CN105163528A - Riveting method and riveting structure for lamination of multilayer PCB - Google Patents
Riveting method and riveting structure for lamination of multilayer PCB Download PDFInfo
- Publication number
- CN105163528A CN105163528A CN201510606430.2A CN201510606430A CN105163528A CN 105163528 A CN105163528 A CN 105163528A CN 201510606430 A CN201510606430 A CN 201510606430A CN 105163528 A CN105163528 A CN 105163528A
- Authority
- CN
- China
- Prior art keywords
- riveted
- layer
- central layer
- prepreg
- central
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Connection Of Plates (AREA)
- Laminated Bodies (AREA)
Abstract
The invention provides a riveting method and a riveting structure for lamination of a multilayer PCB. The method comprises a step in which at least one core board and at least two prepregs are provided and at least one prepreg is respectively overlapped above and below the core board. Before the core board and the prepregs are riveted, anti-slip holes are riveted on board edges of inner prepregs except the outermost two prepregs above and below the core board or the core board riveting layer and in the core board or the core board riveting layer, and anti-slip rivets are riveted inside the anti-slip holes. Before the core board and the prepregs are riveted, the anti-slip holes and the anti-slip rivets are riveted on board edges of inner prepregs except the outermost two prepregs above and below the core board or the core board riveting layer and in the core board or the core board riveting layer, a riveting structure is formed, the prepreg can be prevented from abnormally slipping due to large glue flow quantity in advance, the PCB has a moderate thickness, the PCB has a good appearance, and the production quality of the PCB is thus improved.
Description
Technical field
The present invention relates to multi-layer PCB board pressing technical field, be specifically related to a kind of for the riveting method of multi-layer PCB board pressing and the riveted construction of multi-layer PCB board.
Background technology
Multilayer board (PrintedCircuitBoard is called for short: pcb board) has multilayer routing layer, and be dielectric layer between every two-layer routing layer, it is very thin that dielectric layer can do.Multilayer board has three layers of conductive layer at least, wherein two-layer at outer surface, and remaining one deck is combined in insulation board.
At present, multi-layer PCB board by the internal layer of oxidation processes and central layer, (Prepreg is called for short: PP) namely prepreg, Copper Foil are formed by pressing working procedure pressing, and wherein, three kinds of character of film are flow adhesive, gel time, glue content film.
In prior art, four layers and above pcb board plate are included in outer each monolateral at least two stacked prepregs, this pressing structure does not generally adopt any pre-riveted operation and direct pressing to produce at present, because outer field prepreg number is too much, make prepreg gummosis amount in bonding processes large, easily cause prepreg to slide abnormal, cause the quality problem such as the partially thin and pcb board plate face bad order of pcb board thickness.
Summary of the invention
The invention provides a kind of for the riveting method of multi-layer PCB board pressing and the riveted construction of multi-layer PCB board, effectively suppress the abnormal slip of prepreg caused because the gummosis amount of prepreg is large in bonding processes.
For solving the problem, the technical solution used in the present invention is:
One aspect of the present invention provides a kind of riveting method for multi-layer PCB board pressing, comprising:
There is provided at least one central layer, at least two prepregs, upper and lower stacked at least one the prepreg respectively of described central layer, before central layer described in riveted and prepreg, also comprises:
Central layer or central layer riveted layer and be positioned at central layer or central layer riveted layer upper and lower, except the anti-slide opening of riveted on the edges of boards of the inner side prepreg of outermost two prepregs;
Riveted anti-skid rivet in described anti-slide opening.
Further, when providing at least two central layers, at least three prepregs, when the upper and lower of described central layer is laminated with at least one prepreg respectively, before central layer described in riveted and prepreg, comprising:
At least one prepreg in the middle of outermost two central layers and central layer riveted are fixed, forms described central layer riveted layer.
Further, central layer or central layer riveted layer and be positioned at central layer or central layer riveted layer upper and lower, except diagonal position riveted two the anti-slide openings on the edges of boards of the inner side prepreg of outermost two prepregs;
Riveted two anti-skid rivets in described anti-slide opening.
