CN113163627A - Circuit board manufacturing method - Google Patents
Circuit board manufacturing method Download PDFInfo
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- CN113163627A CN113163627A CN202110332276.XA CN202110332276A CN113163627A CN 113163627 A CN113163627 A CN 113163627A CN 202110332276 A CN202110332276 A CN 202110332276A CN 113163627 A CN113163627 A CN 113163627A
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- copper foil
- riveting
- hole
- hole section
- auxiliary material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to the field of circuit board manufacturing, and provides a circuit board manufacturing method which comprises the steps of material preparation, riveting and fixing, press connection and nail removal and forming. In the material preparation step, preparing a blank, a radiating block and a rivet, wherein the blank comprises a first copper foil, a first prepreg, a substrate, a second prepreg, a second copper foil and a riveting auxiliary material, and the blank is provided with an accommodating hole and a riveting hole; in the riveting fixing step, riveting each rivet in each riveting hole respectively to enable the end part of each rivet to flower at the lower side of the auxiliary riveting material; in the pressing connection step, the radiating blocks are respectively arranged in the accommodating holes, and then the blanks are pressed up and down; in the rivet removing and forming step, each rivet is removed, and the riveting auxiliary material is separated from the second copper foil. The circuit board manufacturing method can manufacture the copper foil laminated circuit board embedded with the radiating block, which has relatively thin board thickness, higher circuit precision and better radiating performance, reduces the risk of deformation and wrinkling of the first copper foil and the second copper foil, and has higher manufacturing yield and higher production efficiency.
Description
Technical Field
The invention belongs to the technical field of circuit board manufacturing, and particularly relates to a circuit board manufacturing method.
Background
The typical stack of the circuit board comprises a core board stack and a copper foil stack, wherein the core board stack comprises at least two core boards which are sequentially stacked, and the copper foil stack circuit board comprises two copper foils and at least one core board stacked between the two copper foils.
However, the rigidity of the copper foil is insufficient, when the heat dissipation performance of the circuit board with the copper foil laminated structure is improved, the copper foil is usually avoided and the heat dissipation block is embedded, and if the heat dissipation block penetrates through the copper foil, that is, the heat dissipation block is embedded, the copper foil is prone to deformation and wrinkling in the manufacturing process, and further the manufacturing yield of the circuit board is easily affected.
Disclosure of Invention
The embodiment of the invention aims to provide a circuit board manufacturing method, which aims to solve the technical problem that if the heat dissipation performance of the existing copper-clad laminated circuit board is improved by embedding a heat dissipation block, the copper foil is easy to deform and wrinkle in the manufacturing process.
In order to achieve the purpose, the invention adopts the technical scheme that: a method of manufacturing a circuit board, comprising the steps of:
preparing a blank, at least one radiating block and at least two rivets, wherein the blank comprises a first copper foil, at least one first prepreg, a substrate, at least one second prepreg, a second copper foil and a riveting auxiliary material which are sequentially stacked from top to bottom, and the blank is provided with at least one accommodating hole penetrating from the first copper foil to the second copper foil and at least two riveting holes penetrating from the first copper foil to the riveting auxiliary material;
riveting and fixing, namely riveting each rivet in each riveting hole respectively, wherein the end part of each rivet is enabled to flower at the lower side of the auxiliary riveting material;
press-fit connection, namely, respectively placing the heat dissipation blocks into the accommodating holes, and then pressing the blank up and down;
and removing the rivets for forming, namely removing the rivets and separating the riveting auxiliary material from the second copper foil.
In one embodiment, in the material preparation step, the blank further includes a first pressing auxiliary material laminated on an upper side of the first copper foil and a second pressing auxiliary material laminated on a lower side of the riveting auxiliary material;
in the step of rivet removing and forming, before removing each rivet and separating the riveting auxiliary material from the second copper foil, the first pressing auxiliary material and the second pressing auxiliary material are removed.
