CN114867204B - Enhanced high-frequency millimeter wave hybrid circuit board - Google Patents
Enhanced high-frequency millimeter wave hybrid circuit board Download PDFInfo
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- CN114867204B CN114867204B CN202210579192.0A CN202210579192A CN114867204B CN 114867204 B CN114867204 B CN 114867204B CN 202210579192 A CN202210579192 A CN 202210579192A CN 114867204 B CN114867204 B CN 114867204B
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- 239000003365 glass fiber Substances 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 22
- 229920005989 resin Polymers 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 9
- 229920001577 copolymer Polymers 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000005553 drilling Methods 0.000 claims description 3
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- 230000005540 biological transmission Effects 0.000 description 9
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- 230000004044 response Effects 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02J—CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
- H02J50/00—Circuit arrangements or systems for wireless supply or distribution of electric power
- H02J50/10—Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0191—Dielectric layers wherein the thickness of the dielectric plays an important role
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Computer Networks & Wireless Communication (AREA)
- Power Engineering (AREA)
- Details Of Aerials (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a reinforced high-frequency millimeter wave hybrid circuit board, which comprises: the first line layer, the second line layer, the third line layer, the first dielectric layer, the second dielectric layer, the third dielectric layer, the fourth dielectric layer, the fifth dielectric layer, the sixth dielectric layer and the seventh dielectric layer; a sleeve penetrating the circuit board and fixed on the circuit board; the connecting support is fixedly arranged on the circuit board; the circuit board is sequentially from top to bottom: the first dielectric layer, the first line layer, the second dielectric layer, the third dielectric layer, the fourth dielectric layer, the second line layer, the fifth dielectric layer, the sixth dielectric layer, the seventh dielectric layer, the third line layer; the base is arranged on the upper side of the first dielectric layer; and other components, the efficiency of the antenna and the stability of line operation are improved, and the strength of the circuit board and the connection convenience are improved.
Description
Technical Field
The invention relates to the technical field of circuit boards, in particular to a reinforced high-frequency millimeter wave hybrid circuit board.
Background
The circuit board processes different types of signals, including analog, digital, RF, and millimeter wave signals, simultaneously by providing a multi-layer structure. However, the millimeter wave application type circuit board mainly faces the problems of integration and miniaturization, and different circuit functions make the requirements of circuit board materials different, and the circuit board materials need to match the functions required to be realized by each circuit, such as: power circuits, high-speed digital circuits, low-frequency radio frequency circuits, microwave/high-frequency millimeter wave circuits, and the like.
The material selection of the circuit board generally needs to consider the electrical parameters of the material, such as: the dielectric constant Dk, loss factor Df/loss tangent, etc., and secondly, the mechanical properties of the materials (mainly affecting strength, transmission performance, transmission line spacing/size) and the connection between laminates of different materials, as well as other flow specifications of production and manufacturing processes, are considered according to the functions and the number of layers of the circuit, so as to ensure quality.
In the popularization of the application of the high-frequency millimeter wave, the influence of the high-speed digital circuit on the circuit board is more prominent, and the transmission delay, skew, timing difference and the like between adjacent signals are also influenced.
Furthermore, circuit boards are currently being developed in the direction of small size, light weight, three-dimensional mounting, and high connection reliability. Particularly, the development of overhead installation makes the thicker circuit board not withstand voltage after overhead, and the middle part becomes low (the middle arrangement support can influence the arrangement of back components) because of no support strength, so that the inner structure of the thick circuit board can be damaged when the front surface of the circuit board presses the plug wire.
Accordingly, there is a need for an enhanced high frequency millimeter wave hybrid circuit board that solves one or more of the above problems.
