CN103747639B - A kind of high-rise board fabrication method - Google Patents
A kind of high-rise board fabrication method Download PDFInfo
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- CN103747639B CN103747639B CN201410050656.4A CN201410050656A CN103747639B CN 103747639 B CN103747639 B CN 103747639B CN 201410050656 A CN201410050656 A CN 201410050656A CN 103747639 B CN103747639 B CN 103747639B
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- central layer
- harmomegathus
- plate
- concentric circles
- walkthrough
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 238000003825 pressing Methods 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 4
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 230000002950 deficient Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000004927 fusion Effects 0.000 claims 1
- 239000010410 layer Substances 0.000 description 54
- 239000000047 product Substances 0.000 description 11
- 239000012790 adhesive layer Substances 0.000 description 3
- 239000011162 core material Substances 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Abstract
The invention discloses a kind of high-rise board fabrication method, it comprises the following steps: preparing the polylith central layer for being stacked into high laminate, described central layer all includes at least one of which conductor layer；Determine the harmomegathus coefficient of every piece of central layer；The different concentric circles of external diameter is set in the long limit of every piece of central layer and the centre position of minor face, and by central layer heap poststack, the radius of the concentric circles on every piece of central layer increases successively from top to bottom；For basic point, walkthrough plate is carried out to central layer with the concentric circles of central layer heap poststack；Carry out X RAY fluoroscopic examination to the central layer after walkthrough plate, and by rivet, central layer after walkthrough plate is reinforced；Pressing is carried out to the central layer after reinforcing；The harmomegathus value of the central layer after pressing is measured, product within positive and negative 2/10000ths for the harmomegathus value is holed by the boring file of 1:1, by harmomegathus value positive and negative more than 2/10000ths product use individually go out stretching boring file hole.Present invention, avoiding the situation that off normal occurs when pressing because rushing central layer when central layer is rinsed by target drone.
Description
Technical field
The present invention relates to a kind of method of manufacturing printed circuit board, particularly relate to a kind of high-rise board fabrication method.
Background technology
As the continuous renewal of electronic product is regenerated, people are also more and more higher to the requirement of electronic product, should meet electricity
Sub-product function is complete, meets its light, thin and little requirement again.This is to the circuit board as electronic product basic building block
Manufacturing technology is had higher requirement, and single sided board, dual platen, four panels and six panels can not meet existing electronic product
Demand, in this regard, many printed circuit board manufacturers start to manufacture high laminate, the preparation method of high laminate is also increasingly
Many.Such as Chinese Patent Application No.: 2010102031684 disclose a kind of method for producing multi-layer board, and it comprises the following steps: provide
First copper-clad plate, the first copper-clad plate has forming area and surrounds the fringe region of forming area；Limit to the first copper-clad plate
Edge region is etched to form at least one concentric copper ring group, described at least one concentric copper ring group include the first copper ring and
Second copper ring of annular the first copper ring, the center of circle of the first copper ring is defined as initial center, provides second copper-clad and adhesive layer, and will
Adhesive layer hot pressing is together between the first copper-clad plate and second copper-clad plate, thus forms multilager base plate；With this initial center as the center of circle
Make the detection hole running through the first copper-clad plate, adhesive layer and second copper-clad plate；Utilize light to irradiate multilager base plate, thus obtain inspection
Gaging hole detects, to determine, the stand-off error that initial center is deviateed in hole with the relative position relation of concentric copper ring group；According to this off normal by mistake
Harmomegathus ratio after difference determination multilager base plate hot pressing, and the position of via is offered according to this harmomegathus ratio-dependent multilager base plate
Put.
