KR102026214B1 - Printed circuit board and manufacturing method thereof - Google Patents

Printed circuit board and manufacturing method thereof Download PDF

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Publication number
KR102026214B1
KR102026214B1 KR1020120147275A KR20120147275A KR102026214B1 KR 102026214 B1 KR102026214 B1 KR 102026214B1 KR 1020120147275 A KR1020120147275 A KR 1020120147275A KR 20120147275 A KR20120147275 A KR 20120147275A KR 102026214 B1 KR102026214 B1 KR 102026214B1
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KR
South Korea
Prior art keywords
layer
aluminum
circuit pattern
laminate
metal circuit
Prior art date
Application number
KR1020120147275A
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Korean (ko)
Other versions
KR20140078197A (en
Inventor
이우영
손영준
안윤호
윤재현
한준욱
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020120147275A priority Critical patent/KR102026214B1/en
Publication of KR20140078197A publication Critical patent/KR20140078197A/en
Application granted granted Critical
Publication of KR102026214B1 publication Critical patent/KR102026214B1/en

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The present invention relates to a printed circuit board and a method for manufacturing the same. In the method for manufacturing a printed circuit board according to the present invention, an aluminum circuit pattern layer is formed on each of an upper surface and a lower surface of an insulating layer to form a laminate. Roughness is formed on the surface of the layer, and the metal circuit layer is bonded to the surface on which the roughness of the aluminum circuit pattern layer is formed via the adhesive layer.

Description

Printed circuit board and its manufacturing method {PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF}

The present invention relates to a printed circuit board and a method for manufacturing the same, and more particularly, to a printed circuit board and a method for manufacturing the same that can be reduced in weight.

As the electronic industry develops, demand for miniaturization and multifunction of electronic components is increasing.

In order to miniaturize and multifunctional electronic components, high-density integration of circuit boards constituting electronic components has to be made, and in recent years, development of multilayered substrates has been actively performed.

The substrate having a multilayer structure is configured in the form of an embedded printed circuit board (embedded PCB) in which circuit elements such as active elements and passive elements and internal circuit patterns are embedded.

A printed circuit board (PCB) is a printed circuit printed on an electrically insulating substrate with a conductive material. In order to mount many kinds of electronic components on a flat plate, the mounting position of each component is determined and the components are connected. It means a circuit board which is printed by fixing a circuit line to the flat surface.

Meanwhile, an embedded printed circuit board is a PCB in which passive components such as resistors, capacitors, and inductors are embedded in the substrate, and recently, active components such as IC chips are embedded. In addition, in this sense, it is used as a term for PCB that embeds electronic components regardless of the type.

A CCL (Copper Clad Laminate) is used for the printed circuit board according to the prior art.

CCL forms copper foil on the upper and lower portions of an insulating layer composed of an insulating material coated with a thermosetting resin on glass fibers.

However, according to the prior art, since the copper foil is used on the printed circuit board, it is difficult to reduce the weight of the printed circuit board and the manufacturing cost is high.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and replaces the copper foil layer used in the copper clad laminate (CCL) of the conventional printed circuit board with an aluminum circuit pattern layer, thereby reducing the printed circuit board and reducing the manufacturing process time. To reduce it.

In the manufacturing method of the method of manufacturing a printed circuit board according to an embodiment of the present invention for solving the above problems, an aluminum circuit pattern layer is formed on the upper and lower surfaces of the insulating layer, respectively, to form a laminated plate, the aluminum circuit pattern Roughness is formed on the surface of the layer, and the metal circuit layer is bonded to the surface on which the roughness of the aluminum circuit pattern layer is formed via the adhesive layer.

According to another embodiment of the present invention, the aluminum circuit pattern layer is formed on the upper and lower surfaces of the insulating layer, respectively, during the construction of the laminate through an adhesive layer.

According to another embodiment of the present invention, when roughness is formed on the surface of the aluminum circuit pattern layer, the roughness is formed on the surface of the aluminum circuit pattern layer by plasma treatment using argon (Ar) gas. .

According to another embodiment of the present invention, a cavity and a hole are created in the laminate and a device is mounted on the generated cavity.

According to another embodiment of the present invention, via holes are processed on the mounted device, and the via holes are filled with plating to form vias connecting the device and the metal circuit layer.

According to another embodiment of the present invention, on the laminated plate on which the device is mounted, each of which is formed on the upper and lower surfaces of the second insulating layer, and includes a second aluminum circuit pattern layer having roughness on the surface thereof. A second laminated plate is further formed.

