CN114262580A - Composite adhesive tape and display module - Google Patents
Composite adhesive tape and display module Download PDFInfo
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- CN114262580A CN114262580A CN202111668600.1A CN202111668600A CN114262580A CN 114262580 A CN114262580 A CN 114262580A CN 202111668600 A CN202111668600 A CN 202111668600A CN 114262580 A CN114262580 A CN 114262580A
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- 239000002131 composite material Substances 0.000 title claims abstract description 115
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 25
- 239000004020 conductor Substances 0.000 claims abstract description 150
- 230000003068 static effect Effects 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 250
- 239000000758 substrate Substances 0.000 claims description 25
- 239000012790 adhesive layer Substances 0.000 claims description 20
- 239000006260 foam Substances 0.000 claims description 18
- 230000001681 protective effect Effects 0.000 claims description 16
- 239000003292 glue Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 4
- 229920001821 foam rubber Polymers 0.000 claims description 2
- 230000005611 electricity Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 16
- 230000017525 heat dissipation Effects 0.000 description 14
- 239000002184 metal Substances 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 230000002829 reductive effect Effects 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000005452 bending Methods 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
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- 238000000576 coating method Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000008030 elimination Effects 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
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- 238000000059 patterning Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
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- 239000002096 quantum dot Substances 0.000 description 1
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- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The disclosure relates to a composite adhesive tape and a display module. The composite tape includes a layer of conductive material. Wherein the conductive material layer includes a first portion multiplexed as a conductive portion of the FPC. Preferably, the conductive material layer further includes a second portion, and the second portion is a static electricity eliminating portion. The composite adhesive tape and the display module can reduce the thickness of the display module, and simultaneously ensure and even improve the reliability of the display module.
Description
Technical Field
The disclosure relates to the technical field of display, in particular to a composite adhesive tape and a display module.
Background
With the development of display technology, users have increasingly high requirements for the lightness and thinness of display devices. Therefore, the thickness of the display device can be effectively reduced by reducing the thickness of the display module. However, the reduction of the thickness of the display module can be generally achieved by reducing the material thickness of the internal layer structure, but this easily results in a reduction of the performance of the corresponding layer structure.
Disclosure of Invention
Accordingly, there is a need for a composite tape and a display module, which can reduce the thickness of the display module and ensure or even improve the reliability of the display module.
According to one aspect of an embodiment of the present disclosure, a composite tape is provided. The composite tape includes a layer of conductive material. Wherein the conductive material layer includes a first portion multiplexed as a conductive portion of the FPC.
In the embodiment of the present disclosure, the first portion of the conductive material layer in the composite tape is patterned into the conductive portion of the FPC, and the first portion may be used to replace each circuit in the Flexible Printed Circuit (FPC), so that the display panel is directly bonded by the first portion of the composite tape while the display panel is attached by the composite tape. Thereby need not to reserve the space that sets up of flexible circuit board in display module assembly, do benefit to the thickness that reduces display module assembly. Moreover, the composite adhesive tape is generally adhered to the back side of the display panel, and can have a larger plane area. The first part can also have a larger wiring space, so that the wiring design is facilitated, and the reliability of the display module is ensured and even improved.
Optionally, the conductive material layer includes a second portion, and the second portion is an electrostatic elimination portion. The conductive material layer can have good electrostatic shielding performance besides the first part, so that the flexible display panel can be well electrostatically shielded.
Optionally, the second portion of the conductive material layer is grounded. Therefore, the heat dissipation efficiency of the composite adhesive tape is further improved on the basis of effectively preventing static charges from accumulating on the composite adhesive tape.
Optionally, the thickness of the conductive material layer is less than or equal to 25 μm, so as to facilitate thinning of the overall thickness of the composite tape.
In some embodiments, the number of layers of conductive material is multiple. The composite tape further comprises: and the middle layer is arranged between any two adjacent conductive material layers. The intermediate layer comprises a substrate or an insulating glue layer.
Optionally, the intermediate layer is provided with a plurality of via holes; the first parts of any two adjacent conductive material layers are connected through the corresponding through holes.
