CN105657963A - Insulation laminate board for printed circuit board, printed circuit board utilizing insulation laminate board and manufacturing method thereof - Google Patents
Insulation laminate board for printed circuit board, printed circuit board utilizing insulation laminate board and manufacturing method thereof Download PDFInfo
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- CN105657963A CN105657963A CN201410646242.8A CN201410646242A CN105657963A CN 105657963 A CN105657963 A CN 105657963A CN 201410646242 A CN201410646242 A CN 201410646242A CN 105657963 A CN105657963 A CN 105657963A
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- circuit board
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Abstract
The invention provides an insulation laminate board for a printed circuit board, the printed circuit board utilizing the insulation laminate board and a manufacturing method thereof. The insulation laminate board for the printed circuit board comprises an insulation layer having a first surface and a second surface, and an isolation film which is pressed on the first surface of the insulation layer to realize surface roughness transfer of one surface of the insulation layer. Through the insulation laminate board for the printed circuit board, surface roughness transfer to the insulation layer is realized through the solidification technology, the decontamination technology is omitted, so the treatment time is likely shortened; decontamination liquid concentration reduction can be realized, and production efficiency of the substrate technology can be improved.
Description
Technical field
Embodiments of the present invention relate to the insulating laminated sheet of printed circuit board (PCB), use the Printed circuit board and manufacturing methods of this insulating laminated sheet.
Background technology
Usually, printed circuit board (PCB) is by connecting up Copper Foil on a surface or two surfaces of the circuit board being made up of various thermoset synthetic resins, it is fixedly disposed integrated circuit (ICs) or electronic unit on circuit boards, implement electric wiring betwixt, and be then coated with electric wiring with insulator and implement.
According to the development that electron trade is nearest, the demand of multi-functional and light and little electronic component is being increased sharply always. In order to adapt to this trend, it is necessary to increase the wiring density of the mounted thereon printed circuit board (PCB) having electronic component, and reduce the thickness of printed circuit board (PCB). Therefore, it is actively carried out the research of method for implementing various fine circuit pattern, and as basic prerequisite, carry out for forming the surface roughness with even roughness degree on the insulating layer widely, to improve Copper Foil (electrodeposited coating) and the fusible research of insulation interlayer.
In order to carry out semi-additive process (semi-additivemethod) after being formed insulating barrier by laminating and solidifying accumulating film in piling up base process, it is necessary to the technique of the thin film of lamination electroless copper. In order to increase electroless copper and the stiffness of coupling of insulation interlayer, in decontamination process, guarantee that the surface roughness of the insulating barrier of one or more predetermined height (predeterminedlevel) is critically important. But, if dielectric film is corresponding to low CTE and low DF, due to the increase of inorganic filler, the increase of resin cured density, the minimizing etc. of resin Semi-polarity functional group, it is difficult to form the surface roughness being able to ensure that required plating peel strength in decontamination process.
Summary of the invention
On the one hand, the present invention can provide a kind of printed circuit board (PCB) for forming the surface roughness being able to ensure that required plating peel strength.
According to an aspect of the present invention, insulating laminated sheet for printed circuit board (PCB) may include that the insulating barrier with first surface and second surface, is pressed against on the first surface of insulating barrier and makes the isolating membrane (releasefilm) that the surface roughness of formation shifts on a surface of insulating barrier.
Surface roughness Ra can in the scope of 0.3 ��m to 3.1 ��m.
Insulating laminated sheet may further include the protective layer formed on the second surface of insulating barrier.
According to a further aspect in the invention, printed circuit board (PCB) may include that substrate; And there is the second surface being laminated on substrate and there is the insulating barrier forming surface roughness on the first surface, wherein this surface roughness is by the transfer of the surface roughness of the isolating membrane on first surface being formed.
Surface roughness Ra can in the scope of 0.3 ��m to 3.1 ��m.
According to a further aspect in the invention, the method for manufacturing printed circuit board (PCB) may include that and prepares substrate; Preparation has first surface and second surface and has the isolating membrane forming surface roughness on the first surface; Preparation has the insulating barrier of first surface and second surface; By arranging on the first surface of insulating barrier and pressing the first surface of isolating membrane to form insulating laminated sheet; Substrate arranges the second surface of insulating laminated sheet and insulating laminated sheet is pasted to substrate; And solidify the substrate being pasted with insulating laminated sheet on it.
Surface roughness Ra can in the scope of 0.3 ��m to 3.1 ��m.
The preparation of isolating membrane can include carrying out silicon isolation processing (silicon-releasetreatment) on a surface of polyethylene terephthalate (polyethyleneterephthalate) film.
Insulating laminated sheet can include pressing the insulating laminated sheet pressed and substrate to the attaching of substrate.
The method may further include after solidifying substrate, removes isolating membrane.
