CN110039852A - A kind of preparation method of PTFE copper-clad plate - Google Patents

A kind of preparation method of PTFE copper-clad plate Download PDF

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Publication number
CN110039852A
CN110039852A CN201910317061.3A CN201910317061A CN110039852A CN 110039852 A CN110039852 A CN 110039852A CN 201910317061 A CN201910317061 A CN 201910317061A CN 110039852 A CN110039852 A CN 110039852A
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ptfe
clad plate
copper
preparation
glass fabric
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高枢健
王丽倩
庞子博
张伟
武聪
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CETC 46 Research Institute
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CETC 46 Research Institute
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
    • B32B17/064—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B32B27/304—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers comprising vinyl halide (co)polymers, e.g. PVC, PVDC, PVF, PVDF
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide

Abstract

The invention discloses a kind of preparation method of PTFE copper-clad plate, this method step: 1, being that ceramic powder, silane coupling agent, deionized water and PTFE emulsion are uniformly mixed by starting components forms PTFE glue；2, glass fabric is at the uniform velocity infiltrated in PTFE glue, pretreatment cloth is obtained after drying；3, obtained pretreatment cloth and fluororesin film are overlapped into the raw substrate of specified thickness, is sintered again after raw substrate two sides cover copper foil, room temperature is cooled to after pressure maintaining, obtains PTFE copper-clad plate.Preparation method of the present invention is simple, easily operated, and filler dispersion effect is good, is uniformly mixed, product size stability is good.By reasonably matching, prepared PTFE copper-clad plate has a different dielectric constant of 2.6 ~ 8.6MHz, dielectric loss factor≤0.003, peel strength >=2.2kN/m, and comprehensive performance meets requirement, meets the requirement of industrialized mass production.