The composite adhesive tape is provided with the multiple layers of conductive material layers, so that various different circuit designs can be conveniently realized by utilizing the interconnection among the multiple layers of conductive material layers. Thereby ensuring that the first portion of the composite tape can have a larger design space and a wider application space.
Optionally, the substrate comprises a non-tacky substrate. The conductive material layer can be directly attached to the surface of the substrate, so that a glue layer does not need to be arranged between the substrate and the conductive material layer. Therefore, on the basis of ensuring the performance of the composite adhesive tape, the thickness of the composite adhesive tape can be further reduced, and the thickness of the display module is further reduced. In addition, the conductive material layer is directly attached to the two sides of the non-adhesive base material, so that the overall heat resistance, stability and reliability of the composite adhesive tape are improved.
In some embodiments, the composite tape has a bonded region. The first portion and the corresponding intermediate layer of at least one of the plurality of layers of conductive material extend to the bonding region.
Optionally, the first portion and the corresponding intermediate layer of the plurality of layers of conductive material extend to the bonding region; the parts to be bound, located in the binding region, of the first parts of the different layers of conductive material layers sequentially form steps, or the parts to be bound, located in the binding region, of the first parts of the multiple layers of conductive material layers are sequentially connected and led out to the outermost conductive material layer through the through holes corresponding to the middle layers.
Optionally, the first portions of the multiple layers of conductive material are interconnected, and the first portions of the one layer of conductive material and the corresponding intermediate layer extend to the bonding region.
Optionally, the first portion extending into the bonding region is a portion to be bonded of the corresponding conductive material layer, and is used for bonding with the display panel.
In the embodiment of the disclosure, the portion of the composite tape located in the bonding region is of the above structure, and may have a smaller thickness and better flexibility, so as to facilitate bending deformation to abut against the bonding pad of the display panel, or to be bonded with the display panel through a Chip On Film (COF for short).
In some embodiments, the layer of conductive material partially covers the corresponding intermediate layer. That is, the conductive material layer may be provided in a partial region of the intermediate layer to reduce the weight of the composite tape or weaken the rigidity of the partial region of the composite tape.
Optionally, the boundary of the conductive material layer in at least one direction has a space from the boundary of the corresponding intermediate layer in the same direction. Therefore, the boundary of the conductive material layer can contract inwards relative to the boundary of the middle layer, so that the flexibility of the edge part of the composite adhesive tape is improved, and the attaching effect of the composite adhesive tape and the curved-surface display panel is improved when the composite adhesive tape is attached to the curved-surface display panel.
Optionally, an edge portion of the conductive material layer is patterned to further weaken the stiffness of the composite tape edge.
In some embodiments, the composite tape further comprises: and the insulating protective film is arranged on one side of the outermost conductive material layer, which is far away from the middle layer. This makes it possible to protect the conductive material layer with insulation using the insulating protective film, for example, to prevent the conductive material layer from being oxidized.
In some embodiments, the composite tape further comprises: and the electrostatic shielding film is arranged on one side, away from the conductive material layer, of the insulating protection film. Therefore, the electrostatic shielding film can be used for electromagnetic shielding to improve the capability of the composite adhesive tape for resisting electromagnetic interference, thereby ensuring the use reliability and stability of the first part in the composite adhesive tape.
In some embodiments, the composite tape further comprises a foam layer. The foam adhesive layer is located on one side, deviating from the conductive material layer, of the insulating protection film, and the adhesive surface of the foam adhesive layer deviates from the surface of the insulating protection film for the foam adhesive layer.
Optionally, the foam adhesive layer is located on a side of the electrostatic shielding layer away from the insulating protection film.
In some embodiments, the composite tape further comprises a functional aperture. The functional holes at least penetrate through the conductive material layer and the corresponding intermediate layer.
According to another aspect of the disclosed embodiments, a display module is provided. The display module comprises a display panel and the composite adhesive tape in some embodiments. The composite adhesive tape is attached to the back side of the display panel and electrically bonded with the display panel.
