CN110039851A - A kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene - Google Patents

A kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene Download PDF

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CN110039851A
CN110039851A CN201910316897.1A CN201910316897A CN110039851A CN 110039851 A CN110039851 A CN 110039851A CN 201910316897 A CN201910316897 A CN 201910316897A CN 110039851 A CN110039851 A CN 110039851A
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polytetrafluoroethylene
preparation
copper
clad laminates
copper clad
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CN110039851B (en
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高枢健
张立欣
金霞
贾倩倩
韩伏龙
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CETC 46 Research Institute
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/08—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the cooling method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide

Abstract

The invention discloses a kind of preparation methods of Copper Clad Laminates Based On Polytetrafluoroethylene.This method step: 1, by starting components it is polytetrafluoroethylene (PTFE) powder, lubricant, ceramic powder and short glass fiber be uniformly mixed, is cured；2, it is molded and preform is made；3, raw substrate, re-dry are obtained by calendering；4, the two sides of raw substrate is covered into copper foil, is sintered, room temperature is cooled to after pressure maintaining, obtains Copper Clad Laminates Based On Polytetrafluoroethylene.The present invention replaces the preparation method using PTFE dispersion liquid gluing dipping, has prevented the harm of toxic fluoride, nitrogen oxides etc., and filler dispersion effect is good, is uniformly mixed, product size stability is good.By reasonably matching, prepared PTFE copper-clad plate has a different dielectric constant of 2.6-8.6MHz, dielectric loss factor≤0.003, peel strength >=1.7kN/m, and comprehensive performance meets requirement.Present invention process process is simple, meets the requirement of industrialized mass production.