Description

A kind of preparation method of PTFE copper-clad plate
Technical field
The present invention relates to copper-clad plate technologies of preparing, more particularly to a kind of preparation method of PTFE copper-clad plate.It is as a kind of High-frequency microwave copper-clad plate, PTFE copper-clad plate obtained meet the requirement of high-frequency microwave circuit board.
Background technique
Polytetrafluoroethylene (PTFE) (abbreviation PTFE) material has excellent dielectric properties (lower dielectric constant and dielectric loss Deng) and good chemical stability and thermal stability, as communication and electronic product are gradually sent out to high-frequency high-speed direction Exhibition, the market demand of PTFE copper-clad plate increase rapidly, are widely used in the manufacture such as communication equipment, computer, automotive electronics, household electrical appliance Industry.In high frequency substrate industry, dielectric constant, dielectric loss, water absorption rate and the frequency characteristic of PTFE copper-clad plate are all best.
Chinese patent application, which discloses No. CN106494036A and proposes, a kind of directly to be pressed with PTFE film with glass cloth Method make PTFE copper-clad plate, but this method due to fluororesin does not flow substantially and can not filling glass cloth gap, Affect the performance and homogeneity of plate, bad mechanical property.
Summary of the invention
It is an object of the invention to be directed to the above-mentioned problems of the prior art and deficiency, a kind of PTFE copper-clad plate is provided Preparation method, PTFE copper-clad plate comprehensive performance obtained meet requirement, and product size has good stability.Present invention process mistake Journey is simple, is easy to serialization large-scale production.
The technical solution adopted by the present invention is that: a kind of preparation method of PTFE copper-clad plate, which is characterized in that this method have with Lower step:
Step (1): being that ceramic powder, silane coupling agent, deionized water and PTFE emulsion are uniformly mixed by starting components forms PTFE glue.
Step (2): glass fabric is at the uniform velocity infiltrated in PTFE glue, and pretreatment cloth is obtained after drying.
Step (3): obtained pretreatment cloth and fluororesin film are overlapped into the raw substrate of specified thickness, in raw substrate two sides It is sintered again after covering copper foil, room temperature is cooled to after pressure maintaining, obtains PTFE copper-clad plate.
In the step (1) of the present invention, starting components are by weight ratio are as follows: 30 ~ 50 parts of PTFE emulsion, silane coupled 0.5 ~ 0.8 part of agent, 50 ~ 70 parts of ceramic powder, 25 ~ 50 parts of deionized water.
In step (2) of the present invention, the glass fabric drying temperature after dipping is 200 ~ 280 DEG C, and drying time is 10~20min。
In step (2) of the present invention, glass fabric is repeatedly infiltrated to and is toasted drying, glass fibre is fabric The pretreatment cloth for being 60 ~ 70% at gel content.
Glass fabric of the present invention with a thickness of 0.1 ~ 0.125mm.
During step (3) of the present invention is sintered, set sintering temperature as 360 ~ 400 DEG C, pressure be 5 ~ 20Mpa, Vacuum degree be-(90 ~ 100) Kpa under conditions of, pressure maintaining 4 ~ 8 hours in hot press, then with the cooling of 1.5 ~ 2.5 DEG C/min The slow pressure maintaining of speed is cooled to room temperature.
In step (3) of the present invention, fluororesin film is that PTFE resin film, PFA resin film, FEP resin film are one of, The thickness of the fluororesin film is between 0.l ~ 0.2mm.
In step (3) of the present invention, fluororesin film is replaced with pretreatment cloth, symmetrical overlapping, and contacted with copper foil Outermost layer is fluororesin film；It is described covering copper foil with a thickness of 10 ~ 50 μm.
Ceramic powder of the present invention using silica, aluminium oxide, aluminium nitride, magnesia, calcium carbonate, titanium dioxide its One of；The partial size of ceramic powder is 5 ~ 20 μm.
PTFE emulsion of the present invention wherein solid content between 15 ~ 60%, PTFE emulsion temperature be 20 DEG C when, Viscosity is 15 ~ 40mPas.
The invention has the advantages that:
1, ceramic powders be joined, can be increased in the case where PTFE itself excellent electric property and physical property in the present invention Big dielectric constant, intensity improve heat resistance, obtain lower dielectric loss, and make up that PTFE thermal expansion coefficient is big, and quality is soft Soft, the missing such as bad mechanical property greatly improves reliability, the stability of PTFE copper-clad plate.
2, the present invention improves the uniformity that PTFE is distributed in plate, reaches DK(dielectric constant) value is from general water in the industry Flat ± 2 ~ 3% are increased to ± 0.04%.
3, in the present invention, reasonably setting and control the parameters such as heating rate, dwell pressure, dwell time is to be closed The guarantee of the PTFE copper-clad plate of lattice.Slow cooling pressure maintaining cooling is dimensional stability and resin in order to improve product and compound The cohesive force of material.
4, process of the present invention is simple, is conducive to industrialized continuous production.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.
Embodiment 1:
Step (1): being 5 μm of ceramic powder TiO by partial size according to parts by weight265 parts of (titanium dioxide), 0.5 part of silane coupling agent, 30 parts of deionized water, 233 parts of PTFE emulsion that solid content is 15%, are uniformly mixed and form PTFE glue.PTFE emulsion is tetrafluoro Dispersion concentration liquid after vinyl polymerization in the presence of nonionic surface active agent, PTFE emulsion is when temperature is 20 DEG C, viscosity For 25mPas.
Step (2): will at the uniform velocity infiltrate in PTFE glue with a thickness of 0.1mm glass fabric, and dry at a temperature of 250 DEG C Dry 15min, glass fabric is impregnated twice and is toasted drying by this example step, to obtain the pre- place of gel content 60% Removing the work.