In one embodiment, in the material preparation step, the blank further includes a balance auxiliary material laminated between the first copper foil and the first press-fit auxiliary material;
in the step of removing the rivets, the first press-fit auxiliary material, the balance auxiliary material and the second press-fit auxiliary material are removed before the rivets are removed and the riveting auxiliary material is separated from the second copper foil.
In one embodiment, the hole wall of the accommodating hole is spaced from the heat dissipation block.
In one embodiment, the accommodating hole comprises a first hole section formed in the first copper foil, a second hole section formed in the first prepreg, a third hole section formed in the second prepreg, and a fourth hole section formed in the second copper foil, a projection of the second hole section falls within a projection of the first hole section, and a projection of the third hole section falls within a projection of the fourth hole section.
In one embodiment, the distance between the hole wall of the first hole section and the radiating block is 0.2-0.3 mm, the distance between the hole wall of the second hole section and the radiating block is 0.15-0.2 mm, the distance between the hole wall of the third hole section and the radiating block is 0.15-0.2 mm, and the distance between the hole wall of the fourth hole section and the radiating block is 0.2-0.3 mm.
In one embodiment, in the material preparing step, the substrate is made to include at least one core plate; the accommodating hole also comprises a fifth hole section formed in the core plate, and the projection of the fifth hole section falls into the projection of the second hole section and the projection of the third hole section;
when at least two core plates are arranged, the substrate further comprises at least one inter-plate prepreg arranged between every two adjacent core plates; the accommodating hole further comprises a sixth hole section formed in the inter-board prepreg, and the projection of the fifth hole section also falls into the projection of the sixth hole section.
In one embodiment, the distance between the hole wall of the second hole section and the heat dissipation block is 0.15-0.2 mm, the distance between the hole wall of the third hole section and the heat dissipation block is 0.15-0.2 mm, the distance between the hole wall of the sixth hole section and the heat dissipation block is 0.15-0.2 mm, and the distance between the hole wall of the fifth hole section and the heat dissipation block is 0.05-0.1 mm.
In one embodiment, the area of the copper layer of the core board corresponding to the fifth hole segment is etched and removed, and then the area of the core board corresponding to the fifth hole segment is penetrated through by mechanical routing or laser processing, so as to form the fifth hole segment.
In one embodiment, the riveting aid is an aluminum plate.
The invention has the following beneficial effects:
according to the circuit board manufacturing method provided by the embodiment of the invention, in the riveting and fixing step, the stress of the rivet during blooming is borne by the riveting auxiliary material, so that the risk of deformation and wrinkling of the second copper foil due to stress concentration is reduced; in the step of pressing connection, the lower side surface of the second copper foil is protected and isolated through the riveting auxiliary material, and pressure, dispersed pressure and balanced pressure are borne, so that the pressing effect is guaranteed, and the risk of deformation and wrinkling of the first copper foil and the second copper foil is further reduced; therefore, the interlayer alignment accuracy of the stacked structure can be ensured and improved to a certain extent. Therefore, the circuit board manufacturing method provided by the embodiment of the invention can be used for manufacturing the circuit board with the copper foil stacking structure embedded with the radiating block, which is relatively thin in board thickness, beneficial to forming the interconnection between the laser micropores and the inner layer, beneficial to improving the space utilization rate, higher in circuit precision and better in radiating performance, and is higher in production efficiency and manufacturing yield.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a flow chart of a circuit board manufacturing method according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a first copper foil after being perforated according to an embodiment of the present invention;
FIG. 3 is a schematic view of a first cured half-slab after being perforated according to an embodiment of the present invention;
fig. 4 is a schematic view of a riveting auxiliary material provided in the embodiment of the present invention after being perforated;
fig. 5 is a schematic diagram of a core board provided in an embodiment of the present invention after a circuit is fabricated;
FIG. 6 is a schematic view of the core plate provided in FIG. 5 after being apertured;
FIG. 7 is a schematic view of a substrate according to an embodiment of the present invention;
FIG. 8 is a schematic illustration of the mating of a blank and a rivet provided by an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
100-blank, 110-first copper foil, 120-first prepreg, 130-substrate, 131-core board, 132-inter-board prepreg, 140-second prepreg, 150-second copper foil, 160-riveting auxiliary material, 101-accommodating hole, 1011-first hole section, 1012-second hole section, 1013-fifth hole section and 102-riveting hole; 200-rivet, 210-cap.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The following describes a specific implementation of the present invention in more detail with reference to specific embodiments:
referring to fig. 1, 7 and 8, an embodiment of the invention provides a method for manufacturing a circuit board, including material preparation, riveting and fixing, press-fit connection, and nail-removing molding.
