CN102946698B - Method for preventing lamination deviation in plate superposing method - Google Patents
Method for preventing lamination deviation in plate superposing method Download PDFInfo
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- CN102946698B CN102946698B CN201210426040.3A CN201210426040A CN102946698B CN 102946698 B CN102946698 B CN 102946698B CN 201210426040 A CN201210426040 A CN 201210426040A CN 102946698 B CN102946698 B CN 102946698B
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Abstract
The invention provides a method for preventing a lamination deviation in a plate superposing method. The method comprises the steps as follows: adding a first copper foil and/or scrapped base material and a second copper foil and/or scrapped base material onto the upper surface of a superposed plate piece or unit in an uppermost layer and the lower surface of the superposed plate piece or unit in a lowermost layer respectively, and windowing in the positions of the rivet holes of the first copper foil and/or scrapped base material and the second copper foil and/or scrapped base material; filling up a first prepreg and a second prepreg on the first copper foil and/or scrapped base material and beneath the second copper foil and/or scrapped base material respectively, and windowing in the positions of the rivet holes of the first prepreg and the second prepreg; riveting superposed plates, the copper foils and/or scrapped base materials and the prepregs by utilizing rivets; adding the copper foils or separation membranes onto an upper surface layer and a lower surface layer of the riveted structure, and carrying out plate superposing and die setting; pressing the structure after plate superposing and die setting; and after pressing, dismounting liner plates.
Description
Technical field
The present invention relates to printed circuit board and manufacture field, more particularly, the present invention relates to a kind of method preventing cladding plate method lamination off normal.
Background technology
Multilayer printed board lamination is folded structure and is comprised and cover paper tinsel method and cladding plate method, cover paper tinsel method and lamination die-filling time top layer be Copper Foil, cladding plate method and lamination die-filling time top layer be the upper and lower blind unit of monolithic or pressing.Fig. 1 schematically shows and covers paper tinsel method and fold structure.As shown in Figure 1, the top and the bottom of the prepreg PP1 stacked gradually, central layer core1, prepreg PP2, central layer core2, prepreg PP3, central layer core3, prepreg PP3 are coated with Copper Foil C1 and C2 respectively.Fig. 2 schematically shows cladding plate method and folds structure.As shown in Figure 2, central layer core1, prepreg PP1, central layer core2, prepreg PP2, central layer core3, prepreg PP3, central layer core4 stack gradually, wherein the upper surface of central layer core1 and the lower surface of central layer core4 be lamination die-filling time top layer.
Some have the printed board of special impedance designing requirement, and being situated between to interlayer thickly proposes harsh requirement, and cladding plate method folds structure because the thick uniformity of Jie of upper and lower monolithic itself is better than covering paper tinsel method, and when designing before making printed board system, preferred cladding plate method folds structure; Also or the buried blind via plate of some repeatedly pressing, the pressing of upper and lower blind unit, defines similar cladding plate method and folds structure during through hole pressing.Such cladding plate is folded structure and is adopted rivet or hot melt location pressing mode, when must ensure riveted or hot melt, upper and lower position of positioning hole harmomegathus at all levels is consistent, otherwise cannot riveted, but often find after pressing that top layer monolithic or the relative middle single-slice of unit or unit more inside contract, after causing lamination, general alignment degree is not good, during follow-up boring, even broken dish, affects product reliability thus.
At present, after usually adopting different harmomegathus to put to realize pressing in advance, the harmomegathus of each monolithic or each unit is consistent, namely before top layer monolithic or unit pressing harmomegathus less times greater than middle single-slice or unit, to ensure thus after pressing each monolithic or each unit harmomegathus consistent.
