CN203040033U - Riveting operating platform and riveting device - Google Patents
Riveting operating platform and riveting device Download PDFInfo
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- CN203040033U CN203040033U CN 201320051094 CN201320051094U CN203040033U CN 203040033 U CN203040033 U CN 203040033U CN 201320051094 CN201320051094 CN 201320051094 CN 201320051094 U CN201320051094 U CN 201320051094U CN 203040033 U CN203040033 U CN 203040033U
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- mistake proofing
- central layer
- riveted
- resin plate
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Abstract
The utility model discloses a riveting operating platform and a riveting device. The riveting operating platform is used for stacking multiple layers of circuit boards. The multiple layers of the circuit boards are formed by stacking M layers of core boards and N layers of resin boards arranged between the core boards successively. The M layers of the core boards and the N layers of the resin boards are both provided with anti-staggering through holes. The core board or the resin board arranged on the I<th> layer is provided with L-I anti-staggering through holes and the positions are from Si to SL. L is equal to M+N+1. i is an arbitrary integer between 1 and M+N. The operating platform includes a platform used for receiving the multiple layers of the circuit boards; at least two positioning posts that is arranged on the platform and is capable of penetrating through the core boards and the positioning holes in the resin boards for fixing the core boards and the resin boards on the platform; an anti-staggering area arranged on an area covered by the core board and provided with L anti-staggering points in positions from S0 to SL that are corresponding to positions of the anti-staggering through holes in the core boards and the resin boards; and detection units arranged on the anti-staggering points and used for detecting whether the stacking sequence of the core boards and the resin boards is correct or not.
Description
Technical field
The utility model relates to the printed circuit board manufacture field, relates in particular to a kind of riveted operating platform and riveted equipment.
Background technology
At present, the PCB(printed circuit board) operation principle of pressing or riveted operation is in advance every layer of central layer and resin plate to be gone out location hole in the manufacturing process, respectively every layer of central layer and resin plate are set to successively on the reference column on the riveted operating desk superimposed then, and then by process for pressing heating the resin plate fusing is solidified again, every layer of central layer will be fused to together like this, can not come off mutually.
Yet existing method is manually to put central layer and resin plate, puts upside down so probably level is put, for example, should be at the 5th layer central layer, mistake has been placed on the 1st layer, resin plate that should be between the 1st central layer and the 2nd central layer, mistake has been placed between the 3rd central layer and the 4th central layer; Perhaps leak and fold, for example between the 1st central layer and the 2nd central layer three-layer resin plate is arranged, the result is leaked and has been put one deck.Especially the quantity of central layer and resin plate more for a long time, the problems referred to above can be more serious.Usually carry out mistake proofing in the prior art in the following manner:
Method one: etch away the edges of boards bearing Copper Foil of the superiors' central layer and orlop central layer, form no copper zone, keep the Copper Foil of intermediate layer central layer bearing; The combination back uses probe detecting respective regions to judge.
Method two: the edge of the conductor layer of central layer arranges at least one sign conductor, has nothing in common with each other on the side of the sign figure of each central layer, and the combination back is observed and judged whether to make mistakes.
Therefore as can be seen, error-preventing method of the prior art has following defective:
Method one: can only be used for that the mistake proofing of 6 laminates, anti-8 laminate levels be put upside down, the outer mistake proofing of the plate more than 8 layers, and can't avoid the mistake of 8 laminates and above other layer to put and leakage is put, so mistake proofing is comprehensive inadequately.
Method two: this method will depend on people's observation and judgement, so bigger to people's degree of dependence, efficient is low, and can not misplace resin plate and judge, so mistake proofing is also comprehensive inadequately.
Therefore, error-preventing method of the prior art is comprehensive inadequately, and efficient is low.
The utility model content
In order to solve in the prior art lamination error-preventing method comprehensive and inefficient technical problem inadequately, the utility model embodiment provides a kind of riveted operating platform and riveted equipment.
