CN211429638U - Double-sided riveting structure of multilayer circuit board - Google Patents
Double-sided riveting structure of multilayer circuit board Download PDFInfo
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- CN211429638U CN211429638U CN202020224863.8U CN202020224863U CN211429638U CN 211429638 U CN211429638 U CN 211429638U CN 202020224863 U CN202020224863 U CN 202020224863U CN 211429638 U CN211429638 U CN 211429638U
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Abstract
The utility model discloses a two-sided riveting structure of multilayer circuit board, it includes multilayer circuit board plate body, evenly distributed in locating hole and rivet hole at plate body edge all around and be located the downthehole rivet of rivet, the length of rivet is less than the thickness of plate body, rivet positive and negative riveting in turn is in on the plate body. The utility model discloses be applied to multilayer circuit board inner plating pressfitting in-process, can simplify process flow through this kind of two-sided riveting structure, improve production efficiency, avoid the disconnected nail of pressfitting between the multilayer board layer and PCB board pressfitting distortion, improve multilayer circuit board pressfitting quality.
Description
Technical Field
The utility model relates to a printed circuit board preparation field especially relates to a two-sided riveting structure of multilayer circuit board.
Background
PCB printed wiring boards are one of the important components in the electronics industry. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components.
Due to the increased packaging density of integrated circuits, a high concentration of interconnect lines is caused, which necessitates the use of multilayer circuit boards. Multilayer circuit boards are manufactured by stacking two or more circuits on top of each other with a reliable predetermined interconnection between them. The production flow of multilayer circuit boards generally comprises the following steps: design of circuit and process edge → transfer of inner layer pattern → etching of inner layer → punching → pretreatment → riveting → laminating → pressing → milling edge → drilling, etc. The lamination of the multilayer material plate of the inner layer plate refers to that a copper foil, a prepreg, a core plate (copper clad plate) with a manufactured pattern and the like are laminated in a certain sequence, and then resin in the prepreg can be melted and flow under the high-temperature and high-pressure condition to fill the core plate pattern and bond all layers together. The counterpoint precision requirement of pressfitting is very high, and the counterpoint deviation will appear slightly carelessly, and tiny deviation also can lead to the circuit board to need reprocess, scrap even, increases the cost of enterprises. Generally, before lamination of a multilayer circuit board, a target-hitting and punching mode is firstly adopted to manufacture positioning holes and riveting holes on an inner layer board, and then a plurality of inner layer boards are riveted together by using rivets so as to avoid interlayer slippage in subsequent processing. The inner-layer plate riveting structure in the prior art usually uses a rivet which is hollow in a nail rod and has a length larger than the plate thickness to penetrate through a multi-layer plate, and then the tail of the rivet is bloomed and fixed on the multi-layer plate, so that the multi-layer plate is pre-stacked together. However, the riveting structure has complex riveting process and low efficiency, and the problems of broken nails, copper scraps, interlayer offset and PCB distortion and deformation caused by the expansion and shrinkage of the inner layer material at high temperature and high pressure often occur during lamination, so that the PCB product is unqualified.
SUMMERY OF THE UTILITY MODEL
To the above-mentioned prior art, the to-be-solved technical problem of the utility model is to provide a two-sided riveting structure of multilayer circuit board, it can improve pressfitting distortion between the multiply wood layer, improves multilayer circuit board pressfitting quality.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:
the utility model provides a two-sided riveting structure of multilayer circuit board, its includes multilayer circuit board plate body, evenly distributed in locating hole and the rivet hole of plate body edge all around and lie in the downthehole rivet of rivet, the length of rivet is less than the thickness of plate body, rivet positive and negative alternative riveting is in on the plate body.
The multilayer circuit board is riveted in a positive and negative alternate mode by the rivets with the length shorter than the thickness of the board body of the multilayer circuit board, so that the fixing strength between the core board layers can be enhanced, the offset between the laminated layers is avoided, the blooming process of the riveting nails is reduced, the process flow is simplified, and the generation of broken nails and copper scraps is reduced; in addition, the front and back sides are riveted alternately, so that the up-and-down elasticity between layers can be improved, the stress dispersion of the expansion and shrinkage of the inner layer material during high-temperature and high-pressure lamination is facilitated, and the distortion and deformation of the PCB are avoided.
Furthermore, each side of plate body respectively is equipped with 4 symmetrical distribution's rivet hole.
Further, the length of the rivet is 65% -75% of the whole thickness of the plate body, the multi-layer core plate can be effectively fixed, and interlayer pressing expansion and contraction stress can be well dispersed.
