CN103747639A - Manufacturing method for high-rise board - Google Patents
Manufacturing method for high-rise board Download PDFInfo
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- CN103747639A CN103747639A CN201410050656.4A CN201410050656A CN103747639A CN 103747639 A CN103747639 A CN 103747639A CN 201410050656 A CN201410050656 A CN 201410050656A CN 103747639 A CN103747639 A CN 103747639A
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- central layer
- core
- core boards
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- concentric circles
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 20
- 238000003825 pressing Methods 0.000 claims description 14
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- 230000002950 deficient Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000007115 recruitment Effects 0.000 claims description 3
- 238000005553 drilling Methods 0.000 abstract 3
- 238000010030 laminating Methods 0.000 abstract 1
- 238000003475 lamination Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 55
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000011162 core material Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a manufacturing method for a high-rise board. The manufacturing method comprises the steps as follows: preparing a plurality of core boards for being stacked to form a high-rise board, wherein each core board comprises one or more conductor layers; ensuring the expansion/shrinkage coefficient of each core board; setting concentric circles of different outer diameters in the middle positions of the long and short edges of each core board, and stacking the core boards, with the radiuses of the concentric circles on the core boards increasing in sequence from the top down; pre-arranging the core boards by taking the concentric circles of the stacked core boards as base points; conducting X-RAY fluoroscopic examination on the pre-arranged core boards, and reinforcing the pre-arranged core boards with rivets; laminating the reinforced core boards; testing the expansion/shrinkage value of the laminated core boards, drilling a product, of which the expansion/shrinkagevalue ranges from plus 0.02% to minus 0.02%, according to a drill file of 1:1, and drilling a product, of which the expansion/shrinkage value is above plus or minus 0.02%, by adopting a separate tensile drill file. The manufacturing method provided by the invention avoids the situation that the core boardsdeviate during lamination because the core boards are rinsed by a drilling machine.
Description
Technical field
The present invention relates to a kind of method of manufacturing printed circuit board, particularly relate to a kind of high-rise board fabrication method.
Background technology
Along with the continuous renewal of electronic product is regenerated, people are also more and more higher to the requirement of electronic product, should meet electronic product multiple functional, meet again its light, thin and little requirement.This manufacturing technology to the circuit board as electronic product basic building block is had higher requirement, single sided board, double sided board, four sides plate and six panels can not meet the demand of existing electronic product, to this, many printed circuit boards manufacturer starts to manufacture high laminate, and the manufacture method of high laminate is also more and more.As Chinese Patent Application No.: 2010102031684 disclose a kind of method for producing multi-layer board, and it comprises the following steps: the first copper-clad plate is provided, and the first copper-clad plate has forming area and surrounds the fringe region of forming area; The fringe region of the first copper-clad plate is etched with and forms at least one concentric copper ring group, at least one described concentric copper ring group comprises the second copper ring of the first copper ring and annular the first copper ring, the center of circle of the first copper ring is defined as initial center, provide second to cover copper and adhesive layer, and by adhesive layer hot pressing between the first copper-clad plate and the second copper-clad plate, thereby form multilager base plate; Take this initial center as the center of circle, make the detection hole of running through the first copper-clad plate, adhesive layer and the second copper-clad plate; Utilize light to irradiate multilager base plate, thereby obtain detection hole, to determine, detect the stand-off error that initial center is departed from hole with the relative position relation of concentric copper ring group; According to this stand-off error, determine the harmomegathus ratio after multilager base plate hot pressing, and according to this harmomegathus ratio-dependent multilager base plate, offer the position of via.