Drawings
Various additional advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the disclosure. Moreover, like reference numerals are used to refer to like elements throughout. In the drawings:
fig. 1 is a schematic structural diagram of a display module according to an embodiment of the disclosure;
FIG. 2 is a schematic structural view of a composite tape according to an embodiment of the present disclosure;
FIG. 3 is a schematic view of another embodiment of the present disclosure;
FIG. 4 is a schematic structural view of another composite tape according to an embodiment of the present disclosure;
FIG. 5 is a schematic structural view of another composite tape according to an embodiment of the present disclosure;
FIG. 6 is a schematic structural view of another composite tape according to an embodiment of the present disclosure;
FIG. 7 is a schematic structural view of another composite tape according to an embodiment of the present disclosure;
FIG. 8 is a schematic structural view of another composite tape according to an embodiment of the present disclosure;
FIG. 9 is a schematic top view of a layer of conductive material according to an embodiment of the present disclosure;
FIG. 10 is a schematic view of another embodiment of the present disclosure;
FIG. 11 is a schematic view of another embodiment of the present disclosure;
FIG. 12 is a schematic view of another embodiment of the present disclosure;
FIG. 13 is a schematic top view of another layer of conductive material in accordance with an embodiment of the present disclosure;
FIG. 14 is a schematic orthographic view of a layer of conductive material on an intermediate layer in one embodiment of the disclosure;
FIG. 15 is a schematic orthographic view of another layer of conductive material on an intermediate layer in one embodiment of the disclosure;
FIG. 16 is a schematic view of another embodiment of the present disclosure;
fig. 17 is a top view of the composite tape shown in fig. 16.
The reference numbers in the detailed description are as follows:
a display module 100;
the display panel comprises a cover plate 1, an optical adhesive layer 2, a polaroid 3, a display panel 4, a support film 5, a composite adhesive tape 6, a driving chip 7 and a bending protective layer 8;
an intermediate layer 61, a conductive material layer 62 (including 62A and 62B), an insulating protective film 63 (including 63A and 63B), an electrostatic shielding layer 64 (including 64A and 64B), a foam rubber layer 65;
a base material 611, an insulating glue layer 612; a layer stack 60;
a first portion 621, a second portion 622;
a functional hole H; a binding region A; and (6) gluing the surface S.
Detailed Description
To facilitate an understanding of the present disclosure, the present disclosure will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present disclosure are set forth in the accompanying drawings. This disclosure may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that, although the terms first, second, etc. may be used herein to describe various elements, these elements are not intended to denote any order, quantity, or importance, but rather are used to distinguish one element from another. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, without departing from the scope of the present disclosure. The word "comprising" or "comprises", and the like, means that the element or item listed before the word covers the element or item listed after the word and its equivalents, but does not exclude other elements or items.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein in the description of the disclosure is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure.
The term "connected" as used herein may be a manner of making electrical connections that provide for the transmission of signals. Also, the term "coupled" is used broadly, and may include, for example, direct electrical coupling or indirect electrical coupling via an intermediate.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the disclosure. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
In addition, in order to clearly show the plurality of layers and regions in the drawings, the thicknesses of the layers and the regions in the drawings are exaggerated to clearly illustrate the relative positions between the layers and the distribution of the regions. When a portion referred to as a layer, film, region, plate, or the like is "on" or "over" another portion, the description includes not only the case where "directly" over the other portion but also the case where another layer is present therebetween.
With the development of display technology, users have increasingly high requirements for the lightness and thinness of display devices. Therefore, the thickness of the display device can be effectively reduced by reducing the thickness of the display module. However, the reduction of the thickness of the display module can be generally achieved by reducing the material thickness of the internal layer structure, but this easily results in a reduction of the performance of the corresponding layer structure.
Referring to fig. 1, an embodiment of the present disclosure provides a display module 100, including: the display panel comprises a cover plate 1, an optical adhesive layer 2, a polaroid 3, a display panel 4 and a support film 5 which are stacked from bottom to top. But is not limited thereto.
The structures of the layers inside the display module 100 can be selected according to actual requirements. For example, the display module 100 may further include a buffer layer or a touch panel. Alternatively, for example, in the case where the display panel is a hard display panel, the support film 5 does not need to be provided in the display module 100. The embodiments of the present disclosure will not be described in detail.
