CN115503306A - Ultrathin superfine glass fiber cloth ceramic high-frequency copper foil-clad substrate and manufacturing process - Google Patents
Ultrathin superfine glass fiber cloth ceramic high-frequency copper foil-clad substrate and manufacturing process Download PDFInfo
- Publication number
- CN115503306A CN115503306A CN202211169767.8A CN202211169767A CN115503306A CN 115503306 A CN115503306 A CN 115503306A CN 202211169767 A CN202211169767 A CN 202211169767A CN 115503306 A CN115503306 A CN 115503306A
- Authority
- CN
- China
- Prior art keywords
- glass fiber
- fiber cloth
- ultrathin
- ceramic
- temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 88
- 239000004744 fabric Substances 0.000 title claims abstract description 57
- 239000003365 glass fiber Substances 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 title claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 51
- 229910052802 copper Inorganic materials 0.000 title claims description 34
- 239000010949 copper Substances 0.000 title claims description 34
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 53
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 50
- 239000000839 emulsion Substances 0.000 claims abstract description 22
- 239000011888 foil Substances 0.000 claims abstract 4
- 238000006243 chemical reaction Methods 0.000 claims description 45
- 238000007598 dipping method Methods 0.000 claims description 37
- 239000000843 powder Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 23
- 239000000178 monomer Substances 0.000 claims description 19
- 239000011889 copper foil Substances 0.000 claims description 17
- 238000003756 stirring Methods 0.000 claims description 17
- 239000003381 stabilizer Substances 0.000 claims description 16
- 239000002002 slurry Substances 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000003995 emulsifying agent Substances 0.000 claims description 14
- 239000003999 initiator Substances 0.000 claims description 14
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 12
- 239000012188 paraffin wax Substances 0.000 claims description 12
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 11
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 11
- 238000001816 cooling Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000013329 compounding Methods 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 238000007667 floating Methods 0.000 claims description 9
- 239000002736 nonionic surfactant Substances 0.000 claims description 9
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 claims description 9
- 239000008367 deionised water Substances 0.000 claims description 8
- 229910021641 deionized water Inorganic materials 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 8
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 7
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 claims description 7
- 239000001301 oxygen Substances 0.000 claims description 7
- 229910052760 oxygen Inorganic materials 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 5
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 5
- 238000001914 filtration Methods 0.000 claims description 5
- 239000011259 mixed solution Substances 0.000 claims description 5
- 239000007787 solid Substances 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- MKTOIPPVFPJEQO-UHFFFAOYSA-N 4-(3-carboxypropanoylperoxy)-4-oxobutanoic acid Chemical group OC(=O)CCC(=O)OOC(=O)CCC(O)=O MKTOIPPVFPJEQO-UHFFFAOYSA-N 0.000 claims description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Natural products CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 4
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 3
- 229920001774 Perfluoroether Polymers 0.000 claims description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 2
- 125000000218 acetic acid group Chemical group C(C)(=O)* 0.000 claims description 2
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 2
- YOALFLHFSFEMLP-UHFFFAOYSA-N azane;2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-pentadecafluorooctanoic acid Chemical group [NH4+].[O-]C(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F YOALFLHFSFEMLP-UHFFFAOYSA-N 0.000 claims description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 claims description 2
- WFRUBUQWJYMMRQ-UHFFFAOYSA-M potassium;1,1,2,2,3,3,4,4,5,5,6,6,7,7,8,8,8-heptadecafluorooctane-1-sulfonate Chemical compound [K+].[O-]S(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F WFRUBUQWJYMMRQ-UHFFFAOYSA-M 0.000 claims description 2
- 150000003138 primary alcohols Chemical class 0.000 claims description 2
- 150000003333 secondary alcohols Chemical class 0.000 claims description 2
- 238000004458 analytical method Methods 0.000 abstract description 10
- 238000005245 sintering Methods 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 11
- 238000004364 calculation method Methods 0.000 description 9
- 238000011049 filling Methods 0.000 description 9
- 239000010410 layer Substances 0.000 description 9
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- -1 polytetrafluoroethylene Polymers 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000011152 fibreglass Substances 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 238000004321 preservation Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000004062 sedimentation Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000003471 anti-radiation Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/08—Impregnating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F114/00—Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F114/18—Monomers containing fluorine
- C08F114/26—Tetrafluoroethene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/02—Composition of the impregnated, bonded or embedded layer
- B32B2260/021—Fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
- B32B2260/04—Impregnation, embedding, or binder material
- B32B2260/046—Synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/204—Di-electric
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/08—PCBs, i.e. printed circuit boards
Abstract
The invention relates to the technical field of copper-clad foil substrate production, in particular to an ultrathin ultrafine glass fiber cloth ceramic high-frequency copper-clad foil substrate and a manufacturing process thereof, wherein a PTFE emulsion is prepared by a special formula, the ultrathin ultrafine glass fiber cloth is ultrathin and ultrafine No. 106, and the ceramic components contain elements such as Si, ti, ca, sm and the like through element analysis and sintering analysis.
Description
Technical Field
The invention relates to the technical field of copper clad laminate substrate production, in particular to an ultrathin ultrafine glass fiber cloth ceramic high-frequency copper clad laminate and a manufacturing process thereof.
