CN102946698A - Method for preventing lamination deviation in plate superposing method - Google Patents
Method for preventing lamination deviation in plate superposing method Download PDFInfo
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- CN102946698A CN102946698A CN2012104260403A CN201210426040A CN102946698A CN 102946698 A CN102946698 A CN 102946698A CN 2012104260403 A CN2012104260403 A CN 2012104260403A CN 201210426040 A CN201210426040 A CN 201210426040A CN 102946698 A CN102946698 A CN 102946698A
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Abstract
The invention provides a method for preventing a lamination deviation in a plate superposing method. The method comprises the steps as follows: adding a first copper foil and/or scrapped base material and a second copper foil and/or scrapped base material onto the upper surface of a superposed plate piece or unit in an uppermost layer and the lower surface of the superposed plate piece or unit in a lowermost layer respectively, and windowing in the positions of the rivet holes of the first copper foil and/or scrapped base material and the second copper foil and/or scrapped base material; filling up a first prepreg and a second prepreg on the first copper foil and/or scrapped base material and beneath the second copper foil and/or scrapped base material respectively, and windowing in the positions of the rivet holes of the first prepreg and the second prepreg; riveting superposed plates, the copper foils and/or scrapped base materials and the prepregs by utilizing rivets; adding the copper foils or separation membranes onto an upper surface layer and a lower surface layer of the riveted structure, and carrying out plate superposing and die setting; pressing the structure after plate superposing and die setting; and after pressing, dismounting liner plates.
Description
Technical field
The present invention relates to printed circuit board and make the field, more particularly, the present invention relates to a kind of method that prevents cladding plate method lamination off normal.
Background technology
Comprise in the folded structure of multilayer printed board lamination and cover paper tinsel method and cladding plate method, cover the paper tinsel method namely during layer press-fitting mould the top layer be Copper Foil, the cladding plate method namely during layer press-fitting mould the top layer be monolithic or the up and down blind unit of pressing.Fig. 1 schematically shows and covers the folded structure of paper tinsel method.As shown in Figure 1, the top and the bottom of the prepreg PP1 that stacks gradually, central layer core1, prepreg PP2, central layer core2, prepreg PP3, central layer core3, prepreg PP3 are coated with respectively Copper Foil C1 and C2.Fig. 2 schematically shows the folded structure of cladding plate method.As shown in Figure 2, central layer core1, prepreg PP1, central layer core2, prepreg PP2, central layer core3, prepreg PP3, central layer core4 stack gradually, the top layer when wherein the lower surface of the upper surface of central layer core1 and central layer core4 is layer press-fitting mould.
Some have the printed board of special impedance designing requirement, to the interlayer thick harsh requirement that proposed that is situated between, the cladding plate method since up and down the thick uniformity of Jie of monolithic itself be better than covering the folded structure of paper tinsel method so that before the printed board system during design preferred cladding plate method fold structure; Also or some buried blind via plate of pressing repeatedly, up and down pressing of blind unit has formed the folded structure of similar cladding plate method during the through hole pressing.The folded structure of such cladding plate adopts rivet or hot melt location pressing mode, position of positioning hole harmomegathus at all levels is consistent up and down in the time of must guaranteeing riveted or hot melt, otherwise can't riveted, but the normal top layer monolithic or the relative middle single-slice in unit or unit found more inside contracts after the pressing, the general alignment degree is not good after causing lamination, during follow-up boring even broken dish, affect thus product reliability.
At present, usually adopt different harmomegathus to put in advance to realize that the harmomegathus of each monolithic after the pressing or each unit is consistent, i.e. harmomegathus guarantees thus after the pressing that less times greater than middle single-slice or unit each monolithic or each unit harmomegathus are consistent before top layer monolithic or the unit pressing.