Description

A kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene
Technical field
The present invention relates to copper-clad plate preparation processes, more particularly to a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene, i.e., For a kind of high-frequency microwave copper-clad plate, Copper Clad Laminates Based On Polytetrafluoroethylene obtained meets the requirement of high-frequency microwave circuit board.
Background technique
Polytetrafluoroethylene (PTFE) (abbreviation PTFE) material has excellent dielectric properties (lower dielectric constant and dielectric loss Deng) and good chemical stability and thermal stability.As communication and electronic product are gradually sent out to high-frequency high-speed direction Exhibition, the market demand of PTFE copper-clad plate increase rapidly, are widely used in the manufacture such as communication equipment, computer, automotive electronics, household electrical appliance Industry.In high frequency substrate industry, dielectric constant, dielectric loss, water absorption rate and the frequency characteristic of PTFE copper-clad plate are all best.
The preparation method of traditional PTFE copper-clad plate is to use PTFE emulsion impregnated glass fiber cloth, at 100 DEG C of temperature or so After dry moisture, several PTFE impregnated cloths stack up, and cover copper foil sintering and obtain PTFE copper-clad plate.Due to the spy of PTFE resin Property, such as it is insoluble not molten, self-lubrication, non-stick, so appropriate resin could be made by generally requiring repeated multiple times above-mentioned steps The PTFE varnished cloth of content causes plate local characteristics so its blanket surface hangs down there are different dipping times flows the current mark of formation Uniformity fluctuations are big, very unfavorable to the PTFE copper-clad plate for preparing excellent combination property.This production method high energy consumption and efficiency Low, PTFE copper-clad plate thermal expansion coefficient obtained is big, and dielectric loss is high, bad mechanical property, and exists in preparation process and largely have Noxious material causes serious harm to environment.
Chinese patent application, which discloses No. CN106494036A and proposes, a kind of directly to be pressed with PTFE film with glass cloth Method make PTFE copper-clad plate, but this method due to fluororesin does not flow substantially and can not filling glass cloth gap, Affect the performance and homogeneity of plate；In addition, affecting plate since glass cloth is easily deformed when operating overlapping Dimensional stability.
Summary of the invention
In view of the problems existing in the prior art and defect, it is an object of the invention to provide a kind of production sides of PTFE copper-clad plate Method, PTFE copper-clad plate comprehensive performance obtained meet requirement, and product size has good stability, and prevents in production process Poisonous and harmful substance.Present invention process process is simple, is easy to serialization large-scale production.
The technical solution adopted by the present invention is that: a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene, which is characterized in that the party Method has following steps:
Step (1): being that polytetrafluoroethylene (PTFE) powder, lubricant, ceramic powder and short glass fiber are put into V-arrangement mixing by starting components It is uniformly mixed in device；Then uniformly mixed powder is put and is cured at a certain temperature.
Step (2): it is molded in the powder filling mold cavity that step (1) is uniformly mixed and preform is made.
The preform that step (2) obtains: being obtained the raw substrate of predetermined thickness by step (3) by way of calendering, then Dry and remove lubricant.
Step (4): covering copper foil for the two sides of the raw substrate of step (3) after dry, be then sintered, cold after pressure maintaining But room temperature is arrived, Copper Clad Laminates Based On Polytetrafluoroethylene is obtained.
In the step (1) of the present invention, starting components are by weight ratio are as follows: 30 ~ 50 parts of polytetrafluoroethylene (PTFE) powder, profit 15 ~ 20 parts of lubrication prescription, 40 ~ 70 parts of ceramic powder, 1 ~ 10 part of short glass fiber.
In the step (1) of the present invention, uniformly mixed powder curing temperature is 35 ~ 50 DEG C, the time 4 ~ 8 hours.
In step (2) of the present invention, being molded obtained preform, wherein pressure is 5 ~ 35kgf/cm2, pressure maintaining 2 ~ 15min。
During step (4) of the present invention is sintered, set sintering temperature as 360 ~ 400 DEG C, pressure be 5 ~ 20Mpa, Vacuum degree be-(90 ~ 100) Kpa under conditions of, pressure maintaining 4 ~ 8 hours in hot press, then with the cooling of 1.5 ~ 2.5 DEG C/min The slow pressure maintaining of speed is cooled to room temperature.
In step (4) of the present invention, the two sides of raw substrate is covered into copper foil, layers of copper with a thickness of 10 ~ 50 μm.
Lubricant of the present invention is that solvent naphtha, petroleum ether, paraffin oil are one such.
Ceramic powder of the present invention using silica, aluminium oxide, aluminium nitride, magnesia, calcium carbonate, titanium dioxide its One of.
The partial size of ceramic powder of the present invention is 5 ~ 20 μm.
It is had the beneficial effect that caused by the present invention:
1, the present invention joined ceramic powders and glass fibers in the case where PTFE itself excellent electric property and physical property Tie up powder, it is possible to increase dielectric constant, intensity improve heat resistance, obtain lower dielectric loss, and make up PTFE thermal expansion coefficient Greatly, soft, the missing such as bad mechanical property greatly improves reliability, the stability of PTFE copper-clad plate.
2, the present invention improves the uniformity that PTFE is distributed in plate, reaches DK value ± 2 ~ 3% from mean level in the industry It is increased to ± 0.04%.
3, the present invention reasonably sets and controls heating rate, dwell pressure, pressure maintaining in the pressing process of copper-clad plate The parameters such as time are to obtain the guarantee of qualified PTFE copper-clad plate.Slow cooling pressure maintaining cooling is in order to which the size for improving product is steady The cohesive force of qualitative and resin and composite material.
4, the present invention does not use gluing impregnation method, without the malicious fluoride in PTFE copper-clad plate production process, nitrogen oxidation The harm to environment such as object meets requirement of the production process to process environments；It does not use gluing impregnation method also while avoiding Different dipping times are hung down surface defects of products caused by stream, meet the requirement of plate uniformity.
5, process of the present invention is simple, is conducive to industrialized continuous production.
Specific embodiment
The present invention is described in detail combined with specific embodiments below.
Embodiment 1:
Step (1): according to parts by weight, by 55 parts of PTFE powder, 20 parts of lubricant petroleum ether, the ceramic powder that partial size is 5 μm TiO244 parts of (titanium dioxide), 1 part of short glass fiber be put into V-arrangement blender be uniformly mixed；Uniformly mixed powder is placed on 8h is cured at a temperature of 35 DEG C, lubricant can be made to be fully absorbed by resin, is evenly distributed in entire resin system.
Step (2): preform is made by being molded in the uniform powder filling mold cavity of step (1) preparation；Setting pressure Power is 20kgf/cm2, pressure maintaining 5min.
Step (3): gained preform in step (2) is obtained into raw substrate, wherein calender pressure by way of calendering For 490N, roller linear velocity 0.5m/min, 990 μm of roller gap；Raw substrate is placed in oven and dried removing lubricant, baking oven temperature again Degree is 310 DEG C, time 6h.
Step (4): the two sides of the raw substrate of step (3) after dry is covered into copper foil, is sintered, obtained PTFE covers copper Plate.Wherein copper thickness is 38 μm, under conditions of sintering temperature is 380 DEG C, pressure 15Mpa, vacuum degree are -100Kpa, Then pressure maintaining 6 hours in hot press are cooled to room temperature with the slow pressure maintaining of the cooling rate of 2 DEG C/min, obtain polytetrafluoroethyl-ne Alkene copper-clad plate.
Through detecting, the PTFE copper-clad plate main performance index of preparation are as follows: at normal temperature, dielectric constant 6.25MHz；Removing is strong Spend 2.4kN/m；Water imbibition 0.01%；Copper foil is without alice, obscission.
Embodiment 2:
Step (1): according to parts by weight, by 55 parts of PTFE powder, 20 parts of lubricant petroleum ether, the ceramic powder that partial size is 15 μm SiO244 parts of (silica), 1 part of short glass fiber be put into V-arrangement blender be uniformly mixed；Uniformly mixed powder is placed on 6h is cured at a temperature of 40 DEG C, lubricant can be made to be fully absorbed by resin, is evenly distributed in entire resin system.
Step (2): preform is made by being molded in the uniform powder filling mold cavity of step (1) preparation；Setting pressure Power is 20kgf/cm2, pressure maintaining 5min.
Step (3): gained preform in step (2) is obtained into raw substrate, wherein calender pressure by way of calendering For 490N, roller linear velocity 0.5m/min, 990 μm of roller gap；
Raw substrate is placed in oven and dried removing lubricant again, oven temperature is 310 DEG C, time 6h.
Step (4): the two sides of the raw substrate after step 3 is dry covers copper foil, is sintered, and PTFE copper-clad plate is made. Wherein copper thickness is 38 μm, under conditions of sintering temperature is 380 DEG C, pressure 15Mpa, vacuum degree are -100Kpa, in hot pressing Then pressure maintaining 6 hours in machine are cooled to room temperature with the slow pressure maintaining of the cooling rate of 2 DEG C/min, obtain polytetrafluoroethylene (PTFE) and cover copper Plate.
Through detecting, the PTFE copper-clad plate main performance index of preparation are as follows: at normal temperature, dielectric constant 2.67MHz；Removing is strong Spend 2.2kN/m；Water imbibition 0.02%；Copper foil is without alice, obscission.
Embodiment 3:
Step (1): according to parts by weight, by 35 parts of PTFE powder, 20 parts of paraffin wax oil, the ceramic powder that partial size is 20 μm SiO260 parts of (silica), 5 parts of short glass fiber be put into V-arrangement blender be uniformly mixed；Uniformly mixed powder is placed on 5h is cured at a temperature of 45 DEG C, lubricant can be made to be fully absorbed by resin, is evenly distributed in entire resin system.
Step (2): preform is made by being molded in the uniform powder filling mold cavity of step (1) preparation；Setting pressure Power is 20kgf/cm2, pressure maintaining 5min.
Step (3): by preform obtained by step (2) by way of calendering, raw substrate is obtained, wherein calender pressure is 490N, roller linear velocity 0.5m/min, 990 μm of roller gap；
Raw substrate is placed in oven and dried removing lubricant again, oven temperature is 310 DEG C, time 6h.
Step (4): the two sides of the raw substrate after step (3) are dry covers copper foil, is sintered, obtained PTFE covers copper Plate.Wherein copper thickness is 18 μm, under conditions of sintering temperature is 380 DEG C, pressure 15Mpa, vacuum degree are -100Kpa, Then pressure maintaining 6 hours in hot press are cooled to room temperature with the slow pressure maintaining of the cooling rate of 2 DEG C/min, obtain polytetrafluoroethyl-ne Alkene copper-clad plate.
Through detecting, the PTFE copper-clad plate main performance index of preparation are as follows: at normal temperature, dielectric constant 3.02MHz；Removing is strong Spend 1.7kN/m；Water imbibition 0.01%；Copper foil is without alice, obscission.
Embodiment 4:
Step (1): according to parts by weight, by 50 parts of PTFE powder, 20 parts of paraffin wax oil, the ceramic powder that partial size is 15 μm TiO244 parts of (titanium dioxide), 6 parts of short glass fiber is put into V-arrangement blender and is uniformly mixed；Uniformly mixed powder is placed on 5h is cured at a temperature of 50 DEG C, lubricant can be made to be fully absorbed by resin, is evenly distributed in entire resin system.
Step (2): preform is made by being molded in the uniform powder filling mold cavity of step (1) preparation；Setting pressure Power is 20kgf/cm2, pressure maintaining 5min.
Step (3): by preform obtained by step (2) by way of calendering, raw substrate is obtained, wherein calender pressure is 490N, roller linear velocity 0.5m/min, 990 μm of roller gap；
Raw substrate is placed in oven and dried removing lubricant again, oven temperature is 310 DEG C, time 6h.
Step (4): the two sides of the raw substrate after step (3) are dry covers copper foil, is sintered, obtained PTFE covers copper Plate.Wherein copper thickness is 24 μm, under conditions of sintering temperature is 380 DEG C, pressure 15Mpa, vacuum degree are -100Kpa, Then pressure maintaining 6 hours in hot press are cooled to room temperature with the slow pressure maintaining of the cooling rate of 2 DEG C/min, obtain polytetrafluoroethyl-ne Alkene copper-clad plate.
Through detecting, the PTFE copper-clad plate main performance index of preparation are as follows: at normal temperature, dielectric constant 6.15MHz；Removing is strong Spend 1.9kN/m；Water imbibition 0.03%；Copper foil is without alice, obscission.
Compared with prior art, the present invention replaces tradition PTFE copper-clad plate using the preparation of PTFE dispersion liquid gluing dipping Mode has prevented the harm of toxic fluoride, nitrogen oxides etc., and filler dispersion effect is good, is uniformly mixed, product size stability It is good.By reasonably matching, there is different dielectric constants (2.6-8.6MHz) using PTFE copper-clad plate prepared by the present invention, be situated between Matter fissipation factor≤0.003, peel strength >=1.7kN/m, comprehensive performance meet requirement.Present invention process process is simple, Meet the requirement of industrialized mass production.

Claims (9)

1. a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene, which is characterized in that this method has following steps:
Step (1): being that polytetrafluoroethylene (PTFE) powder, lubricant, ceramic powder and short glass fiber are put into V-arrangement mixing by starting components It is uniformly mixed in device；Then uniformly mixed powder is put and is cured at a certain temperature；
Step (2): it is molded in the powder filling mold cavity that step (1) is uniformly mixed and preform is made；
Step (3): the preform that step (2) obtains is obtained to the raw substrate of predetermined thickness, re-dry by way of calendering Remove lubricant；
Step (4): the two sides of the raw substrate of step (3) after dry is covered into copper foil, is then sintered, is cooled to after pressure maintaining Room temperature obtains Copper Clad Laminates Based On Polytetrafluoroethylene.
2. a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene as described in claim 1, which is characterized in that the step (1) In, starting components are by weight ratio are as follows: 30 ~ 50 parts of polytetrafluoroethylene (PTFE) powder, 15 ~ 20 parts of lubricant, ceramic powder 40 ~ 70 Part, 1 ~ 10 part of short glass fiber.
3. a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene as described in claim 1, which is characterized in that the step (1) In, uniformly mixed powder curing temperature is 35 ~ 50 DEG C, the time 4 ~ 8 hours.
4. a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene as described in claim 1, which is characterized in that the step (2) In, being molded obtained preform, wherein pressure is 5 ~ 35kgf/cm2, 2 ~ 15min of pressure maintaining.
5. a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene as described in claim 1, which is characterized in that the step (4) It is 5 ~ 20Mpa setting sintering temperature as 360 ~ 400 DEG C, pressure in being sintered, vacuum degree is-condition of (90 ~ 100) Kpa Under, then pressure maintaining 4 ~ 8 hours in hot press are cooled to room temperature with the slow pressure maintaining of the cooling rate of 1.5 ~ 2.5 DEG C/min.
6. a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene as described in claim 1, which is characterized in that the step (4) In, the two sides of raw substrate is covered into copper foil, layers of copper with a thickness of 10 ~ 50 μm.
7. a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene as claimed in claim 2, which is characterized in that the lubricant It is one such for solvent naphtha, petroleum ether, paraffin oil.
8. a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene as claimed in claim 2, which is characterized in that the ceramic powder It is one such using silica, aluminium oxide, aluminium nitride, magnesia, calcium carbonate, titanium dioxide.
9. a kind of preparation method of Copper Clad Laminates Based On Polytetrafluoroethylene as claimed in claim 8, which is characterized in that the ceramic powder Partial size be 5 ~ 20 μm.
CN201910316897.1A 2019-04-19 2019-04-19 Preparation method of polytetrafluoroethylene copper-clad plate Expired - Fee Related CN110039851B (en)

