CN113516924B - Display module assembly and electronic equipment - Google Patents
Display module assembly and electronic equipment Download PDFInfo
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- CN113516924B CN113516924B CN202110543815.4A CN202110543815A CN113516924B CN 113516924 B CN113516924 B CN 113516924B CN 202110543815 A CN202110543815 A CN 202110543815A CN 113516924 B CN113516924 B CN 113516924B
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- 239000010410 layer Substances 0.000 claims abstract description 89
- 230000017525 heat dissipation Effects 0.000 claims abstract description 82
- 239000006260 foam Substances 0.000 claims abstract description 56
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 53
- 239000011889 copper foil Substances 0.000 claims abstract description 35
- 239000012790 adhesive layer Substances 0.000 claims abstract description 29
- 238000005452 bending Methods 0.000 claims description 55
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 12
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 11
- 229920000728 polyester Polymers 0.000 claims description 11
- 229920001169 thermoplastic Polymers 0.000 claims description 11
- 239000004416 thermosoftening plastic Substances 0.000 claims description 11
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000003475 lamination Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 17
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- 239000002346 layers by function Substances 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
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- 238000011161 development Methods 0.000 description 3
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- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/87—Arrangements for heating or cooling
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
Abstract
The embodiment of the invention discloses a display module and electronic equipment. In a specific embodiment, the display module comprises a display panel, a heat dissipation film layer arranged on the non-light-emitting side of the display panel and a flexible circuit board arranged on one side of the heat dissipation film layer away from the display panel, wherein the heat dissipation film layer comprises a first area and a second area, the projection of the second area on the display panel corresponds to the projection of the flexible circuit board on the display panel, the first area comprises copper foil, foam and a first adhesive layer which are arranged from the flexible circuit board to the display panel in a direction lamination manner, and the second area comprises foam and a first adhesive layer which are arranged from the flexible circuit board to the display panel in a direction lamination manner. According to the embodiment, under the condition of guaranteeing heat dissipation and electromagnetic shielding capability, the thickness of the module is reduced, and the demand of lighter and thinner electronic products can be met.
Description
Technical Field
The invention relates to the technical field of display. And more particularly, to a display module and an electronic device.
Background
Along with development of science and technology and economy, users have higher and higher requirements on the volume and thickness of electronic products, light, thin and portable electronic products are necessary development directions, the thickness of a display panel has a critical influence on the thickness of electronic products for mobile phones, tablet computers and other electronic products, the conventional electronic products generally meet the requirements of lighter, thinner and portable electronic products by reducing the thickness of various materials, but the performance of the electronic products is reduced along with gradual reduction of the thickness of various materials, so that the thickness of a simplified module has important significance while ensuring the original performance of the electronic products.
Disclosure of Invention
The invention aims to provide a display module and electronic equipment, which are used for solving at least one of the problems existing in the prior art.
In order to achieve the above purpose, the invention adopts the following technical scheme:
the first aspect of the invention provides a display module, comprising a display panel, a heat dissipation film layer arranged on the non-light-emitting side of the display panel and a flexible circuit board arranged on one side of the heat dissipation film layer away from the display panel,
the heat dissipation film layer comprises a first area and a second area, the projection of the second area on the display panel corresponds to the projection of the flexible circuit board on the display panel, the first area comprises copper foil, foam and a first adhesive layer which are arranged in a stacked mode from the flexible circuit board to the display panel, and the second area comprises foam and a first adhesive layer which are arranged in a stacked mode from the flexible circuit board to the display panel.
According to the display module provided by the first aspect of the invention, the foam and the first adhesive layer are laminated in the direction from the flexible circuit board to the display panel through the areas corresponding to the projection of the heat dissipation film layer on the display panel and the projection of the flexible circuit board on the display panel, and the copper foil, the foam and the first adhesive layer are laminated in other areas of the heat dissipation film layer in the direction from the flexible circuit board to the display panel, namely, the projection overlapping areas of the flexible circuit board of other materials except the first adhesive layer and the foam in the heat dissipation film layer are subjected to special-shaped design according to the shape of the flexible circuit board, so that the thickness of the module is reduced under the condition of ensuring heat dissipation and electromagnetic shielding capability, and the lighter and thinner requirements of electronic products can be realized.