If monolithic or unit rivet hole harmomegathus and middle single-slice or unit are inconsistent up and down, difficulty during riveted, and X-Ray(X ray behind the riveted) check and namely can find the off normal problem; If adopt all rivet hole position harmomegathus consistent, and hardboard monolithic or unit harmomegathus are slightly larger than middle single-slice or unit up and down, plate face centre position may meet the demands by Aligning degree after the pressing, but rivet hole place, hot melt place before because of pressing before the locked and pressing Aligning degree relatively poor, these position alignment degree are not good after the pressing, and the off normal problem is generally still arranged.
Fig. 3 schematically shows the folded structure of the cladding plate method of having arranged conductor pad, wherein, the upper surface L7 of the upper surface L5 of the upper surface L3 of the base material of the base material B(insulating barrier of central layer core1) lower surface L2, central layer core2 and the base material of lower surface L4, central layer core3 and the base material of lower surface L6, central layer core4 has all arranged conductor pad P, and follow-up boring K will pass these conductor pad P.The lower surface L8 of the upper surface L1 of the base material of central layer core1 and the base material of central layer core3 is the arrangement of conductors pad not.
Fig. 4 schematically shows the folded structure of the good cladding plate method of level to level alignment degree, and Fig. 5 schematically shows the folded structure of the not good cladding plate method of level to level alignment degree.As shown in Figure 5, not good with bottom conductor pad P and other conductor pad P Aligning degree topmost.
Summary of the invention
Technical problem to be solved by this invention is for there being defects in the prior art, a kind of method that prevents cladding plate method lamination off normal is provided, mainly solves the problem that the cladding plate method printed board pressing process mesexine monolithic comprise Rigid Flex, rigid plate, different plates mixed pressure plate and buried blind via plate or the relative middle single-slice in unit or unit more inside contract.
According to a first aspect of the invention, a kind of method that prevents cladding plate method lamination off normal is provided, it comprises: first step, be used for for the lamination that comprises the first central layer to the n central layer, lower surface in the upper surface of the superiors' superimposition plate monolithic or unit and undermost superimposition plate monolithic or unit adds respectively the first Copper Foil and/or scraps base material and the second Copper Foil and/or scrap base material, at the first Copper Foil and/or scrap base material and window in the second Copper Foil and/or the rivet hole position of scrapping base material; Second step, be used for the first Copper Foil and/or scrap above the base material and the second Copper Foil and/or scrap base material below fill up respectively the first prepreg and the second prepreg, window in the rivet hole position of the first prepreg and the second prepreg; Third step is used for utilizing rivet will comprise lamination, first Copper Foil of the first central layer to the n central layer and/or scraps base material and the second Copper Foil and/or scrap base material, the first prepreg and the second prepreg and rivet together; The 4th step is used for adding respectively the first Copper Foil or diffusion barrier and the second Copper Foil or diffusion barrier on the up and down top layer by closing-up structure together, then carries out lamination and dress mould; The 5th step is used for the structure after lamination and the dress mould is carried out pressing; The 6th step is used for dismantling after pressing and accompanies plate.
Preferably, in first step, the first Copper Foil and/or scrap base material and the second Copper Foil and/or scrap base material window the size consistent with rivet diameter or slightly large.
Preferably, in second step, the size of windowing of the first prepreg and the second prepreg is consistent with rivet diameter or slightly large.
Preferably, the material that the material that the first prepreg and the second prepreg are identical with the prepreg use between the first central layer to the n central layer or pressing heating curve approach.
Preferably, the described method of cladding plate method lamination off normal that prevents is for the manufacture of Rigid Flex, rigid plate, different plates mixed pressure plate and buried blind via plate.
According to a second aspect of the invention, a kind of method that prevents cladding plate method lamination off normal is provided, it comprises: first step, be used for for the lamination that comprises the first central layer to the n central layer, lower surface in the upper surface of the superiors' superimposition plate monolithic or unit and undermost superimposition plate monolithic or unit adds respectively first to be scrapped substrate layer and second and scraps substrate layer, and scraps substrate layer and second first and scrap the rivet hole position of substrate layer and window; Second step is used for will comprising that by rivet the lamination of the first central layer to the n central layer scraps substrate layer and second with first and scrap the substrate layer riveted; Third step is used for underlay sheet metal on by the up and down top layer of closing-up structure together, then carries out lamination and fills mould; The 4th step is used for the structure after lamination and the dress mould is carried out pressing; The 5th step is used for dismantling after pressing and accompanies plate.