In the material preparation step, a blank 100, at least one heat sink block (not shown in the figure) and at least two rivets 200 are prepared, wherein the blank 100 includes a first copper foil 110, at least one first prepreg 120, a substrate 130, at least one second prepreg 140, a second copper foil 150 and a riveting auxiliary material 160, which are sequentially stacked from top to bottom, and the blank 100 is provided with at least one accommodation hole 101 penetrating from the first copper foil 110 to the second copper foil 150 and at least two riveting holes 102 penetrating from the first copper foil 110 to the riveting auxiliary material 160.
Specifically, the preparation process of the blank 100 may include:
s1: cutting the first copper foil 110, the at least one first prepreg 120, the at least one core board 131, the at least one inter-board prepreg 132 (when only one core board 131 is provided, the inter-board prepreg 132 is not required), the at least one second prepreg 140, the second copper foil 150 and the riveting auxiliary material 160 according to the specified dimensions, wherein the first prepreg 120, the inter-board prepreg 132 and the second prepreg 140 can be substantially the same;
s2 (see fig. 5): manufacturing an inner layer circuit on the core board 131;
s3: the line quality of the core board 131 is detected using AOI (automatic optical inspection machine);
s4 (see fig. 2, 3, 4, and 6): drilling required holes at specific positions on the first copper foil 110, the first prepreg 120, the core board 131, the inter-board prepreg 132, the second prepreg 140, the second copper foil 150 and the riveting auxiliary material 160 respectively by using a mechanical processing or laser processing mode, wherein the holes can be aligned to form an accommodating hole 101, a riveting hole 102, a positioning hole and the like after lamination;
s5: the brown core board 131 can enhance the bonding force between the copper layer on the core board 131 and the inter-board prepreg 132, the first prepreg 120 and the second prepreg 140 based on the brown core board 131, so as to achieve a certain peel strength;
s6 (please refer to fig. 7) (in a possible embodiment, when there is only one core board 131, the core board 131 is the substrate 130, and this process can be skipped): sequentially laminating the core boards 131 from top to bottom, laminating at least one inter-board prepreg 132 between two adjacent core boards 131, then penetrating through positioning holes (the positioning holes penetrate from the uppermost core board 131 to the lowermost core board 131) through positioning pins so as to align and relatively fix the core boards 131 and the inter-board prepregs 132, and finally heating through a fusing device so as to melt a fusing position area of the inter-board prepregs 132, so that the core boards 131 and the inter-board prepregs 132 are basically fixed with each other, thereby forming the substrate 130;
s7 (see fig. 8): the first copper foil 110, the first prepreg 120, the substrate 130, the second prepreg 140, the second copper foil 150, and the auxiliary riveting material 160 are stacked in alignment from top to bottom, and the holes of the respective layers are aligned to form the receiving hole 101 and the riveting hole 102.
The auxiliary riveting material 160 has certain rigidity and cushioning property, and the rigidity of the auxiliary riveting material 160 is greater than the rigidity of the first copper foil 110 and the second copper foil 150.
The heat dissipation block may be, but not limited to, a copper block, a ceramic block, aluminum nitride, aluminum oxide, or other structures having a heat dissipation function.
Of course, in other possible embodiments, the core board 131 and the inter-board prepreg 132 may be laminated according to a predetermined layout and then pressed to form the substrate 130, in this embodiment, the slot holes required by the post-processes, such as the receiving hole 101, the riveting hole 102, and the like of the substrate 130, need to be drilled by machining or laser processing after the substrate 130 is molded.