In one possible implementation, the first region further includes a thermoplastic polyester layer disposed between the copper foil and the foam.
By arranging the thermoplastic polyester layer between the copper foil and the foam, the realization mode has the advantages of ensuring good bubble discharging capability of the heat dissipation film layer, preventing the formation of bubbles of the heat dissipation film layer and the like.
In one possible implementation, the flexible circuit board and the second region are fixed by a second adhesive layer.
In one possible implementation, the first adhesive layer is a grid adhesive, and the second adhesive layer is a pressure sensitive adhesive.
This implementation has the advantages of, for example: the impact resistance of the display panel can be improved by sticking the display panel and the foam, and bubbles generated when the display panel and the foam are stuck can be extruded to the periphery through the grid patterns by arranging the grid glue between the display panel and the foam so as to discharge the bubbles; the thickness of the module can be reduced by sticking the flexible circuit board and the foam, and the foam and the flexible circuit board can be firmly stuck by arranging the pressure-sensitive adhesive between the foam and the flexible circuit board so as to better realize the production process.
In one possible implementation manner, the display panel includes a display area and a bending area bending towards a non-light-emitting side of the display area, the bending area includes a bending part bending towards the non-light-emitting side of the display area and a plane part located at the non-light-emitting side of the display area, and an end part of the plane part is a bonding part bonded with the flexible circuit board.
According to the implementation mode, the display panel is divided into two parts, one part is a display area, the other part is a bending area bending towards the non-light-emitting side of the display area, the projection overlapping area of the flexible circuit board made of other materials except for grid glue and foam in the heat dissipation film layer is subjected to special-shaped design according to the shape of the flexible circuit board, the bending area bending towards the non-light-emitting side of the display area is divided into a bending part bending towards the non-light-emitting side of the display area and a plane part positioned at the non-light-emitting side of the display area, and other materials are sequentially laminated from the display area towards the plane part, so that the thickness of a module is reduced under the condition of guaranteeing heat dissipation and electromagnetic shielding capability, and the lighter and thinner requirements of electronic products can be realized.
In one possible implementation, the projection of the second area on the display area corresponds to the projection of the flexible circuit board on the display area and the projection of the planar portion on the display area.
According to the implementation mode, the projection overlapping area of the flexible circuit board of other materials except the grid glue and foam in the heat dissipation film layer is subjected to special-shaped design according to the shape of the flexible circuit board, so that the thickness of the module is reduced under the condition of guaranteeing heat dissipation and electromagnetic shielding capability, and the demand that an electronic product is lighter and thinner can be realized.
In one possible implementation manner, the display module further includes a bending pad disposed between the display area and an area of the planar portion near the bending portion, and a bending area is formed on the planar portion between the area of the planar portion corresponding to the bending pad and the bonding portion.
According to the realization mode, the requirement of the minimum bending radius in bonding is met by arranging the bending gasket, secondary bending is carried out, and a bending area is formed at the plane part between the area of the plane part corresponding to the bending gasket and the bonding part, so that the production process is better realized, the thickness of the module can be reduced, and the demand that the electronic product is lighter and thinner is realized.
In one possible implementation, the flexible circuit board has a copper leakage area that is connected to the copper foil.
In the implementation mode, the flexible circuit board is provided with the copper leakage area, the copper leakage area is connected with the copper foil of the first area, and heat can be transmitted to the copper foil of the first area, so that the heat dissipation effect of the heat dissipation film layer is ensured.
The second aspect of the invention provides an electronic device comprising the display module set according to the first aspect of the invention.