Step (3): obtained pretreatment cloth and PTFE resin film being replaced, the symmetrical raw substrate for being overlapped into specified thickness, It is sintered again after raw substrate two sides cover copper foil, the outermost layer contacted with copper foil is PTFE resin film；PTFE resin film It with a thickness of 0.lmm, overlaps with a thickness of 990 μm, raw substrate two sides covering copper layer thickness is 38 μm of copper foils, is 380 in sintering temperature DEG C, pressure 15Mpa, vacuum degree be -100Kpa under conditions of, pressure maintaining 6 hours in hot press, then with the drop of 2 DEG C/min The warm slow pressure maintaining of speed is cooled to room temperature, obtains PTFE copper-clad plate.
Through detecting, the PTFE copper-clad plate main performance index of preparation are as follows: at normal temperature, dielectric constant 7.01MHz；Removing is strong Spend 2.4kN/m；Water imbibition 0.01%；Copper foil is without alice, obscission.
Embodiment 2:
Step (1): being 15 μm of ceramic powder SiO by partial size according to parts by weight255 parts of (silica), silane coupling agent 0.8 Part, 300 parts of PTFE emulsion that 40 parts of deionized water, solid content are 15%, are uniformly mixed and form PTFE glue.PTFE emulsion is Dispersion concentration liquid after tetrafluoroethylene polymerization in the presence of nonionic surface active agent, PTFE emulsion temperature be 20 DEG C when, Viscosity is 25mPas.
Step (2): will at the uniform velocity infiltrate in PTFE glue with a thickness of 0.1mm glass fabric, and dry at a temperature of 250 DEG C Dry 15min, glass fabric is impregnated twice and is toasted drying by this example step, to obtain the pre- place of gel content 60% Removing the work.
Step (3): obtained pretreatment cloth and PTFE resin film being replaced, the symmetrical raw substrate for being overlapped into specified thickness, It is sintered again after raw substrate two sides cover copper foil, the outermost layer contacted with copper foil is PTFE resin film；PTFE resin film It with a thickness of 0.lmm, overlaps with a thickness of 990 μm, in raw substrate two sides, covering copper layer thickness is 38 μm of copper foils, is in sintering temperature 380 DEG C, pressure 15Mpa, vacuum degree be -100Kpa under conditions of, pressure maintaining 6 hours in hot press, then with 2 DEG C/min's The slow pressure maintaining of cooling rate is cooled to room temperature, obtains PTFE copper-clad plate.
Through detecting, the PTFE copper-clad plate main performance index of preparation are as follows: at normal temperature, dielectric constant 4.31MHz；Removing is strong Spend 2.7kN/m；Water imbibition 0.03%；Copper foil is without alice, obscission.
Embodiment 3:
Step (1): being 20 μm of ceramic powder SiO by partial size according to parts by weight250 parts of (silica), silane coupling agent 0.8 Part, 78 parts of PTFE emulsion that 40 parts of deionized water, solid content are 45%, are uniformly mixed and form PTFE glue.PTFE emulsion is four Dispersion concentration liquid after vinyl fluoride polymerization in the presence of nonionic surface active agent, PTFE emulsion are glued when temperature is 20 DEG C Degree is 25mPas.
Step (2): will at the uniform velocity infiltrate in PTFE glue with a thickness of 0.1mm glass fabric, and dry at a temperature of 220 DEG C Dry 20min, glass fabric is impregnated twice and is toasted drying by this example step, to obtain the pre- place of gel content 70% Removing the work.
Step (3): obtained pretreatment cloth and PTFE resin film being replaced, the symmetrical raw substrate for being overlapped into specified thickness, It is sintered again after raw substrate two sides cover copper foil, the outermost layer contacted with copper foil is PTFE resin film；PTFE resin film It with a thickness of 0.lmm, overlaps with a thickness of 990 μm, in raw substrate two sides, covering copper layer thickness is 18 μm of copper foils, is in sintering temperature 380 DEG C, pressure 15Mpa, vacuum degree be -100Kpa under conditions of, pressure maintaining 6 hours in hot press, then with 2 DEG C/min's The slow pressure maintaining of cooling rate is cooled to room temperature, obtains PTFE copper-clad plate.
Through detecting, the PTFE copper-clad plate main performance index of preparation are as follows: at normal temperature, dielectric constant 3.87MHz；Removing is strong Spend 2.4kN/m；Water imbibition 0.02%；Copper foil is without alice, obscission.
Embodiment 4:
Step (1): according to parts by weight, the ceramic powder TiO for being 15 μm by partial size245 parts of (titanium dioxide), silane coupling agent 0.8 Part, 183 parts of PTFE emulsion that 40 parts of deionized water, solid content are 30%, are uniformly mixed and form PTFE glue.PTFE emulsion is Dispersion concentration liquid after tetrafluoroethylene polymerization in the presence of nonionic surface active agent, PTFE emulsion temperature be 20 DEG C when, Viscosity is 25mPas.
Step (2): will at the uniform velocity infiltrate in PTFE glue with a thickness of 0.1mm glass fabric, and dry at a temperature of 280 DEG C Dry 10min, glass fabric is impregnated twice and is toasted drying by this example step, to obtain the pre- place of gel content 70% Removing the work.
Step (3): obtained pretreatment cloth and fluororesin film being replaced, the symmetrical raw substrate for being overlapped into specified thickness, It is sintered again after raw substrate two sides covering copper foil, the outermost layer contacted with copper foil is fluororesin film；The thickness of PTFE resin film For 0.lmm, overlap with a thickness of 990 μm, in raw substrate two sides, covering copper layer thickness is 18 μm of copper foils, sintering temperature be 380 DEG C, Under conditions of pressure is 15Mpa, vacuum degree is -100Kpa, pressure maintaining 6 hours in hot press, then with the cooling speed of 2 DEG C/min It spends slow pressure maintaining and is cooled to room temperature, obtain PTFE copper-clad plate.
Through detecting, the PTFE copper-clad plate main performance index of preparation are as follows: at normal temperature, dielectric constant 3.13MHz；Removing is strong Spend 2.2kN/m；Water imbibition 0.03%；Copper foil is without alice, obscission.
Compared with prior art, preparation method of the present invention is simple, easily operated, and filler dispersion effect is good, is uniformly mixed, system Product good stability of the dimension.By reasonably matching, there is different dielectric constants using PTFE copper-clad plate prepared by the present invention (2.6 ~ 8.6MHz), dielectric loss factor≤0.003, peel strength >=2.2kN/m, comprehensive performance meet requirement.This hair Bright technical process is simple, meets the requirement of industrialized mass production.