Disclosure of Invention
The invention provides a reinforced high-frequency millimeter wave hybrid circuit board for solving one or more problems in the prior art. The invention adopts the technical proposal for solving the problems that: a reinforced high frequency millimeter wave hybrid circuit board, comprising: a circuit board, the circuit board comprising: the circuit board is provided with a plurality of micropores, the micropores are used for connecting the first line layer with the second line layer or the third line layer, and the micropores are used for connecting the second line layer with the third line layer;
the external member penetrates through the circuit board and is fixed on the circuit board, and a through hole is formed in the external member;
the connecting support is fixedly arranged on the circuit board, a clamping flange matched with the through hole is arranged at the bottom of the connecting support, a through connecting hole is formed in the connecting support, the connecting hole penetrates through the clamping flange and is connected with the through hole, a wire exposing groove is formed in the bottom surface of the connecting support, and the wire exposing groove is matched with a conductor on the first wire layer;
the first wire layer, the second wire layer and the third wire layer are laminated plates composed of rolled copper and are connected by taking a chlorofluoroethylene copolymer or a fluoroethylene propylene copolymer as a bonding sheet;
the thicknesses of the first line layer, the second line layer, the third line layer, the second dielectric layer, the third dielectric layer, the fourth dielectric layer, the fifth dielectric layer, the sixth dielectric layer and the seventh dielectric layer are equal;
the first medium layer is a combined layer of a shielding net and improved resin, the second medium layer and the seventh medium layer are combined layers of flat open-fiber balance woven glass cloth and low-temperature co-fired ceramic particles, and the thickness density ratio of glass warp yarns on an X axis to weft yarns on a Y axis of glass fibers in the flat open-fiber balance woven glass cloth is in the range of 1 to 1.05;
the third medium layer and the sixth medium layer are flat open-fiber balance woven glass cloth and an improved resin combination layer;
the circuit board is sequentially from top to bottom: the first dielectric layer, the first line layer, the second dielectric layer, the third dielectric layer, the fourth dielectric layer, the second line layer, the fifth dielectric layer, the sixth dielectric layer, the seventh dielectric layer, the third line layer;
the base is arranged on the upper side of the first dielectric layer, an installation groove is formed in the base, a shielding layer is arranged on the bottom surface of the installation groove, and a wiring terminal is arranged at the edge of the base;
the antenna is fixedly arranged in the mounting groove;
the radio frequency chip and the signal wiring thereof are arranged on the third wire layer, and the radio frequency chip is connected with the antenna through the micropore and the wiring terminal.
Further, the connecting support is provided with a limiting glue wall extending towards the upper side; one end of the sleeve member is fixedly connected with the third wire layer.
Further, the fourth medium layer and the fifth medium layer are low-temperature co-fired ceramic particles and an improved resin combination layer.
Further, a first connecting layer, a first middle layer and a first connecting layer are sequentially arranged in the third medium layer from top to bottom, the first connecting layer is an improved resin layer, and the first middle layer is a mixed layer of the improved resin layer and flat open-fiber balance woven glass cloth;
the sixth medium layer is sequentially provided with a second connecting layer, a second intermediate layer and a second connecting layer from top to bottom, wherein the second connecting layer is an improved resin layer, and the second intermediate layer is a mixed layer of the improved resin layer and flat open-fiber balance woven glass cloth.
Further, the thickness of the first connecting layer is smaller than or equal to the thickness of the first intermediate layer, and the thickness of the second connecting layer is smaller than or equal to the thickness of the second intermediate layer.
Further, the circuit board is processed through laser drilling, and the micro holes and the mounting holes of the sleeve on the circuit board are drilled.
The beneficial value obtained by the invention is as follows: according to the invention, the external member and the connecting support are arranged on the circuit board, so that the circuit board is mounted in an overhead manner by matching with the studs, the connecting support is fixed, the influence on the first dielectric layer caused by the fixation by using glue is avoided, meanwhile, the wire exposing groove on the connecting support can be used for connecting a conductor on the first wire layer with an external circuit (transverse welding, transverse spring clamping and transverse inserting), and further, the circuit board is prevented from being inserted for electric connection when being pressed after being mounted in an overhead manner, and meanwhile, the external member can protect the perforation on the circuit board.
