CN104363719B - A kind of preparation method of the circuit board with blind hole - Google Patents
A kind of preparation method of the circuit board with blind hole Download PDFInfo
- Publication number
- CN104363719B CN104363719B CN201410715097.4A CN201410715097A CN104363719B CN 104363719 B CN104363719 B CN 104363719B CN 201410715097 A CN201410715097 A CN 201410715097A CN 104363719 B CN104363719 B CN 104363719B
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- China
- Prior art keywords
- blind hole
- core plate
- circuit board
- area
- laminated
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Abstract
The invention discloses a kind of preparation method of the circuit board with blind hole, including：The area of blind hole on circuit board to be produced and standard value are contrasted, judge whether the blind hole on the circuit board needs separately to clog before being laminated；The circuit board includes the first core plate and the second core plate, and at least one blind hole is located on the first core plate, and at least another blind hole is located on the second core plate；If desired separately clog before being laminated, then make the first core plate, drilled on first core plate；The second core plate is made, is drilled on second core plate；Hole on hole on first core plate and second core plate is clogged；First core plate and second core plate are laminated using prepreg, the circuit board with blind hole is made.The present invention can be quickly and accurately on decision circuit plate blind hole whether need before being laminated separately consent, so as to improve the quality of production and efficiency of blind hole circuit board, and reduce cost.
Description
Technical field
The present invention relates to the making field of circuit board, more particularly to a kind of system of the circuit board with blind hole with blind hole
Make method.
Background technology
As board design is more and more intensive, the design of blind hole is also more and more.In process blind hole need by
Resin filling is full, to prevent in follow-up microetch or etching process, and opening a way in hole is occurred by liquid medicine corrosion in blind hole, makes circuit
Plate can not meet most basic electrical connection.In the high temperature and high pressure environment of circuit board laminates, half for being bonded core plate
Cured sheets can produce gummosis into blind hole, but part prepreg due to mobility it is poor, it is impossible to blind hole is clogged by resin
Full, this part blind hole needs individually to do filling holes with resin.
In current industry, for judging whether blind hole needs individually to do filling holes with resin, without preferable method.Do not enter typically
Row judges, directly individually does filling holes with resin to whole circuit boards, causes circuit board making cost increase；Otherwise it is exactly decision rule
It is unreasonable, the blind hole that can not judge to need individually to do filling holes with resin is easily caused, makes to exist on circuit board finished product and is not filled out by resin
Full blind hole is gorged, circuit board is ultimately resulted in and quality problems occurs.
The content of the invention
The embodiment of the present invention proposes a kind of preparation method of the circuit board with blind hole, can quickly and accurately judge electricity
Whether the blind hole on the plate of road needs before being laminated separately consent, so that the quality of production and efficiency of blind hole circuit board are improved, and
Reduce cost.
The embodiment of the present invention provides a kind of preparation method of the circuit board with blind hole, including：
S1, the area and standard value of the blind hole on circuit board to be produced contrasted, judged on the circuit board
Whether blind hole needs separately is clogged before being laminated；The circuit board to be produced includes the first core plate and the second core plate, at least
One blind hole is located on first core plate, and at least another blind hole is located on second core plate；
S2, if it is determined that blind hole on the circuit board needs separately to clog before being laminated, then perform step S3, S4, S5
And S6；Otherwise step S3, S4 and S6 are performed；
S3, the first core plate of making, drill, first core plate is run through in the hole on first core plate；
S4, the second core plate of making, drill, second core plate is run through in the hole on second core plate；
S5, the hole on the hole on first core plate and second core plate is clogged；
S6, using prepreg first core plate and second core plate are laminated, the electricity with blind hole is made
Road plate；
Wherein, the step S1 is specifically included：
Obtain the blind hole distribution map of circuit board to be produced；The blind hole distribution map includes N number of blind hole, N >=2；It is described N number of
At least one blind hole in blind hole is located on first core plate, and at least another blind hole in N number of blind hole is located at
On second core plate；
M determinating area, M >=1 are marked on the blind hole distribution map；
The gross area of the blind hole in each determinating area is calculated, and selects from the M gross area maximum；
The maximum and standard value are contrasted, if the maximum is more than the standard value, the electricity is judged
Blind hole on the plate of road needs separately to clog before being laminated, otherwise judges that the blind hole on the circuit board need not be before being laminated
Separately clog；
The area of the determinating area is that the depth capacity of the blind hole on S, the circuit board is H, and the standard value refers to：
When being laminated using prepreg to first core plate and second core plate, area is the gummosis of S prepreg
The depth that can be filled up on first core plate and second core plate is the maximum of the gross area of H blind hole.