For example, with continued reference to fig. 1, the cover plate 1 may be an ultra-thin glass cover plate or a polyimide cover plate. The optical adhesive layer 2 is used for bonding the cover plate 1 and the polarizer 3. The polarizer 3 may be a linear polarizer or a circular polarizer. The display panel 4 may be a flexible display panel. The flexible display panel is, for example, an OLED (organic electroluminescent diode) display panel, a QLED (quantum dot light emitting diode) display panel, a Micro-LED (Micro-light emitting diode) display panel, a Mini-LED (Mini-light emitting diode) display panel, or the like. The support film 5 is used for supporting and protecting the display panel 4, and the support film 5 can be directly attached to the surface of the display panel 4 departing from the cover plate 1 so as to be integrated with the display panel 4. The support film 5 is, for example, a polyethylene terephthalate (PET) film or a Polyimide (PI) film.
It is understood that in some embodiments, with continued reference to fig. 1, the display module 100 further includes the composite tape 6. The composite tape 6 is disposed on the back side of the display panel 4, and may be directly attached to the display panel 4, or attached to the surface of the support film 5 away from the display panel 4.
Here, the back side of the display panel 4 refers to the non-display side, i.e. the side of the display panel 4 facing away from the cover plate 1.
The composite tape 6 is disposed on the back side of the display panel 4, and is used for supporting the display panel 4, assisting in heat dissipation, eliminating static electricity, and the like. The composite tape 6 typically includes a metal heat sink layer, such as copper foil or the like.
Based on this, the disclosed embodiments provide a composite tape 6. Referring to fig. 2 to 9, the composite tape 6 includes a conductive material layer 62. Wherein the conductive material layer 62 includes a first portion 621, the first portion 621 being multiplexed as a conductive portion of the FPC.
Here, the number of layers of the conductive material layer 62 may be determined according to the routing of the first portion 621, for example, one layer, two layers or more. The embodiments of the present disclosure are not limited thereto.
Optionally, the composite tape 6 includes a metal heat dissipation layer, and the metal heat dissipation layer is reused as the conductive material layer 62. Thus, the existing metal heat dissipation layer in the composite tape 6 can be reused as the conductive material layer 62, so that the conductive material layer 62 can have good heat conduction performance besides the formation of the first portion 621, thereby performing a better supporting and heat dissipation function on the flexible display panel.
In one example, the metal heat sink layer is, but not limited to, copper foil. Other metal layers or other material layers with good heat dissipation and electrical conductivity are also suitable.
In the embodiment of the present disclosure, the first portion 621 of the conductive material layer 62 in the composite tape 6 is reused as a conductive portion of an FPC, and the first portion 621 may be used to replace each circuit in a Flexible Printed Circuit (FPC) so as to directly bind the display panel 4 by using the first portion 621 in the composite tape 6 while the composite tape 6 is attached to the display panel 4. That is, this application integrates FPC in compound sticky tape to need not to reserve the space that sets up of flexible circuit board in display module assembly 100, be favorable to reducing display module assembly 100's thickness.
The composite tape 6 is attached to the back side of the display panel 4, and can have a large planar area. In this way, the first portion 621 of the composite tape 6 may have a larger wiring space to facilitate wiring design, thereby ensuring or even improving the reliability of the display module 100. The specific trace design of the first portion 621 in the composite tape 6 is not described in the embodiment of the present disclosure, and the circuit trace design of the original flexible circuit board may be adopted.
In some embodiments, with continued reference to fig. 2, the number of layers 62 of conductive material is multiple. The composite tape 6 further comprises: an intermediate layer 61 disposed between any two adjacent layers 62 of conductive material. Here, the intermediate layer 61 serves to carry and insulate the conductive material layer 62. The intermediate layer 61 is, for example, a substrate 611 or an insulating glue layer 612. Also, the plurality of intermediate layers 61 in the plurality of layers 62 of conductive material may be implemented in a variety of ways.
Optionally, referring to fig. 3, two sides of the substrate 611 are respectively provided with the conductive material layer 62, and the surface of each conductive material layer 62 away from the substrate 611 is further bonded with one conductive material layer 62 through the insulating adhesive layer 612.