And (dielectric constant is hereinafter referred to as Dk) the invention connects the first wire layer, the first dielectric layer, etc. together through ingenious layout, makes each wire layer, the thickness of dielectric layer after combining unanimous, make each layer keep the relative consistent mechanical characteristic in the material thickness, make the mechanical characteristic of each layer approach the same under the influence of millimeter wave frequency through the uniformity of thickness, in order to obtain the performance, economy suitable uniformity thickness, avoid the influence that the mechanical characteristic is inconsistent at the same time, like: the difference of phase response and insertion loss is caused, and the stability of the transmission line performance is obtained; the first line layer and the second line layer are provided with two dielectric layers containing flat open-fiber balance woven glass cloth, the distribution of glass fibers is averaged by the multi-layer flat open-fiber balance woven glass cloth, the influence of glass fiber effect on the line board along with the increase of frequency or higher digital speed is reduced, the DK value of the same transmission line passing place cannot generate quite large performance difference, and the Dk on the circuit board material becomes more uniform by being matched with the low-temperature cofired ceramic particle layer with low Dk, so that the influence caused by the glass fiber effect under high frequency is reduced. The flat open-fiber balance woven glass cloth is characterized in that the thickness density ratio of glass yarns on a X, Y shaft is 1 (in ideal state, a certain redundant space is actually reserved), and knuckle intersection areas (areas with relatively more glass fibers) and bundle opening areas (areas with relatively less glass fibers) on the glass cloth in a weaving mode and specification are fewer, so that the abrupt change range of Dk values is fewer; the conductor on the wire layer can obtain a relatively ideal antenna efficiency and improve the stability under the high-frequency state under the condition of not being far away from the glass fiber, so that the distortion of the wire is lower. The practical value of the invention is greatly improved.
Drawings
FIG. 1 is a top view of the present invention;
FIG. 2 is a cross-sectional view of the present invention;
FIG. 3 is an enlarged partial view of a cross-sectional view of the present invention;
fig. 4 is a schematic view of the connection support of the present invention.
[ reference numerals ]
101 first line layer
110 second wire layer
120 third line layer
130. Base
131 mounting groove
132-connection terminal
201 first dielectric layer
301. Micro-pores
310 & gtthrough hole
320. Kit
330 connection support
331 clamping flange
332 & ltconnection hole & gt
333, dew wire groove
334 limit glue wall
401 second dielectric layer
501 third dielectric layer
510 first connection layer
520 first intermediate layer
601 fourth dielectric layer
701 fifth dielectric layer
801 sixth dielectric layer
810 second connection layer
820 second intermediate layer
901. First · seven dielectric layers.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention briefly described above will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. The invention may be embodied in many other forms than described herein without departing from the spirit or scope of the invention as defined in the following claims.
As shown in fig. 1 to 4, the present invention discloses a reinforced high-frequency millimeter wave hybrid circuit board, which comprises: a circuit board, the circuit board comprising: the circuit board is provided with a plurality of micropores 301, the micropores 301 connect the first line layer 101 with the second line layer 110 or the third line layer 120, and the micropores 301 connect the second line layer 110 with the third line layer 120;
the external member 320 penetrates through the circuit board and is fixed on the circuit board, and a through hole 310 is arranged in the external member 320;
the connection support 330 is fixedly installed on the circuit board, a clamping flange 331 matched with the through hole 310 is arranged at the bottom of the connection support 330, a through connection hole 332 is arranged on the connection support 330, the connection hole 332 penetrates through the clamping flange 331 and is connected with the through hole 310, a wire exposing groove 333 is arranged on the bottom surface of the connection support 330, and the wire exposing groove 333 is matched with a conductor on the first wire layer 101;
when in use, the supporting stud with internal threads passes through the sleeve 320 and the connecting hole on the connecting support 330, then the upper end of the stud is fixedly connected with the top surface of the connecting support 330 through screws and/or glue, the lower end of the stud is provided with a step, the step is clamped with the third wire layer 120, the overhead installation of the circuit board is realized, the connecting support 330 is pressed and fixed on the upper side of the first medium layer 201, and enough longitudinal space is reserved on the third wire layer 120 for component arrangement and heat dissipation. The connection support 330 needs to be positioned and limited before being installed, so that the exposed slot 333 frames the conductor extending from the first wire layer 101 (generally, after the column conductor is framed, the conductor is welded and extended, the metal spring is welded, and then the connection support 330 is installed and fixed by the glue wall).