Wherein, the blind hole distribution map is to carry out wires design to circuit theory diagrams using electronic design automation software
Afterwards, the PCB routing figure obtained, the PCB routing figure is comprising blind on first core plate and second core plate
The positional information in hole；Or, the blind hole distribution map is in the manufacturing process of the circuit board, by first core plate
Taken pictures or scanned with the plate face circuit of second core plate, and the PCB routing obtained after being positioned to blind hole
Figure, positional information of the PCB routing figure comprising first core plate and the blind hole on second core plate.
In one embodiment, it is described to mark M determinating area on the blind hole distribution map, specifically include：Respectively
Centered on each blind hole on the blind hole distribution map, M determinating area is marked on the blind hole distribution map, makes M to sentence
Determine region to correspond with N number of blind hole respectively, N=M.
In another embodiment, it is described to mark M determinating area on the blind hole distribution map, specifically include：Will
The blind hole distribution map is divided equally into M determinating area.
The preparation method of circuit board provided in an embodiment of the present invention with blind hole, using prepreg be laminated with
It is made before blind hole circuit board, is first contrasted the area of the blind hole on circuit board to be produced and standard value, judges described
Whether the blind hole on circuit board needs separately is clogged before being laminated.If desired, then illustrate that the blind hole on the circuit board can not
The gummosis of prepreg during being laminated fills up, then, it is necessary to first right before being laminated during circuit board is made
Blind hole on the circuit board is separately clogged, so as to ensure that the blind hole of circuit board finished product is clogged full, raising circuit by resin
The quality of production of plate.If need not, illustrate the blind hole on the circuit board can be laminated during prepreg stream
Plug is expired, then in the manufacturing process of circuit board, the process to the other consent of circuit board is not performed before being laminated, so as to carry
High formation efficiency, and reduce production cost.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of one embodiment of the preparation method for the circuit board with blind hole that the present invention is provided；
Fig. 2, which is one of the consent determination step in the preparation method of the circuit board with blind hole that the present invention is provided, to be implemented
The schematic flow sheet of example；
Fig. 3 is an implementation of the circuit board applied in the preparation method for the circuit board with blind hole that the present invention is provided
The structure chart of example；
Fig. 4 is the schematic diagram of one embodiment that determinating area is set up in the consent determination step that provides of the present invention；
Fig. 5 is the schematic diagram for another embodiment that determinating area is set up in the consent determination step that provides of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.It is the one embodiment for the consent determination step that the present invention is provided referring to Fig. 1
Schematic flow sheet.
It is that the flow of one embodiment of the preparation method for the circuit board with blind hole that the present invention is provided is shown referring to Fig. 1
It is intended to.
The present invention provides a kind of preparation method of the circuit board with blind hole, including step S1 is to S6, specific as follows：
S1, the area and standard value of the blind hole on circuit board to be produced contrasted, judged on the circuit board
Whether blind hole needs separately is clogged before being laminated；The circuit board to be produced includes the first core plate and the second core plate, at least
One blind hole is located on first core plate, and at least another blind hole is located on second core plate；
S2, if it is determined that blind hole on the circuit board needs separately to clog before being laminated, then perform step S3, S4, S5
And S6；Otherwise step S3, S4 and S6 are performed；
S3, the first core plate of making, drill, first core plate is run through in the hole on first core plate；
Wherein, first core plate is lamina or multi-layer sheet.
S4, the second core plate of making, drill, second core plate is run through in the hole on second core plate；
Wherein, second core plate is lamina or multi-layer sheet.
S5, the hole on the hole on first core plate and second core plate is clogged；
Specifically, in step s 5, can be using resin on the hole on first core plate and second core plate
Clogged in hole.
S6, using prepreg first core plate and second core plate are laminated, the electricity with blind hole is made
Road plate.
Wherein, step S1 is being laminated using prepreg to be performed before blind hole circuit board is made, for judging to treat
Whether the blind hole on the circuit board of making needs separately is clogged before being laminated, and for convenience of describing, step S1 is referred to as into " plug below
Hole determination step ".