If up and down monolithic or unit rivet hole harmomegathus and middle single-slice or unit inconsistent, more difficult during riveted, and X-Ray(X ray after riveted) namely inspection can find deviation problem; Consistent according to all rivet hole positions harmomegathus, and up and down hardboard monolithic or unit harmomegathus than middle single-slice or unit slightly large, after pressing, centre position, plate face may meet the demands by Aligning degree, but rivet hole place, hot melt place because of locked before pressing and before pressing Aligning degree poor, after pressing, these position alignment degree are not good, generally still have deviation problem.
Fig. 3 schematically shows the cladding plate method arranging conductor pad and folds structure, wherein, the base material B(insulating barrier of central layer core1) lower surface L2, the upper surface L3 of base material of central layer core2 and lower surface L4, the upper surface L5 of base material of central layer core3 and lower surface L6, central layer core4 the upper surface L7 of base material all arrange conductor pad P, follow-up boring K will through these conductor pad P.The non-arrangement of conductors pad of lower surface L8 of the upper surface L1 of the base material of central layer core1 and the base material of central layer core3.
The cladding plate method that Fig. 4 schematically shows level to level alignment degree good folds structure, and the cladding plate method that Fig. 5 schematically shows level to level alignment degree not good folds structure.As shown in Figure 5, conductor pad P topmost and bottom and other conductor pad P Aligning degree not good.
Summary of the invention
Technical problem to be solved by this invention is for there is above-mentioned defect in prior art, a kind of method preventing cladding plate method lamination off normal is provided, mainly solves the problem that the cladding plate method printed board bonding processes mesexine monolithic comprising Rigid Flex, rigid plate, different plates mixed-compression board and buried blind via plate or the relative middle single-slice of unit or unit more inside contract.
According to a first aspect of the invention, provide a kind of method preventing cladding plate method lamination off normal, it comprises: first step, for for the lamination comprising the first central layer to the n-th central layer, add the first Copper Foil respectively at the superiors' superimposition plate monolithic or the upper surface of unit and the lower surface of undermost superimposition plate monolithic or unit and/or scrap base material and the second Copper Foil and/or scrap base material, windowing at the first Copper Foil and/or the rivet hole position of scrapping base material and the second Copper Foil and/or scrapping base material; Second step, for the first Copper Foil and/or scrap above base material and the second Copper Foil and/or scrap base material below pad the first prepreg and the second prepreg respectively, window in the rivet hole position of the first prepreg and the second prepreg; Third step, will comprise lamination, first Copper Foil of the first central layer to the n-th central layer for utilizing rivet and/or scrap base material and the second Copper Foil and/or scrap base material, the first prepreg and the second prepreg and rivet together; 4th step, for adding the first Copper Foil or diffusion barrier and the second Copper Foil or diffusion barrier respectively in the upper layer by closing-up structure together, then carries out lamination and die-filling; 5th step, for lamination and die-filling after structure carry out pressing; 6th step, accompanies plate for dismounting after pressing.
Preferably, in a first step, the first Copper Foil and/or scrap base material and the second Copper Foil and/or scrap the size of windowing of base material consistent with rivet diameter or slightly large.
Preferably, in the second step, the first prepreg is consistent with rivet diameter or slightly large with the size of windowing of the second prepreg.
Preferably, the first prepreg and the prepreg between the second prepreg with the first central layer to the n-th central layer use identical material or the close material of pressing heating curve.
Preferably, prevent the method for cladding plate method lamination off normal for the manufacture of Rigid Flex, rigid plate, different plates mixed-compression board and buried blind via plate described in.
According to a second aspect of the invention, provide a kind of method preventing cladding plate method lamination off normal, it comprises: first step, for for the lamination comprising the first central layer to the n-th central layer, add first respectively at the superiors' superimposition plate monolithic or the upper surface of unit and the lower surface of undermost superimposition plate monolithic or unit to scrap substrate layer and second and scrap substrate layer, and scrap first the rivet hole position that substrate layer and second scraps substrate layer and window; Second step, scraps riveted together with substrate layer for by rivet the lamination and first comprising the first central layer to the n-th central layer being scrapped substrate layer and second; Third step, for padding sheet metal up and down in the upper layer by closing-up structure together, then performs lamination and die-filling; 4th step, for lamination and die-filling after structure carry out pressing; 5th step, accompanies plate for dismounting after pressing.