In the riveting step, each rivet 200 is riveted to each riveting hole 102, wherein an end of the rivet 200 is made to flower on the lower side of the auxiliary riveting material 160.
Specifically, the other end of the rivet 200, which is away from the nut 210, may be inserted into the riveting hole 102 from the upper side of the first copper foil 110 by the riveting device, and then, may be protruded from the lower side of the auxiliary riveting material 160, and then, the stacked first copper foil 110, first prepreg 120, substrate 130, second prepreg 140, second copper foil 150, and auxiliary riveting material 160 may be aligned and relatively fixed by each rivet 200. In addition, the stress generated when the rivet 200 is opened is directly applied to the auxiliary riveting material 160 and not directly applied to the second copper foil 150, that is, in this process, the auxiliary riveting material 160 can exert the functions of bearing stress and buffering stress, so that the risk of deformation and wrinkling of the second copper foil 150 with insufficient rigidity due to stress concentration can be greatly reduced.
In the press-fit connection step, the heat dissipation blocks are respectively placed into the accommodation holes 101, and then the blank 100 is pressed up and down.
Specifically, each heat dissipation block is placed into each accommodation hole 101 from the upper side of the first copper foil 110, at this time, the riveting auxiliary material 160 can exert the effects of supporting each heat dissipation block, ensuring the matching relationship between the heat dissipation block and the accommodation hole 101, and ensuring the lower side surface of the heat dissipation block to be flush with the lower side surface of the second copper foil 150, compared with the prior art, the process of adhering the positioning protection film on the lower side of the second copper foil 150 can be omitted, and the process of tearing away from the positioning protection film after lamination can be omitted, so that the production efficiency can be improved to a certain extent, and the risk of cracking of the heat dissipation block due to adhesion and tearing of the positioning protection film can be reduced.
After each heat dissipation block is respectively placed into each accommodation hole 101, the blank 100 can be pressed through a pressing device, at this time, the first prepreg 120, the second prepreg 140 and the inter-board prepreg 132 are melted, so that the first copper foil 110, the first prepreg 120, the substrate 130, the second prepreg 140 and the second copper foil 150 can be pressed and connected, and each core board 131 in the substrate 130 and each inter-board prepreg 132 can be pressed and connected, wherein no prepreg is arranged between the second copper foil 150 and the riveting auxiliary material 160, and the second copper foil 150 and the riveting auxiliary material 160 are not bonded. In the pressing process, the auxiliary riveting material 160 can exert the functions of bearing pressure, dispersing pressure and balancing pressure, so that the pressing effect can be ensured, and the risk of deformation and wrinkling of the first copper foil 110 and the second copper foil 150 can be further reduced. Even during the pressing process, the auxiliary riveting material 160 can protect and isolate the lower side of the second copper foil 150, and prevent the molten glue from flowing to the lower side of the second copper foil 150 (i.e., can improve the glue overflow phenomenon).
In the rivet removing molding step, each rivet 200 is removed, and the riveting auxiliary material 160 is separated from the second copper foil 150.
Specifically, the laminated board can be cut inwards by 1-5 mm to remove glue overflowing from the edge of the board, the rivet 200 is drilled in a mechanical drilling mode, and finally the auxiliary riveting material 160 is separated from the second copper foil 150, so that the multilayer board is reserved, and the subsequent processes are facilitated. The subsequent processes may include drilling, copper deposition, electroplating, outer layer circuit, optical inspection of the outer layer circuit, solder resist, surface treatment, molding, etc., and will not be described in detail herein.