The preparation of insulating barrier can include attaching protective layer on the second surface of insulating barrier, and the method may further include, and before insulating laminated sheet is pasted to substrate, removes the protective layer attached on the insulating layer.
Accompanying drawing explanation
The above-mentioned of the present invention and other side, feature and further advantage can be more clearly understood that in conjunction with accompanying drawing and from detailed description below, wherein:
Fig. 1 is the cross-sectional view of the printed circuit board (PCB) of a kind of illustrative embodiments according to the present invention; And
Fig. 2-8 is the process chart of the method for manufacturing printed circuit board (PCB) of the another kind of illustrative embodiments according to the present invention.
Detailed description of the invention
The purpose of the present invention, feature and advantage clearer can be understood in conjunction with accompanying drawing and from the detailed description of following illustrative embodiment. In the accompanying drawings, identical accompanying drawing labelling is used for representing same or analogous parts, and eliminates the explanation of repetition. It addition, in the following description, term " first ", " second ", " side ", " opposite side " etc. are used for distinguishing a certain parts and other parts, but the structure of these parts should not be construed the restriction by term. Additionally, in describing the invention, when the detailed description judging correlation technique can obscure when putting of the present invention, their description will be omitted.
Hereinafter, with reference to the accompanying drawings the illustrative embodiments of the present invention is described in detail.
Printed circuit board (PCB)
Fig. 1 is the cross-sectional view of the printed circuit board (PCB) 1000 of a kind of illustrative embodiments according to the present invention.
As it is shown in figure 1, printed circuit board (PCB) 1000 includes substrate 100 and the second surface having lamination on the substrate 100 the insulating barrier 200 with formation surface roughness 210 on the first surface.
Substrate, forms the circuit board of one or more circuit layer on the insulating layer, it may be preferred to for printed circuit board (PCB). Although fig 1 illustrate that a kind of situation, wherein, for the ease of illustrating to eliminate concrete internal layer circuit structure, but those skilled in the art can also be fully recognized that and the typical circuit board with one or more formation circuit layer on the insulating layer is used as substrate.
As insulating barrier, it is possible to use resin insulating barrier. Material as resin insulating barrier, thermosetting resin is epoxy resin such as, thermoplastic resin is polyimide resin such as, or there is the resin of reinforcing material such as glass fibre or the inorganic filler that is immersed in thermosetting resin and thermoplastic resin, it is, for example possible to use prepreg (prepreg). It addition, be used as thermosetting resin, light-cured resin and/or analog. But, the material of resin insulating barrier is not particularly limited at this.
As the material of circuit layer, as long as can act as the conducting metal for circuit, it is possible to use unrestricted for any conducting metal of circuit, and copper is generally used in printed circuit board (PCB).
Be suitable to the surface roughness 210 improving cohesive to have 0.3 ��m to 3.1 ��m.
In printed circuit board (PCB) 1000 according to an illustrative embodiment of the invention, owing to using the isolating membrane with the surface roughness being formed on, can surface roughness be transferred on insulating barrier, and by the adjustment for manufacturing the surface roughness described in the method for printed circuit board (PCB) of the another kind of illustrative embodiments according to the present invention as described below, the roughness transferring on insulating barrier can be easily controlled, it is possible to be easy to the surface roughness of management insulating barrier.
For the method manufacturing printed circuit board (PCB)
Fig. 2-8 is the process chart of the method for manufacturing printed circuit board (PCB) of the another kind of illustrative embodiments according to the present invention.
As in figure 2 it is shown, first, preparation has the substrate 100 of inner insulation layer 101, multiple circuit layer 102 and passage 103 (throughvia).
As insulating barrier, it is possible to use resin insulating barrier. Material as resin insulating barrier, thermosetting resin is epoxy resin such as, and thermoplastic resin is polyimide resin such as, or has the resin of reinforcing material such as glass fibre or the inorganic filler that is immersed in thermosetting resin and thermoplastic resin, it is, for example possible to use prepreg. It addition, be used as thermosetting resin, light-cured resin and/or analog. But, the material of resin insulating barrier is not particularly limited at this.
As the material of circuit layer, as long as can act as the conducting metal for circuit, it is possible to use for any conducting metal of circuit without restricted, and copper is generally used in printed circuit board (PCB).
Here, in the technique forming passage, it is possible to use by the method using photoetching process well known in the art (photolithographymethod) to form through hole along predeterminated position, but this is not particularly limited by the present invention.
As shown in Figure 3; preparation has first surface 301 and second surface 302 and has the isolating membrane 300 of the surface roughness formed on first surface 301; there is the insulating barrier 200 of first surface 201 and second surface 202, and be pasted to the protective layer 310 of the second surface 202 of insulating barrier 200.
Isolating membrane 300 can have the structure that a surface is silicon isolation processing of pet resin, this structure can be formed by applying the method for silicon on isolating membrane 300, and the material of the resin and applying forming film is not particularly limited to those described above.
