CN103287016B - Copper-clad laminate and preparation method thereof - Google Patents
Copper-clad laminate and preparation method thereof Download PDFInfo
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- CN103287016B CN103287016B CN201210051755.5A CN201210051755A CN103287016B CN 103287016 B CN103287016 B CN 103287016B CN 201210051755 A CN201210051755 A CN 201210051755A CN 103287016 B CN103287016 B CN 103287016B
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Abstract
A kind of copper-clad laminate includes: a mixing cured layer, multi-disc prepreg hot pressing formed；Copper Foil, is attached on described mixing cured layer at least one side；The most mixing cured layer includes at least one first kind cured sheets and Equations of The Second Kind cured sheets, described first kind cured sheets and Equations of The Second Kind cured sheets all include that the resin content in glass fabric and resin component, and Equations of The Second Kind cured sheets is less than the resin content in first kind cured sheets.Being overlapped mutually pressing by first kind prepreg and Equations of The Second Kind prepreg pressure, wherein the resin content of first kind prepreg is more than the resin content of Equations of The Second Kind prepreg.When the resin content of the resin content with existing copper clad laminate that keep first kind prepreg is suitable, first kind prepreg is used to be laminated with Copper Foil, therefore do not affecting between Copper Foil and laminate in the case of adhesion, be effectively increased the dielectric constant of whole copper-clad laminate.
Description
Technical field
The present invention relates to copper-clad laminate field, more particularly, it relates to a kind of high Copper Foil adhesive force and height
Copper-clad laminate of dielectric constant and preparation method thereof.
Background technology
Copper-clad laminate uses in a large number in PCB field, and its environmental work frequency is come relatively
Say it is low-frequency range.But in RF application, especially in Super-material antenna application, copper-clad laminate
Gradually it is widely used in wherein, owing to antenna is in high band (the most existing pcb board field) work
Making in environment, therefore copper-clad laminate relevant parameter is very big to the performance impact of Super-material antenna, as it is situated between
Electric constant about, the relevant parameter such as dielectric loss value.In addition to Super-material antenna field, in Meta Materials field,
Copper-clad laminate is also by substantial amounts of application, the such as one procedure in functional Meta Materials processing technique
It is exactly: need copper-clad laminate is being etched with large-scale metal micro structure.
Super-material antenna based on copper-clad laminate etching, is applied to the medium of functional Meta Materials
Substrate, is all based on existing laminate industry to improve copper-clad laminate, in order to minimum industrialization cost
Applied in Super-material antenna and Meta Materials field.From the point of view of existing layer pressing plate selection, laminate is main
Composition is usually and is made up of glass fabric and resin two parts.Wherein the dielectric constant of glass fabric is about
6.5, dielectric loss is about 0.002；The dielectric constant of resin is generally 3-4, and dielectric loss is typically at 0.015-0.04.
If making the substrate of high dielectric constant and low dielectric loss, it is possible to by making the prepreg of low resin content
Realize.But the prepreg that resin content is the lowest, the laminate after pressing is the poorest with the adhesive force of Copper Foil.
Copper Foil adhesive force size directly influences whether adding of Super-material antenna etch process or Meta Materials metal micro structure
Work operation, and then in a large amount of production processes, cause whole product yield severe exacerbation.
Summary of the invention
The technical problem to be solved in the present invention is, improve produce copper-clad laminate Copper Foil and laminate it
Between adhesive force.Therefore, the present invention provides a kind of high Copper Foil adhesive force and the copper-clad laminate of high-k.
Meanwhile, the present invention also provides for the preparation method of a kind of high Copper Foil adhesive force copper-clad laminate.
A kind of copper-clad laminate includes:
One mixing cured layer, is formed by multi-disc prepreg hot pressing；
Copper Foil, is attached on described mixing cured layer at least one side；The most mixing cured layer includes at least one
First kind cured sheets and Equations of The Second Kind cured sheets, described first kind cured sheets and Equations of The Second Kind cured sheets all include glass
Resin content in fiber cloth and resin component, and Equations of The Second Kind cured sheets is less than the resin in first kind cured sheets
Content.
Further, described at least two panels Equations of The Second Kind cured sheets is laminated and forms one, first kind cured sheets
It is respectively arranged at the Equations of The Second Kind cured sheets both sides of one pressing.