According to another embodiment of the present invention, a cavity and a hole are formed in the second laminate, and a via connecting the metal circuit layer and the element mounted in the cavity is formed.

A printed circuit board according to an embodiment of the present invention includes a laminated plate including an insulating layer and an aluminum circuit pattern layer formed on top and bottom surfaces of the insulating layer, respectively, and having roughness formed on a surface thereof; And a metal circuit layer bonded on the surface on which the roughness of the circuit pattern layer is formed through the adhesive layer.

According to another embodiment of the present invention, the adhesive layer for adhering the aluminum circuit pattern layer on the upper and lower surfaces of the insulating layer; is configured to further include.

According to another embodiment of the present invention, the laminated plate is a cavity and a hole is formed, the element mounted in the cavity; And a via connecting the device and the metal circuit layer.

According to another embodiment of the present invention, a second laminated plate comprising a second insulating layer, and a second aluminum circuit pattern layer formed on the top and bottom surfaces of the second insulating layer, respectively, the surface roughness (roughness) is formed; It is configured to further include.

According to another embodiment of the present invention, the second laminate plate is a cavity and a hole is formed, the element mounted in the cavity; And a via connecting the device and the metal circuit layer.

According to another embodiment of the present invention, the second adhesive layer for adhering the second aluminum circuit pattern layer on the upper and lower surfaces of the second insulating layer;

According to another embodiment of the present invention, the metal circuit layer is made of copper (Cu).

According to another embodiment of the present invention, the insulating layer is made of any one of prepreg and ceramic.

According to the present invention, by replacing the copper foil layer used in the CCL (Copper Clad Laminate) of the conventional printed circuit board with an aluminum circuit pattern layer, the printed circuit board is lighter, and the aluminum material has better physical properties than copper (Cu) of the copper foil layer. Because of their softness, manufacturing process time can be reduced.

1 and 2 are views for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention.

Hereinafter, with reference to the accompanying drawings will be described in detail an embodiment of the present invention. However, in describing the embodiments, when it is determined that detailed descriptions of related known functions or configurations may unnecessarily obscure the subject matter of the present invention, detailed descriptions thereof will be omitted. In addition, the size of each component in the drawings may be exaggerated for description, it does not mean the size that is actually applied.

1 and 2 are views for explaining a method of manufacturing a printed circuit board according to an embodiment of the present invention.

A method of manufacturing a printed circuit board according to an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

As shown in FIG. 1A, an aluminum circuit pattern layer 220 is formed on the top and bottom surfaces of the insulating layer 210 to form a laminate 200.

In this case, the aluminum circuit pattern layer 220 is formed by bonding to the upper and lower surfaces of the insulating layer 210 via the adhesive layer 215, respectively.

That is, in the related art, copper foil layers are formed on the top and bottom surfaces of the insulating layer 210, but according to the exemplary embodiment, the aluminum circuit pattern layer 220 is formed on the top and bottom surfaces of the insulating layer 210.

Meanwhile, since the aluminum circuit pattern layer 220 is made of aluminum and has low surface adhesiveness, the aluminum circuit pattern layer 220 may be attached to the insulating layer 210 using the adhesive layer 215.

In addition, the insulating layer 210 is made of any one of prepreg (PPG) and ceramic. Prepreg (PPG) is an intermediate substrate for fiber-reinforced composite materials, and is a molding material in which reinforcing fibers are pre-impregnated with a matrix resin. PPG is laminated, heated and pressurized to cure the resin to form a molded article. As the PPG, a thermosetting resin system such as a polymer epoxy resin can be used, and a thermoplastic resin such as polyether ketone can also be used.

When the laminated board 200 of the printed circuit board is used as the aluminum circuit pattern layer 220 as described above, the specific gravity of aluminum (Al), which is a material constituting the aluminum circuit pattern layer 220, is 2.7 to form a conventional copper foil layer. It is much lower compared to 8.9, which is the specific gravity of copper (Cu), which is about one third, so that when the printed circuit board is formed of a multilayer board, weight reduction is possible.

Thereafter, a cavity 201 and a hole 202 are formed in the laminate 200 formed as described above.

Thereafter, roughness is formed on the surface of the aluminum circuit pattern layer 220 as shown in b of FIG. 1.

In this case, when the roughness is formed, a roughness is formed on the surface of the aluminum circuit pattern layer 220 by plasma treatment using argon (Ar) gas.