Furthermore, the rivet rod of the rivet is a solid rod, and the riveting structure of the invention does not need a rivet blooming process, so that the rivet of the solid rod can be used, the strength of the rivet can be improved, and the occurrence of broken rivets is further avoided.
Furthermore, the positioning hole is an oval positioning hole, and scale mark points are arranged beside the positioning hole. The scale mark points are copper points formed by developing etching. Can monitor the precision of punching a hole at any time through the scale mark point, whether the position that conveniently detects out the locating hole fast has the deviation to in time will punch a hole unqualified inner layer board and reject, prevent that multiply wood lamination from counterpointing the deviation, improve the product percent of pass of multiply wood.
Further, the length-width ratio of the positioning hole is 2.0-2.5. The length of the positioning hole is the distance from the vertex of the ellipse on one side to the vertex of the ellipse on the other side. The oval positioning hole can better disperse the stress borne by the positioning hole when the laminated plate is pressed.
Furthermore, the positioning holes are symmetrically distributed on the periphery of the plate body and comprise transverse positioning holes and longitudinal positioning holes, and the transverse positioning holes and the longitudinal positioning holes are alternately distributed on the periphery of the plate body; can vertically fix the inner plating on PIN nail through horizontal locating hole, can transversely fix the inner plating at PIN nail through vertical locating hole, can prevent effectively that clamp plate process from gathering the skew between the layer.
Compared with the prior art, the utility model discloses an advantage as follows:
(1) the multilayer circuit board is riveted in a positive and negative alternate mode by the rivets with the length shorter than the thickness of the board body of the multilayer circuit board, the rivets do not need to bloom, fixing among the layers of the core boards can be realized, interlayer offset in the process of pressing the board is effectively prevented, the process flow is simplified, and broken nails and copper scraps are reduced; meanwhile, the front and back sides are riveted alternately, so that the stress dispersion of the expansion and shrinkage of the inner layer material during high-temperature and high-pressure lamination is facilitated, the filling uniformity of interlayer lamination resin is better, the PCB is prevented from being distorted and deformed, and the PCB lamination production yield is improved.
(2) Whether the position of detecting out the locating hole conveniently and fast has the deviation through setting up the scale mark by the locating hole to in time reject the unqualified inner layer board that will punch a hole, prevent multiply wood counterpoint deviation, improve the product percent of pass of multiply wood.
Drawings
FIG. 1 is a schematic sectional view of the present invention;
fig. 2 is a schematic top view of a first embodiment of the present invention;
fig. 3 is a schematic top view of a second embodiment of the present invention;
the labels in the figure are: 1-a plate body; 2-positioning holes; 21-transverse positioning holes; 22-longitudinal positioning holes; 3-rivet holes; 31-nail rod; 4-rivet holes; 5-Scale marking points.
Detailed Description
The following describes embodiments of the present invention in detail with reference to the accompanying drawings.
Example one
The utility model provides a two-sided riveted structure of multilayer circuit board, its includes multilayer circuit board plate body 1, evenly distributed in 4 locating holes 2 and 16 rivet holes 4 and the rivet 3 that is located rivet hole 4 at plate body 1 all around edge, the length of rivet 3 is less than plate body 1's thickness, rivet 3 positive and negative alternative riveting is in on the plate body 1.
The plate body 1 comprises 40 layers of plates, and the length of the rivet 3 is 75% of the whole thickness of the plate body 1. The rivet 3 comprises a nail head and a nail rod 31, and the nail rod 31 of the rivet 3 is a solid rod. The positioning hole 2 is an oval positioning hole 2, and a scale mark point 5 is arranged beside the positioning hole 2. The scale mark dots 5 are copper dots formed by development etching. The length-width ratio of the positioning hole 2 is 2.5. The positioning holes 2 are symmetrically distributed around the plate body 1, the positioning holes 2 comprise transverse positioning holes 21 and longitudinal positioning holes 22, the transverse positioning holes 21 and the longitudinal positioning holes 22 are alternately distributed on the periphery of the plate body 1, and the positioning holes 2 are perpendicular to the edge line of the plate body 1.
After the multi-layer circuit board in this embodiment is laminated, the average offset between the four corner bias layers is only 0.66mil through slicing analysis, and the board body 1 has no obvious warpage.
Example two
The utility model provides a two-sided riveted structure of multilayer circuit board, its includes multilayer circuit board plate body 1, evenly distributed in 4 locating holes 2 and 16 rivet holes 4 and the rivet 3 that is located rivet hole 4 at plate body 1 all around edge, the length of rivet 3 is less than plate body 1's thickness, rivet 3 positive and negative alternative riveting is in on the plate body 1.