Background
The copper clad laminate is a plate material prepared by soaking a reinforcing material with resin, coating copper foil on one side or two sides and hot pressing, and is called copper clad laminate for short, and various printed circuit boards with different forms and different functions are prepared by selectively processing, etching, drilling, copper plating and other procedures on the copper clad laminate to prepare different printed circuits.
However, the radiation resistance of the copper clad substrate produced by the existing method is poor.
Disclosure of Invention
The invention aims to provide an ultrathin ultrafine glass fiber cloth ceramic high-frequency copper foil-clad substrate and a manufacturing process thereof, and aims to solve the technical problem that the radiation resistance of a copper foil-clad substrate produced by the existing method in the prior art is poor.
In order to achieve the purpose, the ultrathin ultrafine glass fiber cloth ceramic high-frequency copper-clad laminate comprises a copper foil layer, a dielectric layer and ultrafine glass fiber cloth, wherein the dielectric layer comprises deionized water, a tetrafluoroethylene monomer, an acid-base regulator, an emulsifier, an initiator, a stabilizer and ceramic, the ceramic is made of special low-loss low-temperature floating ceramic powder, and the dielectric layer is composed of 300 parts of deionized water, 125 parts of the tetrafluoroethylene monomer, 0.1-0.15 part of the acid-base regulator, 1.5-5 parts of the emulsifier, 0.002-0.06 part of the initiator and 15-20 parts of the stabilizer by weight.
Wherein the acid-base regulator is acetic acid or succinic acid, and the emulsifier is ammonium perfluorooctanoate or potassium perfluorooctylsulfonate.
Wherein the initiator is succinic acid peroxide or ammonium persulfate, and the stabilizer is paraffin or fluoroether oil.
The invention also provides a preparation process of the ultrathin ultrafine glass fiber cloth ceramic high-frequency copper clad laminate, which is used for preparing the ultrathin ultrafine glass fiber cloth ceramic high-frequency copper clad laminate and comprises the following steps:
the method comprises the following steps: firstly, adding deionized water, an acid-base regulator, an emulsifier and a stabilizer into a reaction kettle according to a proportion, evacuating the reaction kettle, performing replacement operation, testing the oxygen content, heating the reaction kettle at a qualified temperature, adding a PTFE monomer into the reaction kettle until the kettle pressure reaches 2.2MPa, adding a succinic peroxide initiator by using a high-pressure pump to start reaction, continuously introducing the PTFE monomer in the reaction process to maintain the pressure at 2.2MPa, stopping feeding the PTFE monomer into the reaction kettle when the addition of tetrafluoroethylene reaches 125 parts, and reacting the residual pressure to 0.3MPa;
step two: after the reaction is finished, recovering the monomers in the reaction kettle, standing for 5 minutes, opening an emptying valve, cooling and discharging, and separating out paraffin; then putting the material after paraffin separation into a thermal settling tank, adding a nonionic surfactant, namely nonylphenol polyoxyethylene ether, stirring and heating to 60 ℃, then keeping the temperature and concentrating until the solid content is 60%, then adding ammonia water to adjust the pH value to 8.5, then adding 0.1kg of hydrogen peroxide, cooling to 25 ℃ at the stirring speed of 15r/min, reacting for 10min, and filtering to obtain PTFE emulsion;
step three: then selecting low-loss low-temperature floating special ceramic powder according to dielectric constant and loss requirements, mixing the low-loss low-temperature floating special ceramic powder with the slurry of the PTFE emulsion in proportion to obtain a mixed solution for later use, taking ultrathin ultrafine glass fiber cloth as a dipping carrier, and dipping the ultrathin glass fiber cloth into a prefabricated sheet with high-proportion ceramic gel content through multiple dipping drying and high-temperature treatment by a vertical dipping machine;
step four: and then copper foil is coated on the copper clad laminate according to the proportion, and the copper clad laminate is prepared by high-temperature, high-pressure and compounding through a vacuum laminating machine and finally cutting.
Wherein, the nonionic surfactant in the second step is one of nonylphenol polyoxyethylene ether, primary alcohol polyoxyethylene ether and secondary alcohol polyoxyethylene ether.
Wherein the mass percentage concentration of the nonionic surfactant in the material after the stabilizer is separated is 1-3%.
The invention has the following beneficial effects: the PTFE emulsion is prepared by a special formula, the ultrathin ultrafine glass fiber cloth is an ultrathin and ultrafine No. 106, the ceramic components contain Si, ti, ca, sm and other elements through element analysis and sintering analysis, technical improvement and upgrading are carried out on the basis of the traditional polytetrafluoroethylene glass fiber cloth, special ceramic powder with low electric loss and low temperature drift is introduced, the slurry proportion of the ceramic and the PTFE emulsion is designed according to the requirements of dielectric constant, loss and the like, the ultrathin ultrafine glass fiber cloth is used as a glue dipping carrier, a prefabricated sheet with high proportion of ceramic glue content is dipped through multiple dipping drying and high-temperature treatment by a vertical glue dipping machine, then copper foil is mixed and coated according to proportion, and the prefabricated sheet is subjected to high-temperature, high-pressure and compounding by a vacuum laminating machine and finally cut into a copper-clad plate.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of the steps of example 1 of the present invention.