Preferably, in first step, first scrap substrate layer and second scrap substrate layer window the size consistent with rivet diameter or slightly large.
Preferably, in third step, described sheet metal is that aluminium flake or other Type C TE are greater than the sheet metal of Copper Foil.
Preferably, the described method of cladding plate method lamination off normal that prevents is for the manufacture of Rigid Flex, rigid plate, different plates mixed pressure plate and buried blind via plate.
Thus, the method of cladding plate method lamination off normal that prevents according to the present invention can solve the relative middle single-slice of pressing process mesexine monolithic or unit of the cladding plate method printed board that comprises Rigid Flex, rigid plate, different plates mixed pressure plate and buried blind via plate or the problem that the unit more inside contracts, so that harmomegathus is basically identical in all internal layer pressing processes, avoid the interlayer off normal, be specially adapted to new material, new folded structure and without the prior situation of harmomegathus empirical data.
Description of drawings
By reference to the accompanying drawings, and by with reference to following detailed description, will more easily to the present invention more complete understanding be arranged and more easily understand its advantage of following and feature, wherein:
Fig. 1 schematically shows and covers the folded structure of paper tinsel method.
Fig. 2 schematically shows the folded structure of cladding plate method.
Fig. 3 schematically shows the folded structure of the cladding plate method of having arranged conductor pad.
Fig. 4 schematically shows the folded structure of the good cladding plate method of level to level alignment degree.
Fig. 5 schematically shows the folded structure of the not good cladding plate method of level to level alignment degree.
Fig. 6 schematically shows the flow chart according to the method for the cladding plate method that the prevents lamination off normal of first embodiment of the invention.
Fig. 7 schematically shows the schematic diagram according to the method for the cladding plate method that the prevents lamination off normal of first embodiment of the invention.
Fig. 8 schematically shows the flow chart according to the method for the cladding plate method that the prevents lamination off normal of second embodiment of the invention.
Fig. 9 schematically shows the schematic diagram according to the method for the cladding plate method that the prevents lamination off normal of second embodiment of the invention.
Need to prove, accompanying drawing is used for explanation the present invention, and unrestricted the present invention.Note, the accompanying drawing of expression structure may not be to draw in proportion.And in the accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention more clear and understandable, below in conjunction with specific embodiments and the drawings content of the present invention is described in detail.
The＜the first embodiment 〉
Fig. 6 schematically shows the flow chart according to the method for the cladding plate method that the prevents lamination off normal of first embodiment of the invention.Fig. 7 schematically shows the schematic diagram according to the method for the cladding plate method that the prevents lamination off normal of first embodiment of the invention.
Specifically, as shown in Figure 6 and Figure 7, comprise according to the method for the cladding plate method that the prevents lamination off normal of first embodiment of the invention:
First step S1: for the lamination that comprises the first central layer core01 to the n central layer core0n (n is the integer greater than 1), lower surface L2n in the upper surface L1 of the superiors' superimposition plate monolithic or unit and undermost superimposition plate monolithic or unit add respectively the first Copper Foil and/or scrap base material W1 and the second Copper Foil and/or scrap base material W2(scrap the base material cupric or not cupric all can), Copper Foil and/or scrap base material W1 and W2 windows (preferably, window size consistent with rivet diameter or slightly large) to make things convenient for follow-up rivet to pass in the rivet hole position.
Second step S2: the first Copper Foil and/or scrap above the base material W1 and the second Copper Foil and/or scrap base material W2 below fill up respectively the first prepreg PP01 and the second prepreg PP02, prepreg PP01 and PP02 window in the rivet hole position too (preferably, window size consistent with rivet diameter or slightly large).