Protective layer 310 can be that the exterior material that is prevented from well known in the art attaches to the coverlay of the phenomenon on surface. Such as, polypropylene (BOPP) that protective layer 310 can be biaxially oriented and polyethylene terephthalate (PET), but it is not particularly limited to this.
As shown in Figure 4, under state isolating membrane 300, insulating barrier 200 and protective layer 310 attached successively, pressing plate 400 is used to press isolating membrane 300, insulating barrier 200 and protective layer 310.
In this case, the surface roughness 210 that will be formed on the first surface 301 of isolating membrane 300 is transferred on the first surface 201 of insulating barrier 200, thus forming insulating laminated sheet 220.
In this case, the surface roughness 210 improving cohesive to have 0.3 ��m to 3.1 ��m is suitable to.
As it is shown in figure 5, after the protective layer 310 attached in removing on the second surface 202 of the insulating laminated sheet 220 of formation, set gradually the substrate 100 of preparation and remove the insulating laminated sheet 220 of protective layer 310 from which.
In such a case, it is possible to insulating laminated sheet 220 is arranged on a surface and another surface of substrate 100.
As shown in Figure 6, pressing plate 400 is used to press the substrate 100 and insulating laminated sheet 220 set gradually.
In this case, insulating laminated sheet 220 is pressed when being pasted with isolating membrane 300.
It addition, the pressure of pressing plate 400 can be the pressure not producing space well known in the art, because the viscosity of every kind of insulant is different.
Such as, the pressure of pressing plate 400 can in the scope of 0.2MPa to 2MPa.
As it is shown in fig. 7, after removing pressing plate 400, carry out resin curing process when pressing isolating membrane 300.
In this case, owing to carrying out curing process when not removing isolating membrane 300, it is possible to keep and transfer surface roughness on the insulating layer will not be changed.
As shown in Figure 8, solidified by resin after with fixing surface roughness 210, removing isolating membrane 300.
The isolating membrane for manufacturing the use described in the method for printed circuit board (PCB) with the surface roughness being formed on due to the another kind of illustrative embodiments according to the present invention, surface roughness is transferred on insulating barrier, omit decontamination process, be possibly realized so that shortening processes the time. Accordingly, because the operation reducing the concentration of decontamination liquid is possible, the productivity ratio of base process can be improved.
Further, since be easily controlled the roughness transferring on insulating barrier by the adjustment of surface roughness, it is easy to the surface roughness of management insulating barrier.
Hereinafter, by the following examples, the illustrative embodiments of the present invention will be explained in more detail, but protection scope of the present invention is not limited thereto.
Embodiment
The method for manufacturing printed circuit board (PCB) of the another kind of illustrative embodiments according to the present invention, by Dongli Ltd. (TorayIndustries, the XZ-32 polyethylene terephthalate (PET) of the surface roughness Ra value with 0.4 ��m Inc) manufactured carries out inner surface silicon isolation processing, it is then coated with epoxy insulation film the dry thickness to have 37.5 ��m, thus manufacturing accumulating film. What was certain was that by pressing accumulating film to form the accumulation rete of the surface roughness with 0.4 ��m of Ra value at copper-clad laminate (CCL) suprabasal layer, the accumulating film 30 minutes of lamination is solidified at 120 DEG C, at 170 DEG C, solidify the accumulating film 30 minutes of lamination, then remove PET film. What was certain was that when forming electroless copper by not carrying out decontamination process in substrate, when measuring peel strength under 90 DEG C of delamination speed with 10mm/min, peel strength is 512gf/cm.
As it has been described above, in the printed circuit board (PCB) according to a kind of illustrative embodiments of the present invention, owing to transferring on insulating barrier by curing process by surface roughness, omit decontamination process, it is possibly realized so that shortening processes the time. Thus, be possible owing to reducing the operation of concentration of decontamination liquid, it is contemplated that be that the productivity ratio of base process can be improved.
Further, since be easily controlled the roughness transferring on insulating barrier by the adjustment of surface roughness, it is possible to be easy to the surface roughness of management insulating barrier.
Although embodiments of the present invention are had been disclosed for illustrative purposes, should be understood that, the present invention is not limited to this, and skilled person would appreciate that without departing from the scope and spirit of the present invention, various modification, interpolation and what replacement was possible to.
Therefore, any and all of modification, change or equivalence layout is considered as within protection scope of the present invention, and the concrete protection domain of the present invention will be open by claims.
Claims (11)
1., for an insulating laminated sheet for printed circuit board (PCB), described insulating laminated sheet includes:
There is the insulating barrier of first surface and second surface; And
It is pressed against on the first surface of described insulating barrier and makes the isolating membrane that the surface roughness of formation shifts on a surface of described insulating barrier.