Fig. 2 is a flowchart of the steps of embodiment 2 of the present invention.
Fig. 3 is a flowchart of the steps of embodiment 3 of the present invention.
FIG. 4 is a production process diagram of the ultra-thin ultra-fine glass fiber cloth ceramic high-frequency copper clad laminate of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Embodiment 1, please refer to fig. 1, which provides an ultra-thin ultra-fine fiberglass cloth ceramic high-frequency copper clad laminate and a manufacturing process thereof, wherein a dielectric layer comprises, by weight, 300 parts of ionized water, 125 parts of tetrafluoroethylene monomer, 0.1 part of an acid-base regulator, 1.5 parts of an emulsifier, 0.002 part of an initiator, and 15 parts of a stabilizer.
S1: adding 300 parts of deionized water, 0.1 part of an acid-base regulator, 1.5 parts of an emulsifier and 15 parts of a stabilizer into a reaction kettle, evacuating the reaction kettle, carrying out replacement operation, testing the oxygen content, heating the reaction kettle to a temperature of 2.2MPa after the oxygen content is qualified, adding 0.002 part of an initiator into the reaction kettle to start reaction, continuously introducing the PTFE monomer in the reaction process to maintain the pressure at 2.2MPa, stopping feeding the reaction kettle when the addition of the PTFE monomer reaches 125 parts, and reacting the residual pressure to 0.3MPa;
s2: after the reaction is finished, recovering the monomers in the reaction kettle, standing for 5 minutes, opening an emptying valve, cooling and discharging, and separating out paraffin; then putting the material after paraffin separation into a thermal settling tank, adding a nonionic surfactant, namely nonylphenol polyoxyethylene ether, stirring and heating to 60 ℃, then keeping the temperature and concentrating until the solid content is 60%, then adding ammonia water to adjust the pH value to 8.5, then adding 0.1kg of hydrogen peroxide, cooling to 25 ℃ at the stirring speed of 15r/min, reacting for 10min, and filtering to obtain PTFE emulsion;
s3: then selecting low-loss low-temperature floating special ceramic powder according to dielectric constant and loss requirements, mixing the low-loss low-temperature floating special ceramic powder with the slurry of the PTFE emulsion in proportion to obtain a mixed solution for later use, taking ultrathin ultrafine glass fiber cloth as a dipping carrier, and dipping the ultrathin glass fiber cloth into a prefabricated sheet with high-proportion ceramic gel content through multiple dipping drying and high-temperature treatment by a vertical dipping machine;
s4: and then copper foil is coated on the copper clad laminate according to the proportion, and the copper clad laminate is prepared by high-temperature, high-pressure and compounding through a vacuum laminating machine and finally cutting.
The functional reagent is preferably hydrogen peroxide and Na 2 FeO 4 、K 2 Cr 2 O 7 、KMnO 4 、NaBiO 3 One kind of (1).
The PTFE emulsion is prepared by a special formula, the ultrathin ultrafine glass fiber cloth is an ultrathin ultrafine 106-size (the thickness is only 0.028 mm), the ceramic components contain elements such as Si, ti, ca and Sm (a small amount) through element analysis and sintering analysis, the invention is technically improved and upgraded on the basis of the traditional polytetrafluoroethylene glass fiber cloth, special ceramic powder with low electric loss and low temperature drift is introduced, the slurry proportion of ceramic and PTFE emulsion is designed according to the requirements of dielectric constant, loss and the like, the ultrathin ultrafine glass fiber cloth is used as a dipping carrier, a prefabricated sheet with high proportion of ceramic gel content is dipped and dried and treated at high temperature for many times by a vertical dipping machine, then copper foil is proportioned and coated according to the proportion, and the copper-clad plate is prepared by high-temperature, high-pressure and high-pressure compounding and final cutting of a copper-clad plate through a vacuum laminator, compared with the traditional PTFE glass fiber cloth high-frequency material, the series of the dielectric constant is wide and selectable between 2.2 and 10.2, the material performance is greatly improved, the excellent in electrical property, the thermal property, the mechanical property and the stability, the anti-radiation property and the low-emission performance and the aerospace-grade aerospace product is excellent in substitution for the same type aerospace products.
The invention simultaneously uses a theoretical calculation model, and the Lichtenecker calculation model can accurately predict the dielectric constant of the multi-component microwave substrate, and is shown as the following formula:
lnε＝V1lnε1+V2lnε2+…+Vnlnεn
in the formula, vn is the volume fraction of the nth phase, and ε n is the dielectric constant of the nth phase.
