CN103957673A - Method for preventing copper coil from wrinkling in multi-layer board pressing process - Google Patents
Method for preventing copper coil from wrinkling in multi-layer board pressing process Download PDFInfo
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- CN103957673A CN103957673A CN201410214594.6A CN201410214594A CN103957673A CN 103957673 A CN103957673 A CN 103957673A CN 201410214594 A CN201410214594 A CN 201410214594A CN 103957673 A CN103957673 A CN 103957673A
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Abstract
The invention provides a method for preventing copper coil from wrinkling in the multi-layer board pressing process. The board stacking structure of core boards between adjacent laminated layers is changed, the mode that areas with copper in the core boards of the adjacent laminated layers and areas without copper in the core boards of the adjacent laminated layers are stacked in a staggered mode is adopted, the areas without copper in the same vertical direction form a pressure-bearing carrier, it is guaranteed that resin in the areas with copper cannot flow towards the areas without copper too fast and excessively under pressure, therefore, the product percent of pass is effectively increased, and the product quality is guaranteed.
Description
Technical field
The present invention relates to printed wiring board manufacture technology field, what be specifically related to is a kind of wrinkling method of Copper Foil in multi-layer sheet pressing process that prevents.
Background technology
In the production process of multilayer printed circuit board, pressure programming is one of indispensable manufacturing procedure, its object is exactly that one or more central layer of printed circuit board and Copper Foil, prepreg are superposeed, by press, under certain working condition, central layer, Copper Foil and prepreg are bonded together, form multilayer printed circuit board.In pressure programming production process, because the residual copper rate of central layer is less than 100% conventionally, the Wei Wutong district, subregion of central layer, between Yu Wutong district, You Tong district, have difference in height (be highly central layer at the bottom of copper thickness), when this difference in height need to be by pressing high temperature, the resin of melting prepreg is filled.
Yet because Wu Tong district exists without pressure-bearing carrier, it is subject to pressure pressure to be less than You Tong district.Thereby in pressurized situation, the resin in You Tong district can flow in too fast, excessive Xiang Wutong district, and the high viscosity of resin can cause resin when mobile, to pull Copper Foil, causes Copper Foil to move, thereby causes Wu Tong district to form the wrinkling quality abnormal problem of Copper Foil.
Summary of the invention
For this reason, the object of the present invention is to provide a kind of wrinkling method of Copper Foil in multi-layer sheet pressing process that prevents, to avoid the occurring quality problem that Copper Foil is wrinkling in pressing process.
The object of the invention is to be achieved through the following technical solutions.
Prevent the wrinkling method of Copper Foil in multi-layer sheet pressing process, comprise step:
S101, making the first lamination, described the first lamination consists of bottom-up the first steel plate, the first silicagel pad, the first Copper Foil, the first prepreg and the first central layer of placing successively;
S102, make the second lamination, described the second lamination is by bottom-up the second steel plate of placing successively, the second silicagel pad, the second Copper Foil, the second prepreg and the second central layer form, described the second sheet pack co-bit is directly over the first central layer, and described the second central layer and the first central layer be He Wutong district, You Tong district staggered superposition in vertical direction, described staggered superposition comprises: described the second central layer be take the first central layer as with reference to 180 ° of left rotation and right rotation, described the second central layer be take the first central layer as take the first central layer as overturn up and down 180 ° with reference to left and right simultaneously with reference to spinning upside down 180 ° or described the second central layer,
S103, repeating step S101 make the 3rd, the 5th ... n-1 lamination, makes first, the 3rd, the 5th, the central layer modes of emplacement in n-1 lamination is consistent;
S104, repeating step S102 make the 4th, the 6th ... n lamination, makes the 4th, the 6th ... central layer modes of emplacement in n lamination is consistent; And the n central layer in described n lamination and the n-1 central layer in n-1 lamination be He Wutong district, You Tong district staggered superposition in vertical direction;
S105, by above-mentioned the first lamination, the second lamination ..., n-1 lamination, the n lamination superimposed lamination that carries out successively.
Preferably, the n in described n lamination is greater than 2 even number.
Preferably, between described n/2 lamination and n/2+1 lamination, share a steel plate.