Further, described Equations of The Second Kind cured sheets and first kind cured sheets have identical thickness.
Further, described Equations of The Second Kind cured sheets is identical or differs.
Further, described first kind cured sheets thickness is identical or differs.
Further, the Equations of The Second Kind cured sheets in described mixing cured layer and the mutual lamination of first kind cured sheets mix
Combined pressure is closed and is formed one, and wherein mixing pressing is formed and is first kind cured sheets outside one.
Further, described mixing cured layer includes that Equations of The Second Kind cured sheets is different with the thickness of first kind cured sheets.
Further, described mixing cured layer includes that the thickness of first kind cured sheets differs.
A kind of manufacture method of copper-clad laminate, including step as described below:
First kind prepreg is provided；
At the two sides pressing the most a piece of Equations of The Second Kind prepreg that first kind prepreg is relative；
Two sides pressing at least one copper foil by first kind prepreg Yu Equations of The Second Kind prepreg pressing body.
A kind of manufacture method of copper-clad laminate, including step as described below:
At least two panels first kind prepreg is provided；
Described at least two panels first kind prepreg is pressed into first kind laminate；
In the relative two sides of described first kind laminate respectively pressing the most a piece of Equations of The Second Kind prepreg the
The two sides pressing the most a piece of Equations of The Second Kind prepreg that one class laminate is relative；
Two sides pressing at least one copper foil by first kind prepreg Yu Equations of The Second Kind prepreg pressing body.
Hinge structure, by above-mentioned copper-clad laminate structure and preparation method thereof, by the first kind half
Cured sheets and Equations of The Second Kind prepreg pressure are overlapped mutually pressing, and wherein the resin content of first kind prepreg is big
Resin content in Equations of The Second Kind prepreg.The prepreg that resin content is the lowest, the laminate after pressing with
The adhesive force of Copper Foil is the poorest.Tree at the resin content with existing copper clad laminate keeping first kind prepreg
When fat content is suitable, uses first kind prepreg to be laminated with Copper Foil, therefore do not affecting Copper Foil and layer
Between pressing plate in the case of adhesion, it is effectively increased the dielectric constant of whole copper-clad laminate.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is the generalized section of copper-clad laminate of the present invention；
Fig. 2 is doublesided copperclad laminate one embodiment generalized section shown in Fig. 1；
Fig. 3 is another embodiment generalized section of doublesided copperclad laminate shown in Fig. 1；
Fig. 4 is doublesided copperclad laminate the 3rd embodiment generalized section shown in Fig. 1；
Fig. 5 is the generalized section of doublesided copperclad laminate Equations of The Second Kind embodiment of the present invention；
Fig. 6 is the generalized section of singlesided copperclad laminate Equations of The Second Kind embodiment of the present invention；
Fig. 7 is doublesided copperclad laminate one specific embodiment generalized section shown in Fig. 5；
Fig. 8 is another specific embodiment generalized section of singlesided copperclad laminate shown in Fig. 5；
Fig. 9 is the flow chart of a kind of manufacture method of copper-clad laminate of the present invention；
Figure 10 is the flow chart of copper-clad laminate another kind manufacture method of the present invention.
Detailed description of the invention
Now referring in detail to the embodiment described in accompanying drawing.In order to understand the present invention comprehensively, retouching in detailed below
Numerous detail is refer in stating.It will be appreciated by those skilled in the art that the present invention can be without this
A little details and realize.In other embodiments, it is not described in detail known method.Process, assembly
And circuit, in order to avoid embodiment is unnecessarily made to obscure.