According to the electronic equipment provided by the second aspect of the invention, the area, corresponding to the projection of the heat dissipation film layer on the display panel and the projection of the flexible circuit board on the display panel, is used, foam and the first adhesive layer are laminated in the direction from the flexible circuit board to the display panel, and the copper foil, the foam and the display module of the first adhesive layer are laminated in other areas of the heat dissipation film layer in the direction from the flexible circuit board to the display panel, so that the thickness of the module is reduced under the condition of ensuring heat dissipation and electromagnetic shielding capability, and the demand that an electronic product is lighter and thinner can be realized.
In one possible implementation, the electronic device further includes a metal center, and the flexible circuit board has a copper-leakage area, and the copper-leakage area is connected to the metal center.
According to the implementation mode, the flexible circuit board is provided with the copper leakage area, the copper leakage area is connected with the metal middle frame of the electronic equipment, and heat can be transmitted to the metal middle frame, so that the heat dissipation effect of the heat dissipation film layer is guaranteed.
The beneficial effects of the invention are as follows:
according to the technical scheme provided by the invention, through the projection of the heat dissipation film layer on the display panel and the projection of the flexible circuit board on the display panel, foam and a first adhesive layer are laminated in the direction from the flexible circuit board to the display panel, copper foil, foam and the first adhesive layer are laminated in other areas of the heat dissipation film layer in the direction from the flexible circuit board to the display panel, namely, the projection overlapping area of the flexible circuit board of other materials except the first adhesive layer and foam in the heat dissipation film layer is subjected to special-shaped design according to the shape of the flexible circuit board, so that the thickness of a module is reduced under the condition of ensuring heat dissipation and electromagnetic shielding capability, and the lighter and thinner requirements of electronic products can be realized.
Drawings
The following describes the embodiments of the present invention in further detail with reference to the drawings.
Fig. 1 is a schematic cross-sectional view showing a stacked structure of a display module according to the related art.
Fig. 2 is a schematic diagram of a stacking structure of a display module according to an embodiment of the invention.
Fig. 3 is a schematic cross-sectional view of a stacked structure of a display module according to an embodiment of the present invention along A-A direction.
Detailed Description
In order to more clearly illustrate the present invention, the present invention will be further described with reference to examples and drawings. Like parts in the drawings are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and that this invention is not limited to the details given herein.
Along with the continuous improvement of living standard, when the demand of users for electronic products is improved, the requirements for the volume and the thickness of the electronic products are also higher and higher, and the thickness of the display module is greatly influenced on the whole thickness of the electronic products when the display module is used as an indispensable component of the electronic products. Fig. 1 shows a schematic cross-sectional view of a stacking structure of a conventional display module, which can be seen that, in the conventional display module, the conventional display module includes a display panel, a heat dissipation film layer disposed on a non-light-emitting side of the display panel, and a flexible circuit board disposed on a side of the heat dissipation film layer away from the display panel, wherein the heat dissipation film layer includes a pressure-sensitive adhesive 6, a copper foil 5, a thermoplastic polyester layer 4, foam 3 and a grid adhesive 2, which are stacked in a direction from the flexible circuit board 7 to the display panel 1. The thickness of the display module comprises the total thickness of the display panel 1, the grid glue 2, the foam 3, the thermoplastic polyester layer 4, the copper foil 5, the pressure sensitive adhesive 6, the flexible circuit board 7 and the components 8 attached on the flexible circuit board 7. In order to meet the demand of lighter, thinner and portable electronic products, the prior art generally adopts a method for reducing the thickness of various materials in the display module, however, along with the gradual reduction of the thickness of various materials, the corresponding performance of the materials is often reduced, and meanwhile, the display panel is also easier to generate stamping, so that the use of the display module is affected, and the performance of the electronic product is also likely to change.