In summary, in the circuit board manufacturing method provided by the embodiment of the present invention, in the step of riveting and fixing, the auxiliary riveting material 160 bears the stress when the rivet 200 is opened, so as to reduce the risk of deformation and wrinkling of the second copper foil 150 due to stress concentration; in the step of press-fit connection, the lower side surface of the second copper foil 150 is protected and isolated by the riveting auxiliary material 160, and pressure, dispersion pressure and equalization pressure are carried, so that the press-fit effect is ensured, and the risk of deformation and wrinkling of the first copper foil 110 and the second copper foil 150 is further reduced; therefore, the interlayer alignment accuracy of the stacked structure can be ensured and improved to a certain extent. Therefore, the circuit board manufacturing method provided by the embodiment of the invention can be used for manufacturing the circuit board with the copper foil stacking structure embedded with the radiating block, which is relatively thin in board thickness, beneficial to forming the interconnection between the laser micropores and the inner layer, beneficial to improving the space utilization rate, higher in circuit precision and better in radiating performance, and is higher in production efficiency and manufacturing yield.
Referring to fig. 1 and 8, in the present embodiment, in the material preparation step, the blank 100 further includes a first auxiliary pressing material (not shown) stacked on the upper side of the first copper foil 110 and a second auxiliary pressing material (not shown) stacked on the lower side of the riveting auxiliary material 160; in the rivet removing step, the first and second press-fit auxiliary materials are removed before removing each rivet 200 and separating the rivet auxiliary material 160 from the second copper foil 150.
It should be noted that the first pressing auxiliary material and the second pressing auxiliary material are symmetrically distributed on the upper side of the first copper foil 110 and the lower side of the riveting auxiliary material 160, so that the pressing effect can be ensured and improved in the pressing connection step, thereby improving the manufacturing yield. The first press auxiliary material can comprise at least one of a force-dividing plate, kraft paper and a release film, and the second press auxiliary material is arranged by referring to the first press auxiliary material.
The force-dividing plates can be, but not limited to, steel plates or aluminum plates, and in the step of press-fitting connection, the two force-dividing plates symmetrically distributed on the upper side of the first copper foil 110 and the lower side of the riveting auxiliary material 160 can further bear pressure, disperse pressure and balance pressure, so that the press-fitting effect can be guaranteed, and the manufacturing yield can be improved.
The kraft paper is low in cost, and in the step of press-fit connection, the kraft paper symmetrically distributed on the upper side of the first copper foil 110 and the lower side of the riveting auxiliary material 160 can enable the blank 100 to be uniformly pressed and heated, so that the press-fit quality can be guaranteed, and the manufacturing yield can be improved.
The release film with good temperature resistance, filling property and separation property is selected, the release film is attached to the upper side of the first copper foil 110 and the lower side of the auxiliary riveting material 160 to isolate glue overflow, the upper side of the first copper foil 110 and the lower side of the auxiliary riveting material 160 are prevented from being stained with glue overflow in the pressing process, the pressing quality can be guaranteed, and the manufacturing yield is improved.
Referring to fig. 1 and 8, in the present embodiment, in the material preparation step, the blank 100 further includes a balance auxiliary material (not shown) laminated between the first copper foil 110 and the first pressing auxiliary material; in the rivet removing step, the first press-fit auxiliary material, the balance auxiliary material, and the second press-fit auxiliary material are removed before the rivets 200 are removed and the rivet auxiliary material 160 is separated from the second copper foil 150.
It should be noted that the balance auxiliary material may be set with reference to the riveting auxiliary material 160, but does not participate in riveting, and based on this, in the pressing connection step, the balance auxiliary material is symmetrically set with respect to the riveting auxiliary material 160, so that the overall structure of the laminated stack structure is symmetrical, thereby effectively reducing the warpage of pressing, improving the pressing quality, and improving the manufacturing yield.
Referring to fig. 1 and 8, in the present embodiment, the hole wall of the accommodating hole 101 is spaced from the heat dissipation block.
It should be noted that the cross-sectional dimension of the receiving hole 101 is slightly larger than the cross-sectional dimension of the heat slug, so that the heat slug can be easily inserted into the receiving hole 101 manually/mechanically, and the molten resin of the prepreg can be easily infiltrated and filled in the gap between the hole wall of the receiving hole 101 and the heat slug during the press-fit connection, so that the heat slug and the pressed blank 100 can be relatively fixed.
