrate
Stablize, can reduce in manufacturing process unfavorable condition, the reliability that can be improved product printed circuit board manufacturing method.
The manufacturing method of printed circuit board according to an embodiment of the invention, this method comprises: preparing includes being formed
There is the first insulating layer of first circuit layer, the second insulating layer of the covering first circuit layer and the first insulating layer, be formed in institute
The step of stating the substrate of the prime coat in second insulating layer and the film layer being formed on the prime coat；By the prime coat
The step of solidification；The step of removing the film layer；And the step of solidifying the second insulating layer.
Here, the manufacturing method of the printed circuit board further include: after the step of preparing the substrate, by the substrate
The step of investment lamination solidification equipment (Laminator)；And after the step of solidifying the second insulating layer, from the dress
Set the step of receiving substrate.
Here, can make the section of the prime coat with a thickness of 1~10 μm.
In addition, the prime coat can be light-cured resin.
In addition, the prime coat can be solid by photocuring (UV) process in the step of solidifying the prime coat
Change.
In addition, the second insulating layer can be the thermosetting resin containing inorganic filler.
In addition, the second insulating layer can pass through heat curing processes in the step of solidifying the second insulating layer
And solidify.
In addition, the film layer can be polyethylene terephthalate (PET:Polyethyelene
terepthalate)。
In addition, the manufacturing method of the printed circuit board can also include the formation the second circuit layer on the prime coat
Step.
The manufacturing method of the printed circuit board of embodiment according to the present invention will not generate insulating layer when by substrate increasing layer
Resin flowing, with substrate effect in homogeneous thickness.
In addition, forming prime coat and in order to eliminate the insulating layer disadvantage low with the cementability of copper foil, it is easy to carry out base
Plate laminating process has the effect of improving peel strength.
In addition, the uniformity of the quality and thickness with production product is good by the gas that insulating layer is effectively discharged
Shape product effect.
In addition, by process using film that is cheap and can simply starting with, without the use of existing high price film,
Have the effect of reducing process cost.
Detailed description of the invention
Fig. 1 is the process sectional view for indicating the manufacturing method of printed circuit board of the invention in order；
Fig. 2 is the process sectional view for indicating the manufacturing method of printed circuit board of the invention in order；
Fig. 3 is the process sectional view for indicating the manufacturing method of printed circuit board of the invention in order；
Fig. 4 is the process sectional view for indicating the manufacturing method of printed circuit board of the invention in order；
Fig. 5 is the process sectional view for indicating the manufacturing method of printed circuit board of the invention in order.
Description of symbols
100 substrates
101 first insulating layers
102 first circuit layers
103 second insulating layers
104 the second circuit layers
200 prime coats
300 film layers
Specific embodiment
The purpose of the present invention, specific advantage and new feature pass through the reality described further below and preferred to attached drawing
Example is applied to further clarify.In the present specification, it is necessary to notice, when adding reference number to the composition element of each attached drawing, for phase
Same composition element, even if indicating in different drawings, to be also accompanied by and be identically numbered as far as possible.In addition, " on one side ", " another
The terms such as face ", " first ", " second " are to use to differentiate a composition element and other composition elements, constitute
Element is not limited by the term.Hereinafter, omitting when illustrating the present invention in relation to the gist of the invention may be made not know
The detailed description of well-known technique.
Hereinafter, a preferred embodiment of the present invention is described in detail referring to attached drawing.
The manufacturing method of printed circuit board
Fig. 1 to Fig. 4 is the process sectional view for the manufacturing method for indicating printed circuit board of the invention in order.
Firstly, referring to Fig.1, preparing to include the first insulating layer 101 for being formed with first circuit layer 102, the first circuit of covering
The second insulating layer 103 of layer 102 and the first insulating layer 101, the prime coat 200 being formed in second insulating layer 103 and formation
The substrate 100 of film layer 300 on prime coat 200.
Then, the substrate 100 is put into lamination solidification equipment.
At this point, the substrate 100 is the circuit base that 1 layer or more of the circuit containing connection gasket is formed on the insulating layer
Plate can also be preferably printed circuit board.
In this attached drawing, for ease of description, the structure for illustrating specific internal layer circuit is omitted, still, as long as this
Field technical staff, it will be able to be fully recognized that, as the substrate 100, can be applicable in and be formed with 1 layer or more on the insulating layer
Circuit common circuit board.
As first insulating layer 101 and second insulating layer 103, resin insulating barrier can also be used.
As the resin insulating barrier, can be used the thermoplastic resins such as the thermosetting resins such as epoxy resin, polyimides,
Or resin made of the reinforcing materials such as glass fibre or inorganic filler is impregnated in them, such as precompressed can also be used,
Furthermore it is also possible to be not particularly limited to this using thermosetting resin and/or light-cured resin etc..
It, can be without limitation as long as being used as the metal of circuit conductive metal in field of circuit boards, the circuit layer
Ground is applicable in, and in the printed circuit boards, generally uses copper.