Third step S3: utilize rivet D1 and D2 and/or to scrap base material W1 and the second Copper Foil and/or scrap base material W2, the first prepreg PP01 and the second prepreg PP02 rivets together by the lamination, the first Copper Foil that comprise the first central layer core01 to the n central layer core0n.
Wherein, according to the folded structure of lamination, the prepreg (i.e. the first prepreg PP01 and the second prepreg PP02) of accompanying plate to use try one's best with formal flaggy between prepreg (i.e. prepreg between the first central layer core01 to the n central layer core0n) consistent.In other words, preferably, the material that the material that the first prepreg PP01 and the second prepreg PP02 are identical with the prepreg use between the first central layer core01 to the n central layer core0n or pressing heating curve approach.
The 4th step S4: add respectively the first Copper Foil or diffusion barrier W3 and the second Copper Foil or diffusion barrier W4 on the up and down top layer of the structure that rivets together by rivet D1 and D2, then carry out lamination and dress mould.
The 5th step S5: the structure after lamination and the dress mould is carried out pressing.
The 6th step S6: plate is accompanied in dismounting after pressing, can directly tear off this moment the top layer accompany plate (the first Copper Foil or diffusion barrier W3 and the second Copper Foil or diffusion barrier W4, the first prepreg PP01 and the second prepreg PP02 and the first Copper Foil and/or scrap base material W1 and the second Copper Foil and/or scrap base material W2) get final product; Do not have prepreg owing to accompanying about plate and the cladding plate between monolithic or the unit, can not be bonded together.
Thus, method according to the cladding plate method that the prevents lamination off normal of first embodiment of the invention can solve the relative middle single-slice of pressing process mesexine monolithic or unit of the cladding plate method printed board that comprises Rigid Flex, rigid plate, different plates mixed pressure plate and buried blind via plate or the problem that the unit more inside contracts, so that harmomegathus is basically identical in all internal layer pressing processes, avoid the interlayer off normal, be specially adapted to new material, new folded structure and without the prior situation of harmomegathus empirical data.
The＜the second embodiment 〉
Fig. 8 schematically shows the flow chart according to the method for the cladding plate method that the prevents lamination off normal of second embodiment of the invention.Fig. 9 schematically shows the schematic diagram according to the method for the cladding plate method that the prevents lamination off normal of second embodiment of the invention.
In the method according to the cladding plate method that the prevents lamination off normal of second embodiment of the invention, can cancel above-mentioned prepreg and top layer Copper Foil of accompanying in the plate.
Specifically, such as Fig. 8 and shown in Figure 9, comprise according to the method for the cladding plate method that the prevents lamination off normal of second embodiment of the invention:
First step S01: for the lamination that comprises the first central layer core01 to the n central layer core0n (n is the integer greater than 1), lower surface L2n in the upper surface L1 of the superiors' superimposition plate monolithic or unit and undermost superimposition plate monolithic or unit adds respectively first and scraps substrate layer W01 and second and scrap substrate layer W02, and scrap the rivet hole position that substrate layer W01 and second scraps substrate layer W02 first and window, pass to make things convenient for rivet.
Wherein, scrap the base material cupric or not cupric all can.
Preferably, first scrap substrate layer W01 and second scrap substrate layer W02 window the size consistent with rivet diameter or slightly large.
Second step S02: the lamination that will comprise the first central layer core01 to the n central layer core0n by rivet is scrapped substrate layer W01 and second with first and is scrapped substrate layer W02 riveted.
Third step S03: underlay sheet metal (being preferably aluminium flake) on by the up and down top layer of closing-up structure together, then carry out lamination and dress mould.
The 4th step S04: the structure after lamination and the dress mould is carried out pressing.
The 5th step S05: plate is accompanied in dismounting after pressing, takes off the sheet metal of underlay, and can directly tear the top layer off and accompany plate (first scraps substrate layer W01 and second scraps substrate layer W02) to get final product this moment; Do not have prepreg owing to accompanying about plate and the cladding plate between monolithic or the unit, can not be bonded together.