The utility model provides a kind of riveted operating platform on the one hand, be used for the stacked multilayer circuit board, described multilayer circuit board is piled up in order by M layer central layer and the N layer resin plate between described M layer central layer and forms, all has the mistake proofing through hole on the described M layer central layer with on the described N layer resin plate, wherein, be positioned on the central layer of i layer or the resin plate and have L-i mistake proofing through hole, the position is S
iTo S
L, M is the integer more than or equal to 2, and N is the integer more than or equal to 1, and L is the integer of M+N+1, and i is integer arbitrarily between 1 to M+N; Described operating platform comprises: platform is used for placing described multilayer circuit board; At least two reference columns are arranged on the described platform, and described reference column can pass the location hole on described central layer and the described resin plate, so that described central layer and described resin plate are fixed on the described platform; The mistake proofing zone is arranged on the described platform on the zone that can be covered by described central layer, and described mistake proofing zone has L mistake proofing point, and the position is S
0To S
L, corresponding with mistake proofing lead to the hole site on described central layer and the described resin plate; Whether described mistake proofing point is provided with detecting unit, in proper order correct for detection of stacking of described central layer and described resin plate.
Optionally, the quantity of described detecting unit is specially 1 or L, and when the quantity of described detecting unit was L, a described L detecting unit was corresponding one by one with the position of a described L mistake proofing point;
When the quantity of described detecting unit was specially 1, described riveted operating platform also comprised: control unit is used for controlling described detecting unit described L mistake proofing point shift position based on the testing result of described detecting unit.
Optionally, described detecting unit is specially infrared facility, comprises infrared induction probe and infrared transmitter, and the position of described infrared induction probe and the position correspondence of described infrared transmitter lay respectively at the both sides of described platform.
Optionally, described detecting unit is specially probe.
Optionally, described mistake proofing zone is specially groove or runs through the zone of described platform.
Optionally, described riveted operating platform also comprises a control module, be used for described central layer and described resin plate stack order correct and stack finish after, send riveted and instruct to a lock seaming machine, so that the described multilayer circuit board of described lock seaming machine riveted.
The utility model also provides a kind of riveted equipment on the other hand, comprising: the riveted operating platform among aforementioned each embodiment is used for the stacked multilayer circuit board; Lock seaming machine is connected in described riveted operating platform, is used for the described multilayer circuit board of riveted.
The one or more embodiment of the utility model have following technique effect at least:
Riveted operating platform among the utility model embodiment compared with prior art, at first adopt on the central layer that forms multilayer circuit board and resin plate according to stacking the mistake proofing through hole that offers respective numbers in proper order, be positioned on the central layer of i layer or the resin plate and have L-i mistake proofing through hole, the position is S
iTo S
L, L is total number of plies of central layer and resin plate; The put area of central layer or resin plate arranges the mistake proofing zone on the riveted operating platform then, has L mistake proofing point on the mistake proofing zone, and the position is S
0To S
LAt mistake proofing point detecting unit is set then, when i layer central layer or resin plate are passed reference column and overlay on the platform by the location hole on central layer and the resin plate, by being positioned at S
I-1Individual mistake proofing point and S
iThe state of the detecting unit on the individual mistake proofing point judges whether stacking of i layer central layer or resin plate be correct.This shows, by the riveted operating platform in the present embodiment, central layer can be judged accurately or whether resin plate misplaces layer, perhaps leak and put, and no matter how how many layers layer circuit board has, and this riveted operating platform all is suitable for, further, the mistake proofing of the riveted operating platform in the present embodiment does not rely on artificial judgement, so the efficient height; To sum up, the riveted operating platform mistake proofing in the present embodiment is comprehensive, efficient is high, applied widely.
Description of drawings
Fig. 1 is the structural representation of the multilayer circuit board lamination of the utility model one embodiment;
Fig. 2 is the structural representation of the riveted operating platform among the utility model one embodiment;
Fig. 3 is central layer among the utility model one embodiment and the structure chart of resin plate;
Fig. 4 is the flow chart of the lamination error-preventing method among the utility model one embodiment;
Fig. 5 is judged result schematic diagram among the utility model one embodiment.