In order to ensure the original performance of an electronic product and reduce the thickness of a display module, as shown in fig. 2, one embodiment of the invention provides a display module, which comprises a display panel 01, a heat dissipation film layer 10 arranged on a non-light-emitting side of the display panel, and a flexible circuit board 7 arranged on one side of the heat dissipation film layer far away from the display panel, wherein the heat dissipation film layer 10 comprises a first area and a second area, the projection of the second area on the display panel corresponds to the projection of the flexible circuit board on the display panel, the first area comprises copper foil, foam and a first adhesive layer which are laminated in a direction from the flexible circuit board to the display panel, and the second area comprises foam and a first adhesive layer which are laminated in a direction from the flexible circuit board to the display panel.
In a specific example, the display panel is an OLED (Organic Light Emitting Diode; organic light emitting diode) display panel, and the display module is an OLED module, for example, including a flexible substrate, a functional layer, and a flexible cover plate, which are sequentially disposed, where the functional layer includes a buffer layer, a TFT circuit layer, an OLED light emitting layer, a packaging layer, and a heat dissipation film layer, for example.
In a specific example, the heat dissipation film layer is used for dissipating heat of the display panel on one hand, and has an electromagnetic shielding effect for preventing interference on the other hand. In this embodiment, the heat dissipation film layer is disposed on the non-light-emitting side of the display panel, for example, but not limited to, a composite layer structure is adopted, the heat dissipation film layer is shaped according to the shape of the flexible circuit board, the shaped area is an area corresponding to the projection of the flexible circuit board on the display panel and the projection of the flexible circuit board on the display panel, that is, a second area, and an area of the heat dissipation film layer except for the second area is a first area, where the first area includes copper foil, foam and a first adhesive layer stacked in a direction from the flexible circuit board to the display panel, and the second area includes foam and a first adhesive layer stacked in a direction from the flexible circuit board to the display panel.
In a specific example, the foam is a polyurethane foam, a conductive foam, an aluminum foil foam, or the like, which has a better heat conducting property, so as to quickly dissipate heat generated by the display panel, prevent the display effect from being reduced due to overheating of the display panel, and protect the display panel from impact due to softness of the foam.
In a specific example, the copper foil is a copper foil with excellent conductivity, such as a self-adhesive copper foil, a double-conductive copper foil, a single-conductive copper foil, and the like, which can perform heat dissipation on one hand and electromagnetic shielding and electrostatic discharge on the other hand.
In some alternative implementations of this embodiment, the first region further includes a thermoplastic polyester layer disposed between the copper foil and the foam.
In a specific example, the thermoplastic polyester is formed by condensing terephthalic acid (or dimethyl terephthalate) and ethylene glycol, so that the heat dissipation film has good air tightness, and the thermoplastic polyester layer is arranged between the copper foil and the foam in the first area of the heat dissipation film, so that the adhesion between the copper foil, the thermoplastic polyester and the foam can be tight, and the formation of the air bubble layer in the first area of the heat dissipation film is prevented.
In this implementation, by providing a thermoplastic polyester layer between the copper foil and the foam, the formation of bubbles in the heat dissipation film layer can be prevented.
In some optional implementations of this embodiment, the flexible circuit board and the second region are fixed by a second adhesive layer.
In some optional implementations of this embodiment, the first adhesive layer is a grid adhesive and the second adhesive layer is a pressure sensitive adhesive.
According to the realization mode, the impact resistance of the display panel can be improved by sticking the display panel and the foam, and bubbles generated when the display panel and the foam are stuck can be extruded to the periphery through the grid lines by arranging the grid glue between the display panel and the foam so as to discharge the bubbles; the thickness of the module can be reduced by sticking the flexible circuit board and the foam, and the foam and the flexible circuit board can be firmly stuck by arranging the pressure-sensitive adhesive between the foam and the flexible circuit board so as to better realize the production process.