The present invention provides a kind of riveted construction of multi-layer PCB board on the other hand, comprise at least one central layer, at least two prepregs, the upper and lower of described central layer is laminated with at least one prepreg respectively, except the rivet hole of the edges of boards riveted at described central layer and prepreg and riveted nail, also comprise:
Central layer or central layer riveted layer and be positioned at central layer or central layer riveted layer upper and lower, have anti-slide opening except riveted on the edges of boards of the inner side prepreg of outermost two prepregs;
In described anti-slide opening, riveted has anti-skid rivet.
Further, when comprising at least two central layers, at least three prepregs, when the upper and lower of described central layer is laminated with at least one prepreg respectively, at least one prepreg in the middle of outermost two central layers and central layer is fixed, forms described central layer riveted layer.
Further, central layer or central layer riveted layer and be positioned at central layer or central layer riveted layer upper and lower, have two anti-slide openings except the diagonal position riveted on the edges of boards of the inner side prepreg of outermost two prepregs;
In described anti-slide opening, riveted has two anti-skid rivets.
Beneficial effect of the present invention is:
Riveting method for multi-layer PCB board pressing provided by the invention is by before central layer described in riveted and prepreg; central layer or central layer riveted layer and be positioned at central layer or central layer riveted layer upper and lower, except the anti-slide opening of riveted and anti-skid rivet on the edges of boards of the inner side prepreg of outermost two prepregs; form riveted construction; realize preventing prepreg from extremely sliding because gummosis amount is large in advance; make pcb board thickness moderate and pcb board plate face outward appearance is good, thus improve pcb board production quality.
Accompanying drawing explanation
Fig. 1 is the structural representation of the first embodiment of the riveted construction of multi-layer PCB board of the present invention;
Fig. 2 is the structural representation of the second embodiment of the riveted construction of multi-layer PCB board of the present invention;
Fig. 3 is the structural representation of the internal layer film figure frame of the first embodiment of the riveted construction of multi-layer PCB board of the present invention;
Fig. 4 is the structural representation of the internal layer film figure frame of the second embodiment of the riveted construction of multi-layer PCB board of the present invention.
Embodiment
Specifically illustrate embodiments of the present invention below in conjunction with accompanying drawing, accompanying drawing is only for reference and use is described, does not form the restriction to scope of patent protection of the present invention.
embodiment 1:
The present embodiment provides a kind of riveting method for multi-layer PCB board pressing, comprise: provide at least one central layer 1, at least two prepregs 2, upper and lower stacked at least one the prepreg 2 respectively of described central layer 1, as shown in Figure 1, for providing the upper and lower of a central layer CORE11, central layer 1 stacked three prepreg 21-23 respectively in the present embodiment, 24-26, in the present embodiment, multi-layer PCB board is four layers of pcb board L1-L4; Before central layer described in riveted 1 and prepreg 2, also comprise:
Due to described anti-slide opening 31,32 will be got by the automatic film punching machine of internal layer, the anti-slide opening 31 of the diagonal angle setting of the internal layer film figure frame 100 of four layers of pcb board, 32 be one group of aperture is the rivet hole of 3.175mm, for outer prepreg PP2 and central layer 1 are riveted together, A and the B icon namely identified.
Pcb board part uses CCD to bore target drone and diameter 3.175mm brill after completing internal layer operation is chewed and is got by rivet hole, outer field prepreg gong machine or drilling machine, and the brill of cut-off footpath 3.175mm is chewed and got out corresponding hole according to the coordinate of plate rivet hole position.
During walkthrough, central layer 1 and be positioned at central layer 1 upper and lower, except the inner side prepreg 21-22 of outermost two prepregs 23,26, the anti-slide opening 31,32 of riveted two on the edges of boards of 24-25; Preferably, as shown in Figure 3, at described inner side prepreg 21-22, the anti-slide opening 31,32 of the diagonal position riveted on the edges of boards of 24-25 two; At described anti-slide opening 31, riveted two anti-skid rivets 41,42 in 32.