Each edge of plate body 1 respectively is equipped with 4 symmetric distribution's locating hole 2. The plate body 1 comprises 40 layers of plates, and the length of the rivet 3 is 65% of the whole thickness of the plate body 1. The rivet 3 comprises a nail head and a nail rod 31, and the nail rod 31 of the rivet 3 is a solid rod. The positioning hole 2 is an oval positioning hole 2, and a scale mark point 5 is arranged beside the positioning hole 2. The scale mark dots 5 are copper dots formed by development etching. The length-width ratio of the positioning hole 2 is 2. The positioning holes 2 are symmetrically distributed around the plate body 1, the positioning holes 2 comprise transverse positioning holes 21 and longitudinal positioning holes 22, the transverse positioning holes 21 and the longitudinal positioning holes 22 are alternately distributed on the periphery of the plate body 1, and the positioning holes 2 are parallel to the edge line of the plate body 1.
After the multi-layer circuit board in this embodiment is laminated, the average offset between the four corner layers is only 0.65mil through slice analysis, and the board body 1 has no obvious warpage.
The present invention has been described in detail with reference to the specific embodiments. However, the present invention is not limited to the above description. Within the knowledge of a person skilled in the art, variations are possible without departing from the inventive concept, which falls within the scope of the invention.
Claims (8)
1. The utility model provides a two-sided riveted structure of multilayer circuit board, its includes multilayer circuit board plate body, evenly distributed in locating hole and rivet hole of plate body all around edge and lie in the rivet downthehole rivet of rivet, its characterized in that: the length of the rivet is smaller than the thickness of the plate body, and the rivet is riveted on the plate body in a positive and negative alternate mode.
2. The double-sided riveting structure of the multilayer circuit board as claimed in claim 1, wherein: each edge of plate body respectively is equipped with four rivet holes of symmetric distribution.
3. The double-sided riveting structure of the multilayer circuit board as claimed in claim 2, wherein: the length of the rivet is 65% -75% of the whole thickness of the plate body.
4. The double-sided riveting structure of the multilayer circuit board as claimed in claim 3, wherein: the rivet rod of the rivet is a solid rod.
5. The double-sided riveting structure of the multilayer circuit board as claimed in claim 4, wherein: the positioning hole is an oval positioning hole, and scale mark points are arranged beside the positioning hole.
6. The double-sided riveting structure of the multilayer circuit board as claimed in claim 5, wherein: the length-width ratio of the positioning holes is 2.0-2.5.
7. The double-sided riveting structure of the multilayer circuit board as claimed in claim 6, wherein: the positioning holes are symmetrically distributed on the periphery of the plate body and comprise transverse positioning holes and longitudinal positioning holes.
8. The double-sided riveting structure of the multilayer circuit board as claimed in claim 7, wherein: the transverse positioning holes and the longitudinal positioning holes are alternately distributed on the periphery of the plate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020224863.8U CN211429638U (en) | 2020-02-28 | 2020-02-28 | Double-sided riveting structure of multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020224863.8U CN211429638U (en) | 2020-02-28 | 2020-02-28 | Double-sided riveting structure of multilayer circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN211429638U true CN211429638U (en) | 2020-09-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020224863.8U Active CN211429638U (en) | 2020-02-28 | 2020-02-28 | Double-sided riveting structure of multilayer circuit board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056120A (en) * | 2021-02-06 | 2021-06-29 | 深圳市昶东鑫线路板有限公司 | Lamination method for preventing high-rise board from layer deviation |
| WO2023065411A1 (en) * | 2021-10-22 | 2023-04-27 | 智恩电子(大亚湾)有限公司 | New laminating and positioning structure of high multilayer pcb |
-
2020
- 2020-02-28 CN CN202020224863.8U patent/CN211429638U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113056120A (en) * | 2021-02-06 | 2021-06-29 | 深圳市昶东鑫线路板有限公司 | Lamination method for preventing high-rise board from layer deviation |
| WO2023065411A1 (en) * | 2021-10-22 | 2023-04-27 | 智恩电子(大亚湾)有限公司 | New laminating and positioning structure of high multilayer pcb |
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Address after: 519180 No. 28, Xinqing Second Road, Jing'an Town, Doumen District, Zhuhai City, Guangdong Province Patentee after: Zero one electronics (Zhuhai) Co.,Ltd. Address before: 519180 No. 28, Xinqing Second Road, Jing'an Town, Doumen District, Zhuhai City, Guangdong Province Patentee before: CORAD ELECTRONIC TECHNOLOGY (ZHUHAI) CO.,LTD. |