Above-mentioned manufacturing method of multi-layer circuit board can accurately obtain the concrete data of the stand-off error in detection hole, it is to avoid by
Cause the via of follow-up making to there is the bigger problem of stand-off error in being out of one's reckoning, thus decrease multilayer circuit board and lead
Logical bad or short-circuit situation, effectively increase multilayer circuit board leads quality.But, foregoing invention simply rises from multiple-plate
Multiple-plate making is optimized by this factor of contracting coefficient, and during multiple-plate actual fabrication, affects high laminate
The principal element making has: slide plate off normal control when harmomegathus coefficient, interlayer alignment, high laminate pressing and high-rise twist drill hole essence
The control of degree.The practice using during high laminate pressing is by traditional high laminate process: on core material, design riveting
Rivet hole, after core material machines, is developed by nail by rushing target drone, holds successfully after prepreg on prepreg
Get out corresponding via, after walkthrough plate, riveted is carried out with regard to the rivet hole on employing central layer and the via on prepreg.On
State high laminate compression method and use flushing, thus cause central layer that the situation of off normal occurs when pressing, thus affect the matter of product
Amount, will make to manage when serious partly to scrap；Meanwhile, the practice in high-rise twist drill hole is by traditional high laminate process: will
It is processed by the boring file of 1:1 after central layer pressing, if the above-mentioned practice runs into the direction in inclined hole of holing and produces plate
During the contrast of harmomegathus direction, the part that should connect will cause open circuit；And the part that should disconnect will be short-circuit, from
And cause high laminate batch to scrap.
Content of the invention
It is an object of the invention to overcome the deficiencies in the prior art, provide a kind of to harmomegathus system in high laminate manufacturing process
The high laminate manufacturer of the control of slide plate off normal when number, interlayer alignment precision, high laminate pressing and high-rise plate borehole accuracy
Method, by keys such as slide plate off normal when harmomegathus coefficient, interlayer alignment precision, high laminate pressing and high-rise plate borehole accuracies
The control of the factor, thus improve the quality of high laminate, it is ensured that the reliability that high laminate produces.
It is an object of the invention to be achieved through the following technical solutions: a kind of high-rise board fabrication method, it includes following
Step:
S1: preparing the polylith central layer for being stacked into high laminate, described central layer all includes at least one of which conductor layer；
S2: determine the harmomegathus coefficient of every piece of central layer；
S3: the different concentric circles of external diameter is set in the long limit of every piece of central layer and the centre position of minor face, and central layer is stacked
After, the radius of the concentric circles on every piece of central layer increases successively from top to bottom；
S4: for basic point, walkthrough plate is carried out to central layer with the concentric circles of central layer heap poststack；
S5: carry out X-RAY fluoroscopic examination to the central layer after walkthrough plate, the central layer qualified to fluoroscopic examination simultaneously will be pre-with rivet
After row's plate, central layer is reinforced, if defective, takes out；
S6: pressing is carried out to the central layer after reinforcing；
Product within positive and negative 2/10000ths for the harmomegathus value is pressed by S7: be measured the harmomegathus value of the central layer after pressing
The boring file of 1:1 is holed, by harmomegathus value positive and negative more than 2/10000ths product use individually go out stretching boring literary composition
Part is holed.
Currently preferred, described harmomegathus coefficient ratio is according to the sheet material of central layer, thickness of slab, copper thickness, direction of warp and weft
And different prepreg combinations is determined.
Currently preferred, the increments of described concentric circles radius is 3mil.
Currently preferred, the described method carrying out walkthrough plate to central layer is to use heating head height temperature to merge walkthrough plate side
Method.
Currently preferred, it is to walkthrough plate with rivet with rivet to the specific practice that the central layer after walkthrough plate is reinforced
After the surrounding of central layer reinforce.
Compared with prior art, the method have the advantages that
1) carry out walkthrough plate with concentric circles to central layer for basic point, and X-RAY lens inspection carried out to the central layer after walkthrough plate,
When X-RAY lens check that the concentric circles in result display X-direction and Y-direction is very uniform between ring and ring, just central layer is carried out
Walkthrough plate, and reinforced by rivet, thus avoid and when pressing, off normal occurs because rushing central layer when central layer is rinsed by target drone
Situation, improves the quality of high laminate；
2) the harmomegathus value of the central layer after pressing is measured, by product within positive and negative 2/10000ths for the harmomegathus value by 1:
The boring file of 1 is holed, by harmomegathus value positive and negative more than 2/10000ths product use individually go out stretching boring file
When holing, thus avoid the harmomegathus direction contrast because of the direction in the inclined hole of boring and production plate, should connect
Part will cause open circuit, and the part that should disconnect will be short-circuit, causes the situation that high laminate batch is scrapped.
Brief description
Fig. 1 is the implementing procedure figure of the present invention.
Detailed description of the invention
Technical scheme is described in further detail below in conjunction with the accompanying drawings, but protection scope of the present invention is not limited to
The following stated.