The first wire layer 101, the second wire layer 110 and the third wire layer 120 are laminated boards made of rolled copper and are connected by using a vinyl chloride-vinyl fluoride copolymer or a vinyl fluoride-propylene copolymer as a bonding sheet (the vinyl chloride-vinyl fluoride copolymer or the vinyl fluoride-propylene copolymer has small dielectric constant in the Z-axis direction and small loss factor at high frequency, and the expansion coefficient of the Z-axis is low, so that the reliability of the plated through holes can be ensured, and the laminated boards are compatible with flat open-fiber balanced woven glass cloth materials, so that the connection reliability can be ensured);
the thicknesses of the first line layer 101, the second line layer 110, the third line layer 120, the second dielectric layer 401, the third dielectric layer 501, the fourth dielectric layer 601, the fifth dielectric layer 701, the sixth dielectric layer 801, and the seventh dielectric layer 901 are equal;
the first dielectric layer 201 is a combined layer of a shielding net and an improved resin, the second dielectric layer 401 and the seventh dielectric layer 901 are combined layers of flat open-fiber balance woven glass cloth and low-temperature co-fired ceramic particles, and the thickness density ratio of glass warp yarns on an X axis to weft yarns on a Y axis of glass fibers in the flat open-fiber balance woven glass cloth is in a range of 1 to 1.05;
the third dielectric layer 501 and the sixth dielectric layer 801 are flat open-fiber balance woven glass cloth and an improved resin combination layer;
the circuit board is sequentially from top to bottom: the first dielectric layer 201, the first line layer 101, the second dielectric layer 401, the third dielectric layer 501, the fourth dielectric layer 601, the second line layer 110, the fifth dielectric layer 701, the sixth dielectric layer 801, the seventh dielectric layer 901, and the third line layer 120;
the base 130 is arranged on the upper side of the first dielectric layer 201, an installation groove 131 is arranged in the base 130, a shielding layer is arranged on the bottom surface of the installation groove 131, and a wiring terminal 132 is arranged on the edge of the base 130;
an antenna fixedly installed in the installation recess 131;
the radio frequency chip and the signal wiring thereof are disposed on the third wire layer 120, and the radio frequency chip is connected with the antenna through the micro-hole 301 and the connection terminal 132.
Specifically, as shown in fig. 1, 2 and 4, the connection support 330 is provided with a limiting glue wall 334 extending toward the upper side. The purpose of the limiting glue wall 334 is: the external connecting wire is convenient to transversely plug and fix the plugged external connecting wire. One end of the sleeve 320 is fixedly connected with the third wire layer 120, because the stability of the connection between the sleeve 320 and the first dielectric layer 201 is poor, and the tearing of the shielding net is easily caused during the connection process, and the one end of the sleeve 320 is connected with the third wire layer 120 by glue, too much glue cannot be used on the first dielectric layer 201 for connecting components, so as to avoid damaging the internal structure and performance thereof. The sleeve 320 and the connection support 330 are made of insulating materials.