In a specific example, fig. 3 is a schematic cross-sectional view along A-A in fig. 2, as shown in fig. 3, the heat dissipation film layer 10 includes a first area 20 and a second area 30, the first area 20 includes a copper foil 5, thermoplastic polyester 4, foam 3 and a grid adhesive 2 stacked in a direction from the flexible circuit board 7 to the display panel 1, the second area 30 includes a pressure sensitive adhesive 6, foam 3 and grid adhesive 2 stacked in a direction from the flexible circuit board 7 to the display panel 1, and at this time, the thickness of the display module is changed to be the total thickness of the display panel 1, the grid adhesive 2, foam 3, pressure sensitive adhesive 6, flexible circuit board 7 and a component 8 attached on the flexible circuit board 7, and compared with the thickness of the display module in the prior art, the thickness of the first area of the heat dissipation film layer is thinner, and the copper foil can realize both a heat dissipation function and an electromagnetic shielding function; for the second area of the heat dissipation film, the flexible circuit board has electromagnetic shielding function, so long as the heat dissipation function can be realized, the heat dissipation and electromagnetic shielding functions of the heat dissipation film layer can be ensured, and the second area 30 and the first area 20 of the heat dissipation film layer have gaps, namely gaps exist between 4, 5, 6 and 7 in fig. 3, so that the heat dissipation function can be realized (4, 5, 6 and 7 are not in a plane in the drawing). Therefore, the thickness of the module is reduced under the condition of ensuring heat dissipation and electromagnetic shielding capability, and the demand of lighter and thinner electronic products can be realized.
In a preferred implementation, the flexible circuit board has a copper leakage area, which is connected to the copper foil.
In a specific example, a copper leakage area for transmitting signals is arranged on the flexible circuit board, the copper leakage area is connected with the copper foil of the first area of the heat dissipation film layer through a transmission strip, and the flexible circuit board is connected with the second area of the heat dissipation film layer through a pressure sensitive adhesive, so that heat generated by the second area of the heat dissipation film layer can be transmitted to the copper foil of the first area of the heat dissipation film layer through the copper leakage area on the flexible circuit board, and therefore a heat dissipation function is achieved.
According to the implementation mode, the flexible circuit board is provided with the copper leakage area, the copper leakage area is connected with the copper foil of the first area, and heat can be transmitted to the copper foil of the first area, so that the heat dissipation effect of the heat dissipation film layer is better ensured.
In one possible implementation manner, the display panel includes a display area and a bending area bending towards a non-light-emitting side of the display area, the bending area includes a bending part bending towards the non-light-emitting side of the display area and a plane part located at the non-light-emitting side of the display area, and an end part of the plane part is a bonding part bonded with the flexible circuit board.
According to the implementation mode, the display panel is divided into two parts, one part is a display area, the other part is a bending area bending towards the non-light-emitting side of the display area, the projection overlapping area of the flexible circuit board made of other materials except for grid glue and foam in the heat dissipation film layer is subjected to special-shaped design according to the shape of the flexible circuit board, the bending area bending towards the non-light-emitting side of the display area is divided into a bending part bending towards the non-light-emitting side of the display area and a plane part positioned at the non-light-emitting side of the display area, and other materials are sequentially laminated from the display area towards the plane part, so that the thickness of a module is reduced under the condition of guaranteeing heat dissipation and electromagnetic shielding capability, and the lighter and thinner requirements of electronic products can be realized.
In one possible implementation manner, the display module further includes a bending pad disposed between the display area and an area of the planar portion near the bending portion, and a bending area is formed on the planar portion between the area of the planar portion corresponding to the bending pad and the bonding portion.
In a specific example, as shown in fig. 3, when the projection overlapping area of the flexible circuit board made of other materials except the grid glue and the foam in the heat dissipation film layer is specially designed according to the shape of the flexible circuit board, the display panel originally on the plane is bent towards the non-light-emitting side of the display area, and the bending gasket 9 is arranged between the display area and the area, close to the bending part, of the plane part in consideration of the minimum bending radius limited by the bonding process, so as to meet the requirement of the minimum bending radius limited by the bonding process, and then secondary bending is performed, and the area, corresponding to the bending gasket, of the plane part is bonded with the bonding part.