In this item, the target dielectric constant of the substrate is 2.2 to 10.2, the dielectric constant of the ptfe matrix is 2.07, the dielectric constant of the glass cloth is 6.0/4.4, and the dielectric constant of the ceramic powder is to be determined. After the volume fractions of PTFE, glass fiber cloth and ceramic powder are set, the dielectric constant of the ceramic powder can be reversely deduced according to a Lichtenecker calculation model, the high ceramic filling proportion is favorable for reducing the thermal expansion coefficient of the composite material and improving the dielectric constant, 3 low-loss ceramics are introduced into the material according to different designs of the dielectric constant, the ceramics are also applied to foreign products of the same type and are filled in a large proportion, the filling mass ratio is 40-60% (the traditional PTFE glass fiber cloth plate does not contain ceramics or the filling amount is less than 10%), a foundation is provided for the use amount of ultrathin, ultrafine and low glass fibers, the sufficient resin content is ensured, so that the performances of excellent binding force, low loss and the like are ensured, the thermal expansion coefficient of the material is reduced, the dimensional stability is improved, the reliability of the material is improved, the thermal conductivity is improved, the phase is stable, the temperature characteristic is excellent, the irradiation resistance is realized, the low exhaust is realized, and the like. The following are the dielectric constants and losses of the introduced 3 kinds of low-loss ceramics, ultra-thin ultra-fine glass cloth, and PTFE resin. The following table shows the basic properties of the components:
when preparing the mixed liquid, preparing the slurry by adopting a physical stirring mode, researching and confirming the proportion, the adding sequence, the stirring speed, the temperature, the stirring time, the monitoring parameters and the like of the raw materials by adopting the preparation principle of firstly metering, then stirring, then modifying and finally adjusting the viscosity, accurately weighing the calculated micromolecule PTFE emulsion, tiO2 ceramic, CLST ceramic, modifier, dispersant, thickener and the like according to the proportion for later use after determining the proportion formula, firstly adding the micromolecule PTFE emulsion into a mixing tank, then carrying out physical stirring after sequentially adding, adjusting the stirring speed, monitoring the viscosity, the sedimentation and the agglomeration of the slurry to enable the slurry to reach the requirements, regulating the stirring time, taking the sedimentation change of the slurry into consideration for later use after meeting the requirements, and recording the configuration time and the specified use time.
Embodiment 2, please refer to fig. 2, which provides an ultra-thin ultra-fine fiberglass cloth ceramic high-frequency copper clad laminate and a manufacturing process thereof, wherein a dielectric layer comprises, by weight, 300 parts of ionized water, 125 parts of tetrafluoroethylene monomer, 0.125 parts of acid-base regulator, 3.25 parts of emulsifier, 0.004 parts of initiator, and 17.5 parts of stabilizer.
S1: adding 300 parts of deionized water, 0.125 part of acid-base regulator, 3.25 parts of emulsifier and 17.5 parts of stabilizer into a reaction kettle, evacuating and replacing the reaction kettle, testing the oxygen content, keeping the temperature of the reaction kettle at a qualified oxygen content, adding 0.004 part of initiator into the reaction kettle until the pressure of the reaction kettle reaches 2.2MPa, continuously introducing the PTFE monomer in the reaction process to maintain the pressure at 2.2MPa, stopping feeding the PTFE monomer into the reaction kettle when the addition of the PTFE monomer reaches 125 parts, and reacting the residual pressure to 0.3MPa;
s2: after the reaction is finished, recovering the monomers in the reaction kettle, standing for 5 minutes, opening an emptying valve, cooling and discharging, and separating out paraffin; then putting the material from which the paraffin is separated into a thermal settling tank, adding a nonionic surfactant, namely nonylphenol polyoxyethylene ether, stirring and heating to 60 ℃, then keeping the temperature and concentrating until the solid content is 60%, then adding ammonia water to adjust the pH value to 8.5, then adding 0.1kg of hydrogen peroxide, cooling to 25 ℃ at the stirring speed of 15r/min, reacting for 10min, and filtering to obtain PTFE emulsion;
s3: then selecting low-loss low-temperature special ceramic powder according to the requirements on dielectric constant and loss, mixing the special ceramic powder with the PTFE emulsion slurry in proportion to obtain a mixed solution for later use, taking ultrathin superfine glass fiber cloth as a dipping carrier, and dipping the superfine glass fiber cloth into a prefabricated sheet with high-proportion ceramic gel content through multiple dipping drying and high-temperature treatment by a vertical dipping machine;
s4: and then copper foil is coated on the copper clad laminate according to the proportion, and the copper clad laminate is prepared by high-temperature, high-pressure and compounding through a vacuum laminating machine and finally cutting.
The pH value has an influence on the stability of the product, the pH value in the invention is 8-10, and the deterioration and yellowing of the PTFE emulsion surfactant can be avoided under an alkaline environment.
In this embodiment, the dipping method adopts a vertical dipping technique, slurry is dipped and taken out by glass fiber cloth, then a vertical oven is used for drying and rolling the water and solvent in the dipping slurry to prepare a prefabricated sheet, the viscosity of the dipping solution has an important influence on the thickness of a glue layer.
The PTFE emulsion is prepared by a special formula, the ultrathin ultrafine glass fiber cloth is an ultrathin ultrafine 106-size (the thickness is only 0.028 mm), the ceramic components contain elements such as Si, ti, ca, sm (a small amount) and the like through element analysis and sintering analysis, technical improvement and upgrading are carried out on the basis of the traditional polytetrafluoroethylene glass fiber cloth, special ceramic powder with low electric loss and low temperature drift is introduced, the slurry proportion of the ceramic and the PTFE emulsion is designed according to the requirements of dielectric constant, loss and the like, the ultrathin ultrafine glass fiber cloth is used as a glue dipping carrier, a prefabricated sheet with high proportion of ceramic glue content is dipped through multiple dipping drying and high-temperature treatment by a vertical glue dipping machine, then copper foil is mixed and coated according to the proportion, and the prefabricated sheet is subjected to high-temperature, high-pressure and compounding by a vacuum laminating machine and finally cutting to prepare the copper-clad plate.