As it is shown in figure 1, a kind of high-rise board fabrication method, it comprises the following steps:
S1: preparing the polylith central layer for being stacked into high laminate, described central layer all includes at least one of which conductor layer；
S2: determine the harmomegathus coefficient of every piece of central layer；
S3: the different concentric circles of external diameter is set in the long limit of every piece of central layer and the centre position of minor face, and central layer is stacked
After, the radius of the concentric circles on every piece of central layer increases successively from top to bottom；
S4: for basic point, walkthrough plate is carried out to central layer with the concentric circles of central layer heap poststack；
S5: carry out X-RAY fluoroscopic examination to the central layer after walkthrough plate, the central layer qualified to fluoroscopic examination simultaneously will be pre-with rivet
After row's plate, central layer is reinforced, if defective, takes out；
S6: pressing is carried out to the central layer after reinforcing；
Product within positive and negative 2/10000ths for the harmomegathus value is pressed by S7: be measured the harmomegathus value of the central layer after pressing
The boring file of 1:1 is holed, by harmomegathus value positive and negative more than 2/10000ths product use individually go out stretching boring literary composition
Part is holed.
Preferably, described harmomegathus coefficient is according to the sheet material of central layer, thickness of slab, copper thickness, direction of warp and weft and different half
Cured sheets combination is determined.
Preferably, the increments of described concentric circles radius is 3mil, for example with second layer radius as 2.0mm as base
Circle, then third layer strengthens 3mil as concentric radius and arranges circle, by that analogy.
Preferably, the described method carrying out walkthrough plate to central layer is to use heating head height temperature to merge walkthrough plate method.
Preferably, it is to the core after walkthrough plate with rivet with rivet to the specific practice that the central layer after walkthrough plate is reinforced
The surrounding of plate is reinforced.
The sheet material of central layer, thickness of slab, copper thickness, direction of warp and weft and the harmomegathus coefficient to central layer for the different prepregs combination
Impact carry out have employed experiment measurement, draw the experimental result as shown in table 1～table 5.
Table 1: prepreg combine every layer for multiple (>=2 or mix with other prepregs) when, according to the form below data are true
Determine harmomegathus coefficient (unit: ten thousand/)
Table 2: when prepreg combines other collocation, according to the form below data determine harmomegathus coefficient (unit: ten thousand/)
Table 3: when the plate that length direction is warp-wise, according to the form below data determine harmomegathus coefficient (unit: ten thousand/)
Table 4: when the plate that length direction is broadwise, according to the form below data determine harmomegathus coefficient (unit: ten thousand/)
Table 5: during internal layer tabula rasa, according to the form below data determine harmomegathus coefficient (unit: ten thousand/)
Can be obtained by table 1～table 5, sheet material according to central layer, thickness of slab, copper thickness, direction of warp and weft and different prepregs
Combination determines its harmomegathus coefficient so that the harmomegathus value of central layer is more accurate.
Claims (3)
1. a high-rise board fabrication method, it is characterised in that: it comprises the following steps:
S1: preparing the polylith central layer for being stacked into high laminate, described central layer all includes at least one of which conductor layer；
S2: determine the harmomegathus coefficient of every piece of central layer；
S3: the different concentric circles of external diameter is set in the long limit of every piece of central layer and the centre position of minor face, and by central layer heap poststack, from
Top to bottm the radius of the concentric circles on every piece of central layer increases successively, and the increments of described concentric circles radius is 3mil；
S4: for basic point, walkthrough plate is carried out to central layer with the concentric circles of central layer heap poststack；
S5: carry out X-RAY fluoroscopic examination to the central layer after walkthrough plate, X-RAY lens check in result display X-direction and Y-direction
Concentric circles be between ring and ring uniformly when, just walkthrough plate is carried out to central layer, the central layer qualified to fluoroscopic examination simultaneously will with rivet
After walkthrough plate, central layer is reinforced, and is to walkthrough plate with rivet with rivet to the specific practice that the central layer after walkthrough plate is reinforced
After the surrounding of central layer reinforce, if defective, take out, thus avoid because rushing central layer when central layer is rinsed by target drone
The situation of off normal occurs when pressing, improves the quality of high laminate；
S6: pressing is carried out to the central layer after reinforcing；
Product within positive and negative 2/10000ths for the harmomegathus value is pressed 1:1's by S7: be measured the harmomegathus value of the central layer after pressing
Boring file hole, by harmomegathus value positive and negative more than 2/10000ths product use individually go out stretching boring file carry out
Boring, thus when avoiding the harmomegathus direction contrast because of the direction in the inclined hole of boring and production plate, the part that should connect
Open circuit will be caused, and the part that should disconnect will be short-circuit, causes the situation that high laminate batch is scrapped.