2. insulating laminated sheet according to claim 1, wherein, described surface roughness Ra is in the scope of 0.3 ��m to 3.1 ��m.
3. insulating laminated sheet according to claim 1, described insulating laminated sheet further includes at the protective layer formed on the second surface of described insulating barrier.
4. a printed circuit board (PCB), described printed circuit board (PCB) includes:
Substrate; And
There is lamination second surface on the substrate and there is the insulating barrier forming surface roughness on the first surface,
Wherein, described surface roughness is by the transfer of the surface roughness of the isolating membrane on described first surface being formed.
5. printed circuit board (PCB) according to claim 4, wherein, described surface roughness Ra is in the scope of 0.3 ��m to 3.1 ��m.
6. the method for manufacturing printed circuit board (PCB), described method includes:
Prepare substrate;
Preparation has first surface and second surface and has the isolating membrane forming surface roughness on the first surface;
Preparation has the insulating barrier of first surface and second surface;
By arranging on the first surface of described insulating barrier and pressing the described first surface of isolating membrane to form insulating laminated sheet;
The second surface of described insulating laminated sheet is set on the substrate and described insulating laminated sheet is pasted to described substrate; And
Solidify the substrate being pasted with described insulating laminated sheet on it.
7. method according to claim 6, wherein, described surface roughness Ra is in the scope of 0.3 ��m to 3.1 ��m.
8. method according to claim 6, wherein, the preparation of described isolating membrane includes carrying out isolation processing on a surface or two surfaces of film.
9. method according to claim 6, wherein, described insulating laminated sheet includes pressing the described insulating laminated sheet pressed and described substrate to the attaching of described substrate.
10. method according to claim 6, described method removes described isolating membrane after further including at the described substrate of solidification.
11. method according to claim 6, wherein, the preparation of described insulating barrier includes attaching protective layer on the described second surface of described insulating barrier,
Described method farther includes, and before described insulating barrier is pasted to described substrate, removes the described protective layer being attached on described insulating barrier.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410646242.8A CN105657963A (en) | 2014-11-14 | 2014-11-14 | Insulation laminate board for printed circuit board, printed circuit board utilizing insulation laminate board and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410646242.8A CN105657963A (en) | 2014-11-14 | 2014-11-14 | Insulation laminate board for printed circuit board, printed circuit board utilizing insulation laminate board and manufacturing method thereof |
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| CN105657963A true CN105657963A (en) | 2016-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410646242.8A Pending CN105657963A (en) | 2014-11-14 | 2014-11-14 | Insulation laminate board for printed circuit board, printed circuit board utilizing insulation laminate board and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106626615A (en) * | 2016-12-20 | 2017-05-10 | 广东生益科技股份有限公司 | Manufacturing method of insulation tabula rasa and insulation tabula rasa |
| CN114867204A (en) * | 2022-05-26 | 2022-08-05 | 深圳市金晟达电子技术有限公司 | Strenghthened type high frequency millimeter wave hybrid circuit board |
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| KR100700321B1 (en) * | 2005-11-07 | 2007-03-29 | 삼성전기주식회사 | Substrate having minute surface roughness and Manufacturing method thereof |
| JP2010258162A (en) * | 2009-04-23 | 2010-11-11 | Panasonic Electric Works Co Ltd | Method of manufacturing flexible laminated board |
| KR20110022284A (en) * | 2009-08-27 | 2011-03-07 | 삼성전기주식회사 | A printed circuit board and a fabricating method the same |
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- 2014-11-14 CN CN201410646242.8A patent/CN105657963A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1535101A (en) * | 2003-03-28 | 2004-10-06 | ���µ�����ҵ��ʽ���� | Transfer board wiring board using the same and its mfg. method |
| KR100700321B1 (en) * | 2005-11-07 | 2007-03-29 | 삼성전기주식회사 | Substrate having minute surface roughness and Manufacturing method thereof |
| JP2010258162A (en) * | 2009-04-23 | 2010-11-11 | Panasonic Electric Works Co Ltd | Method of manufacturing flexible laminated board |
| KR20110022284A (en) * | 2009-08-27 | 2011-03-07 | 삼성전기주식회사 | A printed circuit board and a fabricating method the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106626615A (en) * | 2016-12-20 | 2017-05-10 | 广东生益科技股份有限公司 | Manufacturing method of insulation tabula rasa and insulation tabula rasa |
| CN114867204A (en) * | 2022-05-26 | 2022-08-05 | 深圳市金晟达电子技术有限公司 | Strenghthened type high frequency millimeter wave hybrid circuit board |
| CN114867204B (en) * | 2022-05-26 | 2023-11-17 | 深圳市金晟达电子技术有限公司 | Enhanced high-frequency millimeter wave hybrid circuit board |
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Application publication date: 20160608 |
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