With reference to Fig. 2 to Fig. 5, to the plug in the preparation method of the circuit board provided in an embodiment of the present invention with blind hole
Hole determination step is described in detail.
Referring to Fig. 2, be the circuit board with blind hole that the present invention is provided preparation method in consent determination step one
The schematic flow sheet of individual embodiment.
The consent determination step of consent determination step provided in an embodiment of the present invention, including step S101 to S104, specifically
It is as follows：
S101, the blind hole distribution map for obtaining circuit board to be produced；The blind hole distribution map includes N number of blind hole, N >=2；Institute
At least one blind hole that stating circuit board to be produced is included in the first core plate and the second core plate, N number of blind hole is located at described
On first core plate, at least another blind hole in N number of blind hole is located on second core plate.
Specifically, the blind hole distribution map can be that circuit theory diagrams are connected up using electronic design automation software
After design, and the PCB routing figure obtained, the PCB routing figure is comprising on first core plate and second core plate
Blind hole positional information.
In addition, the blind hole distribution map can also be in the manufacturing process of the circuit board, by first core
The plate face circuit of plate and second core plate is taken pictures or scanned, and the PCB routing obtained after being positioned to blind hole
Figure, positional information of the PCB routing figure comprising first core plate and the blind hole on second core plate.
That is, consent determination step provided in an embodiment of the present invention, can be before circuit board is made or in system
During making circuit board, judge whether the blind hole on the circuit board needs before being laminated according to the wiring diagram of the circuit board
Separately consent.
S102, on the blind hole distribution map mark M determinating area, M >=1.
In step s 102, setting up the method for determinating area includes at least two embodiments.In one embodiment, it is above-mentioned
Step S102 is specifically included：Respectively centered on each blind hole on the blind hole distribution map, drawn on the blind hole distribution map
Go out M determinating area, M determinating area is corresponded respectively with N number of blind hole, N=M.
In another embodiment, above-mentioned steps S102 is specifically included：The blind hole distribution map is divided equally into M to sentence
Determine region.
When it is implemented, the determinating area is circular, ellipse, regular polygon or irregular polygon.Wherein,
The regular polygon is the equal polygon of each length of side, such as equilateral triangle, square, regular pentagon, regular hexagon；
The irregular polygon is the unequal polygon of each length of side, and the length of side is straight line or curve, such as trapezoidal.
It is preferred that, the determinating area is square, and the length of side is 16mm.
It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention,
The length of side can be set as to other numerical value, or the determinating area is set to other shapes, these improvement are also considered as this hair
Bright protection domain.
S103, the blind hole calculated in each determinating area the gross area, and select from the M gross area maximum.
When it is implemented, in step s 103, it can be calculated every according to the positional information of the blind hole on blind hole distribution map
The area of individual blind hole, then the gross area of the blind hole in each determinating area is calculated respectively.Then, then by way of contrast,
Draw the maximum in the M gross area.
S104, the maximum and standard value contrasted, if the maximum is more than the standard value, judge institute
Stating the blind hole on circuit board needs separately to clog before being laminated, otherwise judges that the blind hole on the circuit board need not be in lamination
Separately clog before.
In process for manufacturing circuit board, when being pressed using prepreg to the first core plate and the second core plate, semi-solid preparation
The gummosis that piece is produced because of HTHP can enter in the blind hole of the first core plate and the second core plate, by prepreg in layer
Gummosis ability during pressure is analyzed, and can count the prepreg of a certain size in lamination process, its gummosis institute
The size for the blind hole that can be filled up.
Assuming that the area of the determinating area is S, the depth capacity of the blind hole on the circuit board is H, the standard value
Refer to：When being laminated using prepreg to first core plate and second core plate, area is S prepreg
The depth that gummosis can be filled up on first core plate and second core plate is the maximum of the gross area of H blind hole.
The maximum of the gross area of blind hole in the determinating area that the embodiment of the present invention will be drawn in above-mentioned steps S103, with
Standard value is contrasted, if the maximum is more than the standard value, judges the circuit board (including the first core plate and second
Core plate) on blind hole can not be laminated during the gummosis of prepreg fill up, it is necessary to before being laminated to the circuit board
On blind hole separately clog；If the maximum is less than or equal to the standard value, the blind hole energy on the circuit board is judged
The gummosis of prepreg during being enough laminated is filled up, it is not necessary to the blind hole on the circuit board is separately filled out before being laminated
Plug.