Optionally, referring to fig. 4, the conductive material layer 62 is disposed on each side of the substrate 611 to form a layer group 60. The two layer sets 60 are bonded by an insulating glue layer 612.
Optionally, referring to fig. 5, a layer of conductive material 62 is disposed on one side of the substrate 611 to form a layer stack 60. A plurality of layer groups 60 are stacked in sequence.
On this basis, it is understood that in some examples, the intermediate layer 61 may be provided with a plurality of vias, so that the first portions 621 in adjacent conductive material layers 62 may be connected by the corresponding vias.
In view of the above, the embodiment of the present disclosure provides the multiple layers of conductive material layers 62 in the composite tape 6, so that it is convenient to implement various circuit designs by using the interconnection between the first portions 621 of the multiple layers of conductive material layers 62. Thereby ensuring that the first portion 621 of the composite tape 6 can have a larger design space and a wider application space.
In addition, in the example where the conductive material layer 62 is formed by multiplexing metal heat dissipation layers, the multiple layers of conductive material layers 62 can be used as heat dissipation media, so as to effectively improve the heat dissipation efficiency of the composite tape 6.
For convenience of description, the composite tape 6 shown in fig. 6 is described in detail below as an example.
In some embodiments, referring to fig. 6, the composite tape 6 includes a substrate 611. The number of the conductive material layers 62 is two, and the conductive material layers are respectively disposed on two sides of the substrate 61, such as a first conductive material layer 62A and a second conductive material layer 62B, so that in an example where the first conductive material layer 62A and the second conductive material layer 62B are metal heat dissipation layers (such as copper foils), both the first conductive material layer 62A and the second conductive material layer 62B can be used as heat dissipation media, thereby effectively improving the heat dissipation efficiency of the composite tape 6.
Optionally, the thicknesses of the first conductive material layer 62A and the second conductive material layer 62B are less than or equal to the first threshold. The first threshold may be set according to actual requirements, for example, determined by taking the overall thickness of the composite tape 6 as a primary consideration on the premise of meeting the preparation requirement of the first portion 621.
Illustratively, the first threshold may be 25 μm. The thickness of the first conductive material layer 62A or the second conductive material layer 62B is, for example, 15 μm, 18 μm, 20 μm, 22 μm, or 25 μm.
It is to be understood that the embodiments are disclosed. The first portion 621 of the composite tape 6 is used to replace each circuit in the flexible circuit board. The first portions 621 of the different layers of conductive material may be interconnected based on the complexity of the circuits in the flexible circuit board.
In some embodiments, a plurality of vias (not shown in FIG. 6) are provided in the base material 611. The first portions 621 of the first and second conductive material layers 62A and 62B are connected by corresponding vias. Here, the number and the arrangement position of the via holes may be determined according to the wiring design of the first portion 621. As such, the first conductive material layer 62A and the second conductive material layer 62B are disposed in the composite tape 6 according to the embodiments of the present disclosure, which facilitates the implementation of a variety of different circuit designs by using the interconnection between the first conductive material layer 62A and the second conductive material layer 62B. Thereby ensuring that the first portion 621 of the composite tape 6 can have a larger design space and a wider application space.
In some embodiments, the material of the base material 611 may be selected according to the requirement. The substrate 611 and the conductive material layer 62 may be connected by a glue layer, or may be bonded by sputtering, coating, or hot pressing. The embodiments of the present disclosure are not limited thereto.
Optionally, the substrate 611 is a polyimide substrate to support and protect the conductive material layer 62. The base material 611 is connected with the conductive material layer 62 through a glue layer.
Optionally, the substrate 611 is a non-adhesive substrate, and the substrate 611 is made of polyimide. The conductive material layer 62 can be directly attached to the surface of the substrate 611 by sputtering, coating, or hot pressing, so that a glue layer is not required to be disposed between the substrate 611 and the conductive material layer 62. This makes it possible to make the connection between the base material 611 and the conductive material layer 62 more stable and also makes it easy to reduce the thickness of the composite tape 6, as compared with the connection using a glue layer. Therefore, on the basis of ensuring the performance of the composite adhesive tape 6, the thickness of the composite adhesive tape 6 can be further reduced, and the thickness of the display module is further reduced.