Preferably, in a first step, first scraps substrate layer and second to scrap the size of windowing of substrate layer consistent with rivet diameter or slightly large.
Preferably, in third step, described sheet metal is the sheet metal that aluminium flake or other Type C TE are greater than Copper Foil.
Preferably, prevent the method for cladding plate method lamination off normal for the manufacture of Rigid Flex, rigid plate, different plates mixed-compression board and buried blind via plate described in.
Thus, the problem that the bonding processes mesexine monolithic preventing the method for cladding plate method lamination off normal from can solve the cladding plate method printed board comprising Rigid Flex, rigid plate, different plates mixed-compression board and buried blind via plate according to of the present invention or the relative middle single-slice of unit or unit more inside contract, make harmomegathus in all internal layer bonding processes basically identical, avoid interlayer off normal, be specially adapted to new material, new folded structure and without the situation of prior harmomegathus empirical data.
Accompanying drawing explanation
By reference to the accompanying drawings, and by reference to detailed description below, will more easily there is more complete understanding to the present invention and more easily understand its adjoint advantage and feature, wherein:
Fig. 1 schematically shows and covers paper tinsel method and fold structure.
Fig. 2 schematically shows cladding plate method and folds structure.
Fig. 3 schematically shows the cladding plate method arranging conductor pad and folds structure.
The cladding plate method that Fig. 4 schematically shows level to level alignment degree good folds structure.
The cladding plate method that Fig. 5 schematically shows level to level alignment degree not good folds structure.
Fig. 6 schematically shows the flow chart preventing the method for cladding plate method lamination off normal according to a first embodiment of the present invention.
Fig. 7 schematically shows the schematic diagram preventing the method for cladding plate method lamination off normal according to a first embodiment of the present invention.
Fig. 8 schematically shows the flow chart preventing the method for cladding plate method lamination off normal according to a second embodiment of the present invention.
Fig. 9 schematically shows the schematic diagram preventing the method for cladding plate method lamination off normal according to a second embodiment of the present invention.
It should be noted that, accompanying drawing is for illustration of the present invention, and unrestricted the present invention.Note, represent that the accompanying drawing of structure may not be draw in proportion.Further, in accompanying drawing, identical or similar element indicates identical or similar label.
Embodiment
In order to make content of the present invention clearly with understandable, below in conjunction with specific embodiments and the drawings, content of the present invention is described in detail.
< first embodiment >
Fig. 6 schematically shows the flow chart preventing the method for cladding plate method lamination off normal according to a first embodiment of the present invention.Fig. 7 schematically shows the schematic diagram preventing the method for cladding plate method lamination off normal according to a first embodiment of the present invention.
Specifically, as shown in Figure 6 and Figure 7, the method for cladding plate method lamination off normal that prevents according to a first embodiment of the present invention comprises:
First step S1: for comprise the first central layer core01 to the n-th central layer core0n lamination (n be greater than 1 integer), add the first Copper Foil respectively at the superiors' superimposition plate monolithic or the upper surface L1 of unit and the lower surface L2n of undermost superimposition plate monolithic or unit and/or scrap base material W1 and the second Copper Foil and/or scrap base material W2(and scrap base material cupric or not cupric), Copper Foil and/or scrap base material W1 and W2 and window (size of preferably, windowing is consistent with rivet diameter or slightly large) in rivet hole position to facilitate follow-up rivet to pass.
Second step S2: the first Copper Foil and/or scrap above base material W1 and the second Copper Foil and/or scrap base material W2 below pad the first prepreg PP01 and the second prepreg PP02 respectively, prepreg PP01 and PP02 windows in rivet hole position too (size of preferably, windowing is consistent with rivet diameter or slightly large).