Above-mentioned manufacturing method of multi-layer circuit board can accurately obtain the concrete data of the stand-off error that detects hole, avoid causing owing to being out of one's reckoning the via of follow-up making to have the problem that stand-off error is larger, thereby reduced the situation of multilayer circuit board poor flow or short circuit, effectively improved the quality of leading of multilayer circuit board.But, foregoing invention is just optimized multiple-plate making from multiple-plate this factor of harmomegathus coefficient, and in multiple-plate actual fabrication process, the principal element that affects high laminate making has: slide plate off normal control when harmomegathus coefficient, interlayer alignment, high laminate pressing and the control of high-rise plate borehole accuracy.The practice adopting during to high laminate pressing in traditional high laminate course of processing is: on core material, design rivet hole, after core material machines, rivet hole is developed with rushing target drone, after holding prepreg successfully, on prepreg, get out corresponding via, after walkthrough plate, just adopt the via on rivet hole and the prepreg on central layer to carry out riveted.Above-mentioned high laminate compression method adopts and rinses, thereby causes central layer when pressing, to occur the situation of off normal, thereby affects the quality of product, when serious, will make to manage partly to scrap; Simultaneously, in traditional high laminate course of processing, to the practice in high-rise twist drill hole, be: the boring file by 1:1 after central layer pressing is processed, if when the harmomegathus direction that the above-mentioned practice runs into the direction in the inclined to one side hole of boring and produces plate is just in time contrary, the part that should connect will cause open circuit; And the part that should disconnect will short circuit, thereby cause high laminate to scrap in batches.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, a kind of high-rise board fabrication method to the control of slide plate off normal when harmomegathus coefficient, interlayer alignment precision, high laminate pressing and high-rise plate borehole accuracy in high laminate manufacturing process is provided, the control of the key factors such as the slide plate off normal when to harmomegathus coefficient, interlayer alignment precision, high laminate pressing and high-rise plate borehole accuracy, thereby improve the quality of high laminate, guarantee the reliability that high laminate is produced.
The object of the invention is to be achieved through the following technical solutions: a kind of high-rise board fabrication method, it comprises the following steps:
S1: prepare the polylith central layer for being stacked into high laminate, described central layer includes at least one deck conductor layer;
S2: the harmomegathus coefficient of determining every central layer;
S3: on the long limit of every central layer and the centre position of minor face, the different concentric circles of external diameter is set, and central layer is piled to poststack, the concentrically ringed radius on every central layer increases successively from top to bottom;
S4: central layer is carried out to walkthrough plate take the concentric circles of central layer heap poststack as basic point;
S5: the central layer after walkthrough plate is carried out to X-RAY fluoroscopic examination, to the qualified central layer of fluoroscopic examination and with rivet, central layer after walkthrough plate is reinforced, take out if defective;
S6: the central layer after reinforcing is carried out to pressing;
S7: the harmomegathus value to the central layer after pressing is measured, the product by harmomegathus value in positive and negative 2/10000ths is holed by the boring file of 1:1, adopts the independent boring file that goes out to stretch to hole harmomegathus value at positive and negative more than 2/10000ths product.
The present invention is preferred, and described harmomegathus coefficient ratio is determined according to the sheet material of central layer, thickness of slab, copper thickness, direction of warp and weft and different prepreg combinations.
The present invention is preferred, and the recruitment of described concentric circles radius is 3mil.
The present invention is preferred, and the described method that central layer is carried out to walkthrough plate is to adopt heating head high temperature to merge walkthrough plate method.
The present invention is preferred, and the specific practice that the central layer with rivet after to walkthrough plate is reinforced is that the surrounding of the central layer after to walkthrough plate with rivet is reinforced.
Compared with prior art, the present invention has following beneficial effect:
1) take concentric circles as basic point, central layer is carried out to walkthrough plate, and the central layer after walkthrough plate is carried out to the inspection of X-RAY lens, X-RAY lens check result shows when the concentric circles in directions X and Y-direction is very even between ring and ring, just central layer is carried out to walkthrough plate, and reinforce with rivet, thereby avoided when rushing target drone central layer is rinsed central layer when pressing, to occur the situation of off normal, improved the quality of high laminate;
2) the harmomegathus value of the central layer after pressing is measured, product by harmomegathus value in positive and negative 2/10000ths is holed by the boring file of 1:1, at positive and negative more than 2/10000ths product, adopt the independent boring file that goes out to stretch to hole harmomegathus value, thereby avoided because the direction in the inclined to one side hole of holing and the harmomegathus direction of producing plate are when just in time contrary, the part that should connect will cause open circuit, and the part that should disconnect will short circuit, the situation that causes high laminate to scrap in batches.
Accompanying drawing explanation
Fig. 1 is implementing procedure figure of the present invention.
Embodiment
Below in conjunction with accompanying drawing, technical scheme of the present invention is described in further detail, but protection scope of the present invention is not limited to the following stated.