Thus, method according to the cladding plate method that the prevents lamination off normal of second embodiment of the invention can solve the relative middle single-slice of pressing process mesexine monolithic or unit of the cladding plate method printed board that comprises Rigid Flex, rigid plate, different plates mixed pressure plate and buried blind via plate or the problem that the unit more inside contracts, so that harmomegathus is basically identical in all internal layer pressing processes, avoid the interlayer off normal, be specially adapted to new material, new folded structure and without the prior situation of harmomegathus empirical data.
In addition, need to prove, unless otherwise indicated, otherwise the term in the specification " first ", " second ", " the 3rd " etc. describe each assembly of only being used for distinguishing specification, element, step etc., rather than are used for logical relation between each assembly of expression, element, the step or ordinal relation etc.
Be understandable that, although the present invention with the preferred embodiment disclosure as above, yet above-described embodiment is not to limit the present invention.For any those of ordinary skill in the art, do not breaking away from the technical solution of the present invention scope situation, all can utilize the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention according to any simple modification, equivalent variations and the modification that technical spirit of the present invention is done above embodiment, all still belongs in the scope of technical solution of the present invention protection.
Claims (9)
1. method that prevents cladding plate method lamination off normal is characterized in that comprising:
First step, be used for for the lamination that comprises the first central layer to the n central layer, lower surface in the upper surface of the superiors' superimposition plate monolithic or unit and undermost superimposition plate monolithic or unit adds respectively the first Copper Foil and/or scraps base material and the second Copper Foil and/or scrap base material, at the first Copper Foil and/or scrap base material and window in the second Copper Foil and/or the rivet hole position of scrapping base material;
Second step, be used for the first Copper Foil and/or scrap above the base material and the second Copper Foil and/or scrap base material below fill up respectively the first prepreg and the second prepreg, window in the rivet hole position of the first prepreg and the second prepreg;
Third step is used for utilizing rivet will comprise lamination, first Copper Foil of the first central layer to the n central layer and/or scraps base material and the second Copper Foil and/or scrap base material, the first prepreg and the second prepreg and rivet together;
The 4th step is used for adding respectively the first Copper Foil or diffusion barrier and the second Copper Foil or diffusion barrier on the up and down top layer by closing-up structure together, then carries out lamination and dress mould;
The 5th step is used for the structure after lamination and the dress mould is carried out pressing;
The 6th step is used for dismantling after pressing and accompanies plate.
2. the method that prevents cladding plate method lamination off normal according to claim 1 is characterized in that, in first step, the first Copper Foil and/or scrap base material and the second Copper Foil and/or scrap base material window the size consistent with rivet diameter or slightly large.
3. the method that prevents cladding plate method lamination off normal according to claim 1 and 2 is characterized in that, in second step, the size of windowing of the first prepreg and the second prepreg is consistent with rivet diameter or slightly large.
4. the method that prevents cladding plate method lamination off normal according to claim 1 and 2 is characterized in that, the material that the material that the first prepreg and the second prepreg are identical with the prepreg use between the first central layer to the n central layer or pressing heating curve approach.
5. the method that prevents cladding plate method lamination off normal according to claim 1 and 2 is characterized in that, the described method of cladding plate method lamination off normal that prevents is for the manufacture of Rigid Flex, rigid plate, different plates mixed pressure plate and buried blind via plate.
6. method that prevents cladding plate method lamination off normal is characterized in that comprising:
First step, be used for for the lamination that comprises the first central layer to the n central layer, lower surface in the upper surface of the superiors' superimposition plate monolithic or unit and undermost superimposition plate monolithic or unit adds respectively first to be scrapped substrate layer and second and scraps substrate layer, and scraps substrate layer and second first and scrap the rivet hole position of substrate layer and window;
Second step is used for will comprising that by rivet the lamination of the first central layer to the n central layer scraps substrate layer and second with first and scrap the substrate layer riveted;
Third step is used for underlay sheet metal on by the up and down top layer of closing-up structure together, then carries out lamination and fills mould;
The 4th step is used for the structure after lamination and the dress mould is carried out pressing;
The 5th step is used for dismantling after pressing and accompanies plate.
