CN205793612U - TD antenna plate is with high PIM value microwave base plate - Google Patents
TD antenna plate is with high PIM value microwave base plate Download PDFInfo
- Publication number
- CN205793612U CN205793612U CN201620500076.5U CN201620500076U CN205793612U CN 205793612 U CN205793612 U CN 205793612U CN 201620500076 U CN201620500076 U CN 201620500076U CN 205793612 U CN205793612 U CN 205793612U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- base plate
- layer
- microwave base
- fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of high PIM value microwave base plate of TD antenna plate, including: PTFE thin film;Two-layer glass-fiber-fabric, two-layer glass-fiber-fabric is separately fixed on the two sides of described PTFE thin film;And two-layer reversion Copper Foil, two-layer reversion Copper Foil is fixed on glass-fiber-fabric described in two-layer back on the side of described PTFE thin film by sticking film respectively, and the roughness of described reversion Copper Foil is 2~3um.Reversion Copper Foil, with high PIM value microwave base plate, is reduced to 2~3um by the TD antenna plate that this utility model provides, and is greatly improved the circuit in PCB substrate production process is made precision, thus ensures product height PIM value required precision after reduction;And, in order to ensure to reduce the bad problem of microwave base plate adhesive force that reversion Copper Foil roughness is brought, this microwave base plate uses composite/laminate structure, it is ensured that product adhesive force, meets customer need.
Description
Technical field
This utility model relates to the parts of circuit board, particularly relates to a kind of high PIM value of TD antenna plate
Microwave base plate.
Background technology
PIM (passive intermodulation) embodies the characteristic of whole base station, is the important of antenna for base station
One of parameter.The selection of most of wireless transmit and reception frequency range is the most careful, it is to avoid maximum intermodulation product
Fall into reception frequency range, and avoid the higher-order inter-modulation products of self to fall into some communications bands.Feelings but more
Condition is, the base station (or competitor of co-sited) of neighbouring competitor produces intermodulation product more can become thorny doing
Disturb source.So, PIM index is also the important indicator of antenna for base station client, and the height of PIM value directly affects
The quality of production of high-frequency apparatus.
Summary of the invention
For above-mentioned prior art present situation, technical problem to be solved in the utility model is, it is provided that a kind of
The TD antenna plate of high-precision PIM value is with high PIM value microwave base plate.
In order to solve above-mentioned technical problem, a kind of TD antenna plate provided by the utility model is by high PIM value
Microwave base plate, including:
PTFE thin film;
Two-layer glass-fiber-fabric, two-layer glass-fiber-fabric is separately fixed on the two sides of described PTFE thin film;And
Two-layer reversion Copper Foil, two-layer reversion Copper Foil is fixed on glass-fiber-fabric described in two-layer by sticking film respectively and carries on the back
On side to described PTFE thin film, the roughness of described reversion Copper Foil is 2~3um.
Wherein in an embodiment, described sticking film is PFA film.
Wherein in an embodiment, the thickness of described sticking film is 0.02~0.04mm.
Wherein in an embodiment, described reversion Copper Foil, described sticking film, described PTFE thin film and institute
Stating glass-fiber-fabric uses heat pressing process to stack together.
Compared with prior art, the TD antenna plate that this utility model provides, with high PIM value microwave base plate, is incited somebody to action
Reversion Copper Foil is reduced to 2~3um, the circuit in PCB substrate production process will be made precision after reduction
It is greatly improved, thus ensures product height PIM value required precision;And, thick in order to ensure reduction reversion Copper Foil
The bad problem of microwave base plate adhesive force that degree of making brings, this microwave base plate uses composite/laminate structure, it is ensured that produce
Product adhesive force.
This utility model additional technical feature is had the advantage that in this specification detailed description of the invention portion
Divide and illustrate.
Accompanying drawing explanation
Fig. 1 is the structural representation of the high PIM value microwave base plate of the TD antenna plate in this utility model embodiment
Figure.
Description of reference numerals: 1, reversion Copper Foil;2, sticking film;3, glass-fiber-fabric;4, PTFE thin film.
Detailed description of the invention
Below with reference to the accompanying drawings and in conjunction with the embodiments to this utility model it is described in detail.It should be noted that
In the case of not conflicting, the feature in following embodiment and embodiment can be mutually combined.
Seeing Fig. 1, the TD antenna plate in one of them embodiment of this utility model is with high PIM value microwave base plate
Including two-layer reversion Copper Foil 1, two-layer sticking film 2, two-layer glass-fiber-fabric 3 and PTFE thin film 4, wherein,
Two-layer glass-fiber-fabric 3 is separately fixed on the two sides of described PTFE thin film 4.Glass-fiber-fabric 3 and PTFE thin film
4 is dielectric material, and dielectric properties and the high and low temperature resistance of PTFE thin film 4 are excellent.
Two-layer reversion Copper Foil 1 is fixed on glass-fiber-fabric 3 described in two-layer back to described by sticking film 2 respectively
On the side of PTFE thin film 4, the roughness of described reversion Copper Foil 1 is 2~3um, it is preferable that reversion copper
The roughness of paper tinsel 1 is 2.5um.TD antenna plate in the present embodiment, with high PIM value microwave base plate, will invert
Copper Foil is reduced to 2~3um, the circuit in PCB substrate production process will be made precision significantly after reduction
Improve, thus ensure product height PIM value required precision.
Preferably, described sticking film 2 is PFA film, and PFA film is a small amount of perfluoro propyl perfluoroalkyl vinyl ether
With the copolymer of politef, its bond vitrified strengthens, and performance, electric property and politef
Compare unchanged.It is further preferred that the thickness of described sticking film 2 is 0.02~0.04mm.PFA is thin
The thickness of film selects to obtain through inventor's test of many times checking, takes into account cost-effective and ensures that surface Copper Foil is attached
Put forth effort 2 demands, on the premise of the PFA usage amount reduced, meet the attachment of client's physical property reliability table copper
Power >=0.71n/mm requirement, final products adhesive force can reach 1.2n/mm and fully meet customer requirement.