Refer to Fig. 1, the generalized section of copper-clad laminate of the present invention.Copper-clad laminate 13 includes copper
Paper tinsel 20 and the mixing cured layer 2 by multi-disc prepreg hot pressing.The two sides that described mixing cured layer is relative
On be attached with Copper Foil 20.Described mixing cured layer 2 includes at least one first kind cured sheets 21 and Equations of The Second Kind solidification
Sheet 22.Described first kind cured sheets 21 and Equations of The Second Kind cured sheets 22 all include glass fabric and resin component,
Glass fabric in described first kind cured sheets 21 and Equations of The Second Kind cured sheets 22 and resin content component ratio
Differ.Because the cured sheets that resin content is the lowest, the mixing cured layer 2 after pressing and the attachment of Copper Foil 20
Power is the poorest.Therefore the resin component content in Equations of The Second Kind cured sheets 22 is less than the tree in first kind cured sheets 21
Fat component content.The first kind cured sheets 21 that resin content is high is the most just made to be laminated it with Copper Foil 20
After, there is bigger adhesive force between described Copper Foil 20 and mixing cured layer 2.Comparatively speaking, Equations of The Second Kind solidification
Sheet 22 glass fabric content is high, and its dielectric constant is high, thus improves the dielectric of a whole copper-clad laminate
Constant.The resin content of cured sheets the most of the present invention is at 35%-50%.Described mixing cured layer 2 includes multi-disc
Equations of The Second Kind cured sheets 22 is laminated formation, and described mixing cured layer 2 includes two panels first kind cured sheets 21
And it is placed in mixing cured layer 2 both sides.
In first kind embodiment of the present invention, refer to Fig. 2, cut open for copper-clad laminate one embodiment of the present invention
Face schematic diagram.Mixing cured layer 2 includes that two panels Equations of The Second Kind cured sheets 22 is laminated and forms one, two first
Class cured sheets 21 is respectively arranged at Equations of The Second Kind cured sheets 22 both sides of one pressing.In other embodiments,
Described mixing cured layer 2 include being laminated shape all-in-one-piece Equations of The Second Kind cured sheets 22 quantity be arbitrary (as
Equations of The Second Kind cured sheets 22 quantity shown in Fig. 3 is 3).
In first kind embodiment the 3rd embodiment, refer to Fig. 4, for copper-clad laminate of the present invention another
Embodiment generalized section.The most different from the embodiment described above it is: the Equations of The Second Kind in mixing cured layer 2
Cured sheets 22 and the mutual lamination mixing pressing of first kind cured sheets 21 form one.Mixing cured layer 2 both sides
First kind cured sheets 21 is the most still set, in order to have stronger between described Copper Foil 20 and mixing cured layer 2
Adhesive force.
It is understood that for the ease of production equipment based on single gauge thickness laminate and production technology,
Described Equations of The Second Kind cured sheets 22 and first kind cured sheets 21 have identical thickness.Above-mentioned introduction is all double
Face copper-clad laminate, under some application scenarios, singlesided copperclad laminate and be widely applied, therefore
Singlesided copperclad laminate structure is identical with doublesided copperclad laminate structural principle, therefore single sided copper clad layer
Pressing plate also belongs to the scope that application claims is advocated.
Seeing also Fig. 5 and Fig. 6, the doublesided copperclad laminate for Equations of The Second Kind embodiment one embodiment cuts open
Face schematic diagram and singlesided copperclad laminate generalized section.Different from above-mentioned Equations of The Second Kind embodiment it is: mixed
Close cured layer 2 and include that the thickness of Equations of The Second Kind cured sheets 22 and first kind cured sheets 21 is permissible along with application demand
It it is any thickness size.Wherein first kind cured sheets 21 differs with Equations of The Second Kind cured sheets 22.
See also Fig. 7 and Fig. 8, for the doublesided copperclad laminate of Equations of The Second Kind another embodiment of embodiment
Generalized section and singlesided copperclad laminate generalized section.Different from the embodiment shown in Fig. 5 and Fig. 6
It is: close cured layer 2 and include that the thickness of first kind cured sheets 21 differs.
Refer to Fig. 9, the flow chart of a kind of manufacture method of invention copper-clad laminate.Cover in manufacturing the present invention
The step of copper-clad laminate is as follows:
S31: first kind prepreg is provided.Described first kind prepreg includes that glass fabric becomes with resin
Part, wherein resin content is at 35%-45%.
S33: at the two sides pressing the most a piece of Equations of The Second Kind prepreg that first kind prepreg is relative.Described
Equations of The Second Kind prepreg includes glass fabric and resin component, and wherein resin content is at 40%-50%.At tool
Body implements Formulation Ingredients, and Equations of The Second Kind prepreg resin content is higher than the resin content of first kind prepreg,
After the first kind cured sheets that resin content is high is laminated with Copper Foil, described Copper Foil and mixing cured layer
Between have bigger adhesive force.