Pcb board part uses gong machine to be fallen by the rivet gong beaten after walkthrough and pressing, can effectively prevent rear operation rivet position from plate bursting quality hidden danger occurring.
The present embodiment also provides the riveted construction of corresponding multi-layer PCB board, comprise at least one central layer 1, at least two prepregs 2, the upper and lower of described central layer 1 is laminated with at least one prepreg 2 respectively, as shown in Figure 1, in the present embodiment, multi-layer PCB board is four layers of pcb board L1-L4, comprise respectively stacked three the prepreg 21-23 of upper and lower of a central layer 11, central layer 1,24-26; Except the rivet hole of the edges of boards riveted at described central layer 1 and prepreg 2 and riveted nail, also comprise:
Central layer 1 and be positioned at central layer upper and lower, except the inner side prepreg 21-22 of outermost two prepregs 23,26, on the edges of boards of 24-25, riveted has anti-slide opening 31,32; Preferably, as shown in Figure 3, at described inner side prepreg 21-22, the diagonal position riveted on the edges of boards of 24-25 has two anti-slide openings 31,32; In described anti-slide opening, riveted has anti-skid rivet 41,42.
embodiment 2:
As shown in Figure 2, when providing at least two central layers 1, at least three prepregs 2, when the upper and lower of described central layer 1 is laminated with at least one prepreg 2 respectively, for providing two central layer CORE11 in the present embodiment, 12, the upper and lower of the first central layer 11 stacked three 21-23 and two prepreg 24-25 respectively, upper and lower stacked described two prepreg 24-25 and three prepreg 26-28 respectively of the second central layer 12, in the present embodiment, multi-layer PCB board is six layers of pcb board L1-L6; Before central layer described in riveted 1 and prepreg 2, comprising:
The frame 100 of the pcb board part internal layer film figure of more than six layers except have just be usually used in riveted layer rivet hole icon except, namely A, B, C, D, E, F, G and H of identifying tetra-pairs of icons, also to add at diagonal angle one group of aperture be the rivet hole icon of 3.175mm for outer prepreg PP2 and central layer 1 are riveted together, I and the J icon namely identified.
Pcb board part uses CCD to bore target drone and diameter 3.175mm brill after completing internal layer operation is chewed and is got by rivet hole, outer field prepreg gong machine or drilling machine, and the brill of cut-off footpath 3.175mm is chewed and got out corresponding hole according to the coordinate of plate rivet hole position.
During walkthrough, by outermost two central layers 11, at least one prepreg (being two prepreg 24-25 in the present embodiment) in the middle of 12 and central layer 11,12 riveteds are fixed, form described central layer riveted layer 10, central layer riveted layer 10 is fixed by anti-skidding fixing hole 51,52 and anti-skidding fixing rivet 61,62 riveted.Then central layer riveted layer 10 and be positioned at central layer riveted layer 10 upper and lower, except the anti-slide opening 31,32 of riveted two on the edges of boards of the inner side prepreg 21,22,26,27 of outermost two prepregs 23,28; Preferably, as shown in Figure 3, the anti-slide opening 31,32 of diagonal position riveted two on the edges of boards of described inner side prepreg 21,22,26,27; At described anti-slide opening 31, riveted two anti-skid rivets 41,42 in 32.
Pcb board part uses gong machine to be fallen by the rivet gong beaten after walkthrough and pressing, can effectively prevent rear operation rivet position from plate bursting quality hidden danger occurring.
