CN115038264A - Multilayer circuit board capable of preventing layer deviation and manufacturing method thereof - Google Patents

Abstract

The invention discloses a multilayer circuit board capable of preventing layer deviation and a manufacturing method thereof, wherein the multilayer circuit board comprises an inner core layer, the inner core layer comprises two metal substrates, the two metal substrates are symmetrically distributed up and down, an adhesion layer is arranged between the two metal substrates, accommodating cavities are formed in the ends, far away from each other, of the two metal substrates, the accommodating cavities are of rectangular structures, prepregs are arranged in the two accommodating cavities, and circuit layers are arranged at the ends, far away from each other, of the two prepregs. According to the invention, the accommodating cavity is formed in the outer surface of the metal substrate and used for accommodating the semi-solid piece, the flowing range of the semi-solid piece is limited, the probability of sliding between layers caused by disordered flowing of the semi-solid piece is reduced, the connection strength between layers is further reinforced by arranging the rivet, the purpose of reducing the probability of layer deviation is achieved, and the redundant plate and the rivet are subtracted in the shearing step, so that the yield of the multilayer circuit board is improved.

Description

Multilayer circuit board capable of preventing layer deviation and manufacturing method thereof

Technical Field

The invention relates to the technical field of printed circuit boards, in particular to a multilayer circuit board capable of preventing layer deviation and a manufacturing method thereof.

Background

With the continuous development of electronic technology, especially the wide and deep application of large-scale and super-large-scale integrated circuits, the multilayer printed circuit is rapidly developing to the direction of high density, high precision and high numeralization to generate the technologies of micro-fine lines, small aperture penetration, blind hole buried hole, high board thickness aperture ratio and the like so as to meet the market demand. The phenomenon of sliding plate easily appears in the circuit board pressfitting in-process, melts when PP piece (prepreg) promptly, appears the phenomenon of skew between the layer, and the factor that arouses the slide has following several: firstly, the temperature is raised too fast during pressing, and the resin is melted too fast to enable the core plate to be in a suspension state, so that the sliding plate is slid; secondly, rivets are not punched, and generally, rivets are punched on more than 6 layers of plates to prevent the sliding between layers; thirdly, the glue content of the PP sheet is too high, and a large amount of residual glue is remained after hot melting except for filling a copper-free area, so that the slide plate is caused by disordered flowing.

The prior patent (application No. 201310114656.1) discloses a method for producing a multilayer circuit board capable of preventing layer deviation, which comprises a multilayer board pressing procedure and is characterized in that: the multi-layer board pressing procedure comprises a, pre-laminating boards and laminating boards; b. PE punching holes on the edges of the multilayer circuit boards; c. fusing; d. riveting; e. and heating and pressing. The multi-layer circuit board is gradually reinforced in a fusing and riveting mode in the pressing process, and finally the multi-layer circuit board is formed by heating and pressing, so that the problem that the layers of the multi-layer circuit board are prone to being deviated when the multi-layer circuit board is pressed is effectively solved, and the method is particularly suitable for production of the high-layer multi-layer circuit board; meanwhile, the shrinkage and expansion abnormity of the inner layer board is compensated in a mode of carrying out PE punching on the edge of the multilayer circuit board, so that the layer deviation between the inner layer boards in the pressing procedure is further prevented, the product reject ratio is reduced, and the precision of the multilayer circuit board is improved.

The multilayer circuit board is gradually reinforced by fusing and riveting, and finally the multilayer circuit board is formed by heating and pressing, but in the pressing process, the semi-solid piece is still in a flowing state, so that a sliding plate phenomenon can be caused, and therefore the multilayer circuit board capable of preventing the layer deviation and the manufacturing method thereof are provided.

Disclosure of Invention

The invention mainly aims to provide a multilayer circuit board capable of preventing layer deviation and a manufacturing method thereof, which can effectively solve the problems in the background technology.