It should be noted that, the first dielectric layer 201 is a combination layer of a shielding net and a modified resin, so as to reduce the influence of millimeter waves on the first wire layer 101, and also to isolate the first wire layer 101 from the outside; while the shielding mesh and the modified resin make up the first dielectric layer 201 can provide better strength relative to the shielding film layer in order to provide the connection support 330. The conductor on the first line layer 101 forms an entire electromagnetic environment with the external air under the high frequency condition, so that the dielectric constant is increased (under the high frequency condition, the electric field and the magnetic field generated by the conductor on the first line layer 101 can propagate out of the page, and then form the entire electromagnetic environment with the air, and at this time, the effective dielectric constant is the combination of the dielectric constant of the substrate material and the dielectric constant of the air, that is, the dielectric constant is unstable or increased, so that the stability of the circuit is poor or the efficiency of the antenna is poor). The improved resin is an improved epoxy resin, which is applied to the FR5 type glass cloth substrate in the prior art, and will not be described in detail herein.
In the millimeter wave range, the mechanical properties of the circuit board material, such as: the thickness and consistency of thickness will have an impact on circuit performance and therefore, by maintaining consistent thicknesses of the various dielectric layers and wire layers, the mechanical properties are tuned to improve circuit performance. Also, at small wavelengths, the roughness of the conductor also affects the performance of the circuit, the average surface roughness of the rolled copper is about 0.35 μm RMS, the average surface roughness of the conventional standard electrolytic copper is about 2.0 μm RMS, and the smooth copper foil surface has less effect on conductor loss (the rougher the copper foil, the more the electromagnetic wave propagation path of the circuit will increase, and the slow wave effect is formed, so that the dielectric constant on the circuit is higher than the nominal value thereof, and further the phase delay of signal propagation is caused), thus the effect on the insertion loss is also small, and the circuit performance can be improved under high-frequency millimeter waves.
At millimeter wave frequencies, particularly at high frequencies, even if the dielectric constant of the wiring board material changes little, it may cause a change in electrical properties.
The flat open-fiber balance woven glass cloth is a glass cloth adopting a flat open-fiber weaving mode, wherein the balance means that the thickness density ratio of glass warp yarns on an X axis and weft yarns on a Y axis of glass fibers is within a certain range, and the range is about 1 to 1.05, so that certain error redundancy is provided for actual production. The flat open-fiber balanced woven glass cloth is smaller in dielectric constant and more even in glass fiber distribution compared with the glass cloth in a standard weaving mode; the glass fiber yarns generally have different geometric structures in the bundling and opening areas between the bundling and the opening areas, but the thickness of the glass fiber yarns determines whether the glass fiber yarns are balanced, namely, the change of the dielectric constant of the balanced woven glass cloth on a horizontal plane is smoother, so that the same transmission line is less influenced (the generated signal delay and phase difference are reduced) when passing, and the performances of the antenna and the transmission line are improved (the working efficiency of the antenna is mainly influenced by the dielectric constant of a material on a circuit board, and the conductor is smaller when being far away from the dielectric constant of the glass fiber, so that the working efficiency is better).
It should be noted that the purposes of the second dielectric layer 401, the seventh dielectric layer 901, the third dielectric layer 501, and the sixth dielectric layer 801 including the flat open-fiber balance woven glass cloth are: multiple layers of glass fibers are arranged between the first, second and third wire layers (for example, the second dielectric layer 401 and the third dielectric layer 501 are arranged between the first wire layer 101 and the second wire layer 110, and the sixth dielectric layer 801 and the seventh dielectric layer 901 are arranged between the second wire layer 110 and the third wire layer 120), because the multiple layers of glass fibers can lead the glass to be distributed more uniformly under the superposition effect, and the generated glass fiber effect is smaller (namely, the dielectric constant change is more gradual) than that of a single layer. And the second dielectric layer 401 and the seventh dielectric layer 901 are further filled with low-temperature co-fired ceramic particles with low dielectric constant as a combined layer, and the dielectric constant distribution on the circuit board material is more uniform by the additional material, so that the influence of the glass fiber effect under high frequency is reduced.
Specifically, as shown in fig. 1-3, the fourth dielectric layer 601 and the fifth dielectric layer 701 are low-temperature co-fired ceramic particles and modified resin composite layers. The fourth dielectric layer 601 and the fifth dielectric layer 701 serve as two dielectric layers containing the flat open-fiber balance woven glass cloth, and a transition layer between the two dielectric layers and an intermediate wire layer (the second wire layer 110) provides a good transition effect through low-temperature co-fired ceramic particles.