The embodiment of the present invention can be quickly and accurately on decision circuit plate blind hole whether need separately to fill in before being laminated
Hole, if it is not required, then in the manufacturing process of circuit board, do not perform the process to the other consent of circuit board before being laminated,
So as to improve formation efficiency, and reduce production cost；If it is required, then in the manufacturing process of circuit board, holding before being laminated
The process gone to the other consent of circuit board, so as to ensure that the blind hole of circuit board finished product is clogged full, raising circuit board by resin
The quality of production.
It is one of the circuit board applied in the preparation method for the circuit board with blind hole that the present invention is provided referring to Fig. 3
The structure chart of individual embodiment.
A kind of circuit board (circuit board i.e. to be produced) for needing to carry out consent judgement of offer of the embodiment of the present invention, including the
One core plate 201 and the second core plate 202.The first blind hole A1 and the second blind hole A2, the second core plate 202 are offered on first core plate 201
On offer the 3rd blind hole A3 and the 4th blind hole A4.In the manufacturing process of circuit board, the first core plate 201 and the second core plate 202
Need to be integrated by the lamination of prepreg 203.
It should be noted that foregoing circuit plate may be used also in addition to being to include the two-ply of the first core plate and the second core plate
To be three ply board, four laminates etc., and above-mentioned first core plate and the second core plate can be lamina or multi-layer sheet.
It is the schematic diagram of one embodiment that determinating area is set up in the consent determination step that the present invention is provided referring to Fig. 4.
Blind hole distribution map 1 is that have on the blind hole distribution map for needing to carry out the circuit board of consent judgement, the blind hole distribution map 1
4 blind holes, respectively the first blind hole A1, the second blind hole A2, the 3rd blind hole A3 and the 4th blind hole A4.Wherein, the first blind hole A1 and
Second blind hole A2 is located on the first core plate 201, and the 3rd blind hole A3 and the 4th blind hole A4 are located on the second core plate 202.
Respectively centered on each blind hole on blind hole distribution map 1,4 determinating areas are marked on blind hole distribution map 1, are made
4 determinating areas are corresponded with 4 blind holes respectively, specific as follows：Centered on the first blind hole A1, on blind hole distribution map 1
Mark the first determinating area B1；Centered on the second blind hole A2, the second determinating area B2 is marked on blind hole distribution map 1；With
Centered on three blind hole A3, the 3rd determinating area B3 is marked on blind hole distribution map 1；Centered on the 4th blind hole A4, in blind hole point
The 4th determinating area B4 is marked on cloth Fig. 1.
Calculated according to the positional information of each blind hole, the area for drawing the first blind hole A1 is SA1, the second blind hole A2's
Area is SA2, the 3rd blind hole A3 area is SA3, the 4th blind hole A4 area is SA4。
Assuming that the gross area of the blind hole in the first determinating area B1 is SB1, then SB1=SA1。
Assuming that the gross area of the blind hole in the second determinating area B2 is SB2, then SB2=SA2+SA3。
Assuming that the gross area of the blind hole in the 3rd determinating area B3 is SB3, then SB3=SA2+SA3。
Assuming that the gross area of the blind hole in the 4th determinating area B4 is SB4, then SB4=SA4。
Due to SB2=SB3, therefore maximum in 4 gross areas is SB2And SB3。
By by SB2(or SB3) and standard value be compared, if SB2Less than standard value, then decision circuit plate (including
One core plate and the second core plate) on all or part of blind hole can not be laminated during the gummosis of prepreg fill up, need
All blind holes on the circuit board are separately clogged before being laminated；If SB2Less than or equal to standard value, then judge described
The gummosis of prepreg during all blind holes on circuit board can be laminated fills up, it is not necessary to before being laminated to described
Blind hole on circuit board is separately clogged.
It is the signal for another embodiment that determinating area is set up in the consent determination step that the present invention is provided referring to Fig. 5
Figure.
Blind hole distribution map 1 is that have on the blind hole distribution map for needing to carry out the circuit board of consent judgement, the blind hole distribution map 1
4 blind holes, respectively the first blind hole A1, the second blind hole A2, the 3rd blind hole A3 and the 4th blind hole A4.Wherein, the first blind hole A1 and
Second blind hole A2 is located on the first core plate 201, and the 3rd blind hole A3 and the 4th blind hole A4 are located on the second core plate 202.
