CN202818760U - Polytetrafluoroethylene fiberglass cloth and epoxy resin fiberglass cloth mixedly-compressed multilayer circuit board - Google Patents
Polytetrafluoroethylene fiberglass cloth and epoxy resin fiberglass cloth mixedly-compressed multilayer circuit board Download PDFInfo
- Publication number
- CN202818760U CN202818760U CN 201220549927 CN201220549927U CN202818760U CN 202818760 U CN202818760 U CN 202818760U CN 201220549927 CN201220549927 CN 201220549927 CN 201220549927 U CN201220549927 U CN 201220549927U CN 202818760 U CN202818760 U CN 202818760U
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- epoxy resin
- fiberglass cloth
- circuit board
- cloth
- fiber
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Abstract
The utility model designs a polytetrafluoroethylene fiberglass cloth and epoxy resin fiberglass cloth mixedly-compressed multilayer circuit board, which mainly comprises a circuit board, and is characterized in that the circuit board is a stitching structure formed by arranging multiple layers of the polytetrafluoroethylene fiberglass cloth and the epoxy resin fiberglass cloth at intervals. The structure is characterized in that the polytetrafluoroethylene fiberglass cloth and the ordinary epoxy resin fiberglass cloth are compressed in a mixed manner, and the difficulty and cost of production process are reduced.
Description
Technical field
The utility model relates to a kind of wiring board, particularly a kind of polytetrafluoroethylfiberglass fiberglass-cloth and epoxy resin glass-fiber-fabric mixed pressure multilayer circuit board.
Background technology
The polytetrafluoroethylfiberglass fiberglass-cloth wiring board has excellent high-frequency dielectric performance, resistance to elevated temperatures and excellent radiation resistance and is widely used in Aeronautics and Astronautics, satellite communication, navigation, radar, the fields such as electronic countermeasures, 3G communication.There is not other material can replace its position in the high frequency field.But polytetrafluoroethylene is known as King, and physical property is special, and the restriction of technology, reliability, equipment, cost aspect is arranged when making multilayer circuit board with it, has hindered production and the application of polytetrafluoroethylmulti multi-layer wiring board.
The utility model content
The purpose of this utility model is to provide a kind of cost low for the deficiency that solves above-mentioned technology, low-and high-frequency superior performance, dependable performance, polytetrafluoroethylfiberglass fiberglass-cloth convenient for production and epoxy resin glass-fiber-fabric mixed pressure multilayer circuit board.
In order to achieve the above object, the polytetrafluoroethylfiberglass fiberglass-cloth that the utility model is designed and epoxy resin glass-fiber-fabric mixed pressure multilayer circuit board, it mainly is made of wiring board, it is characterized in that the pressing structure that wiring board is comprised of polytetrafluoroethylfiberglass fiberglass-cloth layer and epoxy resin glass-fiber-fabric layer multi-layer interval.The characteristics of this structure are with polytetrafluoroethylfiberglass fiberglass-cloth and common epoxy resin glass-fiber-fabric mixed pressure, reduce difficulty and the cost of production technology.
In order further to reduce production costs, the prepreg bed of material by the epoxy resin glass-fiber-fabric between described polytetrafluoroethylfiberglass fiberglass-cloth and the epoxy resin glass-fiber-fabric coheres.
Reliability for the performance that improves wiring board, element is installed jack on the described wiring board, described element is installed the jack hole wall and is provided with the coat of metal, by after the plasma activation processing, then form the hole wall coat of metal through electroless copper plating and electric plating method between the described hole wall coat of metal and the polytetrafluoroethylfiberglass fiberglass-cloth layer.
The resulting polytetrafluoroethylfiberglass fiberglass-cloth of the utility model and epoxy resin glass-fiber-fabric mixed pressure multilayer circuit board by the mixed pressure of bi-material, obtain convenient for productionly, and cost is low, but the wiring board of low-and high-frequency superior performance.Adopt the prepreg bed of material of epoxy resin glass section cloth as binding material, when pressing, adopt conventional epoxy resin glass-fiber-fabric process for pressing parameter to get final product, need not the pressings machinery that image height frequency multi-layer sheet adopts expensive polytetrafluoroethylene binding material and 400 degree that can heat up like that, saved cost.Process by plasma activation, make the hole wall of chemical copper and polytetrafluoroethylfiberglass fiberglass-cloth produce good adhesion, make serviceability rate of wiring board hole wall copper facing reach 100%, produce without the cavity, hole wall is behind 288 ℃ Thermal Stress, and coating has the through hole reliability of high reliability without segregation phenomenon.The polytetrafluoroethylfiberglass fiberglass-cloth and the epoxy resin glass-fiber-fabric mixed pressure multilayer circuit board that obtain of the utility model has good height frequency performance in sum, can be widely used in Aeronautics and Astronautics, satellite communication, navigation, radar, the electronic product field that the different frequencies such as electronic countermeasures, 3G communication require.