Preferably, described reversion Copper Foil 1, described sticking film 2, described PTFE thin film 4 and described glass
Cloth 3 uses heat pressing process to stack together, and can improve adhesive force.
To sum up, the TD antenna plate of this utility model embodiment, with high PIM value microwave base plate, can meet visitor
Family high-precision PIM value demand, and, that brings after solving reversion Copper Foil roughness reduction by combination process is attached
Put forth effort bad problem.
Embodiment described above only have expressed several embodiments of the present utility model, its describe more concrete and
In detail, but therefore can not be interpreted as the restriction to this utility model the scope of the claims.It should be pointed out that,
For the person of ordinary skill of the art, without departing from the concept of the premise utility, it is also possible to
Making some deformation and improvement, these broadly fall into protection domain of the present utility model.
Claims (4)
1. a TD antenna plate is with high PIM value microwave base plate, it is characterised in that including:
PTFE thin film (4);
Two-layer glass-fiber-fabric (3), two-layer glass-fiber-fabric (3) is separately fixed at the both sides of described PTFE thin film (4)
On face;And
Two-layer reversion Copper Foil (1), two-layer reversion Copper Foil (1) is fixed on two by sticking film (2) respectively
The described glass-fiber-fabric of layer (3) back on the side of described PTFE thin film (4), described reversion Copper Foil (1)
Roughness is 2~3um.
TD antenna plate the most according to claim 1 is with high PIM value microwave base plate, it is characterised in that
Described sticking film (2) is PFA film.
TD antenna plate the most according to claim 2 is with high PIM value microwave base plate, it is characterised in that
The thickness of described sticking film (2) is 0.02~0.04mm.
TD antenna plate the most as claimed in any of claims 1 to 3 with high PIM value microwave base plate,
It is characterized in that, described reversion Copper Foil (1), described sticking film (2), described PTFE thin film (4) and
Described glass-fiber-fabric (3) uses heat pressing process to stack together.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620500076.5U CN205793612U (en) | 2016-05-26 | 2016-05-26 | TD antenna plate is with high PIM value microwave base plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620500076.5U CN205793612U (en) | 2016-05-26 | 2016-05-26 | TD antenna plate is with high PIM value microwave base plate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205793612U true CN205793612U (en) | 2016-12-07 |
Family
ID=57408495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620500076.5U Expired - Fee Related CN205793612U (en) | 2016-05-26 | 2016-05-26 | TD antenna plate is with high PIM value microwave base plate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205793612U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108322994A (en) * | 2018-01-18 | 2018-07-24 | 郑州云海信息技术有限公司 | A method of reducing HW High Way loss |
-
2016
- 2016-05-26 CN CN201620500076.5U patent/CN205793612U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108322994A (en) * | 2018-01-18 | 2018-07-24 | 郑州云海信息技术有限公司 | A method of reducing HW High Way loss |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108454192B (en) | Double-sided copper foil substrate for PI type high-frequency high-speed transmission and preparation method thereof | |
JP5611355B2 (en) | Metal-clad laminate | |
TWI765306B (en) | Flexible printed circuits having high electromagnetic shielding property and preparing methods thereof | |
JP2010153542A (en) | Electromagnetic wave suppression sheet and method of manufacturing the same | |
CN102774079A (en) | Flexible copper clad plate and method for producing same | |
CN205793612U (en) | TD antenna plate is with high PIM value microwave base plate | |
CN109152218A (en) | The low gummosis filler technique of a kind of thickness copper PCB and using PCB made of the technique | |
CN108859326B (en) | Copper-clad method of PTFE (polytetrafluoroethylene) -based PCB (printed Circuit Board) copper-clad plate | |
KR101627090B1 (en) | Method for manufacturing pcb using composite materials for antenna | |
CN101677486A (en) | Printed circuit board and manufacturing method thereof | |
CN101934611A (en) | Plane resistor copper foil laminated sheet covered with polytetrafluoroethylene glass cloth | |
JP2005001274A (en) | Fluoroplastic copper-clad laminate and manufacturing method thereof | |
CN201700081U (en) | Polytetrafluoroethylene glass fibre basal plate | |
CN102427666A (en) | Manufacturing method of high frequency microwave circuit board base material | |
CN103379748B (en) | High-frequency mixed-compression board and preparation method thereof | |
CN208657159U (en) | Combined type high frequency substrate with high Dk and low Df characteristic | |
CN201700082U (en) | Polytetrafluoroethylene glass fiber ceramic base plate | |
CN108440878B (en) | Composite microwave dielectric material and preparation method and application thereof | |
CN204761833U (en) | Multilayer circuit board is thoughtlessly pressed to fine cloth of composite ceramic glass and fine cloth of epoxy glass | |
CN205830144U (en) | Circuit board cooling structure | |
CN205800352U (en) | The composite fin of electrographite/copper | |
JP4628991B2 (en) | Distributed constant filter device | |
CN202242178U (en) | Plane resistor copper foil plywood coated with polytetrafluoroethylene glass cloth | |
CN218399750U (en) | Aramid paper and glass fiber cloth composite copper-clad plate | |
KR20180093780A (en) | Manufacturing method of wireless antenna using hole making process skill of polymer layer sheet and wireless antenna circuit board, wireless antenna module manufactured thereby, electric-electronic device having wireless antenna module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20161207 |
|
CF01 | Termination of patent right due to non-payment of annual fee |