In addition, the conductive material layer 62 is directly attached to the two sides of the non-adhesive base material, so that the overall heat resistance, stability and reliability of the composite tape 6 are improved.
In some embodiments, referring to fig. 2 to 8, the composite tape 6 further includes: and an insulating protective film 63 disposed on a side of the outermost conductive material layer 62 facing away from the intermediate layer 61. This makes it possible to protect the conductive material layer 62 with insulation by the insulating protective film 63, for example, to prevent the conductive material layer 62 from being oxidized.
In some embodiments, referring to fig. 8, the composite tape 6 further includes: and an electrostatic shielding film (EMI)64 provided on a side of the insulating protection film 63 facing away from the conductive material layer 62. This can improve the electromagnetic interference resistance of the composite tape 6 by performing electromagnetic shielding using the electrostatic shielding film 64, thereby ensuring the reliability and stability of the first portion 621 of the composite tape 6.
In the example where the composite tape 6 includes two insulating protective films 63, the electrostatic shielding film 64 may be provided only on the side of one insulating protective film 63 facing away from the conductive material layer 62, or the electrostatic shielding films 64 may be provided on the side of each insulating protective film 63 facing away from the conductive material layer 62. The embodiments of the present disclosure are not limited thereto.
In some embodiments, referring to fig. 7 and 8, the composite tape 6 further includes a foam layer 65. The foam adhesive layer 65 is located on one side of the insulating protection film 63 departing from the conductive material layer 62, and the adhesive surface S of the foam adhesive layer 65 is the surface of the foam adhesive layer 65 departing from the insulating protection film 63.
Alternatively, as shown in fig. 8, the foam adhesive layer 65 is located on the side of the electrostatic shielding layer 64 facing away from the insulating protective film 63.
The adhesive surface S of the foam adhesive layer 65 is used for attaching the display panel 4. The composite tape 6 may be directly attached to the display panel 4 through the adhesive surface S of the foam adhesive layer 65, or may be attached to the display panel 4 through other intermediate media such as a buffer layer.
It is understood that the portion of the conductive material layer 62 other than the first portion 621 needs to be insulated from the first portion 621. That is, the portion of the conductive material layer 62 other than the first portion 621 does not adversely affect the normal operation of the first portion 621.
Optionally, referring to fig. 9, a portion of the conductive material layer 62 other than the first portion 621 is grounded, that is, the second portion 622 is grounded, and the second portion 622 is an electrostatic elimination portion for eliminating static electricity.
For example, the second portion 622 of each conductive material layer 62 is grounded through a ground hole. Thus, the heat dissipation efficiency of the composite tape 6 can be further improved on the basis of effectively preventing static charges from accumulating on the composite tape 6.
In some embodiments, please understand with reference to fig. 1 and fig. 10 to 13, the composite tape 6 has a binding region a. The first portion 621 of at least one of the conductive material layers 62 and the corresponding intermediate layer 61 extend to the binding region a.
Optionally, referring to fig. 10, the first portion 621 of the multiple layers of conductive material 62 and the corresponding middle layer 61 extend to the bonding region a; the portion to be bonded of the first portion 621 of the multiple layers of conductive material layers 62 located in the bonding region a is sequentially connected to the first portion 621 of the outermost layer of conductive material layer 62 through the via hole of the corresponding middle layer 61, so as to be bonded with the display panel 4 by using the first portion 621 of the outermost layer of conductive material layer 62.
Optionally, referring to fig. 11, the first portion 621 of the multiple layers of conductive material 62 and the corresponding middle layer 62 extend to the bonding region; wherein, the first portions 621 of the conductive material layers 62 in different layers are located in the binding region a, and the portions to be bound sequentially form steps. That is, the first portions 621 of the different layers of conductive material layer 62 extend to different lengths within the binding region a. As such, the portion to be bonded of the first portion 621 of each layer of the conductive material layer 62 may be exposed to be directly bonded with the corresponding bonding region in the display panel 4.