Blind hole distribution map 1 is divided equally into 4 determinating areas, including the first determinating area C1, the second determinating area C2,
3rd determinating area C3 and the 4th determinating area C4.
Calculated according to the positional information of each blind hole, the area for drawing the first blind hole A1 is SA1, the second blind hole A2's
Area is SA2, the 3rd blind hole A3 area is SA3, the 4th blind hole A4 area is SA4。
Assuming that the gross area of the blind hole in the first determinating area C1 is SC1, then SC1=SA1。
Assuming that the gross area of the blind hole in the second determinating area C2 is SC2, then SC2=0.
Assuming that the gross area of the blind hole in the 3rd determinating area C3 is SC3, then SC3=SA2+SA3。
Assuming that the gross area of the blind hole in the 4th determinating area C4 is SC4, then SC4=SA4。
Therefore the maximum in 4 gross areas is SC3。
By by SC3It is compared with standard value, if SC3Less than standard value, then decision circuit plate (including the first core plate and
Second core plate) on all or part of blind hole can not be laminated during prepreg gummosis fill up, it is necessary to lamination
All blind holes on the circuit board are separately clogged before；If the SC3Less than or equal to standard value, then the circuit is judged
The gummosis of prepreg during all blind holes on plate can be laminated fills up, it is not necessary to before being laminated to the circuit
Blind hole on plate is separately clogged.
It should be noted that in 4 determinating areas in the present embodiment, not comprising blind in each determinating area
Hole.
It should be further stated that, above-described embodiment is only illustrated by taking M=4 as an example.It should be pointed out that for this technology
For the those of ordinary skill in field, under the premise without departing from the principles of the invention, M can be set as to other numerical value, and correspondingly
Standard value is changed, can equally realize that consent judges, these improvement are also considered as protection scope of the present invention.
Above-described embodiment is only using circuit board as doubling plate, and determinating area does not represent this to be illustrated exemplified by square
Invention can be only applied to above-described embodiment.Among specific implementation, circuit board can also be the multi-layer sheet such as three ply board, four laminates,
Determinating area can also be the other shapes such as circle, ellipse, regular pentagon.
The preparation method of circuit board provided in an embodiment of the present invention with blind hole, using prepreg be laminated with
It is made before blind hole circuit board, is first contrasted the area of the blind hole on circuit board to be produced and standard value, judges described
Whether the blind hole on circuit board needs separately is clogged before being laminated.If desired, then illustrate that the blind hole on the circuit board can not
The gummosis of prepreg during being laminated fills up, then, it is necessary to first right before being laminated during circuit board is made
Blind hole on the circuit board is separately clogged, so as to ensure that the blind hole of circuit board finished product is clogged full, raising circuit by resin
The quality of production of plate.If need not, illustrate the blind hole on the circuit board can be laminated during prepreg stream
Plug is expired, then in the manufacturing process of circuit board, the process to the other consent of circuit board is not performed before being laminated, so as to carry
High formation efficiency, and reduce production cost.
One of ordinary skill in the art will appreciate that realize all or part of flow in above-described embodiment method, being can be with
The hardware of correlation is instructed to complete by computer program, described program can be stored in a computer read/write memory medium
In, the program is upon execution, it may include such as the flow of the embodiment of above-mentioned each method.Wherein, described storage medium can be magnetic
Dish, CD, read-only memory (Read-Only Memory, ROM) or random access memory (Random Access
Memory, RAM) etc..