2. a kind of high-rise board fabrication method according to claim 1, it is characterised in that: described harmomegathus coefficient is according to central layer
Sheet material, thickness of slab, copper thickness, direction of warp and weft and different prepregs combination be determined.
3. a kind of high-rise board fabrication method according to claim 1, it is characterised in that: described carries out walkthrough plate to central layer
Method be use heating head height temperature fusion walkthrough plate method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410050656.4A CN103747639B (en) | 2014-02-13 | 2014-02-13 | A kind of high-rise board fabrication method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410050656.4A CN103747639B (en) | 2014-02-13 | 2014-02-13 | A kind of high-rise board fabrication method |
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| CN103747639B true CN103747639B (en) | 2016-10-05 |
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Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104244590B (en) * | 2014-08-28 | 2018-07-20 | 广州兴森快捷电路科技有限公司 | The control method of circuit board outer layer deviation |
| CN104470265B (en) * | 2014-11-19 | 2017-09-22 | 广州兴森快捷电路科技有限公司 | A kind of preparation method of multilayer circuit board |
| CN104363719B (en) * | 2014-11-28 | 2017-09-22 | 广州杰赛科技股份有限公司 | A kind of preparation method of the circuit board with blind hole |
| CN105050339A (en) * | 2015-07-10 | 2015-11-11 | 东莞市科佳电路有限公司 | Method for detecting interlayer position deviation of multilayer printed circuit board |
| CN105636345A (en) * | 2016-03-18 | 2016-06-01 | 奥士康科技股份有限公司 | Multilayer PCB core material expansion and shrinkage matching method |
| CN106102331A (en) * | 2016-06-27 | 2016-11-09 | 深圳崇达多层线路板有限公司 | A kind of method of large scale wiring board inner cord exposure aligning |
| CN107666768A (en) * | 2017-09-29 | 2018-02-06 | 奥士康科技股份有限公司 | Aligning degree monitoring method between PCB layer |
| CN109688736B (en) * | 2019-01-29 | 2020-10-30 | 深圳市景旺电子股份有限公司 | Multilayer circuit board and manufacturing method thereof |
| CN110324993A (en) * | 2019-07-29 | 2019-10-11 | 重庆伟鼎电子科技有限公司 | Circuit board pressing is to pressure |
| CN110708874B (en) * | 2019-09-24 | 2021-06-04 | 珠海崇达电路技术有限公司 | Method for rapidly judging hole deviation of OPE (optical connection edge) of HDI (high Density interconnect) plate |
| CN110996564A (en) * | 2019-12-30 | 2020-04-10 | 惠州市永隆电路有限公司 | Expansion and shrinkage control method for PCB (printed circuit board) multilayer board |
| CN111867252B (en) * | 2020-06-02 | 2021-10-22 | 江西一诺新材料有限公司 | High-precision covering film laminating method |
| CN112165854A (en) * | 2020-10-21 | 2021-01-01 | 宜兴硅谷电子科技有限公司 | Interlayer alignment visual monitoring method |
| CN113133211B (en) * | 2021-04-16 | 2022-03-11 | 苏州维嘉科技股份有限公司 | Drilling machine and machining compensation method and device thereof |
| CN114190015A (en) * | 2021-12-29 | 2022-03-15 | 湖北金禄科技有限公司 | PCB of wearable product and processing method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102291949B (en) * | 2010-06-18 | 2013-08-28 | 富葵精密组件(深圳)有限公司 | Manufacturing method of multi-layer circuit board |
| CN102098884B (en) * | 2010-12-29 | 2014-07-23 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
| CN202178918U (en) * | 2011-07-27 | 2012-03-28 | 胜宏科技（惠州）有限公司 | Copper-clad plate capable of controlling CORE expansion-contraction layer deviation |
| CN103249266B (en) * | 2013-04-03 | 2016-05-11 | 胜宏科技（惠州）股份有限公司 | The inclined to one side multilayer line plate producing process of a kind of anti-layer |
| CN103533761B (en) * | 2013-10-23 | 2016-05-04 | 广东依顿电子科技股份有限公司 | A kind of preparation method that promotes pcb board back of the body borehole accuracy |
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