Embodiment
The utility model one embodiment provides a kind of riveted operating platform, be used for the stacked multilayer circuit board, multilayer circuit board is piled up in order by M layer central layer and the N layer resin plate between M layer central layer and forms, in the present embodiment, please refer to Fig. 1, be example with 8 layer circuit boards, comprise three layers of central layer (M is 3), be respectively first central layer 101, second central layer 102 and the 3rd central layer 103; Also comprise three-layer resin plate (N is 3), be respectively first resin plate 104, between first central layer 101 and second central layer 102, second resin plate 105 and the 3rd resin plate 106, second resin plate 105 and the 3rd resin plate 106 are between second central layer 102 and the 3rd central layer 103, wherein, second resin plate 105 be positioned at the 3rd resin plate 106 below.Wherein, M is the integer more than or equal to 2, and N is the integer more than or equal to 1.
Wherein, first central layer 101, second central layer 102 and the 3rd central layer 103 can comprise a layer insulating and two-sided copper wire.First resin plate 104, second resin plate 105 and the 3rd resin plate 106 concrete examples are prepreg in this way.Further, in the present embodiment, first resin plate 104 can be the same with the material of second resin plate 105 and first resin plate 106, also can be different.
Next will introduce in detail the structure of riveted operating platform and how with three layers of central layer and three-layer resin plate to building up as the structure among Fig. 1.
Specifically please refer to Fig. 2, Fig. 2 is the structural representation of riveted operating platform in the present embodiment.
As shown in Figure 2, this riveted operating platform comprises: platform 201 is used for the placement of multiple layers circuit board; At least two reference columns 202 are arranged on the platform 201, and reference column 202 can pass the location hole on central layer and the resin plate, so that central layer and resin plate are fixed on the platform 201; Mistake proofing zone 203 is arranged on the platform 201 on the zone that can be covered by central layer, and mistake proofing zone 203 has L mistake proofing point, for example mistake proofing point 204 and mistake proofing point 205, and the position is S0 to S
L, wherein, the position of mistake proofing point 204 is position S0, the position of mistake proofing point 205 is S
L, corresponding with mistake proofing lead to the hole site on central layer and the resin plate, wherein, L is that M adds N and adds 1; Whether the mistake proofing point is provided with detecting unit (not shown), in proper order correct for detection of stacking of central layer and resin plate.
Wherein, the quantity of detecting unit is specially 1 or L, when the quantity of detecting unit is L, on each mistake proofing point detecting unit is arranged, and when the quantity of detecting unit was 1, detecting unit can move at each mistake proofing point, so further, the riveted operating platform also comprises a control unit, is used for the testing result control detecting unit shift position on L mistake proofing point based on detecting unit.
In one embodiment, detecting unit is specially infrared facility, comprises infrared induction probe and infrared transmitter, and the position of infrared induction probe and the position correspondence of infrared transmitter lay respectively at the both sides of platform 201.Concrete example such as mistake proofing zone 203 are one and drag for dummy section, namely being one and having run through platform 201, can be a continuous groove, also can be L through hole of a corresponding L mistake proofing point, the infrared induction probe is arranged on the below of platform 201, and infrared transmitter is positioned at the top of platform 201.For example mistake proofing zone 203 is grooves again, can certainly be a continuous recess, also can be L independent groove, and the infrared induction probe is arranged on the bottom of groove, and infrared transmitter is positioned at the top of platform 201.
In another embodiment, detecting unit specifically can also be probe, with detecting unit be that the situation of infrared induction probe and infrared transmitter is similar, just probe need be arranged on platform 201 above or below one-sided getting final product.
In a further embodiment, the riveted operating platform also comprises a sensing unit, is used for sensing time or sensing central layer or resin plate and whether is placed on platform 201.Concrete occupation mode will be introduced in the back.
Further, the position of mistake proofing zone 203, mistake proofing point can be the benchmark setting according to the position of the reference column 202 on the platform 201.
For structure and the using method of the riveted operating platform of clearer detailed explanation present embodiment, please refer to shown in Figure 3ly, Fig. 3 is the structure chart of central layer and resin plate among Fig. 1.
As shown in Figure 3, have M on first central layer 101 and add N through hole, be respectively S
1To S
L, wherein, L is that M adds N and adds 1, and in the present embodiment, M is that 3, N is that 3, L is 6, and the through hole on first central layer 101 is respectively S so
1To S
6Six through holes, in addition, in the present embodiment, S
1To S
6The quantity that not only refers to through hole is also distinguished the position of corresponding through hole.On first resin plate 104, also have through hole then, be respectively S
2To S
6, namely the position of second through hole on first through hole on first resin plate 104 and first central layer 101 is corresponding.