Referring to fig. 2, 3 and 8, in the present embodiment, the receiving hole 101 includes a first hole section 1011 formed in the first copper foil 110, a second hole section 1012 formed in the first prepreg 120, a third hole section (not shown, refer to the second hole section 1012) formed in the second prepreg 140, and a fourth hole section (not shown, refer to the first hole section 1011) formed in the second copper foil 150, a projection of the second hole section 1012 falls within a projection of the first hole section 1011, and a projection of the third hole section falls within a projection of the fourth hole section.
It should be noted here that the projection of the second hole section 1012 falls within the projection of the first hole section 1011, that is, the cross-sectional size of the first hole section 1011 is slightly larger than the cross-sectional size of the second hole section 1012; based on this, even if there is a position deviation between the first hole section 1011 and the second hole section 1012, the risk that the solid part of the first copper foil 110 falls into the projection area of the second hole section 1012 is relatively small, so that the risk that the first copper foil 110 collapses at the edge of the first hole section 1011 in the press-fit connection step can be reduced, the risk that the collapsed part of the first copper foil 110 cannot be completely removed due to the coating of the collapsed part by the molten glue of the first semi-cured sheet 120 in the subsequent process can be reduced, and the manufacturing yield of the circuit board can be ensured and improved.
Similarly, the projection of the third bore section falls within the projection of the fourth bore section, i.e. the cross-sectional dimension of the fourth bore section is slightly larger than the cross-sectional dimension of the third bore section; based on this, even if there is a position deviation between the fourth hole section and the third hole section, the risk that the entity part of the second copper foil 150 falls into the projection area of the third hole section is relatively small, so that the risk that the second copper foil 150 collapses at the edge of the fourth hole section in the press-fit connection step can be reduced, the risk that the collapse part of the second copper foil 150 cannot be cleaned by removing the glue in the subsequent process after being wrapped by the molten glue of the second prepreg 140 can be further reduced, and the manufacturing yield of the circuit board can be further ensured and improved.
Referring to fig. 2, 3 and 8, in the present embodiment, a distance between the hole wall of the first hole section 1011 and the heat dissipation block is 0.2 to 0.3mm, a distance between the hole wall of the second hole section 1012 and the heat dissipation block is 0.15 to 0.2mm, a distance between the hole wall of the third hole section and the heat dissipation block is 0.15 to 0.2mm, and a distance between the hole wall of the fourth hole section and the heat dissipation block is 0.2 to 0.3 mm.
By adopting the scheme, on one hand, the risk of collapse of the first copper foil 110 and the second copper foil 150 in the step of press connection can be reduced, and the risk of incomplete glue removal in the post-process step of the collapse parts of the first copper foil 110 and the second copper foil 150 because of being wrapped by glue is further reduced; on the other hand, the filling of the glue between the hole wall of the accommodating hole 101 and the radiating block can be ensured to be sufficient and uniform, so that the risk of occurrence of cavities is reduced; thereby improving the manufacturing yield of the circuit board.
Referring to fig. 6, 7 and 8, in the present embodiment, in the material preparation step, the substrate 130 includes at least one core board 131; the receiving hole 101 further includes a fifth hole section 1013 formed in the core plate 131, a projection of the fifth hole section 1013 falling within a projection of the second hole section 1012 and falling within a projection of the third hole section; when there are at least two core boards 131, the substrate 130 further includes at least one inter-board prepreg 132 disposed between two adjacent core boards 131; the receiving hole 101 further includes a sixth hole segment (not shown, refer to the second hole segment 1012 in fig. 3) formed in the interplate prepreg 132, and a projection of the fifth hole segment 1013 falls within a projection of the sixth hole segment.
It should be noted here that the projection of the fifth bore section 1013 falls within the projection of the second bore section 1012, the projection of the third bore section, and also the projection of the sixth bore section, i.e., the cross-sectional dimensions of the second bore section 1012, the third bore section, and the sixth bore section are all slightly larger than the cross-sectional dimension of the fifth bore section 1013. Therefore, the risk of excessive glue overflow after the prepreg is melted can be reduced, and the manufacturing yield of the circuit board can be ensured and improved.