The present invention compared with prior art, beneficial effect is: the present invention has changed the laminate structure of central layer in adjacent laminates, adopt the mode of central layer You Tong district He Wutong district staggered superposition in adjacent laminates, make without copper region, to form pressure-bearing carrier in same vertical direction, guaranteed in pressurized situation, the resin that has a copper region can be too fast, inexcessive in flowing without copper region, thereby effectively improved the qualification rate of product, guaranteed the quality of product; The present invention increases a silicagel pad in each lamination in addition, has effectively cushioned pressure, the balanced force value of regional.
Accompanying drawing explanation
Fig. 1 is multi-layer sheet pressing layer stack structure schematic diagram of the present invention.
Identifier declaration in figure: brown paper 100, steel plate 200, silicagel pad 300, Copper Foil 400, prepreg 500, central layer 600, copper layer 601.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein, only in order to explain the present invention, is not intended to limit the present invention.
In the embodiment of the present invention for be because central layer exists Wu Tongheyou copper district in Lamination Process of Multilayer Printed Board, and between Wu Tongheyou copper district, there is difference in height, the resin that easily occurs being filled in when pressing in Wu Tong district can too fast because of resin, the excessive mobile wrinkling problem of Copper Foil that causes.
Refer to shown in Fig. 1, Fig. 1 is multi-layer sheet pressing layer stack structure schematic diagram of the present invention.First the pressing layer stack structure that the present invention adopts, include the individual lamination of even number (n), wherein each lamination includes steel plate 200, silicagel pad 300, Copper Foil 400, prepreg 500 and central layer 600, on described central layer 600, have copper layer 601, and described lamination is that the order being superimposed together from bottom to top according to steel plate 200, silicagel pad 300, Copper Foil 400, prepreg 500 and central layer 600 forms.
Between each lamination, according to order from bottom to top, be superimposed together, form multi-layer sheet, and the top that is positioned at the bottom of the first lamination of below and is positioned at the top lamination is provided with a brown paper 100, so that when carrying out pressure programming, prevent from plate face to cause damage.
The present invention, in to multi-layer sheet pressing lamination process, prevents the wrinkling main following mode that adopted of Copper Foil:
S101, making the first lamination, described the first lamination consists of bottom-up the first steel plate, the first silicagel pad, the first Copper Foil, the first prepreg and the first central layer of placing successively;
Its concrete mode is: first the bottom of the first lamination place brown paper 100 several, then up place in order successively steel plate 200, silicagel pad 300, Copper Foil 400, prepreg 500, central layer 600, the object that wherein increases silicagel pad 300 is compensator or trimmer pressure, the force value of balanced regional.
S102, making the second lamination, described the second lamination consists of bottom-up the second steel plate, the second silicagel pad, the second Copper Foil, the second prepreg and the second central layer of placing successively, described the second sheet pack co-bit is directly over the first central layer, and described the second central layer and the first central layer He Wutong district, You Tong district staggered superposition in vertical direction;
Then at above-mentioned steel plate 200, up continue the structure of stack, be followed successively by and silicagel pad, Copper Foil, prepreg and central layer identical in the first lamination.
Wherein the second central layer and the first central layer You Tong district He Wutong district staggered superposition, comprise following three kinds of situations:
One, the second central layer be take the first central layer as with reference to 180 ° of left rotation and right rotation;
Two, the second central layer be take the first central layer as with reference to spinning upside down 180 °;
Three, the second central layer be take the first central layer as overturn up and down 180 ° with reference to left and right simultaneously.
By the mode of this staggered superposition, can make the position in Wu Tongqu on central layer can not produce stack, thus the inhomogeneous problem of pressurized occurring in the time of can effectively avoiding occurring pressing.