As shown in Figure 1, a kind of high-rise board fabrication method, it comprises the following steps:
S1: prepare the polylith central layer for being stacked into high laminate, described central layer includes at least one deck conductor layer;
S2: the harmomegathus coefficient of determining every central layer;
S3: on the long limit of every central layer and the centre position of minor face, the different concentric circles of external diameter is set, and central layer is piled to poststack, the concentrically ringed radius on every central layer increases successively from top to bottom;
S4: central layer is carried out to walkthrough plate take the concentric circles of central layer heap poststack as basic point;
S5: the central layer after walkthrough plate is carried out to X-RAY fluoroscopic examination, to the qualified central layer of fluoroscopic examination and with rivet, central layer after walkthrough plate is reinforced, take out if defective;
S6: the central layer after reinforcing is carried out to pressing;
S7: the harmomegathus value to the central layer after pressing is measured, the product by harmomegathus value in positive and negative 2/10000ths is holed by the boring file of 1:1, adopts the independent boring file that goes out to stretch to hole harmomegathus value at positive and negative more than 2/10000ths product.
Preferably, described harmomegathus coefficient is determined according to the sheet material of central layer, thickness of slab, copper thickness, direction of warp and weft and different prepreg combinations.
Preferably, the recruitment of described concentric circles radius is 3mil, for example, take second layer radius as 2.0mm, be basic circle, and the 3rd layer is strengthened 3mil as concentric radius circle is set, by that analogy.
Preferably, the described method that central layer is carried out to walkthrough plate is to adopt heating head high temperature to merge walkthrough plate method.
Preferably, the specific practice that the central layer after to walkthrough plate is reinforced with rivet is that the surrounding of the central layer after to walkthrough plate with rivet is reinforced.
The impact that sheet material, thickness of slab, copper thickness, direction of warp and weft and the different prepregs of central layer combines the harmomegathus coefficient on central layer has adopted experiment measuring, draws the experimental result as shown in table 1～table 5.
Table 1: every layer of prepreg combination is multiple when (>=2 or mix with other prepreg), according to the form below data are determined harmomegathus coefficient (unit: ten thousand/)
Table 2: prepreg combines other when collocation, according to the form below data are determined harmomegathus coefficient (unit: ten thousand/)
Table 3: when the length direction plate that is warp-wise, according to the form below data are determined harmomegathus coefficient (unit: ten thousand/)
Table 4: when the length direction plate that is broadwise, according to the form below data are determined harmomegathus coefficient (unit: ten thousand/)
Table 5: when internal layer is used tabula rasa, according to the form below data are determined harmomegathus coefficient (unit: ten thousand/)
By table 1～table 5, can be obtained, according to the sheet material of central layer, thickness of slab, copper thickness, direction of warp and weft and different prepregs, combine and determine its harmomegathus coefficient, make the harmomegathus value of central layer more accurate.
Claims (5)
1. a high-rise board fabrication method, is characterized in that: it comprises the following steps:
S1: prepare the polylith central layer for being stacked into high laminate, described central layer includes at least one deck conductor layer;
S2: the harmomegathus coefficient of determining every central layer;
S3: on the long limit of every central layer and the centre position of minor face, the different concentric circles of external diameter is set, and central layer is piled to poststack, the concentrically ringed radius on every central layer increases successively from top to bottom;
S4: central layer is carried out to walkthrough plate take the concentric circles of central layer heap poststack as basic point;
S5: the central layer after walkthrough plate is carried out to X-RAY fluoroscopic examination, to the qualified central layer of fluoroscopic examination and with rivet, central layer after walkthrough plate is reinforced, take out if defective;
S6: the central layer after reinforcing is carried out to pressing;
S7: the harmomegathus value to the central layer after pressing is measured, the product by harmomegathus value in positive and negative 2/10000ths is holed by the boring file of 1:1, adopts the independent boring file that goes out to stretch to hole harmomegathus value at positive and negative more than 2/10000ths product.
2. the high-rise board fabrication method of one according to claim 1, is characterized in that: described harmomegathus coefficient is determined according to the sheet material of central layer, thickness of slab, copper thickness, direction of warp and weft and different prepreg combinations.
3. the high-rise board fabrication method of one according to claim 1, is characterized in that: the recruitment of described concentric circles radius is 3mil.