Claims (10)

1. a kind of preparation method of PTFE copper-clad plate, which is characterized in that this method has following steps:
Step (1): being that ceramic powder, silane coupling agent, deionized water and PTFE emulsion are uniformly mixed by starting components forms PTFE glue；
Step (2): glass fabric is at the uniform velocity infiltrated in PTFE glue, and pretreatment cloth is obtained after drying；
Obtained pretreatment cloth and fluororesin film: being overlapped into the raw substrate of specified thickness by step (3), is covered in raw substrate two sides It is sintered again after copper foil, room temperature is cooled to after pressure maintaining, obtain PTFE copper-clad plate.
2. a kind of preparation method of PTFE copper-clad plate as described in claim 1, which is characterized in that in the step (1), former material Expect component by weight ratio are as follows: 30 ~ 50 parts of PTFE emulsion, 0.5 ~ 0.8 part of silane coupling agent, 50 ~ 70 parts of ceramic powder, deionization 25 ~ 50 parts of water.
3. a kind of preparation method of PTFE copper-clad plate as described in claim 1, which is characterized in that in the step (2), dipping Glass fabric drying temperature afterwards is 200 ~ 280 DEG C, and drying time is 10 ~ 20min.
4. such as claim 1 or a kind of preparation method of PTFE copper-clad plate as claimed in claim 3, which is characterized in that the step Suddenly in (2), glass fabric is repeatedly infiltrated to and is toasted drying, by glass fabric be made gel content be 60 ~ 70% it is pre- Treatment cloth.
5. a kind of preparation method of PTFE copper-clad plate as claimed in claim 4, which is characterized in that the thickness of the glass fabric Degree is 0.1 ~ 0.125mm.
6. a kind of preparation method of PTFE copper-clad plate as described in claim 1, which is characterized in that the step (3) is burnt Be 5 ~ 20Mpa setting sintering temperature as 360 ~ 400 DEG C, pressure in knot, vacuum degree is-(90 ~ 100) Kpa under conditions of, Then pressure maintaining 4 ~ 8 hours in hot press are cooled to room temperature with the slow pressure maintaining of the cooling rate of 1.5 ~ 2.5 DEG C/min.
7. a kind of preparation method of PTFE copper-clad plate as described in claim 1, which is characterized in that in the step (3), fluorine tree Adipose membrane is that PTFE resin film, PFA resin film, FEP resin film are one of, the thickness of the fluororesin film 0.l ~ 0.2mm it Between.
8. a kind of preparation method of PTFE copper-clad plate as described in claim 1, which is characterized in that in the step (3), by fluorine Resin film replaces with pretreatment cloth, symmetrically overlaps, and the outermost layer contacted with copper foil is fluororesin film；The thickness of the covering copper foil Degree is 10 ~ 50 μm.
9. a kind of preparation method of PTFE copper-clad plate as claimed in claim 2, which is characterized in that the ceramic powder uses two Silica, aluminium oxide, aluminium nitride, magnesia, calcium carbonate, titanium dioxide are one such；The partial size of ceramic powder is 5 ~ 20 μm.
10. a kind of preparation method of PTFE copper-clad plate as claimed in claim 2, which is characterized in that the PTFE emulsion its Middle solid content is between 15 ~ 60%, and for PTFE emulsion when temperature is 20 DEG C, viscosity is 15 ~ 40mPas.
CN201910317061.3A 2019-04-19 2019-04-19 A kind of preparation method of PTFE copper-clad plate Pending CN110039852A (en)