Because, in actual production and transportation, the flat open-fiber balance woven glass cloth is difficult to avoid deformation, and knuckle intersection areas (areas with relatively more glass fibers) and bundle opening areas (areas with relatively less glass fibers) generated by deformation can cause uneven transition of dielectric constants on a horizontal plane, and the knuckle intersection areas have higher dielectric constants than the bundle opening areas. Here, in addition to the relief by providing a plurality of glass cloths (relief is achieved by superposition), the dielectric constant distribution is further balanced by a plurality of dielectric layers (the second dielectric layer 401, the fourth dielectric layer 601) containing low-temperature co-fired ceramic particles, which act on the first wire layer 101, the second wire layer 110.
As shown in fig. 3, in the third dielectric layer 501, a first connection layer 510, a first middle layer 520, and a first connection layer 510 are sequentially arranged from top to bottom, where the first connection layer 510 is an improved resin layer, and the first middle layer 520 is a mixed layer of the improved resin layer and a flat open-fiber balance woven glass cloth;
the sixth dielectric layer 801 sequentially comprises a second connection layer 810, a second intermediate layer 820 and a second connection layer 810 from top to bottom, wherein the second connection layer 810 is an improved resin layer, and the second intermediate layer 820 is a mixed layer of the improved resin layer and flat open-fiber balance woven glass cloth;
the thickness of the first connection layer 510 is less than or equal to the thickness of the first intermediate layer 520, and the thickness of the second connection layer 810 is less than or equal to the thickness of the second intermediate layer 820.
When the third dielectric layer 501 and the sixth dielectric layer 801 are formed as a whole, the thicknesses of the third dielectric layer 501 and the sixth dielectric layer 801 are consistent with those of other layers, so that the mechanical properties of the third dielectric layer 501 and the sixth dielectric layer 801 are not greatly different; the thickness of the first and second connection layers is very thin, which is used as a connection, and the difference of the mechanical characteristics is very small, but the medium layers (such as the second medium layer 401 and the fourth medium layer 601) containing low-temperature co-fired ceramic particles on the upper side and the lower side of the smooth transition connection are connected, so that the reliability is improved, the influence on the conductor on the line layer (such as the second line layer 110) is avoided, the surface roughness of the conductor is avoided, and the influence on the circuit performance caused by the surface roughness of the circuit board material under the small wavelength is further reduced, such as: phase response and insertion loss.
It should be noted that, the circuit board is processed by laser drilling, and the micro holes 301 and the mounting holes of the sleeve 320 on the circuit board are drilled, so that the processing of the holes is ensured to have high consistency. The radio frequency chip, the antenna, the matched wiring, the resistor, the capacitor and other components arranged on the circuit board are the conventional common technology. And will not be described in detail herein. The main circuits and components on the circuit board are mainly connected to the third wire layer 120, for example: a coil for wireless charging is disposed on the third wire layer 120.
And the antenna is mounted through the base 130, so that the antenna is prevented from being directly mounted on the first dielectric layer 201, and the direct mounting is easy to cause tearing of the first dielectric layer 201 and has low connection strength; the base 130 is generally fixedly connected to the first wire layer 101, so that the bottom surface of the base is not provided with a shielding layer, and therefore, the shielding layer is disposed on the bottom surface of the mounting groove 131 in the base 130, the base 130 also plays a certain role in isolation, and the antenna is electrically connected to the first wire layer 101 through the connection terminal 132. The radio frequency chip is arranged away from the antenna, so that the mutual influence between the high-frequency millimeter wave and the high-speed digital circuit is avoided, the circuit board is prevented from being heated and concentrated on a single side surface, and the circuit board is prevented from being bent due to thermal expansion under long-time use, so that the flat open-fiber balance woven glass cloth is prevented from being further broken.