4. the high-rise board fabrication method of one according to claim 1, is characterized in that: the described method that central layer is carried out to walkthrough plate is to adopt heating head high temperature to merge walkthrough plate method.
5. the high-rise board fabrication method of one according to claim 1, is characterized in that: the specific practice that the central layer with rivet after to walkthrough plate is reinforced is that the surrounding of the central layer after to walkthrough plate with rivet is reinforced.
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| CN201410050656.4A CN103747639B (en) | 2014-02-13 | 2014-02-13 | A kind of high-rise board fabrication method |
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| CN201410050656.4A CN103747639B (en) | 2014-02-13 | 2014-02-13 | A kind of high-rise board fabrication method |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244590A (en) * | 2014-08-28 | 2014-12-24 | 广州兴森快捷电路科技有限公司 | Control method of outer layer deviation of circuit boards |
| CN104363719A (en) * | 2014-11-28 | 2015-02-18 | 广州杰赛科技股份有限公司 | Manufacturing method of circuit board with blind holes |
| CN104470265A (en) * | 2014-11-19 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | Manufacturing method of multi-layer circuit board |
| CN105050339A (en) * | 2015-07-10 | 2015-11-11 | 东莞市科佳电路有限公司 | Method for detecting interlayer position deviation of multilayer printed circuit board |
| CN105636345A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Multilayer PCB core material expansion and shrinkage matching method |
| CN106102331A (en) * | 2016-06-27 | 2016-11-09 | 深圳崇达多层线路板有限公司 | A kind of method of large scale wiring board inner cord exposure aligning |
| CN107666768A (en) * | 2017-09-29 | 2018-02-06 | 奥士康科技股份有限公司 | Aligning degree monitoring method between PCB layer |
| CN109688736A (en) * | 2019-01-29 | 2019-04-26 | 深圳市景旺电子股份有限公司 | Multilayer circuit board and preparation method thereof |
| CN110324993A (en) * | 2019-07-29 | 2019-10-11 | 重庆伟鼎电子科技有限公司 | Circuit board pressing is to pressure |
| CN110708874A (en) * | 2019-09-24 | 2020-01-17 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN110996564A (en) * | 2019-12-30 | 2020-04-10 | 惠州市永隆电路有限公司 | Expansion and shrinkage control method for PCB (printed circuit board) multilayer board |
| CN111867252A (en) * | 2020-06-02 | 2020-10-30 | 江西一诺新材料有限公司 | High-precision covering film laminating method |
| CN112165854A (en) * | 2020-10-21 | 2021-01-01 | 宜兴硅谷电子科技有限公司 | Interlayer alignment visual monitoring method |
| CN113133211A (en) * | 2021-04-16 | 2021-07-16 | 苏州维嘉科技股份有限公司 | Drilling machine and machining compensation method and device thereof |
| CN114190015A (en) * | 2021-12-29 | 2022-03-15 | 湖北金禄科技有限公司 | PCB of wearable product and processing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102098884A (en) * | 2010-12-29 | 2011-06-15 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN102291949A (en) * | 2010-06-18 | 2011-12-21 | 富葵精密组件(深圳)有限公司 | Manufacturing method of multi-layer circuit board |
| CN202178918U (en) * | 2011-07-27 | 2012-03-28 | 胜宏科技（惠州）有限公司 | Copper-clad plate capable of controlling CORE expansion-contraction layer deviation |
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN103533761A (en) * | 2013-10-23 | 2014-01-22 | 广东依顿电子科技股份有限公司 | Manufacturing method for improving accuracy of PCB (printed circuit board) back drilling hole |
-
2014
- 2014-02-13 CN CN201410050656.4A patent/CN103747639B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291949A (en) * | 2010-06-18 | 2011-12-21 | 富葵精密组件(深圳)有限公司 | Manufacturing method of multi-layer circuit board |
| CN102098884A (en) * | 2010-12-29 | 2011-06-15 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN202178918U (en) * | 2011-07-27 | 2012-03-28 | 胜宏科技（惠州）有限公司 | Copper-clad plate capable of controlling CORE expansion-contraction layer deviation |