Argon gas is an inert gas that accelerates to hundreds of eV when it receives electrons, thereby forming roughness in the object. Therefore, the argon gas may be accelerated to collide with the aluminum circuit pattern layer 220 to form roughness in the aluminum circuit pattern layer 220.

Thereafter, as shown in FIG. 1C, the metal circuit layer 230 is attached to the lower surface of the lower side aluminum circuit pattern layer 220 having roughness as described above through the adhesive layer 225.

In this case, a copper foil layer formed of copper (Cu) may be used as the metal circuit layer 230, and the adhesive layer 225 may be formed using prepreg (PPG).

Subsequently, as shown in FIG. 1D, the device 250 is mounted on the cavity 201 formed on the printed circuit board, and the adhesive layer 235 and the metal circuit layer 240 are pressed and joined to the upper portion thereof.

Thereafter, as shown in FIG. 1E, the second laminate 300 is formed on the laminate 200 formed as described above.

In more detail, the second laminate 300 has a second aluminum circuit pattern layer 320 attached to the upper and lower surfaces of the second insulating layer 310 via the adhesive layer 315, respectively, Roughness is formed on the surface of the aluminum circuit pattern layer 320, and then, the cavity 301 is formed, and then the device 350 is mounted on the cavity 301.

The devices 250 and 350 may be semiconductor chips, active devices, or passive devices.

The adhesive layer 335 and the metal circuit layer 340 are pressed and bonded to the upper portion of the second printed circuit board 300 formed as described above.

Subsequently, via holes 302 are formed on the laminates 200 and 300 as illustrated in FIG. 2A, and the via holes 302 are filled with plating material as shown in FIG. 2B. 303 is formed.

Accordingly, the via 303 connects the elements 250 and 350 mounted in the cavity and the metal circuit layer 340.

Thereafter, as shown in FIG. 2C, the upper metal circuit layer 340 is etched and patterned, and as shown in FIG. 2D, the protective layer 360 is etched between the metal circuit layers 340. ).

Hereinafter, the configuration of the printed circuit board according to the exemplary embodiment of the present invention will be described with reference to FIG.

The printed circuit board according to the exemplary embodiment of the present invention includes a laminate 200 and a metal circuit layer 230, and the laminate 200 includes elements 250 and vias 303.

In addition, the second laminate 300 is configured to further include, and the second laminate 300 is provided with an element 350 and the via 303.

In more detail, the laminate 200 includes an insulating layer 210 and an aluminum circuit pattern layer 220 formed on upper and lower surfaces of the insulating layer 210, and the insulating layer 210 and the aluminum circuit pattern. Layer 220 is configured to be bonded via adhesive layer 215.

Roughness is formed on the surface of the aluminum circuit pattern layer 220, and the metal circuit layers 230 and 240 are formed on the surface of the aluminum circuit pattern layer 200 via the adhesive layer 215. Attach. That is, metal circuit layers 230 and 240 are provided on the upper aluminum circuit pattern layer 200 and the lower aluminum circuit pattern layer 200, respectively.

The laminate 200 has a cavity and a hole formed therein, and an element 250 is mounted on the cavity, and the element 250 is formed on the metal circuit layer 340 formed on the upper surface of the printed circuit board by vias 303. Connected.

The second laminate 300 includes a second aluminum circuit pattern layer 320 having roughness formed on surfaces of upper and lower surfaces of the second insulating layer 310, and the second insulating layer 310 is formed. ) And the second aluminum circuit pattern layer 320 are configured to be bonded through the adhesive layer 315.

Like the laminate 200, the second laminate 300 has a cavity and a hole formed therein, and an element 350 is mounted on the cavity, and the element 350 is formed of a printed circuit board by a via 303. It is connected to the metal circuit layer 340 formed on the upper surface.

Meanwhile, the metal circuit layers 240 and 340 may be made of copper (Cu), and the insulating layers 215 and 315 may be made of any one of prepreg and ceramic.

As described above, according to the present invention, the copper foil layer used in the copper clad laminate (CCL) of the conventional printed circuit board is replaced with an aluminum circuit pattern layer, thereby reducing the weight of the printed circuit board and the aluminum material is made of copper of the copper foil layer ( Since the physical properties are lower than that of Cu), the manufacturing process time can be reduced.

In the detailed description of the invention as described above, specific embodiments have been described. However, many modifications are possible without departing from the scope of the invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined not only by the claims, but also by those equivalent to the claims.