The invention simultaneously uses a theoretical calculation model, and the Lichtenecker calculation model can accurately predict the dielectric constant of the multi-component microwave substrate, which is shown as the following formula:
lnε＝V1lnε1+V2lnε2+…+Vnlnεn
in the formula, vn is the volume fraction of the nth phase, and ε n is the dielectric constant of the nth phase.
In this item, the target dielectric constant of the substrate is 2.2 to 10.2, the dielectric constant of the ptfe matrix is 2.07, the dielectric constant of the glass cloth is 6.0/4.4, and the dielectric constant of the ceramic powder is to be determined. After the volume fractions of PTFE, glass fiber cloth and ceramic powder are set, the dielectric constant of the ceramic powder can be reversely deduced according to a Lichtenecker calculation model, the high ceramic filling proportion is favorable for reducing the thermal expansion coefficient of the composite material and improving the dielectric constant, 3 low-loss ceramics are introduced into the material according to different designs of the dielectric constant, the ceramics are also applied to foreign products of the same type and are filled in a large proportion, the filling mass ratio is 40-60% (the traditional PTFE glass fiber cloth plate does not contain ceramics or the filling amount is less than 10%), a foundation is provided for the use amount of ultrathin, ultrafine and low glass fibers, the sufficient resin content is ensured, so that the performances of excellent binding force, low loss and the like are ensured, the thermal expansion coefficient of the material is reduced, the dimensional stability is improved, the reliability of the material is improved, the thermal conductivity is improved, the phase is stable, the temperature characteristic is excellent, the irradiation resistance is realized, the low exhaust is realized, and the like. The dielectric constants and losses of the introduced 3 kinds of low-loss ceramics, ultra-thin ultrafine glass cloth, and PTFE resin were as follows. The following table shows the basic properties of the components:
embodiment 3, referring to fig. 3, the invention provides an ultra-thin ultra-fine fiberglass cloth ceramic high-frequency copper clad laminate and a manufacturing process thereof, wherein a dielectric layer comprises, by weight, 300 parts of ionized water, 125 parts of tetrafluoroethylene monomer, 0.15 part of an acid-base regulator, 5 parts of an emulsifier, 0.006 part of an initiator, and 20 parts of a stabilizer.
S1: adding 300 parts of deionized water, 0.15 part of acid-base regulator, 5 parts of emulsifier and 20 parts of stabilizer into a reaction kettle, evacuating the reaction kettle, carrying out replacement operation, testing the oxygen content, adding PTFE monomer into the reaction kettle to the kettle pressure of 2.2MPa, adding 0.006 part of initiator into the reaction kettle by using a high-pressure pump to start reaction, continuously introducing the PTFE monomer in the reaction process to maintain the pressure of 2.2MPa, stopping feeding the reaction kettle when the addition of the PTFE monomer reaches 125 parts, and reacting the residual pressure to 0.3MPa;
s2: after the reaction is finished, recovering the monomers in the reaction kettle, standing for 5 minutes, opening an emptying valve, cooling and discharging, and separating out paraffin; then putting the material after paraffin separation into a thermal settling tank, adding a nonionic surfactant, namely nonylphenol polyoxyethylene ether, stirring and heating to 60 ℃, then keeping the temperature and concentrating until the solid content is 60%, then adding ammonia water to adjust the pH value to 8.5, then adding 0.1kg of hydrogen peroxide, cooling to 25 ℃ at the stirring speed of 15r/min, reacting for 10min, and filtering to obtain PTFE emulsion;
s3: then selecting low-loss low-temperature floating special ceramic powder according to dielectric constant and loss requirements, mixing the low-loss low-temperature floating special ceramic powder with the slurry of the PTFE emulsion in proportion to obtain a mixed solution for later use, taking ultrathin ultrafine glass fiber cloth as a dipping carrier, and dipping the ultrathin glass fiber cloth into a prefabricated sheet with high-proportion ceramic gel content through multiple dipping drying and high-temperature treatment by a vertical dipping machine;
s4: and then copper foil is coated on the copper clad laminate according to the proportion, and the copper clad laminate is prepared by high-temperature, high-pressure and compounding through a vacuum laminating machine and finally cutting.
The shape of the ceramic powder mainly comprises a spherical shape, an angular shape, a strip shape and the like, the spherical ceramic powder has a smooth surface and a large contact area, is easy to settle in a dipping solution, is easy to fall off by mechanical external force after being mixed with resin, is generally used for products of extrusion forming process, and is not suitable for products of glue forming; the production cost of the strip-shaped ceramic powder is high, the process is complex, the qualification rate is low, and the strip-shaped ceramic powder with high proportion is easy to break and wind in the dipping solution, which is not beneficial to production control; therefore, the adopted angular ceramic particles are easy to disperse, not wound, not easy to fall off, low in manufacturing cost and low in control cost.