| CN103249266A (en) * | 2013-04-03 | 2013-08-14 | 胜宏科技（惠州）股份有限公司 | Multilayer circuit board production method capable of preventing layer deviation |
| CN103533761A (en) * | 2013-10-23 | 2014-01-22 | 广东依顿电子科技股份有限公司 | Manufacturing method for improving accuracy of PCB (printed circuit board) back drilling hole |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244590A (en) * | 2014-08-28 | 2014-12-24 | 广州兴森快捷电路科技有限公司 | Control method of outer layer deviation of circuit boards |
| CN104244590B (en) * | 2014-08-28 | 2018-07-20 | 广州兴森快捷电路科技有限公司 | The control method of circuit board outer layer deviation |
| CN104470265A (en) * | 2014-11-19 | 2015-03-25 | 广州兴森快捷电路科技有限公司 | Manufacturing method of multi-layer circuit board |
| CN104470265B (en) * | 2014-11-19 | 2017-09-22 | 广州兴森快捷电路科技有限公司 | A kind of preparation method of multilayer circuit board |
| CN104363719A (en) * | 2014-11-28 | 2015-02-18 | 广州杰赛科技股份有限公司 | Manufacturing method of circuit board with blind holes |
| CN104363719B (en) * | 2014-11-28 | 2017-09-22 | 广州杰赛科技股份有限公司 | A kind of preparation method of the circuit board with blind hole |
| CN105050339A (en) * | 2015-07-10 | 2015-11-11 | 东莞市科佳电路有限公司 | Method for detecting interlayer position deviation of multilayer printed circuit board |
| CN105636345A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Multilayer PCB core material expansion and shrinkage matching method |
| CN106102331A (en) * | 2016-06-27 | 2016-11-09 | 深圳崇达多层线路板有限公司 | A kind of method of large scale wiring board inner cord exposure aligning |
| CN107666768A (en) * | 2017-09-29 | 2018-02-06 | 奥士康科技股份有限公司 | Aligning degree monitoring method between PCB layer |
| CN109688736A (en) * | 2019-01-29 | 2019-04-26 | 深圳市景旺电子股份有限公司 | Multilayer circuit board and preparation method thereof |
| CN109688736B (en) * | 2019-01-29 | 2020-10-30 | 深圳市景旺电子股份有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN110324993A (en) * | 2019-07-29 | 2019-10-11 | 重庆伟鼎电子科技有限公司 | Circuit board pressing is to pressure |
| CN110708874A (en) * | 2019-09-24 | 2020-01-17 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN110708874B (en) * | 2019-09-24 | 2021-06-04 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN110996564A (en) * | 2019-12-30 | 2020-04-10 | 惠州市永隆电路有限公司 | Expansion and shrinkage control method for PCB (printed circuit board) multilayer board |
| CN111867252A (en) * | 2020-06-02 | 2020-10-30 | 江西一诺新材料有限公司 | High-precision covering film laminating method |
| CN111867252B (en) * | 2020-06-02 | 2021-10-22 | 江西一诺新材料有限公司 | High-precision covering film laminating method |
| CN112165854A (en) * | 2020-10-21 | 2021-01-01 | 宜兴硅谷电子科技有限公司 | Interlayer alignment visual monitoring method |
| CN113133211A (en) * | 2021-04-16 | 2021-07-16 | 苏州维嘉科技股份有限公司 | Drilling machine and machining compensation method and device thereof |
| CN113133211B (en) * | 2021-04-16 | 2022-03-11 | 苏州维嘉科技股份有限公司 | Drilling machine and machining compensation method and device thereof |
| CN114190015A (en) * | 2021-12-29 | 2022-03-15 | 湖北金禄科技有限公司 | PCB of wearable product and processing method thereof |
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Denomination of invention: Manufacturing method for high-rise board Effective date of registration: 20190313 Granted publication date: 20161005 Pledgee: Suining rural commercial bank Limited by Share Ltd Pledgor: Wesky (Suining) Electronics Co., Ltd. Registration number: 2019510000026 |
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Denomination of invention: A manufacturing method of high rise board Effective date of registration: 20201217 Granted publication date: 20161005 Pledgee: Suining rural commercial bank Limited by Share Ltd. Pledgor: WESKY (SUINING) ELECTRONICS Co.,Ltd. Registration number: Y2020510000113 |
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