Described above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (8)
1. a kind of preparation method of the circuit board with blind hole, it is characterised in that including：
S1, the area and standard value of the blind hole on circuit board to be produced contrasted, judge the blind hole on the circuit board
Whether need separately to clog before being laminated；The circuit board to be produced includes the first core plate and the second core plate, at least one
Blind hole is located on first core plate, and at least another blind hole is located on second core plate；
S2, if it is determined that blind hole on the circuit board needs separately to clog before being laminated, then perform step S3, S4, S5 and S6；
Otherwise step S3, S4 and S6 are performed；
S3, the first core plate of making, drill, first core plate is run through in the hole on first core plate；
S4, the second core plate of making, drill, second core plate is run through in the hole on second core plate；
S5, the hole on the hole on first core plate and second core plate is clogged；
S6, using prepreg first core plate and second core plate are laminated, the circuit board with blind hole is made；
Wherein, the step S1 is specifically included：
Obtain the blind hole distribution map of circuit board to be produced；The blind hole distribution map includes N number of blind hole, N >=2；N number of blind hole
In at least one blind hole be located on first core plate, at least another blind hole in N number of blind hole is located at described
On second core plate；
M determinating area, M >=1 are marked on the blind hole distribution map；
The gross area of the blind hole in each determinating area is calculated, and selects from the M gross area maximum；
The maximum and standard value are contrasted, if the maximum is more than the standard value, the circuit board is judged
On blind hole need separately clog before being laminated, otherwise judge that the blind hole on the circuit board need not before being laminated separately
Filling；
The area of the determinating area is that the depth capacity of the blind hole on S, the circuit board is H, and the standard value refers to：Make
When being laminated with prepreg to first core plate and second core plate, area can for the gummosis of S prepreg
The depth filled up on first core plate and second core plate is the maximum of the gross area of H blind hole.
2. the preparation method of the circuit board with blind hole as claimed in claim 1, it is characterised in that the blind hole distribution map is
Circuit theory diagrams are carried out after wires design using electronic design automation software, and the PCB routing figure obtained, the print
Positional information of the making sheet wiring diagram comprising first core plate and the blind hole on second core plate；
Or, the blind hole distribution map is in the manufacturing process of the circuit board, by first core plate and described
The plate face circuit of two core plates is taken pictures or scanned, and the PCB routing figure obtained after being positioned to blind hole, the print
Positional information of the making sheet wiring diagram comprising first core plate and the blind hole on second core plate.
3. there is the preparation method of the circuit board of blind hole as claimed in claim 2, it is characterised in that described in the blind hole point
M determinating area is marked on Butut, is specifically included：
Respectively centered on each blind hole on the blind hole distribution map, M determinating area is marked on the blind hole distribution map,
M determinating area is set to be corresponded respectively with N number of blind hole, N=M.
4. there is the preparation method of the circuit board of blind hole as claimed in claim 2, it is characterised in that described in the blind hole point
M determinating area is marked on Butut, is specifically included：
The blind hole distribution map is divided equally into M determinating area.
5. there is the preparation method of the circuit board of blind hole as claimed in claim 1, it is characterised in that the determinating area is circle
Shape, ellipse, regular polygon or irregular polygon.
6. there is the preparation method of the circuit board of blind hole as claimed in claim 1, it is characterised in that first core plate is single
Laminate or multi-layer sheet.
7. there is the preparation method of the circuit board of blind hole as claimed in claim 1, it is characterised in that second core plate is single
Laminate or multi-layer sheet.
8. there is the preparation method of the circuit board of blind hole as claimed in claim 1, it is characterised in that in the step S5,
The hole on the hole on first core plate and second core plate is clogged using resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410715097.4A CN104363719B (en) | 2014-11-28 | 2014-11-28 | A kind of preparation method of the circuit board with blind hole |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410715097.4A CN104363719B (en) | 2014-11-28 | 2014-11-28 | A kind of preparation method of the circuit board with blind hole |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104363719A CN104363719A (en) | 2015-02-18 |
| CN104363719B true CN104363719B (en) | 2017-09-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410715097.4A Active CN104363719B (en) | 2014-11-28 | 2014-11-28 | A kind of preparation method of the circuit board with blind hole |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722935A (en) * | 2004-07-14 | 2006-01-18 | 三星电机株式会社 | Method of fabricating PCB including embedded passive chip |
| CN103747639A (en) * | 2014-02-13 | 2014-04-23 | 遂宁市广天电子有限公司 | Manufacturing method for high-rise board |
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| US8877565B2 (en) * | 2007-06-28 | 2014-11-04 | Intel Corporation | Method of forming a multilayer substrate core structure using sequential microvia laser drilling and substrate core structure formed according to the method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1722935A (en) * | 2004-07-14 | 2006-01-18 | 三星电机株式会社 | Method of fabricating PCB including embedded passive chip |
| CN103747639A (en) * | 2014-02-13 | 2014-04-23 | 遂宁市广天电子有限公司 | Manufacturing method for high-rise board |
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