Referring to fig. 6, 7 and 8, in the present embodiment, the distance between the hole wall of the second hole section 1012 and the heat dissipation block is 0.15 to 0.2mm, the distance between the hole wall of the third hole section and the heat dissipation block is 0.15 to 0.2mm, the distance between the hole wall of the sixth hole section and the heat dissipation block is 0.15 to 0.2mm, and the distance between the hole wall of the fifth hole section 1013 and the heat dissipation block is 0.05 to 0.1 mm.
By adopting the scheme, on one hand, the excessive risk of glue overflow after the prepreg is melted can be reduced; on the other hand, the filling of the glue between the hole wall of the accommodating hole 101 and the radiating block can be ensured to be sufficient and uniform, so that the risk of occurrence of cavities is reduced; thereby improving the manufacturing yield of the circuit board.
Referring to fig. 5 and 6, in the present embodiment, the copper layer region of the core plate 131 corresponding to the fifth hole section 1013 is etched and removed, and then the region of the core plate 131 corresponding to the fifth hole section 1013 is penetrated by mechanical routing or laser processing, so as to form the fifth hole section 1013.
It should be noted that, for the first copper foil 110, the first prepreg 120, the inter-board prepreg 132, the second prepreg 140, and the second copper foil 150, the corresponding portions of the accommodating hole 101 may be directly formed by a mechanical routing or laser processing method, and for each core board 131, the copper in the corresponding area may be etched and removed, and then the fifth hole section 1013 is formed by a mechanical routing or laser processing method. Therefore, the risk of flash can be effectively reduced and even avoided, and the manufacturing yield of the circuit board can be improved.
Referring to fig. 4 and 8, in the present embodiment, the auxiliary riveting material 160 is an aluminum plate.
By adopting the above scheme, the rigidity and the cushioning property of the riveting auxiliary material 160 can be ensured and improved.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents or improvements made within the spirit and principle of the present invention should be included in the scope of the present invention.
Claims (10)
1. A method for manufacturing a circuit board, comprising the steps of:
preparing a blank, at least one radiating block and at least two rivets, wherein the blank comprises a first copper foil, at least one first prepreg, a substrate, at least one second prepreg, a second copper foil and a riveting auxiliary material which are sequentially stacked from top to bottom, and the blank is provided with at least one accommodating hole penetrating from the first copper foil to the second copper foil and at least two riveting holes penetrating from the first copper foil to the riveting auxiliary material;
riveting and fixing, namely riveting each rivet in each riveting hole respectively, wherein the end part of each rivet is enabled to flower at the lower side of the auxiliary riveting material;
press-fit connection, namely, respectively placing the heat dissipation blocks into the accommodating holes, and then pressing the blank up and down;
and removing the rivets for forming, namely removing the rivets and separating the riveting auxiliary material from the second copper foil.
2. The wiring board manufacturing method according to claim 1, wherein in the material preparation step, the blank further includes a first press-fit auxiliary material laminated on an upper side of the first copper foil and a second press-fit auxiliary material laminated on a lower side of the riveting auxiliary material;
in the step of rivet removing and forming, before removing each rivet and separating the riveting auxiliary material from the second copper foil, the first pressing auxiliary material and the second pressing auxiliary material are removed.
3. The wiring board manufacturing method according to claim 2, wherein in the material preparation step, the blank further includes a balance auxiliary material laminated between the first copper foil and the first press-fit auxiliary material;
in the step of removing the rivets, the first press-fit auxiliary material, the balance auxiliary material and the second press-fit auxiliary material are removed before the rivets are removed and the riveting auxiliary material is separated from the second copper foil.
4. The method for manufacturing a wiring board according to claim 1, wherein a hole wall of the receiving hole is spaced apart from the heat dissipation block.
5. The method for manufacturing the circuit board according to claim 4, wherein the receiving hole comprises a first hole section formed in the first copper foil, a second hole section formed in the first prepreg, a third hole section formed in the second prepreg, and a fourth hole section formed in the second copper foil, a projection of the second hole section falls within a projection of the first hole section, and a projection of the third hole section falls within a projection of the fourth hole section.
