JPS62144937A - Process for adhesion in multi-layer state for multi-layered printed circuit board - Google Patents

Abstract

PURPOSE:To maintain the accuracy of positions between circuits and to raise workability, by adhering with pressing under heating after fastening previously with a wire the required number of stacked circuit boards, prepregs, and copper foils. CONSTITUTION:Guide holes 3 are provided at the four corners departed from the circuit area 2 of a circuit board 1, and holes of more than same diameter are opened at the four corners of a prepreg 4 on same positions corresponding to the circuit board. A positioning pin 7 with an air-cylinder at a fastening tool table 6 is lifted and the pin is inserted into the guide holes. Then a pressing board 9 is lowered and presses the positioned circuit board 1 and prepreg 4, and the positioning pin 7 is pulled out. With a fastening tool 10 a wire 11 is struck at A spot on the circuit board 1, prepreg 4, and caulked with a caulking jig A 12 and a caulking jig B 13. A copper foil 14 is stacked above and below the circuit board 1, prepreg 4, then several layers of set hold between panel boards 18 are stacked, and above and below them cushion 17 and plate B 16, cushion 17 and plate A 15 are placed. This is set to a multi-layering adhesion apparatus 19 to be adhered. A dismounted article 20 is unloaded to obtain a product 21 by cutting the wire part.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for performing multilayer Ifj deposition while maintaining mutual positional accuracy of a plurality of circuits in a multilayer printed wiring board.

(Prior art) Multilayer printed wiring boards are made by drilling a predetermined number of guide holes in circuit boards, prepregs, and copper foil, and attaching pins to mirror plates to maintain positional accuracy between multiple circuits. , prepreg, and copper foil, and perform multilayer bonding.

(Problems to be Solved by the Invention) In the above method, when heating is performed for multilayer adhesion, resin flows out from the guide hole and the end, and adheres to the guide pin and the end of the end plate. Therefore, it is difficult to disassemble the product and the plate after bonding, and it takes time to remove the resin that adheres to the mirror plate and is difficult to remove.
, there is a problem in that if the mirror plate is empty, it will create a dent when the mirror plate is used next time.

(Tth means for solving the problem) The present invention binds a plurality of circuit boards, prepregs, and steel foils with wire, maintains the positional accuracy between the circuits, performs all multilayer bonding, and then discards the binding portion. It's a method.

(Function) By binding a plurality of circuits 5f2, prepreg, and copper foil with wire, the mutual position of the circuits is maintained. or,
9th, do not use holes within the size of one plate, and resin will not adhere to the mirror plate. In addition, there is a provision to cut and discard the binding section, and
f! There is no need to remove the strips and the dismantling work is easy.

Example Embodiments of the method of the present invention are described in Section 1. 2. Shown in Figure 5.

External circuit area 2 of circuit @1, and guide holes 5 in the four corners.
, and holes with the same diameter or more are made at the same positions in the four corners of the prepreg 4 in correspondence with the circuit board. The circuit board and the prepreg are transported by the transport device 5, and the pin 7 for determining the position of the air cylinder on the binding device table 6 is raised, and the pin is inserted into the guide hole to align the circuits. Next, the holding plate 9 is lowered to hold down the positioning plate 1, the fixed rotation tread plate 1, and the prepreg 4, and the positioning pin 7 is pulled out. Further, the table 6 is moved only up and down and stopped at the foot position. A wire 11 is attached to a portion A of the circuit board 1 and the prepreg 4 using a binding device 10. In FIG. 2, caulking is performed using a caulking jig A12 and a caulking jig B15. The caulking points shall be five on each side of the circuit board and the two sides of the prepreg. Next, in Fig. 5, the slope n
Copper foils 14 are stacked on top and bottom of the circuit board and prepreg, and all the layers of the set sandwiched by mirrors 1i18 are stacked, and a cushion 17 and a plate B16, and a cushion 17 and a plate A15 are placed above and below the set. 07''l is set in the multi-node bonding device 19 and bonded. After bonding, it is dismantled and the disassembled product 20 is taken out, and the entire wire portion is cut by a cutting machine to obtain the product 21.

(Effect of the invention〕 The present invention has achieved the following remarkable effects.

(1) The position accuracy between the circuits can be maintained at 70%, improving workability. (2) The ease of disassembly after multi-layer bonding is the same as above. (3) For those who want resin to adhere to the end plate. Its cleaning has become easier0

[Brief explanation of drawings]

The first factor is the binding device of the present invention, FIG. 2 is a sectional view and perspective view until the binding is completed, and FIG. Explanation of symbols 1 Circuit board 2 Circuit area 5 Guide hole
4 Prepreg si feeding fl 6
Binding device table 7 Positioning pin 8 Air cylinder 9 Presser foot 10 Binding device 1
1 wire 12 caulking jig A13
Caulking jig B 14 Copper foil 15 Plate A 16 Plate B 17 Cushion
18 @ Board 19 Multilayer adhesive device 20
Dismantled products, 21 Finished products by cutting Patent attorney Kunihiko Wakabayashi ``・□ ...or Figure 1 Figure 2 Figure 3

Claims (1)

[Claims] 1. In the adhesion process of multilayer printed wiring boards, in which a predetermined number of circuit boards, prepregs, and copper foils are stacked and heated and pressed, a predetermined number of stacked circuit boards, prepregs, and copper foils are bound in advance with wire and then heated and pressed. A multilayer adhesion method for a multilayer printed wiring board, characterized by adhering the multilayer printed wiring board.