JP2003174259A - Method and device for pin lamination for excluding irregularities of multi-layer print wiring plate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and device for pin lamination capable of excluding irregularities on a multi-layer print wiring plate. <P>SOLUTION: The method of pin lamination comprises (a) a step wherein a plurality of steel plates 31 and copper layers 32 are prepared in a clean room while a plurality of prepregs 91 and cores 92 are prepared in a work room; (b) a step wherein a first sheet of the copper layer 32, whose luster surface is faced upward, one sheet of the steel plate 31 and the second sheet of the copper layer 32, whose luster surface is faced downward, are continuously laminated to prepare a sandwich type lamination board 20 or the step, wherein the steel plate 31 is pinched between two sheets of the copper layer 32 so that the luster surface of two sheets of the copper layer 32 is faced to the side of the steel plate 31; and (c) a step wherein the sandwich type lamination board 30 is transferred into the work room to continuously laminate the sandwich type lamination board 30, the prepreg 91 and the core 92 to provide a multi- layer board B. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a pin laminating method and a laminating apparatus. More specifically, the present invention relates to a pin laminating method and a laminating apparatus capable of removing unevenness and improving the quality of a multilayer board and the quality of a final product.

[0002]

2. Description of the Related Art Generally, a multilayer printed wiring board requires a laminating process at the time of manufacture. In this lamination process, at least one core, a plurality of prepregs and copper wires are provided layer by layer. After the lamination process, the laminate is heat-pressed into a multilayer board. The copper wire of the outer layer of this multilayer board is printed in a circuit form to provide a multilayer printed wiring board. The lamination process uses a pin lamination method to laminate the core, prepreg and copper wire.

The conventional pin stacking method shown in FIG. 6 is used to manufacture a plurality of multilayer boards A. This multi-layer board A
Is mounted between two mold plates 11, a plurality of buffer plates 12 and a plurality of steel plates 16. Each multilayer board A includes two cores 15, a plurality of prepregs 14 and a plurality of copper layers 13. The mold plate 11 has pinholes aligned with the core 15, and the core 15 and the prepreg 1
4 and copper layer 13 are laminated layer by layer and heat pressed to provide a plurality of multilayer boards A. However, since the prepreg 14 is often provided with an epoxy resin, its debris and powder adhere to the surface of the copper layer 13. Therefore, the copper layer 13 located on the outer surface of the multilayer board A becomes uneven, which adversely affects the quality of the multilayer board A and deteriorates the quality of the product.

[0004]

SUMMARY OF THE INVENTION One of the main objects of the present invention is to provide a pin laminating method and a laminating apparatus for eliminating the irregularities of a multilayer printed wiring board, which eliminates the irregularity phenomenon and enhances the quality of the multilayer board to obtain the final product. Is to improve the quality of.

[0005]

In order to achieve the above object, the present invention is a pin laminating method, comprising: (a) preparing a plurality of steel plate layers and copper layers in a clean room, and preparing a plurality of steel plate layers in a work room. A step of preparing a prepreg layer and a core layer, (b) the first copper layer having a glossy surface facing upward, one of the steel plate layers, and the glossy surface facing downward on a laminating device And a step of continuously laminating the second copper layer and a second copper layer to prepare a sandwich-type laminated board, wherein the steel plate layer is sandwiched between the two copper layers, and the steel plate layer is sandwiched between the two copper layers. A step of directing a glossy surface to the steel plate layer side, (c) transporting the sandwich type laminated board to the work room, and successively laminating the sandwich type laminated board, the prepreg layer and the core layer Processed and multi-layered bo And providing a pin lamination method characterized by comprising the was the gist thereof.

Further, the present invention includes a work table, a lift rod, a tilt board, a base steel plate and a laminated plate for carrying out the pin laminating method,
The lift rod has a first end that pivots on a first side of the work table and a second end that pivots on a first end of the tilt board, the tilt board comprising: A second end that pivots on a second side, the lift rod is raised and lowered to adjust the tilt angle of the tilt board, and the base steel plate is fixed on the tilt board; In order to solve the above problems, a laminating apparatus is proposed, characterized in that the laminating plate is fixed on the base steel plate.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION The pin laminating method and laminating apparatus of the present invention will be described below in more detail with reference to the preferred embodiments shown in the drawings. The pin stacking method of the present invention shown in FIGS. 1 and 5 includes the following steps.

First, the plurality of steel plates 31 and the copper layer 32 are manufactured in the clean room S1, and the plurality of prepregs 91 and the core 92 are manufactured in the work room S2.
Plural pin holes H are prepared in advance in each steel plate 31, copper layer 32, prepreg 91 and core 92.