Third step S3: utilize rivet D1 and D2 by by comprising lamination, first Copper Foil of the first central layer core01 to the n-th central layer core0n and/or scrapping base material W1 and the second Copper Foil and/or scrap base material W2, the first prepreg PP01 and the second prepreg PP02 and rivet together.
Wherein, fold structure according to lamination, the prepreg (i.e. the first prepreg PP01 and the second prepreg PP02) of accompanying plate to use is as far as possible consistent with the prepreg (prepreg namely between the first central layer core01 to the n-th central layer core0n) between formal flaggy.In other words, preferably, the prepreg between the first prepreg PP01 and the second prepreg PP02 with the first central layer core01 to the n-th central layer core0n uses identical material or the close material of pressing heating curve.
4th step S4: add the first Copper Foil or diffusion barrier W3 and the second Copper Foil or diffusion barrier W4 respectively in the upper layer of the structure riveted together by rivet D1 and D2, then carries out lamination and die-filling.
5th step S5: to lamination and die-filling after structure carry out pressing.
6th step S6: plate is accompanied in dismounting after pressing, now directly can tear top layer off and accompany plate (the first Copper Foil or diffusion barrier W3 and the second Copper Foil or diffusion barrier W4, the first prepreg PP01 and the second prepreg PP02 and the first Copper Foil and/or scrap base material W1 and the second Copper Foil and/or scrap base material W2); There is no prepreg owing to accompanying between plate and the upper and lower monolithic of cladding plate or unit, can not be bonded together.
Thus, the problem preventing from the method for cladding plate method lamination off normal from can solve the bonding processes mesexine monolithic of the cladding plate method printed board comprising Rigid Flex, rigid plate, different plates mixed-compression board and buried blind via plate or the relative middle single-slice of unit or unit more inside contracting according to a first embodiment of the present invention, make harmomegathus in all internal layer bonding processes basically identical, avoid interlayer off normal, be specially adapted to new material, new folded structure and without the situation of prior harmomegathus empirical data.
< second embodiment >
Fig. 8 schematically shows the flow chart preventing the method for cladding plate method lamination off normal according to a second embodiment of the present invention.Fig. 9 schematically shows the schematic diagram preventing the method for cladding plate method lamination off normal according to a second embodiment of the present invention.
According to a second embodiment of the present invention prevent in the method for cladding plate method lamination off normal, can cancel and above-mentionedly accompany prepreg in plate and top layer Copper Foil.
Specifically, as shown in Figure 8 and Figure 9, the method for cladding plate method lamination off normal that prevents according to a second embodiment of the present invention comprises:
First step S01: for comprise the first central layer core01 to the n-th central layer core0n lamination (n be greater than 1 integer), add first respectively at the superiors' superimposition plate monolithic or the upper surface L1 of unit and the lower surface L2n of undermost superimposition plate monolithic or unit to scrap substrate layer W01 and second and scrap substrate layer W02, and scrap first the rivet hole position that substrate layer W01 and second scraps substrate layer W02 to window, pass to facilitate rivet.
Wherein, base material cupric or not cupric is scrapped.
Preferably, first scraps substrate layer W01 and second to scrap the size of windowing of substrate layer W02 consistent with rivet diameter or slightly large.
Second step S02: the lamination and first comprising the first central layer core01 to the n-th central layer core0n scrapped substrate layer W01 and second by rivet and scrap riveted together with substrate layer W02.
Third step S03: pad sheet metal (being preferably aluminium flake) up and down in the upper layer by closing-up structure together, then performs lamination and die-filling.
4th step S04: to lamination and die-filling after structure carry out pressing.
5th step S05: plate is accompanied in dismounting after pressing, takes off the sheet metal of underlay, now directly can tear top layer off and accompany plate (first scraps substrate layer W01 and second scraps substrate layer W02); There is no prepreg owing to accompanying between plate and the upper and lower monolithic of cladding plate or unit, can not be bonded together.