7. the method that prevents cladding plate method lamination off normal according to claim 1 and 2 is characterized in that, in first step, first scrap substrate layer and second scrap substrate layer window the size consistent with rivet diameter or slightly large.
8. the method that prevents cladding plate method lamination off normal according to claim 1 and 2 is characterized in that, in third step, described sheet metal is that aluminium flake or other Type C TE are greater than the sheet metal of Copper Foil.。
9. the method that prevents cladding plate method lamination off normal according to claim 1 and 2 is characterized in that, the described method of cladding plate method lamination off normal that prevents is for the manufacture of Rigid Flex, rigid plate, different plates mixed pressure plate and buried blind via plate.
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| CN103561548A (en) * | 2013-11-20 | 2014-02-05 | 广东生益科技股份有限公司 | Method for relieving plate pressing winkles at rivet positions of multi-layer plate |
| CN103906379A (en) * | 2014-02-28 | 2014-07-02 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN103987194A (en) * | 2014-05-04 | 2014-08-13 | 奥士康精密电路（惠州）有限公司 | Method for controlling expansion and shrinkage of lamination of multiple layers of boards |
| CN105163528A (en) * | 2015-09-22 | 2015-12-16 | 惠州中京电子科技股份有限公司 | Riveting method and riveting structure for lamination of multilayer PCB |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
| CN105472911A (en) * | 2014-09-12 | 2016-04-06 | 深南电路有限公司 | Lamination positioning and detecting method |
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
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| CN103561548A (en) * | 2013-11-20 | 2014-02-05 | 广东生益科技股份有限公司 | Method for relieving plate pressing winkles at rivet positions of multi-layer plate |
| CN103561548B (en) * | 2013-11-20 | 2016-09-14 | 广东生益科技股份有限公司 | Improve the method for pressing plate wrinkle at multi-layer sheet rivet location |
| CN103906379B (en) * | 2014-02-28 | 2017-01-25 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
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| CN105472911A (en) * | 2014-09-12 | 2016-04-06 | 深南电路有限公司 | Lamination positioning and detecting method |
| CN105472911B (en) * | 2014-09-12 | 2018-03-20 | 深南电路有限公司 | One kind lamination positioning and detection method |
| CN105163528A (en) * | 2015-09-22 | 2015-12-16 | 惠州中京电子科技股份有限公司 | Riveting method and riveting structure for lamination of multilayer PCB |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
| CN105392304B (en) * | 2015-10-21 | 2017-12-05 | 胜宏科技（惠州）股份有限公司 | A kind of circuit board pressing method |
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
| CN106163136A (en) * | 2016-07-01 | 2016-11-23 | 业成光电（深圳）有限公司 | Prevent the manufacture method of sensing circuit plate and flexible PCB pressing dislocation |
| CN106163136B (en) * | 2016-07-01 | 2019-04-12 | 业成光电（深圳）有限公司 | Prevent sensing circuit plate and flexible circuit board from pressing the manufacturing method of dislocation |
| CN107493650A (en) * | 2017-08-22 | 2017-12-19 | 景旺电子科技(龙川)有限公司 | A kind of automotive electronics high-frequency multi-layer circuit board laminated construction and process for pressing |
| CN112689400A (en) * | 2020-11-13 | 2021-04-20 | 奥士康科技股份有限公司 | Manufacturing method of HDI board blind hole |
| CN112689400B (en) * | 2020-11-13 | 2022-07-12 | 奥士康科技股份有限公司 | Manufacturing method of HDI board blind hole |
| CN113056120A (en) * | 2021-02-06 | 2021-06-29 | 深圳市昶东鑫线路板有限公司 | Lamination method for preventing high-rise board from layer deviation |
| CN113163627A (en) * | 2021-03-29 | 2021-07-23 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
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