The PTFE emulsion is prepared by a special formula, the ultrathin ultrafine glass fiber cloth is an ultrathin ultrafine 106-size (the thickness is only 0.028 mm), the ceramic components contain elements such as Si, ti, ca, sm (a small amount) and the like through element analysis and sintering analysis, technical improvement and upgrading are carried out on the basis of the traditional polytetrafluoroethylene glass fiber cloth, special ceramic powder with low electric loss and low temperature drift is introduced, the slurry proportion of the ceramic and the PTFE emulsion is designed according to the dielectric constant and loss requirements, the ultrathin ultrafine glass fiber cloth is used as a glue dipping carrier, a prefabricated sheet with high proportion of ceramic glue content is dipped through multiple dipping drying and high-temperature treatment by a vertical glue dipping machine, then copper foils are proportioned and coated according to the proportion, and the copper clad laminate is prepared through high-temperature, high-pressure and compounding and final cutting.
The invention simultaneously uses a theoretical calculation model, and the Lichtenecker calculation model can accurately predict the dielectric constant of the multi-component microwave substrate, which is shown as the following formula:
lnε＝V1lnε1+V2lnε2+…+Vnlnεn
in the formula, vn is the volume fraction of the nth phase, and ε n is the dielectric constant of the nth phase.
In this item, the target dielectric constant of the substrate is 2.2 to 10.2, the dielectric constant of the ptfe matrix is 2.07, the dielectric constant of the glass cloth is 6.0/4.4, and the dielectric constant of the ceramic powder is to be determined. After the volume fractions of PTFE, glass fiber cloth and ceramic powder are set, the dielectric constant of the ceramic powder can be reversely deduced according to a Lichtenecker calculation model, the high ceramic filling proportion is favorable for reducing the thermal expansion coefficient of the composite material and improving the dielectric constant, 3 low-loss ceramics are introduced into the material according to different designs of the dielectric constant, the ceramics are also applied to foreign products of the same type and are filled in a large proportion, the filling mass ratio is 40-60% (the traditional PTFE glass fiber cloth plate does not contain ceramics or the filling amount is less than 10%), a foundation is provided for the use amount of ultrathin, ultrafine and low glass fibers, the sufficient resin content is ensured, so that the performances of excellent binding force, low loss and the like are ensured, the thermal expansion coefficient of the material is reduced, the dimensional stability is improved, the reliability of the material is improved, the thermal conductivity is improved, the phase is stable, the temperature characteristic is excellent, the irradiation resistance is realized, the low exhaust is realized, and the like. The following are the dielectric constants and losses of the introduced 3 kinds of low-loss ceramics, ultra-thin ultra-fine glass cloth, and PTFE resin. The following table shows the basic properties of the components:
the invention adopts vacuum high temperature and high pressure technology, cuts the prefabricated sheets and the copper foil according to the thickness requirement of a medium and the thickness requirement of the copper foil, superposes the prefabricated sheets and the copper foil according to the process proportion, adopts special parameters such as temperature, pressure, vacuum degree and the like in a vacuum high temperature vacuum press, takes a mirror steel plate as leveling and a buffer material as a heat preservation and pressure buffer, takes an isolation material as a copper protection layer, leads the prefabricated sheets and the copper foil to be combined by hot melting, and finally forms after cutting the edges of the plate. The vacuum laminating machine is adopted to reduce the forming pressure and the tension of the film, reduce the internal stress, improve the compactness and the bonding force of the material, ensure that the peeling strength of the copper foil meets the requirement, and control the thermal expansion coefficient and the water absorption of the panel.
The hot-press forming process of the invention uses a mirror steel plate as leveling, high-temperature cotton as heat preservation and pressure buffering, an aluminum sheet as a copper protective layer, and adopts special parameters of temperature, pressure, vacuum degree and the like repeatedly and iteratively to lead the prefabricated sheets to be combined with each other in a hot melting way, and the plate edges are cut to be finally formed. The forming pressure and the tension of the film are reduced, the internal stress is reduced, the compactness and the binding force of the material are improved, the peeling strength of the copper foil is ensured to meet the requirement, and the thermal expansion coefficient and the water absorption of the panel are controlled.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (6)
1. The ultra-thin superfine glass fiber cloth ceramic high-frequency copper-clad substrate is characterized by comprising the following components:
the dielectric layer comprises deionized water, a tetrafluoroethylene monomer, an acid-base regulator, an emulsifier, an initiator, a stabilizer and ceramics, wherein the ceramics are special ceramic powder with low electric loss and low temperature drift;
the dielectric layer comprises, by weight, 300 parts of ionized water, 125 parts of tetrafluoroethylene monomer, 0.1-0.15 part of an acid-base regulator, 1.5-5 parts of an emulsifier, 0.002-0.06 part of an initiator and 15-20 parts of a stabilizer.
2. The ultra-thin ultra-fine glass cloth ceramic high frequency copper clad laminate of claim 1,
the acid-base regulator is acetic acid or succinic acid, and the emulsifier is ammonium perfluorooctanoate or potassium perfluorooctylsulfonate.
3. The ultra-thin ultra-fine glass cloth ceramic high frequency copper clad laminate of claim 2,
the initiator is succinic acid peroxide or ammonium persulfate, and the stabilizer is paraffin or fluoroether oil.