6. The method of manufacturing a wiring board according to claim 5, wherein a distance between the hole wall of the first hole section and the heat dissipation block is 0.2 to 0.3mm, a distance between the hole wall of the second hole section and the heat dissipation block is 0.15 to 0.2mm, a distance between the hole wall of the third hole section and the heat dissipation block is 0.15 to 0.2mm, and a distance between the hole wall of the fourth hole section and the heat dissipation block is 0.2 to 0.3 mm.
7. The wiring board manufacturing method according to claim 5, wherein in the material preparation step, the substrate is made to include at least one core board; the accommodating hole also comprises a fifth hole section formed in the core plate, and the projection of the fifth hole section falls into the projection of the second hole section and the projection of the third hole section;
when at least two core plates are arranged, the substrate further comprises at least one inter-plate prepreg arranged between every two adjacent core plates; the accommodating hole further comprises a sixth hole section formed in the inter-board prepreg, and the projection of the fifth hole section also falls into the projection of the sixth hole section.
8. The method for manufacturing a wiring board according to claim 7, wherein a distance between the hole wall of the second hole section and the heat dissipation block is 0.15 to 0.2mm, a distance between the hole wall of the third hole section and the heat dissipation block is 0.15 to 0.2mm, a distance between the hole wall of the sixth hole section and the heat dissipation block is 0.15 to 0.2mm, and a distance between the hole wall of the fifth hole section and the heat dissipation block is 0.05 to 0.1 mm.
9. The method for manufacturing a circuit board according to claim 7, wherein the area of the copper layer of the core board corresponding to the fifth hole section is etched and removed, and then the area of the core board corresponding to the fifth hole section is penetrated through by mechanical routing or laser processing, so as to form the fifth hole section.
10. The method for manufacturing a wiring board according to any one of claims 1 to 9, wherein the riveting auxiliary material is an aluminum plate.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060019418A1 (en) * | 2004-07-22 | 2006-01-26 | Tellkamp John P | Method for evaluating and modifying solder attach design for integrated circuit packaging assembly |
| CN102946698A (en) * | 2012-10-30 | 2013-02-27 | 无锡江南计算技术研究所 | Method for preventing lamination deviation in plate superposing method |
| CN103402332A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN108419361A (en) * | 2018-05-15 | 2018-08-17 | 景旺电子科技(龙川)有限公司 | Bury copper billet printed circuit board and preparation method thereof |
| CN108684161A (en) * | 2018-04-25 | 2018-10-19 | 江门崇达电路技术有限公司 | It is a kind of to improve riveting method short in PCB pressings |
| CN112040673A (en) * | 2020-06-05 | 2020-12-04 | 景旺电子科技(龙川)有限公司 | Circuit board manufacturing method |
-
2021
- 2021-03-29 CN CN202110332276.XA patent/CN113163627B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060019418A1 (en) * | 2004-07-22 | 2006-01-26 | Tellkamp John P | Method for evaluating and modifying solder attach design for integrated circuit packaging assembly |
| CN102946698A (en) * | 2012-10-30 | 2013-02-27 | 无锡江南计算技术研究所 | Method for preventing lamination deviation in plate superposing method |
| CN103402332A (en) * | 2013-07-25 | 2013-11-20 | 东莞生益电子有限公司 | Printed circuit board (PCB) with high-density interconnection design and heat radiation structure, and manufacturing method thereof |
| CN108684161A (en) * | 2018-04-25 | 2018-10-19 | 江门崇达电路技术有限公司 | It is a kind of to improve riveting method short in PCB pressings |
| CN108419361A (en) * | 2018-05-15 | 2018-08-17 | 景旺电子科技(龙川)有限公司 | Bury copper billet printed circuit board and preparation method thereof |
| CN112040673A (en) * | 2020-06-05 | 2020-12-04 | 景旺电子科技(龙川)有限公司 | Circuit board manufacturing method |
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