Thus, the problem preventing from the method for cladding plate method lamination off normal from can solve the bonding processes mesexine monolithic of the cladding plate method printed board comprising Rigid Flex, rigid plate, different plates mixed-compression board and buried blind via plate or the relative middle single-slice of unit or unit more inside contracting according to a second embodiment of the present invention, make harmomegathus in all internal layer bonding processes basically identical, avoid interlayer off normal, be specially adapted to new material, new folded structure and without the situation of prior harmomegathus empirical data.
In addition, it should be noted that, unless otherwise indicated, otherwise the term " first " in specification, " second ", " the 3rd " etc. describe only for distinguishing each assembly, element, step etc. in specification, instead of for representing logical relation between each assembly, element, step or ordinal relation etc.
Be understandable that, although the present invention with preferred embodiment disclose as above, but above-described embodiment and be not used to limit the present invention.For any those of ordinary skill in the art, do not departing under technical solution of the present invention ambit, the technology contents of above-mentioned announcement all can be utilized to make many possible variations and modification to technical solution of the present invention, or be revised as the Equivalent embodiments of equivalent variations.Therefore, every content not departing from technical solution of the present invention, according to technical spirit of the present invention to any simple modification made for any of the above embodiments, equivalent variations and modification, all still belongs in the scope of technical solution of the present invention protection.
Claims (8)
1. prevent a method for cladding plate method lamination off normal, it is characterized in that comprising:
First step, for for the lamination comprising the first central layer to the n-th central layer, add the first Copper Foil respectively at the superiors' superimposition plate monolithic or the upper surface of unit and the lower surface of undermost superimposition plate monolithic or unit and/or scrap base material and the second Copper Foil and/or scrap base material, windowing at the first Copper Foil and/or the rivet hole position of scrapping base material and the second Copper Foil and/or scrapping base material;
Second step, for the first Copper Foil and/or scrap above base material and the second Copper Foil and/or scrap base material below pad the first prepreg and the second prepreg respectively, window in the rivet hole position of the first prepreg and the second prepreg;
Third step, will comprise lamination, first Copper Foil of the first central layer to the n-th central layer for utilizing rivet and/or scrap base material and the second Copper Foil and/or scrap base material, the first prepreg and the second prepreg and rivet together;
4th step, for adding the first Copper Foil or diffusion barrier and the second Copper Foil or diffusion barrier respectively in the upper layer by closing-up structure together, then carries out lamination and die-filling;
5th step, for lamination and die-filling after structure carry out pressing;
6th step, accompanies plate for dismounting after pressing.
2. the method preventing cladding plate method lamination off normal according to claim 1, is characterized in that, in a first step, and the first Copper Foil and/or scrap base material and the second Copper Foil and/or scrap the size of windowing of base material consistent with rivet diameter or slightly large.
3. the method preventing cladding plate method lamination off normal according to claim 1 and 2, is characterized in that, in the second step, the first prepreg is consistent with rivet diameter or slightly large with the size of windowing of the second prepreg.
4. the method preventing cladding plate method lamination off normal according to claim 1 and 2, is characterized in that, the first prepreg and the prepreg between the second prepreg with the first central layer to the n-th central layer use identical material or the close material of pressing heating curve.
5. the method preventing cladding plate method lamination off normal according to claim 1 and 2, is characterized in that, described in prevent the method for cladding plate method lamination off normal for the manufacture of Rigid Flex, rigid plate, different plates mixed-compression board and buried blind via plate.