4. A preparation process of an ultrathin ultrafine glass fiber cloth ceramic high-frequency copper-clad foil substrate, which is used for preparing the ultrathin ultrafine glass fiber cloth ceramic high-frequency copper-clad foil substrate as claimed in claim 3, and is characterized by comprising the following steps:
the method comprises the following steps: firstly, adding deionized water, an acid-base regulator, an emulsifier and a stabilizer into a reaction kettle according to a proportion, evacuating the reaction kettle, performing replacement operation, testing the oxygen content, heating the reaction kettle at a qualified temperature, adding a PTFE monomer into the reaction kettle until the kettle pressure reaches 2.2MPa, adding a succinic peroxide initiator by using a high-pressure pump to start reaction, continuously introducing the PTFE monomer in the reaction process to maintain the pressure at 2.2MPa, stopping feeding the PTFE monomer into the reaction kettle when the addition of tetrafluoroethylene reaches 125 parts, and reacting the residual pressure to 0.3MPa;
step two: after the reaction is finished, recovering the monomers in the reaction kettle, standing for 5 minutes, opening an emptying valve, cooling and discharging, and separating out paraffin; then putting the material after paraffin separation into a thermal settling tank, adding a nonionic surfactant, namely nonylphenol polyoxyethylene ether, stirring and heating to 60 ℃, then keeping the temperature and concentrating until the solid content is 60%, then adding ammonia water to adjust the pH value to 8.5, then adding 0.1kg of hydrogen peroxide, cooling to 25 ℃ at the stirring speed of 15r/min, reacting for 10min, and filtering to obtain PTFE emulsion;
step three: then selecting low-loss low-temperature floating special ceramic powder according to dielectric constant and loss requirements, mixing the low-loss low-temperature floating special ceramic powder with the slurry of the PTFE emulsion in proportion to obtain a mixed solution for later use, taking ultrathin ultrafine glass fiber cloth as a dipping carrier, and dipping the ultrathin glass fiber cloth into a prefabricated sheet with high-proportion ceramic gel content through multiple dipping drying and high-temperature treatment by a vertical dipping machine;
step four: and then copper foil is coated on the copper clad laminate according to the proportion, and the copper clad laminate is prepared by high-temperature, high-pressure and compounding through a vacuum laminating machine and finally cutting.
5. The process for preparing the ultra-thin ultra-fine glass fiber cloth ceramic high-frequency copper clad laminate as claimed in claim 4,
and the nonionic surfactant in the second step is one of nonylphenol polyoxyethylene ether, primary alcohol polyoxyethylene ether and secondary alcohol polyoxyethylene ether.
6. The process for preparing the ultra-thin ultra-fine glass fiber cloth ceramic high-frequency copper clad laminate as claimed in claim 5,
the mass percentage concentration of the nonionic surfactant in the material after the stabilizer is separated is 1-3%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211169767.8A CN115503306A (en) | 2022-09-22 | 2022-09-22 | Ultrathin superfine glass fiber cloth ceramic high-frequency copper foil-clad substrate and manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211169767.8A CN115503306A (en) | 2022-09-22 | 2022-09-22 | Ultrathin superfine glass fiber cloth ceramic high-frequency copper foil-clad substrate and manufacturing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN115503306A true CN115503306A (en) | 2022-12-23 |
Family
ID=84506412
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211169767.8A Pending CN115503306A (en) | 2022-09-22 | 2022-09-22 | Ultrathin superfine glass fiber cloth ceramic high-frequency copper foil-clad substrate and manufacturing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115503306A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117241479A (en) * | 2023-09-20 | 2023-12-15 | 无锡睿龙新材料科技有限公司 | High-frequency copper-clad plate with low-temperature drift coefficient and high dielectric constant and preparation method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104403035A (en) * | 2014-11-26 | 2015-03-11 | 浙江巨圣氟化学有限公司 | Preparation method of polytetrafluoroethylene dispersion emulsion |
| CN106671517A (en) * | 2016-07-06 | 2017-05-17 | 武汉联恒电子材料有限公司 | Composition of fluorine-containing resin and compound ceramic fillers and high-frequency copper-clad laminate manufactured from composition |
| CN108822455A (en) * | 2018-07-11 | 2018-11-16 | 无锡睿龙新材料科技有限公司 | A kind of high frequency Copper Clad Laminates Based On Polytetrafluoroethylene and preparation method thereof |
| CN110039852A (en) * | 2019-04-19 | 2019-07-23 | 中国电子科技集团公司第四十六研究所 | A kind of preparation method of PTFE copper-clad plate |
| CN110065279A (en) * | 2017-10-18 | 2019-07-30 | 泰州市旺灵绝缘材料厂 | A kind of polytetrafluoroethylglass glass cloth ceramic membrane copper coated foil plate and preparation method thereof |
| CN110077056A (en) * | 2019-04-29 | 2019-08-02 | 泰州博远科技咨询有限公司 | A kind of nano ceramics filled polytetrafluoroethylene glass cloth coated copper foil plate and its manufacture craft |