In order to achieve the purpose, the invention adopts the technical scheme that:

the utility model provides a prevent inclined to one side multilayer circuit board in layer, includes interior sandwich layer, interior sandwich layer includes metal substrate, metal substrate is provided with two, two metal substrate is upper and lower symmetric distribution, two be provided with the adhesion layer jointly between the metal substrate, two the one end that metal substrate kept away from each other all is provided with holds the chamber, it is the rectangle structure, two to hold the chamber all be provided with the prepreg, two the one end that the prepreg kept away from each other all is provided with circuit layer, upside circuit layer upper end four corners all is provided with the rivet, the rivet lower extreme extends to terminal surface under the circuit layer of downside, the rivet does not contact with the prepreg.

Preferably, the size specification of the prepreg is matched with the size specification of the accommodating cavity.

Preferably, the metal substrate is made of one metal material selected from copper, aluminum, iron and steel.

Preferably, the thickness of the metal substrate is 120-400 μm.

Preferably, the two ends of the metal substrate, which are far away from each other, are provided with inner layer patterns, the inner layer patterns are sequentially manufactured by chemical pretreatment, film pressing, UV exposure, development, etching and film stripping, the two ends of the circuit layer, which are far away from each other, are provided with outer layer patterns, and the outer layer patterns are manufactured by a chemical etching method.

A manufacturing method of a multilayer circuit board for preventing layer deviation comprises the following steps:

cutting materials according to engineering data, wherein the engineering data comprises cutting data, graph data, drilling data and other auxiliary material tool data, and then manufacturing an inner layer graph of an inner core layer;

secondly, assembling the two metal substrates according to a preset stack structure, then performing primary pressing, and respectively punching the outer surfaces of the two metal substrates out of the accommodating cavity through a punching device;

thirdly, placing a prepreg in the accommodating cavity in the second step, then assembling the circuit layer and the prepreg according to a preset stack structure, and then performing secondary pressing in a riveting mode;

a fourth step of manufacturing an outer layer pattern on the outer surface of the circuit layer in a chemical etching mode to obtain a multilayer circuit semi-finished product;

and fifthly, cutting the multilayer circuit semi-finished product according to the transverse cutting line and the vertical cutting line by using a cutting device to obtain the multilayer circuit board.

Compared with the prior art, the invention has the following beneficial effects:

1. according to the invention, the accommodating cavity is formed in the outer surface of the metal substrate and used for accommodating the semi-solid piece, the flowing range of the semi-solid piece is limited, the probability of sliding between layers caused by disordered flowing of the semi-solid piece is reduced, and the connection strength between the layers is further reinforced by arranging the rivet, so that the purpose of reducing the occurrence probability of layer deviation is achieved, and the method is suitable for production of multilayer circuit boards.

2. In the invention, the redundant plates and rivets are subtracted in the shearing step, so that the edges of the multilayer circuit board are neat and have no burrs, and the yield of the multilayer circuit board is improved.

Drawings

FIG. 1 is a schematic view of an overall structure of a multilayer circuit board for preventing layer deviation according to the present invention;

FIG. 2 is a schematic diagram of the overall structure of the inner core layer of the multilayer circuit board for preventing layer deviation according to the present invention;

FIG. 3 is a schematic diagram of the overall structure of a metal substrate of a multilayer circuit board for preventing layer deviation according to the present invention;

fig. 4 is a schematic diagram of a cutting process of the multilayer circuit board for preventing layer deviation according to the present invention.

In the figure: 1. an inner core layer; 11. a metal substrate; 12. an adhesion layer; 13. an accommodating chamber; 14. a prepreg; 2. a circuit layer; 3. riveting; 4. a transverse cutting line; 5. a vertical cutting line.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, such as "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example one

As shown in fig. 1-3, a multilayer circuit board for preventing layer deviation comprises an inner core layer 1, the inner core layer 1 comprises metal substrates 11, the metal substrates 11 are provided with two metal substrates 11 which are symmetrically distributed up and down, two adhesion layers 12 and two are jointly arranged between the metal substrates 11, one end of each metal substrate 11, which is far away from each other, is provided with a containing cavity 13, the containing cavity 13 is of a rectangular structure, two prepregs 14 are arranged in the containing cavity 13, two prepregs 14 are arranged at one end of each prepreg, which is far away from each prepreg 14, is provided with a circuit layer 2, the upper end of each circuit layer 2 is provided with a rivet 3, the lower end of the rivet 3 extends to the lower end face of the circuit layer 2, and the rivet 3 is not in contact with the prepregs 14.