200: laminate
201: cavity
202: hall
210: insulation layer
215: adhesive layer
220: aluminum circuit pattern layer
225: adhesive layer
230: metal circuit layer
235: adhesive layer
240: metal circuit layer
250: device
300: second laminate
301: cavity
302: hall
303: Via
310: second insulating layer
315: adhesive layer
320: second aluminum circuit pattern layer
335: adhesive layer
340: metal circuit layer
350: device

Claims (15)

A first insulating layer; And a first aluminum circuit pattern layer formed on upper and lower surfaces of the first insulating layer and having roughness formed on a surface thereof.
A first metal circuit layer bonded on a surface on which roughness of the first aluminum circuit pattern layer is formed through a first adhesive layer;
A second metal circuit layer disposed on an upper portion of the first laminate through a second adhesive layer and bonded to a surface on which roughness of the first aluminum circuit pattern layer is formed;
A second insulating layer disposed on the second metal circuit layer; And a second aluminum circuit pattern layer formed on the top and bottom surfaces of the second insulating layer and having roughness formed on a surface thereof. And
A third metal circuit layer disposed on an upper portion of the second laminate through a third adhesive layer and bonded to a surface on which roughness of the second aluminum circuit pattern layer is formed;
The first laminate is a first cavity; A first element mounted in the first cavity; A first via connecting the first element and the third metal circuit layer;
The second laminate is a second cavity; A second element mounted in the second cavity; A second via connecting the second element and the third metal circuit layer;
The first and second aluminum circuit pattern layers include a material different from the first to third metal circuit layers,
The first to third metal circuit layers include copper (Cu),
The first and second insulating layers include any one of prepreg and ceramic. The method according to claim 1,
The first laminate comprises a fourth adhesive layer for adhering the first aluminum circuit pattern layer on the upper and lower surfaces of the first insulating layer. The method according to claim 1,
The third metal circuit layer includes a first sub third metal circuit layer corresponding to the first element and a second sub third metal circuit layer corresponding to the second element,
An upper surface of the second laminate includes an open area between the first sub third metal circuit layer and the second sub third metal circuit layer,
A printed circuit board comprising a protective layer disposed on the open area. The method according to claim 1,
The roughness formed on the surface of each of the first and second aluminum circuit pattern layers is formed by a plasma treatment using argon (Ar) gas. The method according to claim 1,
The first insulating layer and the first adhesive layer is a printed circuit board comprising the same material. The method according to claim 1,
The second laminate plate includes a fifth adhesive layer for adhering the second aluminum circuit pattern layer on the upper and lower surfaces of the second insulating layer. delete delete delete delete delete delete delete delete delete
KR1020120147275A 2012-12-17 2012-12-17 Printed circuit board and manufacturing method thereof KR102026214B1 (en)

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Application Number Priority Date Filing Date Title
KR1020120147275A KR102026214B1 (en) 2012-12-17 2012-12-17 Printed circuit board and manufacturing method thereof

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KR20140078197A KR20140078197A (en) 2014-06-25
KR102026214B1 true KR102026214B1 (en) 2019-09-27

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102355023B1 (en) * 2015-03-30 2022-01-25 엘지이노텍 주식회사 Printed circuit board
KR102435124B1 (en) 2015-10-07 2022-08-24 삼성전기주식회사 Printed circuit board and method of manufacturing the same
KR102497595B1 (en) 2016-01-05 2023-02-08 삼성전자주식회사 Package substrate, methods for fabricating the same and package device including the package substrate
KR20210007217A (en) * 2019-07-10 2021-01-20 삼성전자주식회사 An electronic device including an interposer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183283A (en) * 1998-12-18 2000-06-30 Denso Corp Laminated-type circuit module and its manufacturing method
KR100648971B1 (en) * 2005-10-05 2006-11-27 삼성전기주식회사 Manufacturing method for embedded printed circuit board

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100996914B1 (en) * 2008-06-19 2010-11-26 삼성전기주식회사 Chip embedded printed circuit board and manufacturing method thereof
KR20110078835A (en) * 2009-12-31 2011-07-07 주식회사 두산 Methode for preparing printed circuit board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000183283A (en) * 1998-12-18 2000-06-30 Denso Corp Laminated-type circuit module and its manufacturing method
KR100648971B1 (en) * 2005-10-05 2006-11-27 삼성전기주식회사 Manufacturing method for embedded printed circuit board

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