| CN110077055A (en) * | 2019-04-29 | 2019-08-02 | 泰州博远科技咨询有限公司 | A kind of polytetrafluoroethylglass glass cloth ceramics overlay film copper foil plate |
| CN113135752A (en) * | 2021-06-03 | 2021-07-20 | 中国振华集团云科电子有限公司 | Production method of high-dielectric low-loss high-frequency microwave composite dielectric substrate |
| WO2022007069A1 (en) * | 2020-07-09 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Method for preparing composite dielectric copper-clad laminate, and printed circuit board |
-
2022
- 2022-09-22 CN CN202211169767.8A patent/CN115503306A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104403035A (en) * | 2014-11-26 | 2015-03-11 | 浙江巨圣氟化学有限公司 | Preparation method of polytetrafluoroethylene dispersion emulsion |
| CN106671517A (en) * | 2016-07-06 | 2017-05-17 | 武汉联恒电子材料有限公司 | Composition of fluorine-containing resin and compound ceramic fillers and high-frequency copper-clad laminate manufactured from composition |
| CN110065279A (en) * | 2017-10-18 | 2019-07-30 | 泰州市旺灵绝缘材料厂 | A kind of polytetrafluoroethylglass glass cloth ceramic membrane copper coated foil plate and preparation method thereof |
| CN108822455A (en) * | 2018-07-11 | 2018-11-16 | 无锡睿龙新材料科技有限公司 | A kind of high frequency Copper Clad Laminates Based On Polytetrafluoroethylene and preparation method thereof |
| CN110039852A (en) * | 2019-04-19 | 2019-07-23 | 中国电子科技集团公司第四十六研究所 | A kind of preparation method of PTFE copper-clad plate |
| CN110077056A (en) * | 2019-04-29 | 2019-08-02 | 泰州博远科技咨询有限公司 | A kind of nano ceramics filled polytetrafluoroethylene glass cloth coated copper foil plate and its manufacture craft |
| CN110077055A (en) * | 2019-04-29 | 2019-08-02 | 泰州博远科技咨询有限公司 | A kind of polytetrafluoroethylglass glass cloth ceramics overlay film copper foil plate |
| WO2022007069A1 (en) * | 2020-07-09 | 2022-01-13 | 瑞声声学科技(深圳)有限公司 | Method for preparing composite dielectric copper-clad laminate, and printed circuit board |
| CN113135752A (en) * | 2021-06-03 | 2021-07-20 | 中国振华集团云科电子有限公司 | Production method of high-dielectric low-loss high-frequency microwave composite dielectric substrate |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117241479A (en) * | 2023-09-20 | 2023-12-15 | 无锡睿龙新材料科技有限公司 | High-frequency copper-clad plate with low-temperature drift coefficient and high dielectric constant and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106113802B (en) | A kind of preparation method for the microwave copper-clad plate for reducing Z axis thermal coefficient of expansion | |
| CN108189520B (en) | Manufacturing method of modified polytetrafluoroethylene copper-clad plate | |
| CN111114069B (en) | Ceramic/polytetrafluoroethylene composite medium substrate and preparation method thereof | |
| CN110228239B (en) | Low-dielectric poly (perfluoroethylene propylene) copper-clad plate and preparation method thereof | |
| CN115610044B (en) | Low-loss PTFE-based microwave composite dielectric substrate and preparation method thereof | |
| CN115503306A (en) | Ultrathin superfine glass fiber cloth ceramic high-frequency copper foil-clad substrate and manufacturing process | |
| CN106313840B (en) | Three axis are made to keep the preparation method of the microwave copper-clad plate of low thermal coefficient of expansion at the same time | |
| CN114771050B (en) | High-frequency copper-clad plate and preparation method thereof | |
| CN106800733A (en) | A kind of composite microwave medium material, the substrate for printed circuit board made of it and its manufacture method | |
| CN113619224B (en) | Low-water-absorption fluorine material flexible copper-clad plate and preparation method thereof | |
| CN114670512A (en) | Polytetrafluoroethylene flexible copper-clad plate containing glass fiber cloth and preparation method thereof | |
| CN101856900A (en) | Preparation method of low-loss high-frequency copper-clad plate | |
| CN109910400B (en) | Tape casting preparation method of microwave composite dielectric plate and prepared microwave composite dielectric plate | |
| CN112351591B (en) | Preparation method of polytetrafluoroethylene-based microwave composite dielectric material substrate with high peeling strength | |
| CN113263796A (en) | Copper-clad plate with low thermal expansion coefficient and preparation process thereof | |
| CN116284914B (en) | Preparation method and application of composite dielectric substrate | |
| CN109370497B (en) | Preparation method of glue for producing high-speed copper-clad plate and product thereof | |
| CN114559712B (en) | High-temperature-resistant low-loss copper-clad plate and preparation process thereof | |
| CN110602888A (en) | Preparation method of aluminum-lined high-frequency substrate | |
| CN108219329A (en) | A kind of preparation method of HF link plate base material film | |
| CN114474878A (en) | Copper-clad plate and manufacturing method thereof | |
| CN112812476B (en) | Polytetrafluoroethylene composite material and preparation method and application thereof | |
| CN111546718A (en) | Preparation method of microwave composite dielectric plate and prepared microwave composite dielectric plate | |
| CN110065279A (en) | A kind of polytetrafluoroethylglass glass cloth ceramic membrane copper coated foil plate and preparation method thereof | |
| CN112389044A (en) | PTFE high-frequency high-speed copper-clad plate and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |