CN102658704A - Production process of environment-friendly microwave ceramic copper-clad plate - Google Patents
Production process of environment-friendly microwave ceramic copper-clad plate Download PDFInfo
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- CN102658704A CN102658704A CN2012101364167A CN201210136416A CN102658704A CN 102658704 A CN102658704 A CN 102658704A CN 2012101364167 A CN2012101364167 A CN 2012101364167A CN 201210136416 A CN201210136416 A CN 201210136416A CN 102658704 A CN102658704 A CN 102658704A
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Abstract
The invention relates to a production process of an environment-friendly microwave ceramic copper-clad plate. The environment-friendly microwave ceramic copper-clad plate is mainly applied to the fields meeting high-end requirements, such as microwave and millimeter-wave satellite communications. The process comprises the following steps of: carrying out modification treatment on the surface of glass fiber cloth and immersing in synthetic slurry to form a prepreg; rolling or cutting and laminating, and anchoring a copper foil; then carrying out cold machine pre-pressing to evacuate air; and under the vacuum condition of 10-20 Kpa, keeping the pressure of a hot pressing machine at the temperature of 350-400 DEG C and at the pressure of 15-20 Mpa to be cured for 1-2 hours to prepare the product. The environment-friendly microwave ceramic copper-clad plate has microwave high-frequency low dielectric epsilonr, low loss tan delta, efficient signal transmission and high stability.
Description
Technical field
The present invention relates to a kind of production technology of environment friendly microwave ceramic copper-clad plate.This environment friendly microwave ceramic copper-clad plate is mainly used in the above high tip of 20GHz frequency ranges such as microwave and millimeter wave satellite communication, military project radar and electronic navigation, medical treatment, optical-fibre communications, microwave safe monitoring and requires the field.
Background technology
People adopt paper-base plate or epoxy glass fiber fabric base sheet material in the present electronic product.Paper-base plate dielectric ε
rHigh, tan δ loss is big, unstable; Heat-resisting effect is poor, yielding, can't be as the base material of high frequency product.In addition, its manufacturing process is to belong to batch (-type), and production efficiency is low, and it is big that consistency of product is difficult to the control waste; Also high to water source and atmosphere blowdown flow rate, not environmental protection.Epoxy glass fiber fabric base sheet material can be used in the part high-frequency circuit; In practical application, receive amblent air temperature influence high band the time substrate body reveal dielectric ε
rBecome big, charge and discharge process is slow, tan δ receives amblent air temperature influences the loss increase, the signal transmission is unstable.Epoxy glass fiber fabric base material also is batch production processing, and big, the big leftover pieces of waste of difficulty can not be recycled the low warpage that is prone to of integral smoothness in the process; It is healthy that glass cloth dust has much the victimization body; Epoxy glass fiber fabric base material is narrower to the adjusting range of performance, makes to realize that in enormous quantities, high efficiency, low waste are recyclable, the production scale of high frequency seriation.
Along with the band segment of the high-frequency communication of military use is abdicated, electronic product is developed to the direction of miniaturization, high frequencyization, digitlization, high reliabilityization.The environment friendly microwave ceramic copper-clad plate is with its remarkable microwave high-frequency low loss characteristic, extremely low dielectric ε
r, splendid electric and mechanical performance, low z axle expand, low ease gas property has obtained using widely in all kinds of communication products.
Summary of the invention
Technical problem to be solved by this invention is: a kind of production technology of environment friendly microwave ceramic copper-clad plate is provided, and the environment friendly microwave ceramic copper-clad plate that this technology is produced does not receive the amblent air temperature condition effect; Not only has the low dielectric ε of microwave high-frequency section
r, the efficient and high stable of low-loss tan δ, signal transmission; And the characteristic that has splendid electric and mechanical performance, hangs down the expansion of z axle, hangs down ease gas.
Technical scheme to be solved by this invention is following:
A kind of production technology of environment friendly microwave ceramic copper-clad plate is with after the glass fabric surface modification treatment, in synthetic slip, floods into prepreg; Through rolling or cutting, lamination and anchor Copper Foil; Then carrying out cold machine precompressed earlier closes vent gas; The back is under the vacuum condition of 10～20Kpa, and pressurize curing made in 1～2 hour in the hot press of 350～400 ℃ of temperature, pressure 15～20Mpa; Described glass fabric surface modification treatment is: earlier with silane coupler and deionized water by weight component 1:0.02 requirement weigh; The charging basket of putting into mixer is under room temperature and 150～280r/min speed of agitator; Reacted 2-4 hour, and promptly obtained surface modification liquid; Glass fabric was immersed in this surface modification liquid 3～5 minutes, takes out, toasted 5～10 minutes for 150 ℃, obtain the glass fabric that surface modification treatment is crossed with baking oven; Described synthetic slip is: with raw-material weight percentage: 22～30% alundum (Al powder (Al
2O
3), 0～5% titania powder (TiO
2), 0～2% magnesium oxide powder (MgO), 0～2% Zinc oxide powder (ZnO), 2.5～4.5% glass fibre powder joins in 32～40% the polytetrafluoroethylene (PTFE) emulsion and 34～42% polyfluorinated ethylenes (FEP) emulsion together; Stir mixing in 8-12 hour in room temperature and 10～15r/min rotating speed, promptly obtain synthetic slip; The described prepreg that floods into is: the glass fabric that surface modification treatment is good, be immersed in the above-mentioned synthetic slip 3～5 minutes through gluing machine, and take out; With 150 ℃ in baking oven oven dry 3～5 minutes, again in baking oven 250 ℃ cured 5～10 minutes, take out, be cooled to normal temperature; Repeat above-mentioned gluing machine dipping, oven for drying and baking process more once, take out; Then send 330 ℃ of roasting casees roasting 5～10 minutes, take out again and be cooled to normal temperature, promptly obtain thickness and be 0.33～0.40 prepreg.
Said silane coupler is a kind of vinyl benzyl aminoethyl aminopropyl trimethoxysilane hydrochloride; Contain the amino organic and silica-based inorganic functional group of trimethoxy of styryl; Its chemical structural formula is C
17H
30N
2O
3SiHCl; External corresponding product: DOW CORNING Z-6032, the KBM of SHIN-ETSU HANTOTAI 575, intelligence rope S350.
To solidify be between heat resistant rubber or corrosion resistant plate, to heat and pressurize in pressurize in the described hot press.
Compared with prior art, the present invention has following characteristics.
1. the present invention adopts organic matter, oxide and silane coupler to make low dielectric ε
r, efficient, the high stable performance excellent microwave high-frequency copper-clad plate of low-loss tan δ, signal transmission, in the control range of each component, all have microwave dielectric property ε preferably
r=2.2～5.0; Qf>4000GHz is in the loss tan δ 0.001～0.02; Make copper-clad plate not only have remarkable high-frequency low-consumption characteristic like this; The hot coefficient of extremely low dielectric constant; And have splendid electric and mechanical performance, low z axle expansion, low ease gas property, satisfied electronic product and developed to the direction of miniaturization, high frequencyization, digitlization, high reliabilityization.
2. of the present inventionly on traditional handicraft, innovate, first precompressed is closed vent gas and is carried out the high temperature lamination again, vacuumizes, and in 350-400 ℃ of temperature, solidifies again.Precompressed is closed the density of baseplate material density and substrate and Copper Foil is improved once more, has the effect of predischarge simultaneously; The lamination that is carried out vacuumizes HTHP, makes the uniformity of the performance of substrate, and flatness improves, and angularity lowers, and high-temperature resistant result significantly improves.Make substrate thickness obtain strict ensure and meeting international copper-clad plate standard: GB4723～4725～92 and high accuracy standard: IPC-4101A level.
3. domestic raw material of the present invention is sufficient; Cost is low; The prescription composition does not contain heavy metal compositions such as nickel, cobalt, promptly the present invention is to provide a kind of low dielectric ε r, low-loss tan δ, efficient, the high stable performance excellent microwave high frequency environment friendly microwave high-frequency ceramic substrate of signal transmission.Meet the pollution-free requirement of environmental protection.And the lead-free standard and the waste electrical equipment that meet the up-to-date appearance of the European Community reclaim the RHOS of mark and the strict standard requirement of WEEE.Can in the product of high frequency field, use; Can product be exported to any country in the world.Can further strengthen enlarging competitiveness with external import microwave high-frequency plate.Simultaneously, also quickened homemade high-frequency communication product and transmitted, required satellite communication, the high frequency development and the application of microwave communication and fiber optic communication to high security, high transfer quality, high information quantity.
4. the non-batch production of base material does not have blowdown, high efficiency, low unrestrained useless in the production; Directly reclaiming of waste material makes the useless sharply reduction of raw material wave, has more the greater advantages of environmental protection and energy saving.
5. the prepared product of the present invention high security, high transfer quality, high information quantity that can be used as high-frequency communication transmit with product such as receptions in indispensable critical material use; And be widely used in modern high leading-edge field electron trades such as satellite receiver, base antenna, microwave transmission, automobile telephone, global positioning system, satellite communication, optical-fibre communications, communication apparatus adapter, signal oscillator, household appliances networking, high-speed cruising computer, oscillograph, IC tester, have important industrial application value.
The specific embodiment
Describe the present invention in detail with the specific embodiment below.
A kind of production technology of environment friendly microwave ceramic copper-clad plate is with after the glass fabric surface modification treatment, in synthetic slip, floods into prepreg; Through rolling or cutting, lamination and anchor Copper Foil; Carrying out cold machine precompressed again closes; Last under the vacuum condition of 10～20Kpa, pressurize curing made in 1～2 hour in the hot press of 350～400 ℃ of temperature, pressure 15～20Mpa; Briefing according to this composition of raw material and proportioning and above-mentioned manufacturing approach are implemented is following.
Table 1 provides the data of each embodiment appearance raw material and manufacturing parameter:
Table 2 provides the performance of each embodiment appearance:
Claims (2)
1. the production technology of an environment friendly microwave ceramic copper-clad plate, it is characterized in that: its technical process is with after the glass fabric surface modification treatment, in synthetic slip, floods into prepreg; Through rolling or cutting, lamination and anchor Copper Foil; Then carrying out cold machine precompressed earlier closes vent gas; The back is under the vacuum condition of 10～20Kpa, and pressurize curing made in 1～2 hour in the hot press of 350～400 ℃ of temperature, pressure 15～20Mpa; Described glass fabric surface modification treatment is: earlier with silane coupler and deionized water by weight component 1:0.02 requirement weigh; The charging basket of putting into mixer is under room temperature and 150～280r/min speed of agitator; Reacted 2-4 hour, and promptly obtained surface modification liquid; Glass fabric was immersed in this surface modification liquid 3～5 minutes, takes out, toasted 5～10 minutes for 150 ℃, obtain the glass fabric that surface modification treatment is crossed with baking oven; Described synthetic slip is: with raw-material weight percentage: 22～30% alundum (Al powder (Al
2O
3), 0～5% titania powder (TiO
2), 0～2% magnesium oxide powder (MgO), 0～2% Zinc oxide powder (ZnO), 2.5～4.5% glass fibre powder joins in 32～40% the polytetrafluoroethylene (PTFE) emulsion and 34～42% polyfluorinated ethylenes (FEP) emulsion together; Stir mixing in 8-12 hour in room temperature and 10～15r/min rotating speed, promptly obtain synthetic slip; The described prepreg that floods into is: the glass fabric that surface modification treatment is good, be immersed in the above-mentioned synthetic slip 3～5 minutes through gluing machine, and take out; With 150 ℃ in baking oven oven dry 3～5 minutes, again in baking oven 250 ℃ cured 5～10 minutes, take out, be cooled to normal temperature; Repeat above-mentioned gluing machine dipping, oven for drying and baking process more once, take out; Then send 330 ℃ of roasting casees roasting 5～10 minutes, take out again and be cooled to normal temperature, promptly obtain thickness and be 0.33～0.40 prepreg; Said silane coupler is a kind of vinyl benzyl aminoethyl aminopropyl trimethoxysilane hydrochloride.
2. the production technology of environment friendly microwave ceramic copper-clad plate according to claim 1 is characterized in that: to solidify be between heat resistant rubber or corrosion resistant plate, to heat and pressurize in pressurize in the described hot press.
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| CN201210136416.7A CN102658704B (en) | 2012-05-05 | 2012-05-05 | Production process of environment-friendly microwave ceramic copper-clad plate |
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| CN102658704B CN102658704B (en) | 2014-07-23 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI646137B (en) * | 2017-07-18 | 2019-01-01 | 南亞塑膠工業股份有限公司 | Fluorine prepreg and resin composition thereof |
| CN109648935A (en) * | 2018-12-24 | 2019-04-19 | 嘉兴佳利电子有限公司 | A kind of preparation process of PTFE Ceramic Composite high-frequency copper-clad plate |
| CN110039852A (en) * | 2019-04-19 | 2019-07-23 | 中国电子科技集团公司第四十六研究所 | A kind of preparation method of PTFE copper-clad plate |
| CN110228239A (en) * | 2019-05-22 | 2019-09-13 | 华南理工大学 | A kind of low dielectric perfluoroethylene-propylene copper-clad plate and preparation method thereof |
| CN111825943A (en) * | 2020-07-27 | 2020-10-27 | 郴州功田电子陶瓷技术有限公司 | Resin composition for carbon-hydrogen copper-clad plate |
Citations (4)
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|---|---|---|---|---|
| US4335180A (en) * | 1978-12-26 | 1982-06-15 | Rogers Corporation | Microwave circuit boards |
| US5922453A (en) * | 1997-02-06 | 1999-07-13 | Rogers Corporation | Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates |
| CN1586876A (en) * | 2004-08-10 | 2005-03-02 | 华南理工大学 | Process for preparing high performance copper-clad polytetrafluoroethylene plate |
| CN101838431A (en) * | 2010-05-21 | 2010-09-22 | 广东生益科技股份有限公司 | Fluororesin mixture, copper-clad plate prepared therefrom and manufacturing method thereof |
-
2012
- 2012-05-05 CN CN201210136416.7A patent/CN102658704B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4335180A (en) * | 1978-12-26 | 1982-06-15 | Rogers Corporation | Microwave circuit boards |
| US5922453A (en) * | 1997-02-06 | 1999-07-13 | Rogers Corporation | Ceramic-filled fluoropolymer composite containing polymeric powder for high frequency circuit substrates |
| CN1586876A (en) * | 2004-08-10 | 2005-03-02 | 华南理工大学 | Process for preparing high performance copper-clad polytetrafluoroethylene plate |
| CN101838431A (en) * | 2010-05-21 | 2010-09-22 | 广东生益科技股份有限公司 | Fluororesin mixture, copper-clad plate prepared therefrom and manufacturing method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI646137B (en) * | 2017-07-18 | 2019-01-01 | 南亞塑膠工業股份有限公司 | Fluorine prepreg and resin composition thereof |
| CN109648935A (en) * | 2018-12-24 | 2019-04-19 | 嘉兴佳利电子有限公司 | A kind of preparation process of PTFE Ceramic Composite high-frequency copper-clad plate |
| CN110039852A (en) * | 2019-04-19 | 2019-07-23 | 中国电子科技集团公司第四十六研究所 | A kind of preparation method of PTFE copper-clad plate |
| CN110228239A (en) * | 2019-05-22 | 2019-09-13 | 华南理工大学 | A kind of low dielectric perfluoroethylene-propylene copper-clad plate and preparation method thereof |
| CN110228239B (en) * | 2019-05-22 | 2020-08-18 | 华南理工大学 | Low-dielectric poly (perfluoroethylene propylene) copper-clad plate and preparation method thereof |
| CN111825943A (en) * | 2020-07-27 | 2020-10-27 | 郴州功田电子陶瓷技术有限公司 | Resin composition for carbon-hydrogen copper-clad plate |
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|---|---|
| CN102658704B (en) | 2014-07-23 |
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