The rest may be inferred, and the number of openings on second central layer 102 is 4, and the position is respectively S
3To S
6Number of openings on second resin plate 105 is 3, and the position is respectively S
4To S
6Number of openings on the 3rd resin plate 106 is 2, and the position is respectively S
5To S
6Number of openings on the 3rd central layer 103 is 1, and the position is S
6Therefore, if represent the order that stacks with i, be positioned at so and have L on the central layer of i layer or the resin plate and deduct i mistake proofing through hole, the position is S
iTo S
L, i 1 to M adds between the N integer arbitrarily.
In specific implementation process, the mistake proofing through hole can be made simultaneously with location hole, and the aperture of mistake proofing through hole can arrange according to the sensing demand, also can be identical with the aperture of location hole.
Next will introduce the lamination error-preventing method based on the riveted operating platform among aforementioned each embodiment in detail, and please refer to shown in Figure 4ly, this method comprises:
Step 401: i layer central layer or resin plate are passed reference column 202 by the location hole on central layer and the resin plate overlay on the platform 201;
Step 402: by being positioned at S
I-1Individual mistake proofing point and S
iThe state of the detecting unit on the individual mistake proofing point judges whether stacking of i layer central layer or resin plate be correct.
Further, when detecting unit is specially infrared facility, when comprising infrared induction probe and infrared transmitter, step 402 specifically comprises: judgement is positioned at S
I-1S on the individual mistake proofing point
I-1Whether individual infrared induction probe receives S
I-1The infrared ray of individual infrared transmitter emission; Judge and be positioned at S
iS on the individual mistake proofing point
iWhether individual infrared induction probe receives S
iThe infrared ray of individual infrared transmitter emission; As S
I-1Individual infrared induction probe does not receive infrared ray and S
iIndividual infrared induction probe receives infrared ray, determines that then stacking of i layer central layer or resin plate is correct.
Specifically, because i layer central layer or resin plate at S
I-1The position do not have through hole, at S
iThe position have through hole, and piled up good i-1 layer at S
I-1The position have through hole, so as S
I-1Individual infrared induction probe does not receive infrared ray, and just the central layer of expression placement at present or resin plate are at S
I-1The position do not have through hole; And as S
iIndividual infrared induction probe receives infrared ray, and just the central layer of expression placement at present or resin plate are at S
iThe position have through hole, the central layer placed at present of expression or the resin plate feature that meets the i laminate so, and then represent that the i laminate places correct.
In a further embodiment, when the quantity of detecting unit is 1, control mobile detecting unit in the position of mistake proofing point, place S
I-1When individual infrared induction probe does not receive infrared ray, to control detecting unit earlier and move to S
iIndividual mistake proofing point is just judged to be positioned at S
iS on the individual mistake proofing point
iWhether individual infrared induction probe receives S
iThe infrared ray of individual infrared transmitter emission.
In a further embodiment, for example at S
iWhen individual infrared induction probe does not receive infrared ray, just represent the lamination mistake, will control detecting unit so and move to S
I-1Enterprising horizontal reset is put in individual mistake proofing, detects to carry out next time.
When last laminate stack finish after, namely i is M when adding N, and the judged result of step 402 is when being correct, the method in the present embodiment comprises that also sending riveted instructs to a lock seaming machine, so that lock seaming machine riveted multilayer circuit board.Corresponding, the riveted operating platform also comprises a control module, be used for central layer and resin plate stack order correct and stack finish after, send riveted and instruct to a lock seaming machine, so that lock seaming machine riveted multilayer circuit board.
Therefore, further, another embodiment of the utility model also provides a kind of riveted equipment, comprises riveted operating platform and lock seaming machine among aforementioned each embodiment, and this lock seaming machine is used for this multilayer circuit board of riveted.
For the lamination error-preventing method of the riveted operating platform of those skilled in the art in can clearer understanding the utility model embodiment, below by illustrating for concrete example.
First embodiment: in the present embodiment, it is example that detecting unit is L with infrared induction probe and infrared transmitter, quantity, and namely L mistake proofing point gone up each fixedly a detecting unit.