The present embodiment also provides the riveted construction of corresponding multi-layer PCB board, comprise at least one central layer 1, at least two prepregs 2, the upper and lower of described central layer 1 is laminated with at least one prepreg 2 respectively, in the present embodiment, multi-layer PCB board is six layers of pcb board L1-L6, comprise two central layers 11, 12, the upper and lower of the first central layer 11 distinguishes three 21-23 and two stacked prepreg 24-25, the upper and lower of the second central layer 12 distinguishes stacked described two prepreg 24-25 and three prepreg 26-28, except the rivet hole of the edges of boards riveted at described central layer 1 and prepreg 2 and riveted nail, also comprise:
Central layer riveted layer 10 and be positioned at central layer riveted layer 10 upper and lower, have anti-slide opening 31,32 except riveted on the edges of boards of the inner side prepreg 21,22,26,27 of outermost two prepregs 23,28; Preferably, as shown in Figure 4, the anti-slide opening 31,32 of diagonal position riveted two on the edges of boards of described inner side prepreg 21,22,26,27; At described anti-slide opening 31, riveted two anti-skid rivets 41,42 in 32.
Described central layer riveted layer 10 is by outermost two central layers 11, at least one prepreg (being two prepreg 24-25 in the present embodiment) in the middle of 12 and central layer 11,12 riveteds are fixed and are formed, central layer riveted layer 10 is by anti-skidding fixing hole 51,52 and anti-skidding fixing rivet 61,62 riveted fix.
If above-described embodiment is the present invention's preferably execution mode; but embodiments of the present invention are not restricted to the described embodiments; change, the modification done under other any does not deviate from Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (6)
1., for a riveting method for multi-layer PCB board pressing, comprising:
There is provided at least one central layer, at least two prepregs, upper and lower stacked at least one the prepreg respectively of described central layer, before central layer described in riveted and prepreg, is characterized in that, also comprises:
Central layer or central layer riveted layer and be positioned at central layer or central layer riveted layer upper and lower, except the anti-slide opening of riveted on the edges of boards of the inner side prepreg of outermost two prepregs;
Riveted anti-skid rivet in described anti-slide opening.
2. a kind of riveting method for multi-layer PCB board pressing according to claim 1, it is characterized in that: when providing at least two central layers, at least three prepregs, when the upper and lower of described central layer is laminated with at least one prepreg respectively, before central layer described in riveted and prepreg, comprising:
At least one prepreg in the middle of outermost two central layers and central layer riveted are fixed, forms described central layer riveted layer.
3. the riveting method for multi-layer PCB board pressing according to claim 1 and 2, is characterized in that:
Central layer or central layer riveted layer and be positioned at central layer or central layer riveted layer upper and lower, except diagonal position riveted two the anti-slide openings on the edges of boards of the inner side prepreg of outermost two prepregs;
Riveted two anti-skid rivets in described anti-slide opening.
4. the riveted construction of a multi-layer PCB board, comprise at least one central layer, at least two prepregs, the upper and lower of described central layer is laminated with at least one prepreg respectively, except the rivet hole of the edges of boards riveted at described central layer and prepreg and riveted nail, it is characterized in that, also comprise:
Central layer or central layer riveted layer and be positioned at central layer or central layer riveted layer upper and lower, have anti-slide opening except riveted on the edges of boards of the inner side prepreg of outermost two prepregs;
In described anti-slide opening, riveted has anti-skid rivet.
5. the riveted construction of a kind of multi-layer PCB board according to claim 4, it is characterized in that: when comprising at least two central layers, at least three prepregs, when the upper and lower of described central layer is laminated with at least one prepreg respectively, at least one prepreg in the middle of outermost two central layers and central layer are fixed, forms described central layer riveted layer.