Although not indicated in this attached drawing, the substrate 100 be formed with 1 layer or more circuit multi-sheet printed electricity
Road plate.
Therefore, when laminated substrate 100, in order to mitigate buckling deformation, it is preferable to use being impregnated with made of high amount of inorganic filler
Thermosetting resin, to make second insulating layer 103 that there is low thermal coefficient of expansion.
But when being impregnated with high amount of inorganic filler, in order to supplement the point reduced with the peel strength of copper foil, in the second insulation
Prime coat 200 is formed on layer 103.
Here, the prime coat 200 is light-cured resin, solidified by ultraviolet irradiation (UV).
The prime coat 200 have the advantages that it is high with the peel strength of copper foil, have in lamination and/or curing process prevent
The only effect of the flowing of the resin material of second insulating layer 103.
In addition, prime coat 200 has the thickness with a thickness of several microns of very thin regions (micro meter) in section,
It can also be with substantially 1~10 μm.
In addition, prime coat 200 has when implementing heat curing processes to second insulating layer 103, the gas of outflow is effective
The good gas permeability that ground is discharged to the outside.
Therefore, by second insulating layer 103 formed prime coat 200, have do not change substrate 100 thickness, can
The advantages of producing substrate 100 uniformly maintained.
Here, the film layer 300 formed in second insulating layer 103 is polyethylene terephthalate.
Then, prime coat 200 is solidified by photocuring process referring to Fig. 2.
At this point, photocuring process is carried out by ultraviolet irradiation (UV), it is exhausted to the first insulating layer 101 and second
Edge layer does not have process influential, that only prime coat 200 is cured.
At this point, making when the prime coat 200 being cured has the heat curing processes of the second insulating layer 103 carried out afterwards
The immobilising function being fixedly secured of the resin material of second insulating layer 103.
Then, referring to Fig. 3, film layer 300 is removed after photocuring process.
Have compared with existing use R type PET film by using usually used PET film and reduce process cost
Effect.
In addition, R type PET film is bonded to substrate always in lamination and/or curing process when using R type PET film
On 100, still, in the present invention, even if removing PET film after solidifying prime coat 200 by photocuring process, it may have jail
Admittedly the function of fixed insulating layer, accordingly it is also possible to remove PET film.
Then, second insulating layer 103 is solidified by heat curing processes referring to Fig. 4.
The solidification of second insulating layer 103 is carried out by common heat curing processes, at this point, prime coat 200 is fixed on gravity
The flowing of the resin material of direction flowing.
In addition, gas is generated from second insulating layer 103, still, due to removing in process in front in heat curing processes
PET film, there is only 1~10 μm of thin primer layers 200 in second insulating layer 103, therefore, can be easily drained gas.
As a result, in substrate 100, the defect of the substrate 100 as caused by gas can be prevented, substrate 100 can be made without thickness
Deviation is spent, its uniformity is maintained.
Then, referring to Fig. 5, the second circuit layer 104 is formed on prime coat 200.
Prime coat 200, compared with being impregnated with second insulating layer 103 made of inorganic filler, very with the adhesiveness of copper foil
It is good, in laminating process, by forming prime coat 200 in second insulating layer 103, it can be improved peel strength (Peel
strength)。
Therefore, it by the way that prime coat 200 is formed on the insulating layer, can manufacture in second with low thermal coefficient of expansion
The buckling deformation of substrate 100 is prevented when the bonding of insulating layer 103 and copper foil and improves the print with the effect of the adhesive strength of copper foil
Printed circuit board.
The manufacturing method of the printed circuit board of embodiment according to the present invention, the increasing layer on multilayer board
(Build-up) when substrate, there is the effect in homogeneous thickness of resin flowing, substrate that insulating layer will not occur.
In addition, by the way that prime coat is formed on the insulating layer, having to eliminate the insulating layer disadvantage low with the cementability of copper foil
There is the effect for being easy to carry out substrate laminating process, the peel strength for improving insulating layer and copper foil.
In addition, there is the quality and thickness for producing product by the way that the gas of insulating layer to be effectively discharged to the outside
The effect of the product of the good shape of the uniformity.
In addition, by using common PET film that is cheap and can simply starting with, without the use of the R of existing high price
Type PET film has the effect of reducing process cost.
More than, it describes the invention in detail based on the specific embodiment, still, this is for illustrating this hair
Bright, the present invention is not limited to this, as long as those skilled in the art, just it will be appreciated that in technical idea of the invention
It is inside deformed or is improved.
Simple deformation or even change of the invention all belongs to the scope of the present invention, and specific protection scope of the invention is by weighing
Sharp claim is defined.
Claims (9)
1. a kind of manufacturing method of printed circuit board, this method comprises:
Prepare to include the second of the first insulating layer for being formed with first circuit layer, the covering first circuit layer and the first insulating layer
Insulating layer, formed prime coat on the second insulating layer and the film layer being formed on the prime coat substrate step
Suddenly；
The step of by prime coat solidification；
The step of removing the film layer；And
The step of by second insulating layer solidification.