At first, when first central layer 101 is enclosed within on the reference column 202 by location hole, when being placed on the platform 201, because first central layer 101 is at position S
0There is not the mistake proofing through hole, and position S
1To S
6Has through hole, so S
0The infrared inductor at individual mistake proofing point place does not receive infrared ray, and can be considered lamination and begin this moment.Can judge S then
1Whether the infrared induction probe at individual mistake proofing point place has received infrared ray, if represent that then lamination is correct, because have only first central layer 101 in all plates at position S
1There is through hole at the place; And if do not receive ultrared words, then show and placed other central layers or resin plate, can make mistakes by alarm.
Further, for more accurate detection is judged, as shown in Figure 5, can judge by the logic in the table, namely not only consider S
0Infrared induction probe and the S at individual mistake proofing point place
1The infrared induction probe at individual mistake proofing point place is also considered S
1The infrared induction of the mistake proofing point after the individual mistake proofing point is popped one's head in, for example when stacking order when being 1, if S
0The infrared induction probe at individual mistake proofing point place does not receive infrared ray, and S
1To S
LWhether the infrared induction probe at mistake proofing point place all receives infrared ray, can more accurate judgement stack correct like this.
After first central layer 101 is placed correctly, place the 2nd layer plate again, be second resin plate 104 in the present embodiment, just judge at S then
1Individual mistake proofing point place and S
2Whether the infrared induction probe at individual mistake proofing point place has received infrared ray, if S
1The infrared induction probe at individual mistake proofing point place has received infrared ray or S
1Individual mistake proofing point place and S
2The infrared induction probe at individual mistake proofing point place does not all receive infrared ray, then represents the 2nd laminate placement mistake.
And then repeat to judge at S
1Individual mistake proofing point place and S
2Whether the infrared induction probe at individual mistake proofing point place has received infrared ray, places the tram up to judging.
Certainly, in order to save time, raise the efficiency, reduce energy consumption, can whether reach a predetermined amount of time apart from the time of judging result (correct or incorrect) last time by sensing units sense, if, just judge again, this predetermined amount of time can go to arrange according to actual needs, as long as reserve the time that puts plate.
In another embodiment, also can be whether to have plate to be placed on the platform 201 by sensing units sense, judge again if any.
Repeat aforementioned process, finish up to all plates are all stacked.
Be the situation of other forms for detecting unit, probe for example, similar with process among first embodiment, so do not repeat them here.
Second embodiment: different with first embodiment is, the quantity of detecting unit has only one, thus need last time testing result control detecting unit be mobile at mistake proofing point according to detecting unit, and for example in the time of placement first laminate, the result of judgement is at S
1When the infrared induction probe at individual mistake proofing point place did not receive infrared ray, the expression lamination was made mistakes, and can make mistakes by alarm, and control infrared induction probe returned to S
0Individual mistake proofing point place restarts to detect.After for example in the end a mistake proofing point detection is finished in addition, return to S
0Individual mistake proofing point place resets.
The one or more embodiment of the utility model have following technique effect at least:
Riveted operating platform among the utility model embodiment compared with prior art, at first adopt on the central layer that forms multilayer circuit board and resin plate according to stacking the mistake proofing through hole that offers respective numbers in proper order, be positioned on the central layer of i layer or the resin plate and have L-i mistake proofing through hole, the position is Si to S
L, L is total number of plies of central layer and resin plate; The put area of central layer or resin plate arranges the mistake proofing zone on the riveted operating platform then, has L mistake proofing point on the mistake proofing zone, and the position is S0 to SL; At mistake proofing point detecting unit is set then, when i layer central layer or resin plate are passed reference column and overlay on the platform by the location hole on central layer and the resin plate, by being positioned at the state of the detecting unit on Si-1 mistake proofing point and Si the mistake proofing point, judge whether stacking of i layer central layer or resin plate be correct.This shows, by the riveted operating platform in the present embodiment, central layer can be judged accurately or whether resin plate misplaces layer, perhaps leak and put, and no matter how how many layers layer circuit board has, and this riveted operating platform all is suitable for, further, the mistake proofing of the riveted operating platform in the present embodiment does not rely on artificial judgement, so the efficient height; To sum up, the riveted operating platform mistake proofing in the present embodiment is comprehensive, efficient is high, applied widely.