In summary, the sleeve 320 and the connection support 330 are disposed on the circuit board, so that the circuit board is mounted in an overhead manner by matching with the stud, the connection support is fixed at the same time, the first dielectric layer is prevented from being affected by fixing with glue, and the slot on the connection support can be used for connecting the conductor on the first line layer with an external circuit (transverse welding, transverse spring clamping and transverse inserting), so that the circuit board is prevented from being electrically connected by inserting when pressed after being mounted in an overhead manner, and the sleeve can protect the perforation on the circuit board.
And (dielectric constant: dk for short), the first line layer 101 and the first dielectric layer 201 are connected together through smart layout, the thicknesses of the line layers and the dielectric layers after combination are consistent, so that the mechanical characteristics of each layer are kept relatively consistent in material thickness, and the mechanical characteristics of each layer are made to approach the same under the influence of millimeter wave frequency through the consistency of the thicknesses, so that the consistent thickness which is suitable in performance and economy is obtained, and meanwhile, the influence caused by the non-consistent mechanical characteristics is avoided, such as: the difference of phase response and insertion loss is caused, and the stability of the transmission line performance is obtained; the first line layer and the second line layer are provided with two dielectric layers containing flat open-fiber balance woven glass cloth, the distribution of glass fibers is averaged by the multi-layer flat open-fiber balance woven glass cloth, the influence of glass fiber effect on the line board along with the increase of frequency or higher digital speed is reduced, the DK value of the same transmission line passing place cannot generate quite large performance difference, and the Dk on the circuit board material becomes more uniform by being matched with the low-temperature cofired ceramic particle layer with low Dk, so that the influence caused by the glass fiber effect under high frequency is reduced. The flat open-fiber balance woven glass cloth is characterized in that the thickness density ratio of glass yarns on a X, Y shaft is 1 (in ideal state, a certain redundant space is actually reserved), and knuckle intersection areas (areas with relatively more glass fibers) and bundle opening areas (areas with relatively less glass fibers) on the glass cloth in a weaving mode and specification are fewer, so that the abrupt change range of Dk values is fewer; the conductor on the wire layer can obtain a relatively ideal antenna efficiency and improve the stability under the high-frequency state under the condition of not being far away from the glass fiber, so that the distortion of the wire is lower. The practical value of the invention is greatly improved.
The foregoing examples are merely representative of one or more embodiments of the present invention and are described in more detail and are not to be construed as limiting the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of the invention should be assessed as that of the appended claims.
Claims (7)
1. A reinforced high-frequency millimeter wave hybrid circuit board, comprising: a circuit board, the circuit board comprising: the circuit board is provided with a plurality of micropores, the micropores are used for connecting the first line layer with the second line layer or the third line layer, and the micropores are used for connecting the second line layer with the third line layer;
the external member penetrates through the circuit board and is fixed on the circuit board, and a through hole is formed in the external member;
the connecting support is fixedly arranged on the circuit board, a clamping flange matched with the through hole is arranged at the bottom of the connecting support, a through connecting hole is formed in the connecting support, the connecting hole penetrates through the clamping flange and is connected with the through hole, a wire exposing groove is formed in the bottom surface of the connecting support, and the wire exposing groove is matched with a conductor on the first wire layer;
the first wire layer, the second wire layer and the third wire layer are laminated plates composed of rolled copper and are connected by taking a chlorofluoroethylene copolymer or a fluoroethylene propylene copolymer as a bonding sheet;
the thicknesses of the first line layer, the second line layer, the third line layer, the second dielectric layer, the third dielectric layer, the fourth dielectric layer, the fifth dielectric layer, the sixth dielectric layer and the seventh dielectric layer are equal;
the first medium layer is a combined layer of a shielding net and improved resin, the second medium layer and the seventh medium layer are combined layers of flat open-fiber balance woven glass cloth and low-temperature co-fired ceramic particles, and the thickness density ratio of glass warp yarns on an X axis to weft yarns on a Y axis of glass fibers in the flat open-fiber balance woven glass cloth is in the range of 1 to 1.05;
the third medium layer and the sixth medium layer are flat open-fiber balance woven glass cloth and an improved resin combination layer;
the circuit board is sequentially from top to bottom: the first dielectric layer, the first line layer, the second dielectric layer, the third dielectric layer, the fourth dielectric layer, the second line layer, the fifth dielectric layer, the sixth dielectric layer, the seventh dielectric layer, the third line layer;
the base is arranged on the upper side of the first dielectric layer, an installation groove is formed in the base, a shielding layer is arranged on the bottom surface of the installation groove, and a wiring terminal is arranged at the edge of the base;
the antenna is fixedly arranged in the mounting groove;
the radio frequency chip and the signal wiring thereof are arranged on the third wire layer, and the radio frequency chip is connected with the antenna through the micropore and the wiring terminal.