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Cited By (17)

* Cited by examiner, † Cited by third party
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CN110358230A (en) * 2019-08-18 2019-10-22 赵伟芬 Anti abrasive PTFE based composites under a kind of dry friction
CN110602888A (en) * 2019-09-18 2019-12-20 中国电子科技集团公司第四十六研究所 Preparation method of aluminum-lined high-frequency substrate
CN110606698A (en) * 2019-11-01 2019-12-24 中国电子科技集团公司第四十六研究所 Microwave composite dielectric substrate with high uniformity and low thermal expansion coefficient and preparation process thereof
CN111040348A (en) * 2019-12-26 2020-04-21 江苏东材新材料有限责任公司 Preparation method of polytetrafluoroethylene composite membrane material with high filling amount and large width
CN111770639A (en) * 2020-07-09 2020-10-13 瑞声科技(新加坡)有限公司 Preparation method of composite medium copper-clad plate and printed circuit board
CN111844824A (en) * 2020-06-24 2020-10-30 腾辉电子（苏州）有限公司 Preparation method of PTFE composite material sheet, PTFE composite material sheet and copper-clad plate using PTFE composite material sheet
CN112157975A (en) * 2020-09-18 2021-01-01 江苏中际信通讯材料有限公司 Preparation method of copper-clad plate with ultralow water absorption
CN112175216A (en) * 2020-09-29 2021-01-05 江苏中际信通讯材料有限公司 Production method of copper-clad plate with adjustable dielectric constant
CN112351591A (en) * 2020-11-17 2021-02-09 中国电子科技集团公司第四十六研究所 Preparation method of polytetrafluoroethylene-based microwave composite dielectric material substrate with high peeling strength
CN112442243A (en) * 2020-11-17 2021-03-05 中国电子科技集团公司第四十六研究所 Preparation method of polytetrafluoroethylene-based ceramic composite green substrate
CN112492765A (en) * 2020-11-17 2021-03-12 中国电子科技集团公司第四十六研究所 Preparation method of novel composite medium substrate
CN113061311A (en) * 2021-04-21 2021-07-02 山东森荣新材料股份有限公司 PTFE modified membrane for high-frequency copper-clad plate
WO2022007069A1 (en) * 2020-07-09 2022-01-13 瑞声声学科技(深圳)有限公司 Method for preparing composite dielectric copper-clad laminate, and printed circuit board
CN114369266A (en) * 2022-01-12 2022-04-19 江西安缔诺科技有限公司 Composite material sheet for microwave circuit substrate, preparation method thereof and microwave circuit substrate
CN114851646A (en) * 2022-05-20 2022-08-05 江苏泰氟隆科技有限公司 Thin PTFE high-frequency copper-clad plate and manufacturing process thereof
CN115850888A (en) * 2022-12-22 2023-03-28 广东生益科技股份有限公司 Fluorine-containing resin-based composition and application thereof
CN116373415A (en) * 2023-06-05 2023-07-04 山东森荣新材料股份有限公司 Preparation method of PTFE ceramic filler composite high-frequency copper-clad plate

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CN104647868A (en) * 2015-02-10 2015-05-27 郴州功田电子陶瓷技术有限公司 Manufacturing method for polytetrafluoroethylene copper-clad plate
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Cited By (25)