6. prevent a method for cladding plate method lamination off normal, it is characterized in that comprising:
First step, for for the lamination comprising the first central layer to the n-th central layer, add first respectively at the superiors' superimposition plate monolithic or the upper surface of unit and the lower surface of undermost superimposition plate monolithic or unit to scrap substrate layer and second and scrap substrate layer, and scrap first the rivet hole position that substrate layer and second scraps substrate layer and window;
Second step, scraps riveted together with substrate layer for by rivet the lamination and first comprising the first central layer to the n-th central layer being scrapped substrate layer and second;
Third step, for padding sheet metal up and down in the upper layer by closing-up structure together, then performs lamination and die-filling;
4th step, for lamination and die-filling after structure carry out pressing;
5th step, accompanies plate for dismounting after pressing;
In a first step, first scraps substrate layer and second to scrap the size of windowing of substrate layer consistent with rivet diameter or slightly large.
7. the method preventing cladding plate method lamination off normal according to claim 6, is characterized in that, in third step, described sheet metal is the sheet metal that aluminium flake or other Type C TE are greater than Copper Foil.
8. the method preventing cladding plate method lamination off normal according to claim 6, is characterized in that, described in prevent the method for cladding plate method lamination off normal for the manufacture of Rigid Flex, rigid plate, different plates mixed-compression board and buried blind via plate.
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Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103561548B (en) * | 2013-11-20 | 2016-09-14 | 广东生益科技股份有限公司 | Improve the method for pressing plate wrinkle at multi-layer sheet rivet location |
| CN103906379B (en) * | 2014-02-28 | 2017-01-25 | 奥士康精密电路（惠州）有限公司 | Press fit method for multi-layer printed circuit board |
| CN103987194B (en) * | 2014-05-04 | 2018-03-09 | 奥士康精密电路（惠州）有限公司 | A kind of multi-layer sheet presses harmomegathus control method |
| CN105472911B (en) * | 2014-09-12 | 2018-03-20 | 深南电路有限公司 | One kind lamination positioning and detection method |
| CN105163528A (en) * | 2015-09-22 | 2015-12-16 | 惠州中京电子科技股份有限公司 | Riveting method and riveting structure for lamination of multilayer PCB |
| CN105392304B (en) * | 2015-10-21 | 2017-12-05 | 胜宏科技（惠州）股份有限公司 | A kind of circuit board pressing method |
| CN106061139A (en) * | 2016-06-17 | 2016-10-26 | 奥士康精密电路（惠州）有限公司 | Layer-to-layer registration control method for inner layers of HDI (High Density Interconnector) board |
| CN106163136B (en) * | 2016-07-01 | 2019-04-12 | 业成光电（深圳）有限公司 | Prevent sensing circuit plate and flexible circuit board from pressing the manufacturing method of dislocation |
| CN107493650A (en) * | 2017-08-22 | 2017-12-19 | 景旺电子科技(龙川)有限公司 | A kind of automotive electronics high-frequency multi-layer circuit board laminated construction and process for pressing |
| CN112689400B (en) * | 2020-11-13 | 2022-07-12 | 奥士康科技股份有限公司 | Manufacturing method of HDI board blind hole |
| CN113056120A (en) * | 2021-02-06 | 2021-06-29 | 深圳市昶东鑫线路板有限公司 | Lamination method for preventing high-rise board from layer deviation |
| CN113163627B (en) * | 2021-03-29 | 2023-05-05 | 景旺电子科技(珠海)有限公司 | Circuit board manufacturing method |
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| JPH01110112A (en) * | 1987-10-23 | 1989-04-26 | Matsushita Electric Works Ltd | Production of multilayer printed wiring board |
| JP2751115B2 (en) * | 1989-07-20 | 1998-05-18 | 東芝ケミカル株式会社 | Manufacturing method of multilayer printed wiring board |
| JP2602423B2 (en) * | 1995-01-25 | 1997-04-23 | 富山日本電気株式会社 | Method for producing multilayer copper-clad laminate |
| JP2000332415A (en) * | 1999-05-25 | 2000-11-30 | Hitachi Chem Co Ltd | Manufacture of multilayer printed wiring plate |
| JP2003174259A (en) * | 2001-12-04 | 2003-06-20 | Compeq Manufacturing Co Ltd | Method and device for pin lamination for excluding irregularities of multi-layer print wiring plate |
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