The dimensional specifications of the prepreg 14 match the dimensional specifications of the receiving cavity 13.

The metal substrate 11 is made of one metal material of copper, aluminum, iron and steel.

The thickness of the metal substrate 11 is 120-400 μm.

Two the one end that metal substrate 11 kept away from each other all is provided with the inlayer figure, the inlayer figure is made by chemical pretreatment, press mold, UV exposure, development, etching, skinning in proper order, two the one end that circuit layer 2 kept away from each other all is provided with outer figure, outer figure adopts the method preparation of chemical etching.

Example two

As shown in fig. 4, a method for manufacturing a multilayer circuit board capable of preventing layer deviation includes the following steps:

cutting materials according to engineering data, wherein the engineering data comprises cutting data, graph data, drilling data and other auxiliary material tool data, and then manufacturing an inner layer graph of an inner core layer;

secondly, assembling the two metal substrates according to a preset stack structure, then performing primary pressing, and respectively punching the outer surfaces of the two metal substrates out of the accommodating cavity through a punching device;

thirdly, placing a prepreg in the accommodating cavity in the second step, then assembling the circuit layer and the prepreg according to a preset stack structure, and then performing secondary pressing in a riveting mode;

a fourth step of manufacturing an outer layer pattern on the outer surface of the circuit layer in a chemical etching mode to obtain a multilayer circuit semi-finished product;

and fifthly, cutting the multilayer circuit semi-finished product according to the transverse cutting line and the vertical cutting line by using a cutting device to obtain the multilayer circuit board.

The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims (6)

1. A multilayer wiring board for preventing layer deviation, comprising an inner core layer (1), characterized in that: inner core layer (1) includes metal substrate (11), metal substrate (11) are provided with two, two metal substrate (11) are upper and lower symmetric distribution, two be provided with adhesion layer (12) jointly between metal substrate (11), two the one end that metal substrate (11) kept away from each other all is provided with holds chamber (13), it is the rectangle structure, two to hold chamber (13) all be provided with prepreg (14) in chamber (13), two prepreg (14) the one end of keeping away from each other all is provided with circuit layer (2), upside circuit layer (2) upper end four corners all is provided with rivet (3), rivet (3) lower extreme extends to circuit layer (2) lower terminal surface of downside, rivet (3) do not contact with prepreg (14).

2. The multilayer wiring board of claim 1, wherein: the size specification of the prepreg (14) is matched with that of the accommodating cavity (13).

3. The multilayer circuit board for preventing layer deviation according to claim 1, wherein: the metal substrate (11) is made of one metal material of copper, aluminum, iron and steel.

4. A multilayer wiring board for preventing layer deviation according to claim 3, characterized in that: the thickness of the metal substrate (11) is 120-400 mu m.

5. The multilayer wiring board of claim 4, wherein: two the one end that metal substrate (11) kept away from each other all is provided with the inlayer figure, the inlayer figure is made by chemical pretreatment, press mold, UV exposure, development, etching, shelling membrane in proper order, two the one end that circuit layer (2) kept away from each other all is provided with outer figure, outer figure adopts chemical etching's method to make.

6. The method for manufacturing a multilayer circuit board for preventing layer deviation according to claims 1-5, characterized by comprising the following steps:

cutting materials according to engineering data, wherein the engineering data comprises cutting data, graph data, drilling data and other auxiliary material tool data, and then manufacturing an inner layer graph of an inner core layer;

secondly, assembling the two metal substrates according to a preset stacking structure, then performing primary pressing, and punching the outer surfaces of the two metal substrates out of the accommodating cavity through a punching device;

thirdly, placing a prepreg in the accommodating cavity in the second step, then assembling the circuit layer and the prepreg according to a preset stack structure, and then performing secondary pressing in a riveting mode;

a fourth step of manufacturing an outer layer pattern on the outer surface of the circuit layer in a chemical etching mode to obtain a multilayer circuit semi-finished product;

and fifthly, cutting the multilayer circuit semi-finished product according to the transverse cutting line and the vertical cutting line by using a cutting device to obtain the multilayer circuit board.

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