S103, repeating step S101 make the 3rd, the 5th ... n-1 lamination, makes first, the 3rd, the 5th, the central layer modes of emplacement in n-1 lamination is consistent;
S104, repeating step S102 make the 4th, the 6th ... n lamination, makes the 4th, the 6th ... central layer modes of emplacement in n lamination is consistent; And the n central layer in described n lamination and the n-1 central layer in n-1 lamination be He Wutong district, You Tong district staggered superposition in vertical direction;
In odd-level lamination, the modes of emplacement of central layer need to be consistent in the present embodiment, and in even level lamination, the modes of emplacement of central layer also should be consistent, and the modes of emplacement of even level central layer and odd-level central layer is with reference to three kinds of situations of above-mentioned Wu Tong district staggered superposition.
S105, by above-mentioned the first lamination, the second lamination ..., n-1 lamination, the n lamination superimposed lamination that carries out successively.
It should be noted that: each laminated construction all be take central layer as symmetrical object, silicagel pad 300, Copper Foil 400, prepreg 500 stack in the upper and lower symmetrical typesetting of central layer.
According to the central layer modes of emplacement in first lamination and central layer copper layer characteristic distributions, central layer modes of emplacement in second lamination has three kinds: left-right rotary turnback, spin upside down 180 degree and turn to up and down 180 degree simultaneously, object is by central layer You Tong district He Wutong district staggered superposition in two different laminations, guarantees as much as possible the uniformity of compression area and pressure.
In addition, in pressure programming, between n/2 lamination and n/2+1 lamination, share a block plate, take 6 laminates as example, knownly between 3 layers and 4 layers, can share a block plate.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, all any modifications of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in protection scope of the present invention.
Claims (3)
1. prevent the wrinkling method of Copper Foil in multi-layer sheet pressing process, it is characterized in that, comprise step:
S101, making the first lamination, described the first lamination consists of bottom-up the first steel plate, the first silicagel pad, the first Copper Foil, the first prepreg and the first central layer of placing successively;
S102, make the second lamination, described the second lamination is by bottom-up the second steel plate of placing successively, the second silicagel pad, the second Copper Foil, the second prepreg and the second central layer form, described the second sheet pack co-bit is directly over the first central layer, and described the second central layer and the first central layer be He Wutong district, You Tong district staggered superposition in vertical direction, described staggered superposition comprises: described the second central layer be take the first central layer as with reference to 180 ° of left rotation and right rotation, described the second central layer be take the first central layer as take the first central layer as overturn up and down 180 ° with reference to left and right simultaneously with reference to spinning upside down 180 ° or described the second central layer,
S103, repeating step S101 make the 3rd, the 5th ... n-1 lamination, makes first, the 3rd, the 5th, the central layer modes of emplacement in n-1 lamination is consistent;
S104, repeating step S102 make the 4th, the 6th ... n lamination, makes the 4th, the 6th ... central layer modes of emplacement in n lamination is consistent; And the n central layer in described n lamination and the n-1 central layer in n-1 lamination be He Wutong district, You Tong district staggered superposition in vertical direction;
S105, by above-mentioned the first lamination, the second lamination ..., n-1 lamination, the n lamination superimposed lamination that carries out successively.
2. as claimed in claim 1ly prevent the wrinkling method of Copper Foil in multi-layer sheet pressing process, it is characterized in that, the n in described n lamination is greater than 2 even number.