Optionally, referring to fig. 12, the first portions 621 of the multiple layers of conductive material 62 are interconnected, and the first portions 621 of the multiple layers of conductive material 621 and the corresponding intermediate layer 61 (e.g., the substrate 611) extend to the bonding region a. Here, the extension of the first portion 621 of one of the conductive material layers 621 and the corresponding intermediate layer 61 to the binding region a means: the portion of the composite tape 6 located in the binding region a may only retain the first portion 621 of one layer of the conductive material layer 621. And a corresponding part of the material of the intermediate layer 61 (e.g., the substrate 611) for electrically bonding the first portion 621 of the composite tape 6 with the display panel 4.
In addition, it can be understood that, in the above embodiment, referring to fig. 13, a portion of the first portion 621 extending into the binding region a may be used as a portion to be bound of the corresponding conductive material layer 62 for binding with the display panel 4.
In the embodiment of the present disclosure, the portion of the composite tape 6 located in the bonding region a is configured as above, and has a smaller thickness and better flexibility, so as to facilitate bending deformation to butt the bonding pad of the display panel 4, or to electrically bond the display panel 4 through a Chip On Film (COF).
For example, referring to fig. 1, the composite tape 6 is attached to the back side of the display panel 4, and a portion of the display panel 4 where the bonding pad is disposed may be bent to the back side and is correspondingly bonded to a portion to be bonded (e.g., an exposed portion of the first portion 621) of the composite tape 6 located in the bonding region a. Moreover, the portion of the display panel 4 bent to the back side thereof may also be generally bonded with a driving chip 7, so as to facilitate corresponding connection between the driving chip 7 and the first portion 621 or an external Printed Circuit Board (PCB).
In addition, optionally, a Bending Protection Layer 8 (BPL) may be disposed outside the bent portion of the display panel 4 to support and protect the bent portion of the display panel 4.
It should be noted that, in some embodiments, referring to fig. 14 and 15, the conductive material layer 62 partially covers the corresponding intermediate layer 61. That is, the conductive material layer 62 may be provided in a local area of the intermediate layer 61 according to actual requirements, so as to reduce the weight of the composite tape 6 or weaken the rigidity of a partial area of the composite tape 6.
Optionally, the conductive material layer 62 partially covers the corresponding intermediate layer 61, which may be represented by: the boundaries of the conductive material layer 62 are shrunk inward with respect to the boundaries of the intermediate layer 61. Therefore, the flexibility of the edge part of the composite adhesive tape 6 is improved, and the laminating effect of the composite adhesive tape 6 and the curved-surface display panel in the laminating process is improved.
In some examples, the boundary of the conductive material layer 62 in at least one direction has a space from the boundary of the intermediate layer 61 in the same direction, such as shown in fig. 14 or fig. 15.
Optionally, the conductive material layer 62 partially covers the corresponding intermediate layer 61, and may also be represented as: the edge portions of the conductive material layer 62 are patterned. Therefore, the rigidity of the edge part of the composite tape 6 can be further weakened, and the attaching effect of the composite tape 6 when the curved display panel is attached is improved.
In addition, the pattern for patterning the edge portion of the conductive material layer 62 may be selected according to actual requirements, such as a stripe-shaped opening. The embodiments of the present disclosure do not limit this.
In some embodiments, referring to fig. 16 and 17, the composite tape 6 further comprises a functional hole H. The functional holes H penetrate at least the conductive material layer 62 and the corresponding intermediate layer 61. In the example that the composite tape 6 further includes other film layers, the functional holes H may penetrate all or part of the film layers in the composite tape 6 according to the use requirement.
Alternatively, as shown in fig. 16, the composite tape 6 includes a base material 611 and a first conductive material layer 62A and a second conductive material layer 62B respectively disposed on both sides of the base material 611. The first conductive material layer 62A is provided with an insulating protective film 63 and an electrostatic shielding film 64 stacked in this order on the side facing away from the base 611. The second conductive material layer 62B is provided with an insulating protective film 63, an electrostatic shielding film 64 and a foam adhesive layer 65 in sequence on the side away from the base material 611. The functional hole H sequentially penetrates through the electrostatic shielding film 64, the insulating protective film 63, the first conductive material layer 62A, the base material 611, the second conductive material layer 62B, the insulating protective film 63, the electrostatic shielding film 64 and the foam adhesive layer 65 from top to bottom.