In this specification, the utility model is described with reference to its certain embodiments, and still, those skilled in the art can carry out various changes and modification to the utility model and not break away from spirit and scope of the present utility model.Like this, if of the present utility model these are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these changes and modification interior.
Claims (7)
1. riveted operating platform, be used for the stacked multilayer circuit board, it is characterized in that, described multilayer circuit board is piled up in order by M layer central layer and the N layer resin plate between described M layer central layer and forms, all has the mistake proofing through hole on the described M layer central layer with on the described N layer resin plate, wherein, be positioned on the central layer of i layer or the resin plate and have L-i mistake proofing through hole, the position is S
iTo S
L, M is the integer more than or equal to 2, and N is the integer more than or equal to 1, and L is M+N+1, and i is integer arbitrarily between 1 to M+N; Described operating platform comprises:
Platform is used for placing described multilayer circuit board;
At least two reference columns are arranged on the described platform, and described reference column can pass the location hole on described central layer and the described resin plate, so that described central layer and described resin plate are fixed on the described platform;
The mistake proofing zone is arranged on the described platform on the zone that can be covered by described central layer, and described mistake proofing zone has L mistake proofing point, and the position is S
0To S
L, corresponding with mistake proofing lead to the hole site on described central layer and the described resin plate; Whether described mistake proofing point is provided with detecting unit, in proper order correct for detection of stacking of described central layer and described resin plate.
2. riveted operating platform as claimed in claim 1 is characterized in that, the quantity of described detecting unit is specially 1 or L;
When the quantity of described detecting unit was L, a described L detecting unit was corresponding one by one with the position of a described L mistake proofing point;
When the quantity of described detecting unit was specially 1, described riveted operating platform also comprised:
Control unit is used for controlling described detecting unit described L mistake proofing point shift position based on the testing result of described detecting unit.
3. riveted operating platform as claimed in claim 2, it is characterized in that described detecting unit is infrared facility, comprise infrared induction probe and infrared transmitter, the position of described infrared induction probe and the position correspondence of described infrared transmitter lay respectively at the both sides of described platform.
4. riveted operating platform as claimed in claim 2 is characterized in that, described detecting unit is specially probe.
5. riveted operating platform as claimed in claim 1 is characterized in that, described mistake proofing zone is specially groove or runs through the zone of described platform.
6. riveted operating platform as claimed in claim 1, it is characterized in that, described riveted operating platform also comprises a control module, be used for described central layer and described resin plate stack order correct and stack finish after, send riveted and instruct to a lock seaming machine, so that the described multilayer circuit board of described lock seaming machine riveted.
7. a riveted equipment is characterized in that, comprising:
As each described riveted operating platform of claim 1-6, be used for the stacked multilayer circuit board;
Lock seaming machine is connected in described riveted operating platform, is used for the described multilayer circuit board of riveted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320051094 CN203040033U (en) | 2013-01-29 | 2013-01-29 | Riveting operating platform and riveting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320051094 CN203040033U (en) | 2013-01-29 | 2013-01-29 | Riveting operating platform and riveting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203040033U true CN203040033U (en) | 2013-07-03 |
Family
ID=48692116
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320051094 Expired - Fee Related CN203040033U (en) | 2013-01-29 | 2013-01-29 | Riveting operating platform and riveting device |
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| CN (1) | CN203040033U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722341A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Automatic plate-conveying workbench |
| CN108990318A (en) * | 2018-07-26 | 2018-12-11 | 深圳崇达多层线路板有限公司 | A kind of method for manufacturing circuit board of loophole lamination mistake proofing |
-
2013
- 2013-01-29 CN CN 201320051094 patent/CN203040033U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722341A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Automatic plate-conveying workbench |
| CN108990318A (en) * | 2018-07-26 | 2018-12-11 | 深圳崇达多层线路板有限公司 | A kind of method for manufacturing circuit board of loophole lamination mistake proofing |
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|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130703 Termination date: 20170129 |
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| CF01 | Termination of patent right due to non-payment of annual fee |