Next, the stacking device 80 is provided with a plurality of pins 822. The copper layer 32 having the glossy surface on the upper side, the steel plate 31, and the copper layer 32 having the glossy surface on the lower side are successively laminated on the laminating apparatus 80 to provide the sandwich type laminated board 30. The steel plate 31 is sandwiched between the two copper layers 32, and the shiny surfaces of the two copper layers 32 are directed to the steel plate 31 side.

Sandwich type laminated board 3 with powder and dust
The sandwich type laminated board 30 is manufactured in the clean room S1 so as not to adhere to the surface of No. 0. The pinholes H of the copper layer 32 and the steel plate 31 align with the pins 822 of the laminating device 80 and allow the insertion of the pins 822 of the laminating device 80.

The sandwich type laminated board 30 is transported to the work room S2. Two mold plates 93 are provided in the work room S2. Each mold plate 93 is provided with a plurality of pins 931. A plurality of prepregs 91 and a plurality of cores 92 are laminated on the sandwich type laminated board 30 to provide a multilayer board B. The plurality of multilayer boards B are mounted between the two mold plates 93 as shown in FIG. The pinhole H, the prepreg 91 and the core 92 of the sandwich type laminated board 30 are aligned with the pins 931 of the mold plate 93,
The pin 931 of the mold plate 93 can be inserted.

Next, as shown in FIG. 5, a plurality of multilayer boards B mounted between the two mold plates 93 are heat-pressed to manufacture a plurality of multilayer board B products.
The outer copper layer 32 of each multilayer board B is printed into a circuit shape to provide a multilayer printed wiring board.

In practice, the partition wall 7 is provided between the clean room S1 and the work room S2, and the passage 71 is provided so that the sandwich type laminated board 30 can be installed in the clean room S1.
To the work room S2 by the conveyor belt 6.

As shown in FIGS. 1-5, a laminating apparatus 80.
Includes a work table 801, a lift rod 84, a tilt board 81, a base steel plate 82 and a laminated plate 83. The lift rod 84 has its first end pivoted at the first end of the work table 801 and its second end pivoted at the first end of the tilt board 81. The tilt board 81 rotates on the second side of the work table 801. The lift rod 84 is moved up and down to adjust the tilt angle of the tilt board 81. The base steel plate 82 is an inclined board 81
A plurality of L-shaped fixing blocks 821 fixed to the pin 822, and a plurality of pin holes 823 (FIG. 3) are provided for inserting the plurality of pins 822. The laminated plate 83 includes a plurality of pads 831 fixed to the fixing block 821, and a plurality of pin holes 833 are provided for inserting the plurality of pins 822. Laminate plate 83 has a perimeter that is provided with a plurality of openings 832 for insertion of holder 85 (FIG. 4).

Therefore, the first copper layer 3 with the glossy surface facing upwards
2 is mounted on the laminated plate 83, and the pinhole H of the first copper layer 32 is aligned with the pin 822 of the laminated plate 83 for the insertion of the pin 822 of the laminated plate 83. The steel plate 31 is mounted on the first copper layer 31, and the pin hole H of the steel plate 31 is inserted into the pin 822 of the laminated plate 83 to insert the pin 822 of the laminated plate 83.
Be matched with. The second copper layer 32 with the shiny side facing down is mounted on the steel plate 31, and the pinholes 83 of the second copper layer 32 are aligned with the pins 822 of the laminate plate 83 for the insertion of the pins 822 of the laminate plate 83. It Therefore, the first copper layer 32, the steel plate 31, and the second copper layer 32 are sequentially laminated on the laminated plate 83 to provide the sandwich type laminated board 30, and the steel plate 31 is disposed between the two copper layers 32. Sandwiched, the shiny side of each of the two copper layers 32 faces the steel plate 31 side. The holder 85 is an opening 83 of the laminated plate 83.
2, and sandwiches and fixes the sandwich type laminated board 30 as shown in FIG.

As shown in FIGS. 1 and 5, the plurality of sandwich type laminated boards 30 are carried to the work room S2.
Sandwich type laminated board 30 has a plurality of prepregs 9
A multilayer board B in which one and a plurality of cores 92 are continuously laminated
Will be provided. Then, the holder 85 is removed.

A plurality of multi-layer boards B are mounted between two mold plates 93 as shown in FIG. Pinhole H of sandwich type laminated board 30, prepreg 9
1 and core 92 are aligned with pins 931 of mold plate 93 to allow insertion of pins 931 of mold plate 93.

As shown in FIG. 5, the plurality of multilayer boards B mounted between the two mold plates 93 are heat pressed to provide a plurality of multilayer board B products. The outer copper layer 32 of each multilayer board B is printed in a circuit to provide a multilayer printed circuit board.