According to the realization mode, the requirement of the minimum bending radius in bonding is met by arranging the bending gasket, secondary bending is carried out, and a bending area is formed at the plane part between the area of the plane part corresponding to the bending gasket and the bonding part, so that the production process is better realized, the thickness of the module can be reduced, and the demand that the electronic product is lighter and thinner is realized.
In one possible implementation, the projection of the second area on the display area corresponds to the projection of the flexible circuit board on the display area and the projection of the planar portion on the display area.
According to the implementation mode, the projection overlapping area of the flexible circuit board of other materials except the grid glue and foam in the heat dissipation film layer is subjected to special-shaped design according to the shape of the flexible circuit board, so that the thickness of the module is reduced under the condition of guaranteeing heat dissipation and electromagnetic shielding capability, and the demand that an electronic product is lighter and thinner can be realized.
In summary, in the display module provided in this embodiment, through the projection of the heat dissipation film layer on the display panel and the projection of the flexible circuit board on the display panel correspond to the region, foam and the first adhesive layer are laminated in the direction from the flexible circuit board to the display panel, and copper foil, foam and the first adhesive layer are laminated in other regions of the heat dissipation film layer in the direction from the flexible circuit board to the display panel, that is, the projection overlapping region of the flexible circuit board of other materials except the first adhesive layer and foam in the heat dissipation film layer is designed in a special shape according to the shape of the flexible circuit board, so that the thickness of the module is reduced under the condition of guaranteeing heat dissipation and electromagnetic shielding capability, and the lighter and thinner requirements of electronic products can be realized.
Another embodiment of the present invention provides an electronic device, including the above display module.
In a specific example, the electronic device may be any product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator, which is not limited in this embodiment.
In one possible implementation, the electronic device further includes a metal center, and the flexible circuit board has a copper-leakage area, and the copper-leakage area is connected to the metal center.
In a specific example, a copper leakage area for transmitting signals is arranged on the flexible circuit board, the copper leakage area is connected with a metal middle frame of the electronic product through a transmission strip, and because the flexible circuit board is connected with the second area of the heat dissipation film layer through a pressure sensitive adhesive, heat generated by the second area of the heat dissipation film layer can be transmitted to the metal middle frame of the electronic product through the copper leakage area on the flexible circuit board, so that the heat dissipation function is realized.
According to the implementation mode, the flexible circuit board is provided with the copper leakage area, the copper leakage area is connected with the metal middle frame of the electronic equipment, and heat can be transmitted to the metal middle frame, so that the heat dissipation effect of the heat dissipation film layer is guaranteed.
The electronic equipment provided by this embodiment uses the projection of the heat dissipation film layer on the display panel with the flexible circuit board is in the region that the projection on the display panel corresponds, stacks up foam and first glue film from flexible circuit board to display panel's direction, stacks up the display module that sets up copper foil, foam and first glue film with other regions of heat dissipation film layer from flexible circuit board to display panel's direction to reduce the thickness of module under the circumstances of guaranteeing heat dissipation and electromagnetic shield ability, can realize the lighter and thinner demand of electronic product.
In the description of the present invention, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present invention. Unless specifically stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
It is further noted that in the description of the present invention, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The terms "on … …", "formed on … …" and "disposed on … …" as used herein may mean that one layer is formed directly on or disposed on another layer, or that one layer is formed indirectly on or disposed on another layer, i.e., that other layers are present between the two layers.
It should be noted that although the terms "first," "second," etc. may be used herein to describe various elements, components, elements, regions, layers and/or sections, these elements, components, elements, regions, layers and/or sections should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer and/or section from another. Thus, for example, a first component, a first member, a first element, a first region, a first layer, and/or a first portion discussed below could be termed a second component, a second member, a second element, a second region, a second layer, and/or a second portion without departing from the teachings of the present invention.