Description of drawings
Fig. 1 is front view of the present utility model.
Embodiment
The utility model will be further described by reference to the accompanying drawings below by embodiment.
Embodiment 1:
As shown in Figure 1, polytetrafluoroethylfiberglass fiberglass-cloth and epoxy resin glass-fiber-fabric mixed pressure multilayer circuit board that present embodiment is described, it mainly is made of wiring board 1, it is characterized in that the pressing structure that wiring board 1 is comprised of polytetrafluoroethylfiberglass fiberglass-cloth layer 2 and epoxy resin glass layer of cloth 3 Spaceds.The prepreg bed of material 4 by the epoxy resin glass-fiber-fabric between described polytetrafluoroethylfiberglass fiberglass-cloth and the epoxy resin glass-fiber-fabric coheres.Element is installed jack on the described wiring board 1, and described element is installed Socket walls and is provided with the coat of metal 5, by after the plasma activation, forms the hole wall coat of metal through electroless copper plating and plating between described hole wall metal level and the nonmetallic materials.
Claims (3)
1. a polytetrafluoroethylfiberglass fiberglass-cloth and epoxy resin glass-fiber-fabric mixed pressure multilayer circuit board, it mainly is made of wiring board, it is characterized in that the pressing structure that wiring board is comprised of polytetrafluoroethylfiberglass fiberglass-cloth layer and epoxy resin glass-fiber-fabric layer multi-layer interval.
2. polytetrafluoroethylfiberglass fiberglass-cloth according to claim 1 and epoxy resin glass-fiber-fabric mixed pressure multilayer circuit board is characterized in that the prepreg bed of material by the epoxy resin glass-fiber-fabric coheres between described polytetrafluoroethylfiberglass fiberglass-cloth and the epoxy resin glass-fiber-fabric.
3. polytetrafluoroethylfiberglass fiberglass-cloth according to claim 1 and epoxy resin glass-fiber-fabric mixed pressure multilayer circuit board, it is characterized in that element is installed jack on the described wiring board, described element is installed the jack hole wall and is provided with metal level, by after the plasma activation, form the coat of metal through electroless copper plating and plating between described hole wall metal level and the nonmetallic materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220549927 CN202818760U (en) | 2012-10-24 | 2012-10-24 | Polytetrafluoroethylene fiberglass cloth and epoxy resin fiberglass cloth mixedly-compressed multilayer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220549927 CN202818760U (en) | 2012-10-24 | 2012-10-24 | Polytetrafluoroethylene fiberglass cloth and epoxy resin fiberglass cloth mixedly-compressed multilayer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202818760U true CN202818760U (en) | 2013-03-20 |
Family
ID=47877557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220549927 Expired - Fee Related CN202818760U (en) | 2012-10-24 | 2012-10-24 | Polytetrafluoroethylene fiberglass cloth and epoxy resin fiberglass cloth mixedly-compressed multilayer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202818760U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704949A (en) * | 2016-04-06 | 2016-06-22 | 浙江万正电子科技有限公司 | Mixed-voltage high-frequency multi-layer circuit board, fabrication method thereof and high-frequency electronic component |
| CN106416434A (en) * | 2014-06-18 | 2017-02-15 | 英特尔公司 | Method of use of a unique product identification code |
| CN111194136A (en) * | 2020-03-18 | 2020-05-22 | 浙江万正电子科技有限公司 | Ceramic powder filled polytetrafluoroethylene glass cloth mixed-compression multilayer power divider circuit board |
-
2012
- 2012-10-24 CN CN 201220549927 patent/CN202818760U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106416434A (en) * | 2014-06-18 | 2017-02-15 | 英特尔公司 | Method of use of a unique product identification code |
| CN105704949A (en) * | 2016-04-06 | 2016-06-22 | 浙江万正电子科技有限公司 | Mixed-voltage high-frequency multi-layer circuit board, fabrication method thereof and high-frequency electronic component |
| CN105704949B (en) * | 2016-04-06 | 2018-05-08 | 浙江万正电子科技有限公司 | Mixed pressure high-frequency multilayer wiring board and its manufacture method and high-frequency electronic component |
| CN111194136A (en) * | 2020-03-18 | 2020-05-22 | 浙江万正电子科技有限公司 | Ceramic powder filled polytetrafluoroethylene glass cloth mixed-compression multilayer power divider circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130320 Termination date: 20151024 |
|
| EXPY | Termination of patent right or utility model |