According to the present invention, the steel plate 31 is sandwiched between two copper layers 32, and the sandwich type laminated board 30 is manufactured in the clean room S1. The glossy surface of each copper layer 32 faces the steel plate 31 side. Therefore, powder and dust do not adhere to the surface of the sandwich type laminated board 30. The steel plate 31 is sandwiched between the two copper layers 32, does not adhere to powder and dust, and their glossy surface faces the steel plate 31 side. The finished multilayer board B has no irregularities and the quality is improved, and the performance of the finished multilayer printed wiring board is improved.

[0020]

EFFECTS OF THE INVENTION The pin laminating method and laminating apparatus of the present invention can eliminate the unevenness of the multilayer printed wiring board to remove the unevenness phenomenon, improve the quality of the multilayer board, and improve the quality of the final product.

[Brief description of drawings]

FIG. 1 is a schematic view of a pin stacking method of the present invention.

FIG. 2 is a perspective view of a laminating apparatus of the present invention.

FIG. 3 is a side view of FIG.

FIG. 4 is a side sectional view of the sandwich type laminated board of the present invention.

FIG. 5 is a cross-sectional view of the multilayer board of the present invention.

FIG. 6 is a schematic view of a conventional pin stacking method.

[Explanation of symbols]

30 ... Sandwich type laminated board 31 ... Steel plate 32 ... Copper layer 80 ... Laminating device 81 ... Inclined board 82 ... Base steel plate 83 ... Laminated plate 84: Lift rod 91 ... prepreg 92 ... Core 93 ... Mold plate 93 822 ... pin 931 ... pin S1 ・ ・ ・ Clean room S2: Clean room H: Pinhole B: Multi-layer board

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Zane Liu             Taiwan Taoyang Shen, Lu Chu             Shan, Shin Chan Village, Ta-shi             Download 814 Land 91 F-term (reference) 5E346 AA05 AA06 AA12 AA15 AA22                       AA32 AA51 CC02 CC08 CC32                       EE03 EE09 EE13 EE16 GG28                       HH31

Claims (9)

[Claims] 1. A pin laminating method comprising: (a) preparing a plurality of steel plate layers and copper layers in a clean room and preparing a plurality of prepreg layers and core layers in a work room; and (b) Continuously laminating the first copper layer with the glossy surface facing upward, the first steel plate layer, and the second copper layer with the glossy surface facing downward on the laminating device. And preparing a sandwich-type laminated board by sandwiching the steel plate layer between the two copper layers and directing the glossy surface of the two copper layers toward the steel plate layer side. And (c) transporting the sandwich-type laminated board to the work room and continuously laminating the sandwich-type laminated board, the prepreg layer and the core layer to provide a multilayer board. Characterized by Lupine lamination method. 2. The pin stacking method according to claim 1, wherein in step (a), a plurality of pin holes are provided in each of the steel plate layer, the copper layer, the prepreg layer and the core layer. . 3. In step (b), the laminating apparatus is provided with a plurality of pins, the pinholes of the copper layer and the steel plate layer are aligned with the pins of the laminating apparatus, and the pins of the laminating apparatus can be inserted. 3. The pin stacking method according to claim 2, wherein 4. The pin laminate according to claim 1, wherein in step (c), the sandwich type laminated board, the prepreg layer and the core layer are mounted between two mold plates provided in a work room. Law. 5. A plurality of pins are provided on each mold plate, and the pinholes of the sandwich type laminated board, the prepreg layer and the core layer are aligned with the pins of the mold plate, and the insertion of the pins of the mold plate is performed. The pin stacking method according to claim 4, wherein the pin stacking method is possible. 6. A laminating apparatus for performing the pin laminating method according to claim 1, comprising a work table, a lift rod, a tilt board, a base steel plate and a laminating plate, wherein the lift rod is the work table. A first end pivoting on a first side of the tilting board and a second end pivoting on a first end of the tilting board, the tilting board pivoting on a second side of the worktable. The lift rod is moved up and down to adjust the tilt angle of the tilt board, the base steel plate is fixed on the tilt board, and the laminated plate is mounted on the base steel plate. A laminating device fixed on a plate. 7. The base steel plate includes a plurality of L-shaped fixing blocks fixed to a tilt board, and a plurality of pin holes are provided for inserting a plurality of pins. 6. The laminating device according to 6. 8. The laminate according to claim 7, wherein the laminate plate includes a plurality of pads fixed to a fixing block, and a plurality of pin holes are provided for inserting a plurality of pins. apparatus. 9. The laminating apparatus according to claim 6, wherein the laminating plate has a peripheral portion provided with a plurality of openings for inserting the holder.