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Publication number Priority date Publication date Assignee Title
CN110358230A (en) * 2019-08-18 2019-10-22 赵伟芬 Anti abrasive PTFE based composites under a kind of dry friction
CN110602888A (en) * 2019-09-18 2019-12-20 中国电子科技集团公司第四十六研究所 Preparation method of aluminum-lined high-frequency substrate
CN110606698A (en) * 2019-11-01 2019-12-24 中国电子科技集团公司第四十六研究所 Microwave composite dielectric substrate with high uniformity and low thermal expansion coefficient and preparation process thereof
CN110606698B (en) * 2019-11-01 2021-12-31 中国电子科技集团公司第四十六研究所 Microwave composite dielectric substrate with high uniformity and low thermal expansion coefficient and preparation process thereof
CN111040348B (en) * 2019-12-26 2021-10-26 江苏东材新材料有限责任公司 Preparation method of fluororesin composite membrane material with high filling amount and large width
CN111040348A (en) * 2019-12-26 2020-04-21 江苏东材新材料有限责任公司 Preparation method of polytetrafluoroethylene composite membrane material with high filling amount and large width
CN111844824A (en) * 2020-06-24 2020-10-30 腾辉电子（苏州）有限公司 Preparation method of PTFE composite material sheet, PTFE composite material sheet and copper-clad plate using PTFE composite material sheet
CN111770639A (en) * 2020-07-09 2020-10-13 瑞声科技(新加坡)有限公司 Preparation method of composite medium copper-clad plate and printed circuit board
CN111770639B (en) * 2020-07-09 2023-10-17 瑞声科技(新加坡)有限公司 Preparation method of composite medium copper-clad plate and printed circuit board
WO2022007069A1 (en) * 2020-07-09 2022-01-13 瑞声声学科技(深圳)有限公司 Method for preparing composite dielectric copper-clad laminate, and printed circuit board
CN112157975A (en) * 2020-09-18 2021-01-01 江苏中际信通讯材料有限公司 Preparation method of copper-clad plate with ultralow water absorption
CN112157975B (en) * 2020-09-18 2023-03-24 江苏中际信通讯材料有限公司 Preparation method of polytetrafluoroethylene layer for ultralow-water-absorption copper-clad plate
CN112175216B (en) * 2020-09-29 2022-09-13 江苏中际信通讯材料有限公司 Production method of copper-clad plate with adjustable dielectric constant
CN112175216A (en) * 2020-09-29 2021-01-05 江苏中际信通讯材料有限公司 Production method of copper-clad plate with adjustable dielectric constant
CN112351591A (en) * 2020-11-17 2021-02-09 中国电子科技集团公司第四十六研究所 Preparation method of polytetrafluoroethylene-based microwave composite dielectric material substrate with high peeling strength
CN112351591B (en) * 2020-11-17 2022-05-27 中国电子科技集团公司第四十六研究所 Preparation method of polytetrafluoroethylene-based microwave composite dielectric material substrate with high peeling strength
CN112492765B (en) * 2020-11-17 2022-08-16 中国电子科技集团公司第四十六研究所 Preparation method of microwave composite medium substrate
CN112442243A (en) * 2020-11-17 2021-03-05 中国电子科技集团公司第四十六研究所 Preparation method of polytetrafluoroethylene-based ceramic composite green substrate
CN112492765A (en) * 2020-11-17 2021-03-12 中国电子科技集团公司第四十六研究所 Preparation method of novel composite medium substrate
CN113061311A (en) * 2021-04-21 2021-07-02 山东森荣新材料股份有限公司 PTFE modified membrane for high-frequency copper-clad plate
CN114369266A (en) * 2022-01-12 2022-04-19 江西安缔诺科技有限公司 Composite material sheet for microwave circuit substrate, preparation method thereof and microwave circuit substrate
CN114851646A (en) * 2022-05-20 2022-08-05 江苏泰氟隆科技有限公司 Thin PTFE high-frequency copper-clad plate and manufacturing process thereof
CN115850888A (en) * 2022-12-22 2023-03-28 广东生益科技股份有限公司 Fluorine-containing resin-based composition and application thereof
CN116373415A (en) * 2023-06-05 2023-07-04 山东森荣新材料股份有限公司 Preparation method of PTFE ceramic filler composite high-frequency copper-clad plate
CN116373415B (en) * 2023-06-05 2023-07-28 山东森荣新材料股份有限公司 Preparation method of PTFE ceramic filler composite high-frequency copper-clad plate

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