6. the riveted construction of a kind of multi-layer PCB board according to claim 4 or 5, is characterized in that: central layer or central layer riveted layer and be positioned at central layer or central layer riveted layer upper and lower, have two anti-slide openings except the diagonal position riveted on the edges of boards of the inner side prepreg of outermost two prepregs;
In described anti-slide opening, riveted has two anti-skid rivets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510606430.2A CN105163528A (en) | 2015-09-22 | 2015-09-22 | Riveting method and riveting structure for lamination of multilayer PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510606430.2A CN105163528A (en) | 2015-09-22 | 2015-09-22 | Riveting method and riveting structure for lamination of multilayer PCB |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105163528A true CN105163528A (en) | 2015-12-16 |
Family
ID=54804253
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510606430.2A Pending CN105163528A (en) | 2015-09-22 | 2015-09-22 | Riveting method and riveting structure for lamination of multilayer PCB |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105163528A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106825370A (en) * | 2017-03-28 | 2017-06-13 | 昆山厚荣电子有限公司 | Rivet driver and pcb board production line |
| CN113382565A (en) * | 2021-06-09 | 2021-09-10 | 金禄电子科技股份有限公司 | Multi-layer circuit board, core board structure and laminating method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101965105A (en) * | 2010-08-30 | 2011-02-02 | 昆山元茂电子科技有限公司 | Printed circuit board lamination manufacturing process |
| CN202617499U (en) * | 2012-04-17 | 2012-12-19 | 深圳市奔创电子有限公司 | PCB multi-layer precise circuit board capable of preventing layer deviation |
| CN102946698A (en) * | 2012-10-30 | 2013-02-27 | 无锡江南计算技术研究所 | Method for preventing lamination deviation in plate superposing method |
-
2015
- 2015-09-22 CN CN201510606430.2A patent/CN105163528A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101965105A (en) * | 2010-08-30 | 2011-02-02 | 昆山元茂电子科技有限公司 | Printed circuit board lamination manufacturing process |
| CN202617499U (en) * | 2012-04-17 | 2012-12-19 | 深圳市奔创电子有限公司 | PCB multi-layer precise circuit board capable of preventing layer deviation |
| CN102946698A (en) * | 2012-10-30 | 2013-02-27 | 无锡江南计算技术研究所 | Method for preventing lamination deviation in plate superposing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106825370A (en) * | 2017-03-28 | 2017-06-13 | 昆山厚荣电子有限公司 | Rivet driver and pcb board production line |
| CN113382565A (en) * | 2021-06-09 | 2021-09-10 | 金禄电子科技股份有限公司 | Multi-layer circuit board, core board structure and laminating method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9005456B2 (en) | Method for manufacturing printed circuit board | |
| US20150189738A1 (en) | Flexible printed circuit board and method for manufacturing same | |
| EP2800463A1 (en) | Printed circuit board and fabricating method thereof | |
| TWI659677B (en) | Wiring board and manufacturing method thereof | |
| US9743511B1 (en) | Rigid flex circuit board | |
| US20160105967A1 (en) | Embedded board and method of manufacturing the same | |
| US20170354044A1 (en) | Method for manufacturing wiring board | |
| TWI483655B (en) | Circuit board having tie bar buried therein and method of fabricating the same | |
| CN105163528A (en) | Riveting method and riveting structure for lamination of multilayer PCB | |
| WO2018110897A3 (en) | Multilayer printed circuit board and electronic device including the same | |
| CN103052267B (en) | The processing method of blind buried via hole wiring board | |
| US9883599B2 (en) | Manufacturing method for multi-layer circuit board having cavity | |
| EP2566306A2 (en) | Multi-layer circuit board and manufacturing method thereof | |
| US20130186674A1 (en) | Multi-layer printed circuit board (pcb) | |
| CN104768324A (en) | Method for manufacturing core substrate and circuit board | |
| CN204014250U (en) | For the production of the semi-finished product of the connected system of electronic component | |
| CN102858098A (en) | Production method of asymmetric PCB (printed circuit board) | |
| CN105451469B (en) | A kind of preparation method of circuit edge connector | |
| WO2012150777A3 (en) | The printed circuit board and the method for manufacturing the same | |
| CN105655258A (en) | Manufacturing method for embedded element packaging structure | |
| CN204131835U (en) | Soft and hard combined printing circuit board | |
| CN104981108B (en) | The processing method and circuit board of hanging structure golden finger | |
| CN106879173A (en) | A kind of printed circuit board processing method and printed circuit board | |
| CN104902698A (en) | A circuit board golden finger processing method and a circuit board having golden fingers | |
| JP2015162626A (en) | Printed wiring board and manufacturing method of the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151216 |
|
| RJ01 | Rejection of invention patent application after publication |