Optionally, the functional hole H may be a fingerprint identification avoidance hole. The functional holes H may be disposed correspondingly according to the functional devices in the corresponding display panel 4.
Where the terms "comprising," "having," and "including" are used herein, another element may be added unless an explicit limitation is used, such as "only," "consisting of … …," etc. Unless mentioned to the contrary, terms in the singular may include the plural and are not to be construed as being one in number.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present disclosure, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the concept of the present disclosure, and these changes and modifications are all within the scope of the present disclosure. Therefore, the protection scope of the present disclosure should be subject to the appended claims.
Claims (10)
1. A composite tape, comprising: a layer of conductive material; wherein the conductive material layer includes a first portion multiplexed as a conductive portion of the FPC.
2. The composite tape of claim 1 wherein the layer of conductive material comprises a second portion that is a static dissipative portion;
preferably, the second portion is grounded.
3. The composite tape of claim 1,
the thickness of the conductive material layer is less than or equal to 25 μm.
4. The composite tape of claim 1 wherein the number of layers of conductive material is multiple;
the composite tape further comprises: the middle layer is arranged between any two adjacent conductive material layers; the intermediate layer comprises a substrate or an insulating glue layer;
preferably, the intermediate layer is provided with a plurality of via holes; the first parts of any two adjacent layers of the conductive material layers are connected through the corresponding through holes;
preferably, the substrate comprises a non-tacky substrate.
5. The composite tape of claim 4 wherein the composite tape has a bonding region; a first portion of at least one of the plurality of layers of conductive material and the corresponding intermediate layer extend to the bonding region;
preferably, the first part of the multiple layers of conductive material and the corresponding intermediate layer extend to the binding region; the parts to be bound, of the first parts of the conductive material layers of different layers, located in the binding region sequentially form steps, or the parts to be bound, of the first parts of the conductive material layers, located in the binding region, of the multiple layers are sequentially connected and led out to the first part of the conductive material layer at the outermost layer through the through holes corresponding to the middle layer;
preferably, the first portions of the layers of conductive material are interconnected, and wherein the first portions of one layer of the layers of conductive material and the corresponding intermediate layer extend to the bonding region;
preferably, the part of the first portion extending to the binding region is a part to be bound corresponding to the conductive material layer, and is used for binding with the display panel.
6. The composite tape of claim 4,
the conductive material layer partially covers the corresponding intermediate layer;
preferably, the boundary of the conductive material layer in at least one direction has a space with the boundary of the corresponding intermediate layer in the same direction;
preferably, an edge portion of the conductive material layer is patterned.
7. The composite tape of claim 4,
the composite tape further comprises: the insulating protective film is arranged on one side, away from the middle layer, of the conducting material layer on the outermost layer;
preferably, the composite tape further comprises: and the electrostatic shielding film is arranged on one side, away from the conductive material layer, of the insulating protection film.
8. The composite tape of claim 7 further comprising: a foam adhesive layer;
the foam adhesive layer is positioned on one side, away from the conductive material layer, of the insulation protective film, and the adhesive surface of the foam adhesive layer is the surface, away from the insulation protective film, of the foam adhesive layer;
preferably, the foam rubber layer is located on one side of the electrostatic shielding layer, which is far away from the insulating protection film.
9. The composite tape of claim 4 further comprising: a functional hole; the functional holes at least penetrate through the conductive material layer and the corresponding intermediate layer.
10. A display module, comprising: a display panel and the composite tape according to any one of claims 1 to 9; the composite adhesive tape is attached to the back side of the display panel and is electrically bound with the display panel.
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| CN202111668600.1A CN114262580B (en) | 2021-12-30 | 2021-12-30 | Composite adhesive tape and display module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202111668600.1A CN114262580B (en) | 2021-12-30 | 2021-12-30 | Composite adhesive tape and display module |
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| CN114262580A true CN114262580A (en) | 2022-04-01 |
| CN114262580B CN114262580B (en) | 2023-11-21 |
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| CN114262580B (en) | 2023-11-21 |
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