2. The enhanced high-frequency millimeter wave hybrid circuit board according to claim 1, wherein said connection support is provided with a stopper rubber wall extending toward an upper side.
3. The enhanced high-frequency millimeter wave hybrid circuit board of claim 1, wherein one end of said sleeve is fixedly connected to said third wire layer.
4. The reinforced high-frequency millimeter wave hybrid circuit board of claim 1, wherein the fourth dielectric layer and the fifth dielectric layer are low-temperature co-fired ceramic particles and modified resin composite layers.
5. The reinforced high-frequency millimeter wave hybrid circuit board of claim 1, wherein a first connecting layer, a first intermediate layer and a first connecting layer are sequentially arranged in the third dielectric layer from top to bottom, the first connecting layer is an improved resin layer, and the first intermediate layer is a mixed layer of the improved resin layer and flat open-fiber balance woven glass cloth;
the sixth medium layer is sequentially provided with a second connecting layer, a second intermediate layer and a second connecting layer from top to bottom, wherein the second connecting layer is an improved resin layer, and the second intermediate layer is a mixed layer of the improved resin layer and flat open-fiber balance woven glass cloth.
6. The enhanced high-frequency millimeter wave hybrid circuit board according to claim 5, wherein said first connection layer has a thickness less than or equal to a thickness of said first intermediate layer and said second connection layer has a thickness less than or equal to a thickness of said second intermediate layer.
7. The enhanced high-frequency millimeter wave hybrid circuit board of claim 1, wherein said circuit board is machined by laser drilling and said micro-holes and said mounting holes of said kit on said circuit board are drilled.
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|---|---|---|---|---|
| CN101258787A (en) * | 2005-07-04 | 2008-09-03 | 施韦策电子公司 | Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor |
| JP2014090027A (en) * | 2012-10-29 | 2014-05-15 | Fujitsu Ltd | Circuit board, manufacturing method for circuit board, electronic device and glass cloth |
| CN105657963A (en) * | 2014-11-14 | 2016-06-08 | 三星电机株式会社 | Insulation laminate board for printed circuit board, printed circuit board utilizing insulation laminate board and manufacturing method thereof |
| CN112566356A (en) * | 2020-11-20 | 2021-03-26 | 深圳市金晟达电子技术有限公司 | Millimeter wave radar printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2005268672A (en) * | 2004-03-22 | 2005-09-29 | Mitsubishi Electric Corp | Substrate |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101258787A (en) * | 2005-07-04 | 2008-09-03 | 施韦策电子公司 | Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor |
| JP2014090027A (en) * | 2012-10-29 | 2014-05-15 | Fujitsu Ltd | Circuit board, manufacturing method for circuit board, electronic device and glass cloth |
| CN105657963A (en) * | 2014-11-14 | 2016-06-08 | 三星电机株式会社 | Insulation laminate board for printed circuit board, printed circuit board utilizing insulation laminate board and manufacturing method thereof |
| CN112566356A (en) * | 2020-11-20 | 2021-03-26 | 深圳市金晟达电子技术有限公司 | Millimeter wave radar printed circuit board |
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