3. as claimed in claim 1ly prevent the wrinkling method of Copper Foil in multi-layer sheet pressing process, it is characterized in that, between described n/2 lamination and n/2+1 lamination, share a steel plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410214594.6A CN103957673A (en) | 2014-05-21 | 2014-05-21 | Method for preventing copper coil from wrinkling in multi-layer board pressing process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410214594.6A CN103957673A (en) | 2014-05-21 | 2014-05-21 | Method for preventing copper coil from wrinkling in multi-layer board pressing process |
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| CN103957673A true CN103957673A (en) | 2014-07-30 |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191854A (en) * | 2014-09-02 | 2014-12-10 | 苏州斯迪克新材料科技股份有限公司 | Technology for avoiding wrinkling occurring in aluminum foil intaglio printing |
| CN104582285A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Method for manufacturing printed circuit board low in warping degree and high in flatness |
| CN105208765A (en) * | 2015-09-09 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Method for reducing PCB layering and breakage probability |
| CN106163138A (en) * | 2016-08-26 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | A kind of manufacture method of gold finger plate |
| CN106900143A (en) * | 2015-12-17 | 2017-06-27 | 冠锋电子科技(梅州)有限公司 | A kind of preparation method of Rigid Flex |
| CN107087356A (en) * | 2017-06-27 | 2017-08-22 | 奥士康精密电路（惠州）有限公司 | It is a kind of to reduce the bad PCB multilayer board compression method of copper wrinkle |
| CN110996565A (en) * | 2019-12-30 | 2020-04-10 | 东莞市若美电子科技有限公司 | Pressing method for 5G circuit board |
| CN111295053A (en) * | 2020-03-31 | 2020-06-16 | 生益电子股份有限公司 | PCB (printed circuit board) with embedded heat conductor and preparation method thereof |
| CN111836484A (en) * | 2020-07-29 | 2020-10-27 | 欣强电子（清远）有限公司 | Processing method for PCB (printed circuit board) backrest design |
| CN112822877A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Method for improving wrinkling of press-fit copper-free area |
| CN112867289A (en) * | 2021-01-05 | 2021-05-28 | 宏华胜精密电子(烟台)有限公司 | Manufacturing method of circuit board |
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| CN202911260U (en) * | 2012-11-05 | 2013-05-01 | 广东生益科技股份有限公司 | Laminated component |
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| JP2007180317A (en) * | 2005-12-28 | 2007-07-12 | Matsushita Electric Ind Co Ltd | Manufacturing method of printed wiring board |
| KR20080012390A (en) * | 2008-01-17 | 2008-02-11 | 에스디에이테크놀러지 주식회사 | A pres-adhesive method for multi board |
| CN101772267A (en) * | 2008-12-30 | 2010-07-07 | 深圳玛斯兰电路科技实业发展有限公司 | Improvement method for wrinkled copper foil in compacting process of high-rise plates |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104191854A (en) * | 2014-09-02 | 2014-12-10 | 苏州斯迪克新材料科技股份有限公司 | Technology for avoiding wrinkling occurring in aluminum foil intaglio printing |
| CN104582285B (en) * | 2014-12-31 | 2018-01-30 | 广州兴森快捷电路科技有限公司 | The preparation method of the printed circuit board (PCB) of low warpage high-flatness |
| CN104582285A (en) * | 2014-12-31 | 2015-04-29 | 广州兴森快捷电路科技有限公司 | Method for manufacturing printed circuit board low in warping degree and high in flatness |
| CN105208765A (en) * | 2015-09-09 | 2015-12-30 | 深圳崇达多层线路板有限公司 | Method for reducing PCB layering and breakage probability |
| CN106900143A (en) * | 2015-12-17 | 2017-06-27 | 冠锋电子科技(梅州)有限公司 | A kind of preparation method of Rigid Flex |
| CN106900143B (en) * | 2015-12-17 | 2019-05-17 | 冠锋电子科技(梅州)有限公司 | A kind of preparation method of Rigid Flex |
| CN106163138A (en) * | 2016-08-26 | 2016-11-23 | 广州兴森快捷电路科技有限公司 | A kind of manufacture method of gold finger plate |
| CN107087356A (en) * | 2017-06-27 | 2017-08-22 | 奥士康精密电路（惠州）有限公司 | It is a kind of to reduce the bad PCB multilayer board compression method of copper wrinkle |
| CN110996565A (en) * | 2019-12-30 | 2020-04-10 | 东莞市若美电子科技有限公司 | Pressing method for 5G circuit board |
| CN111295053A (en) * | 2020-03-31 | 2020-06-16 | 生益电子股份有限公司 | PCB (printed circuit board) with embedded heat conductor and preparation method thereof |
| CN111836484A (en) * | 2020-07-29 | 2020-10-27 | 欣强电子（清远）有限公司 | Processing method for PCB (printed circuit board) backrest design |
| CN112867289A (en) * | 2021-01-05 | 2021-05-28 | 宏华胜精密电子(烟台)有限公司 | Manufacturing method of circuit board |
| CN112822877A (en) * | 2021-01-31 | 2021-05-18 | 惠州中京电子科技有限公司 | Method for improving wrinkling of press-fit copper-free area |
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Application publication date: 20140730 |