S35: by a two sides pressing at least Copper Foil of first kind prepreg Yu Equations of The Second Kind prepreg pressing body
Sheet.Above-mentioned process for pressing is all carried out in prepreg state.
Refer to Figure 10, the flow chart of invention copper-clad laminate another kind manufacture method.Manufacturing the present invention
The step of middle copper-clad laminate is as follows:
S51: at least two panels first kind prepreg is provided.Described first kind prepreg includes glass fabric
And resin component, wherein resin content is at 35%-45%.
S53: described at least two panels first kind prepreg is pressed into first kind laminate.
S55: at the two sides pressing the most a piece of Equations of The Second Kind prepreg respectively that described first kind laminate is relative
At the two sides pressing the most a piece of Equations of The Second Kind prepreg that first kind laminate is relative.Described Equations of The Second Kind half is solid
Changing sheet and include glass fabric and resin component, wherein resin content is at 40%-50%.It is being embodied as formula
Composition, Equations of The Second Kind prepreg resin content is higher than the resin content of first kind prepreg so that resin contains
Measure after high first kind cured sheets and Copper Foil be laminated, have bigger between described Copper Foil and mixing cured layer
Adhesive force.
S57: by a two sides pressing at least Copper Foil of first kind prepreg Yu Equations of The Second Kind prepreg pressing body
Sheet.In concrete process for pressing, if by the both sides of first kind prepreg Yu Equations of The Second Kind prepreg pressing body
Face pressing one copper foil respectively, then form doublesided copperclad laminate.In like manner, if simply by solid for the first kind half
Change side pressing one copper foil respectively of sheet and Equations of The Second Kind prepreg pressing body, then form one side and cover copper
Foil laminate.
By above-mentioned copper-clad laminate structure and preparation method thereof, by first kind prepreg and Equations of The Second Kind
Prepreg pressure is overlapped mutually pressing, and wherein the resin content of first kind prepreg is more than Equations of The Second Kind semi-solid preparation
The resin content of sheet.The adhesive force of the prepreg that resin content is the lowest, the laminate after pressing and Copper Foil is more
Difference.When the resin content of the resin content with existing copper clad laminate that keep first kind prepreg is suitable,
Use first kind prepreg to be laminated with Copper Foil, therefore do not affect adhesion between Copper Foil and laminate
In the case of, it is effectively increased the dielectric constant of whole copper-clad laminate.
Above in conjunction with accompanying drawing, embodiments of the invention are described, but the invention is not limited in above-mentioned
Detailed description of the invention, above-mentioned detailed description of the invention is only schematic rather than restrictive, this
The those of ordinary skill in field, under the enlightenment of the present invention, is being protected without departing from present inventive concept and claim
Under the ambit protected, it may also be made that a lot of form, within these belong to the protection of the present invention.
Claims (10)
1. a copper-clad laminate, it is characterised in that including:
One mixing cured layer, is formed by multi-disc prepreg hot pressing；
Copper Foil, is attached on described mixing cured layer at least one side；The most mixing cured layer includes at least one
First kind cured sheets and Equations of The Second Kind cured sheets, described first kind cured sheets and Equations of The Second Kind cured sheets all include glass
Fiber cloth and resin component, described in described first kind cured sheets, described Equations of The Second Kind cured sheets, resin content exists
Resin content in 35-50%, and Equations of The Second Kind cured sheets is less than the resin content in first kind cured sheets.
Copper-clad laminate the most according to claim 1, it is characterised in that described at least two panels second
Class cured sheets is laminated and forms one, and first kind cured sheets is respectively arranged at the Equations of The Second Kind solidification of one pressing
Sheet both sides.
Copper-clad laminate the most according to claim 2, it is characterised in that described Equations of The Second Kind cured sheets
With first kind cured sheets, there is identical thickness.
Copper-clad laminate the most according to claim 2, it is characterised in that described Equations of The Second Kind cured sheets
Thickness is identical or differs.
Copper-clad laminate the most according to claim 2, it is characterised in that described first kind cured sheets
Thickness is identical or differs.
Copper-clad laminate the most according to claim 1, it is characterised in that in described mixing cured layer
Equations of The Second Kind cured sheets and the mutual lamination mixing pressing of first kind cured sheets formed one, wherein mixing pressing shape
Integral outside is first kind cured sheets.