2. the manufacturing method of printed circuit board according to claim 1, wherein this method further include:
After the step of preparing the substrate, the substrate is put into the step of being laminated solidification equipment；And
By the second insulating layer solidify the step of after, from described device receive substrate the step of.
3. the manufacturing method of printed circuit board according to claim 1, wherein the section of the prime coat with a thickness of 1
~10 μm.
4. the manufacturing method of printed circuit board according to claim 1, wherein the prime coat is light-cured resin.
5. the manufacturing method of printed circuit board according to claim 1, wherein in the step of solidifying the prime coat
In, the prime coat is solidified by photocuring process.
6. the manufacturing method of printed circuit board according to claim 1, wherein the second insulating layer is to fill out containing inorganic
The thermosetting resin of material.
7. the manufacturing method of printed circuit board according to claim 1, wherein by the cured step of the second insulating layer
In rapid, the second insulating layer is solidified by heat curing processes.
8. the manufacturing method of printed circuit board according to claim 1, wherein the film layer is poly terephthalic acid second
Diol ester.
9. the manufacturing method of printed circuit board according to claim 1, wherein this method further includes on the prime coat
The step of forming the second circuit layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2013-0128007 | 2013-10-25 | ||
| KR1020130128007A KR20150047926A (en) | 2013-10-25 | 2013-10-25 | Method for Manufacturing Printed Circuit Board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104582326A CN104582326A (en) | 2015-04-29 |
| CN104582326B true CN104582326B (en) | 2019-01-08 |
Family
ID=53047869
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410566475.7A Active CN104582326B (en) | 2013-10-25 | 2014-10-22 | The manufacturing method of printed circuit board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2015084420A (en) |
| KR (1) | KR20150047926A (en) |
| CN (1) | CN104582326B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704915A (en) * | 2016-04-26 | 2016-06-22 | 浪潮电子信息产业股份有限公司 | Corrosion-resistant server PCB (printed circuit board) |
| US10763031B2 (en) | 2016-08-30 | 2020-09-01 | Samsung Electro-Mechanics Co., Ltd. | Method of manufacturing an inductor |
| DE102018102734A1 (en) * | 2018-01-18 | 2019-07-18 | Schreiner Group Gmbh & Co. Kg | Flexible electrical circuit with connection between electrically conductive structural elements |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1155828A (en) * | 1995-10-31 | 1997-07-30 | 住友电木株式会社 | Multilayer printed circuit board and process for producing and using the same |
| CN1201586A (en) * | 1995-10-31 | 1998-12-09 | 住友电木株式会社 | Multilayer printed circuit board and process for producing same |
| CN1464837A (en) * | 2001-07-06 | 2003-12-31 | 钟渊化学工业株式会社 | Laminate and its producing method |
| CN1791647A (en) * | 2003-05-21 | 2006-06-21 | 日立化成工业株式会社 | Primer, conductor foil with resin, laminate and process for producing the laminate |
| CN101781529A (en) * | 2009-01-21 | 2010-07-21 | 日东电工株式会社 | Double-coated pressure sensitive adhesive sheet for fixing flexible printed circuit board |
| CN102099431A (en) * | 2008-03-31 | 2011-06-15 | 汉高有限公司 | Multilayer uv-curable adhesive film |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5101919B2 (en) * | 2007-04-09 | 2012-12-19 | 日東電工株式会社 | Double-sided adhesive tape or sheet for printed circuit board and printed circuit board with double-sided adhesive tape |
| JP2012045887A (en) * | 2010-08-30 | 2012-03-08 | Sumitomo Bakelite Co Ltd | Metal clad laminated plate and method for manufacturing the same |
-
2013
- 2013-10-25 KR KR1020130128007A patent/KR20150047926A/en not_active Application Discontinuation
-
2014
- 2014-10-16 JP JP2014211589A patent/JP2015084420A/en not_active Withdrawn
- 2014-10-22 CN CN201410566475.7A patent/CN104582326B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1155828A (en) * | 1995-10-31 | 1997-07-30 | 住友电木株式会社 | Multilayer printed circuit board and process for producing and using the same |
| CN1201586A (en) * | 1995-10-31 | 1998-12-09 | 住友电木株式会社 | Multilayer printed circuit board and process for producing same |
| CN1464837A (en) * | 2001-07-06 | 2003-12-31 | 钟渊化学工业株式会社 | Laminate and its producing method |
| CN1791647A (en) * | 2003-05-21 | 2006-06-21 | 日立化成工业株式会社 | Primer, conductor foil with resin, laminate and process for producing the laminate |
| CN102099431A (en) * | 2008-03-31 | 2011-06-15 | 汉高有限公司 | Multilayer uv-curable adhesive film |
| CN101781529A (en) * | 2009-01-21 | 2010-07-21 | 日东电工株式会社 | Double-coated pressure sensitive adhesive sheet for fixing flexible printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150047926A (en) | 2015-05-06 |
| CN104582326A (en) | 2015-04-29 |
| JP2015084420A (en) | 2015-04-30 |
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