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CN110591255A (en) * 2019-08-13 2019-12-20 瑞声科技（南京）有限公司 Substrate material, substrate material preparation method and related substrate
CN110606698A (en) * 2019-11-01 2019-12-24 中国电子科技集团公司第四十六研究所 Microwave composite dielectric substrate with high uniformity and low thermal expansion coefficient and preparation process thereof
CN110948917A (en) * 2019-12-11 2020-04-03 无锡睿龙新材料科技有限公司 Preparation method of high-peel-strength modified polytetrafluoroethylene copper-clad plate
CN110982202A (en) * 2019-11-25 2020-04-10 江苏富仕德科技发展有限公司 Thermosetting resin composition, prepreg prepared from thermosetting resin composition and copper-clad plate
CN111038031A (en) * 2019-11-25 2020-04-21 江苏富仕德科技发展有限公司 Method for preparing prepreg, prepreg prepared by method and copper-clad plate
CN111216427A (en) * 2019-12-02 2020-06-02 珠海国能新材料股份有限公司 Preparation method of ceramic-filled PTFE (polytetrafluoroethylene) copper-clad plate
CN113365426A (en) * 2020-04-21 2021-09-07 广州市东泓氟塑料股份有限公司 Novel high-frequency high-speed flexible copper-clad plate and preparation method and application thereof
CN113386418A (en) * 2021-07-13 2021-09-14 郴州功田电子陶瓷技术有限公司 Preparation method of high-performance polytetrafluoroethylene copper-clad plate
CN113881082A (en) * 2021-12-06 2022-01-04 中国电子科技集团公司第四十六研究所 High-tensile-strength ultrathin film material and preparation method thereof
WO2022061970A1 (en) * 2020-09-22 2022-03-31 瑞声声学科技(深圳)有限公司 Insulation board and preparation method therefor, laminate and preparation method therefor, and application of insulation board or laminate
CN114479324A (en) * 2022-03-08 2022-05-13 山东森荣新材料股份有限公司 PTFE (polytetrafluoroethylene) protective film for high-frequency copper-clad plate and preparation process thereof
CN114517351A (en) * 2020-11-18 2022-05-20 南亚塑胶工业股份有限公司 Glass fiber cloth and processing method for manufacturing glass fiber cloth by low-dielectric glass fiber yarns
CN114539626A (en) * 2022-03-14 2022-05-27 浙江鸿盛新材料科技集团股份有限公司 Low-dielectric filler for copper-clad plate, preparation method of low-dielectric filler, copper-clad plate intermediate layer and copper-clad plate
CN114559724A (en) * 2022-03-02 2022-05-31 江苏生益特种材料有限公司 Ceramic polytetrafluoroethylene high-frequency copper-clad plate and preparation method thereof
CN114574129A (en) * 2022-03-02 2022-06-03 江苏生益特种材料有限公司 High-temperature-resistant glass fiber cloth edge sealing agent and preparation method thereof
CN115339174A (en) * 2022-08-15 2022-11-15 黄河三角洲京博化工研究院有限公司 Low dielectric curing sheet and preparation method thereof
CN115503306A (en) * 2022-09-22 2022-12-23 泰州市旺灵绝缘材料厂 Ultrathin superfine glass fiber cloth ceramic high-frequency copper foil-clad substrate and manufacturing process
CN115610044A (en) * 2022-12-20 2023-01-17 中国电子科技集团公司第四十六研究所 Low-loss PTFE (polytetrafluoroethylene) -based microwave composite dielectric substrate and preparation method thereof
CN116373415A (en) * 2023-06-05 2023-07-04 山东森荣新材料股份有限公司 Preparation method of PTFE ceramic filler composite high-frequency copper-clad plate