In the present invention, unless otherwise indicated, the term "co-layer arrangement" is used to mean that two layers, components, members, elements or portions may be formed by the same manufacturing process (e.g., patterning process, etc.), and that the two layers, components, members, elements or portions are generally formed of the same material. For example, the two or more functional layers are arranged in the same layer, meaning that the functional layers arranged in the same layer may be formed using the same material layer and the same manufacturing process, so that the manufacturing process of the display substrate may be simplified.
In the present invention, the expression "patterning process" generally includes the steps of coating of photoresist, exposure, development, etching, stripping of photoresist, and the like, unless otherwise specified. The expression "one patterning process" means a process of forming a patterned layer, feature, component, etc. using a single mask.
It should be understood that the foregoing examples of the present invention are provided merely for clearly illustrating the present invention and are not intended to limit the embodiments of the present invention, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (8)
1. The display module comprises a display panel, a heat dissipation film layer arranged on a non-light-emitting side of the display panel and a flexible circuit board arranged on one side, far away from the display panel, of the heat dissipation film layer, and is characterized in that the heat dissipation film layer comprises a first area and a second area, the projection of the second area on the display panel corresponds to the projection of the flexible circuit board on the display panel, the first area comprises copper foil, foam and a first adhesive layer which are arranged in a stacked manner from the flexible circuit board to the display panel, and the second area comprises foam and a first adhesive layer which are arranged in a stacked manner from the flexible circuit board to the display panel;
the first region further comprises a thermoplastic polyester layer disposed between the copper foil and the foam;
the flexible circuit board is provided with a copper leakage area, and the copper leakage area is connected with the copper foil;
and gaps exist between the second area and the first area of the heat dissipation film layer.
2. The display module of claim 1, wherein the flexible circuit board and the second region are secured by a second glue layer.
3. The display module of claim 2, wherein the first adhesive layer is a grid adhesive and the second adhesive layer is a pressure sensitive adhesive.
4. The display module of claim 1, wherein the display panel comprises a display area and a bending area bending towards a non-light-emitting side of the display area, the bending area comprises a bending part bending towards the non-light-emitting side of the display area and a plane part positioned on the non-light-emitting side of the display area, and an end part of the plane part is a bonding part bonded with the flexible circuit board.
5. The display module of claim 4, wherein the projection of the second area onto the display area corresponds to the projection of the flexible circuit board onto the display area and the projection of the planar portion onto the display area.
6. The display module of claim 4, further comprising a bending pad disposed between the display area and a region of the planar portion proximate to the bending portion, wherein a bending region is formed in the planar portion between a region of the planar portion corresponding to the bending pad and the bonding portion.
7. An electronic device comprising a display module according to any one of claims 1-6.
8. The electronic device of claim 7, further comprising a metal center, wherein the flexible circuit board has a copper-leakage area, and wherein the copper-leakage area is coupled to the metal center.
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| CN114038891B (en) * | 2021-11-16 | 2023-04-07 | 武汉华星光电半导体显示技术有限公司 | OLED display module and OLED display device |
| CN114340146A (en) * | 2022-01-05 | 2022-04-12 | 京东方科技集团股份有限公司 | Flexible circuit board, display module and display device |
| CN114550589A (en) * | 2022-02-22 | 2022-05-27 | 武汉天马微电子有限公司 | Display module and display device |
| CN116997132A (en) * | 2022-04-26 | 2023-11-03 | 京东方科技集团股份有限公司 | Display module and display device |
| CN115087314A (en) * | 2022-06-23 | 2022-09-20 | 京东方科技集团股份有限公司 | Heat dissipation film, display module and display device |
| CN115484791A (en) * | 2022-09-29 | 2022-12-16 | 京东方科技集团股份有限公司 | Display panel and display module |
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