Copper-clad laminate the most according to claim 1, it is characterised in that in described mixing cured layer,
Described Equations of The Second Kind cured sheets is different with the thickness of described first kind cured sheets.
8. according to the copper-clad laminate described in claim 2 or 7, it is characterised in that described mixing cured
In Ceng, the thickness of described first kind cured sheets differs.
9. the manufacture method of a copper-clad laminate, it is characterised in that include step as described below:
Thering is provided first kind prepreg, in described first kind prepreg, resin content is at 35-45%；
At the two sides pressing the most a piece of Equations of The Second Kind prepreg that first kind prepreg is relative, described second
In class prepreg, resin content is at 40-50%；
Two sides pressing at least one copper foil by first kind prepreg Yu Equations of The Second Kind prepreg pressing body.
10. the manufacture method of a copper-clad laminate, it is characterised in that include step as described below:
Thering is provided at least two panels first kind prepreg, in described first kind prepreg, resin content exists
35-45%；
Described at least two panels first kind prepreg is pressed into first kind laminate；
In two sides pressing the most a piece of Equations of The Second Kind prepreg, institute respectively that described first kind laminate is relative
State in Equations of The Second Kind prepreg resin content at 40-50%；
Two sides pressing at least one copper foil by first kind prepreg Yu Equations of The Second Kind prepreg pressing body.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201210051755.5A CN103287016B (en) | 2012-03-01 | 2012-03-01 | Copper-clad laminate and preparation method thereof |
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| CN201210051755.5A CN103287016B (en) | 2012-03-01 | 2012-03-01 | Copper-clad laminate and preparation method thereof |
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| CN103287016B true CN103287016B (en) | 2016-10-26 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106494034B (en) * | 2016-10-26 | 2018-10-19 | 江门市龙兴电子材料有限公司 | A kind of method and copper-clad plate producing copper-clad plate using unqualified prepreg |
| CN106494033B (en) * | 2016-10-26 | 2018-10-19 | 江门市龙兴电子材料有限公司 | A kind of reuse method sampling material, cutting edge material and unqualified prepreg and the copper-clad plate using this method manufacture |
| CN106658956B (en) * | 2017-02-14 | 2023-03-31 | 江苏普诺威电子股份有限公司 | Waterproof and breathable sound hole structure and processing technology thereof |
| CN109548279A (en) * | 2018-12-29 | 2019-03-29 | 广州兴森快捷电路科技有限公司 | Prepreg lamination design method |
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| CN1272424A (en) * | 1999-04-29 | 2000-11-08 | 北京化工大学 | Composite base laminated board covered with copper foil and its production method |
| CN101456276A (en) * | 2009-01-08 | 2009-06-17 | 浙江华正电子集团有限公司 | Method for manufacturing copper clad laminated board adapted to leadless process |
| CN101665017A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Prepreg having nonsymmetrical resin layer thickness and application thereof |
| CN101746102A (en) * | 2008-12-18 | 2010-06-23 | 建滔化工集团有限公司 | Compound base copper-clad laminate and manufacturing method thereof |
| CN102149253A (en) * | 2010-12-29 | 2011-08-10 | 东莞生益电子有限公司 | Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step |
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2012
- 2012-03-01 CN CN201210051755.5A patent/CN103287016B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1272424A (en) * | 1999-04-29 | 2000-11-08 | 北京化工大学 | Composite base laminated board covered with copper foil and its production method |
| CN101746102A (en) * | 2008-12-18 | 2010-06-23 | 建滔化工集团有限公司 | Compound base copper-clad laminate and manufacturing method thereof |
| CN101456276A (en) * | 2009-01-08 | 2009-06-17 | 浙江华正电子集团有限公司 | Method for manufacturing copper clad laminated board adapted to leadless process |
| CN101665017A (en) * | 2009-09-15 | 2010-03-10 | 广东生益科技股份有限公司 | Prepreg having nonsymmetrical resin layer thickness and application thereof |
| CN102149253A (en) * | 2010-12-29 | 2011-08-10 | 东莞生益电子有限公司 | Method for making PCB (Printed Circuit Board) by laminating high-frequency materials and common FR4 materials in one step |
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| CN103287016A (en) | 2013-09-11 |
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