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CN102658704A (en) * 2012-05-05 2012-09-12 郴州功田电子陶瓷技术有限公司 Production process of environment-friendly microwave ceramic copper-clad plate
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Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110591255A (en) * 2019-08-13 2019-12-20 瑞声科技（南京）有限公司 Substrate material, substrate material preparation method and related substrate
WO2021026988A1 (en) * 2019-08-13 2021-02-18 瑞声声学科技(深圳)有限公司 Substrate material, preparation method for substrate material, and related substrates
CN110591255B (en) * 2019-08-13 2021-06-15 瑞声科技（南京）有限公司 Substrate material, substrate material preparation method and related substrate
CN110606698A (en) * 2019-11-01 2019-12-24 中国电子科技集团公司第四十六研究所 Microwave composite dielectric substrate with high uniformity and low thermal expansion coefficient and preparation process thereof
CN110606698B (en) * 2019-11-01 2021-12-31 中国电子科技集团公司第四十六研究所 Microwave composite dielectric substrate with high uniformity and low thermal expansion coefficient and preparation process thereof
CN110982202A (en) * 2019-11-25 2020-04-10 江苏富仕德科技发展有限公司 Thermosetting resin composition, prepreg prepared from thermosetting resin composition and copper-clad plate
CN111038031A (en) * 2019-11-25 2020-04-21 江苏富仕德科技发展有限公司 Method for preparing prepreg, prepreg prepared by method and copper-clad plate
CN111038031B (en) * 2019-11-25 2022-07-05 江苏富仕德科技发展有限公司 Method for preparing prepreg, prepreg prepared by using method and copper-clad plate
CN111216427A (en) * 2019-12-02 2020-06-02 珠海国能新材料股份有限公司 Preparation method of ceramic-filled PTFE (polytetrafluoroethylene) copper-clad plate
CN110948917A (en) * 2019-12-11 2020-04-03 无锡睿龙新材料科技有限公司 Preparation method of high-peel-strength modified polytetrafluoroethylene copper-clad plate
CN113365426A (en) * 2020-04-21 2021-09-07 广州市东泓氟塑料股份有限公司 Novel high-frequency high-speed flexible copper-clad plate and preparation method and application thereof
WO2022061970A1 (en) * 2020-09-22 2022-03-31 瑞声声学科技(深圳)有限公司 Insulation board and preparation method therefor, laminate and preparation method therefor, and application of insulation board or laminate
CN114517351A (en) * 2020-11-18 2022-05-20 南亚塑胶工业股份有限公司 Glass fiber cloth and processing method for manufacturing glass fiber cloth by low-dielectric glass fiber yarns
CN113386418B (en) * 2021-07-13 2024-01-23 郴州功田电子陶瓷技术有限公司 Preparation method of high-performance polytetrafluoroethylene copper-clad plate
CN113386418A (en) * 2021-07-13 2021-09-14 郴州功田电子陶瓷技术有限公司 Preparation method of high-performance polytetrafluoroethylene copper-clad plate
CN113881082A (en) * 2021-12-06 2022-01-04 中国电子科技集团公司第四十六研究所 High-tensile-strength ultrathin film material and preparation method thereof
CN113881082B (en) * 2021-12-06 2022-04-12 中国电子科技集团公司第四十六研究所 High-tensile-strength ultrathin film material and preparation method thereof
CN114574129A (en) * 2022-03-02 2022-06-03 江苏生益特种材料有限公司 High-temperature-resistant glass fiber cloth edge sealing agent and preparation method thereof
CN114559724A (en) * 2022-03-02 2022-05-31 江苏生益特种材料有限公司 Ceramic polytetrafluoroethylene high-frequency copper-clad plate and preparation method thereof
CN114574129B (en) * 2022-03-02 2023-06-30 江苏生益特种材料有限公司 High-temperature-resistant glass fiber cloth edge sealing agent and preparation method thereof
CN114479324A (en) * 2022-03-08 2022-05-13 山东森荣新材料股份有限公司 PTFE (polytetrafluoroethylene) protective film for high-frequency copper-clad plate and preparation process thereof
CN114539626A (en) * 2022-03-14 2022-05-27 浙江鸿盛新材料科技集团股份有限公司 Low-dielectric filler for copper-clad plate, preparation method of low-dielectric filler, copper-clad plate intermediate layer and copper-clad plate
CN115339174A (en) * 2022-08-15 2022-11-15 黄河三角洲京博化工研究院有限公司 Low dielectric curing sheet and preparation method thereof
CN115503306A (en) * 2022-09-22 2022-12-23 泰州市旺灵绝缘材料厂 Ultrathin superfine glass fiber cloth ceramic high-frequency copper foil-clad substrate and manufacturing process
CN115610044A (en) * 2022-12-20 2023-01-17 中国电子科技集团公司第四十六研究所 Low-loss PTFE (polytetrafluoroethylene) -based microwave composite dielectric substrate and preparation method thereof
CN116373415A (en) * 2023-06-05 2023-07-04 山东森荣新材料股份有限公司 Preparation method of PTFE ceramic filler composite high-frequency copper-clad plate
CN116373415B (en) * 2023-06-05 2023-07-28 山东森荣新材料股份有限公司 Preparation method of PTFE ceramic filler composite high-frequency copper-clad plate

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