CN203675439U - High-stability multilayer flexible printed board - Google Patents
High-stability multilayer flexible printed board Download PDFInfo
- Publication number
- CN203675439U CN203675439U CN201320697108.1U CN201320697108U CN203675439U CN 203675439 U CN203675439 U CN 203675439U CN 201320697108 U CN201320697108 U CN 201320697108U CN 203675439 U CN203675439 U CN 203675439U
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- China
- Prior art keywords
- layer
- printed board
- copper foil
- semi
- product
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a high-stability multilayer flexible printed board, and the printed board comprises a copper foil layer, a binder layer, a semi-solidified layer, a binder layer, a flexible board, a binder layer, a semi-solidified layer, a binder layer, and a copper foil layer, which are all stacked sequentially. Aiming at the problem that a conventional technical product is poor in stability, the printed board employs a mode that the interior of a product is additionally provided with a semi-solidified piece, thereby preventing the product from being damaged. The printed board is better in performance of resistance to high temperature.
Description
Technical field
The utility model relates to printed circuit board field, is specifically related to the printed board of a kind of high stable multi-layer flexible.
Background technology
At present, along with the development of electronic technology, flex circuit application is compared with rigidity wiring board, can carry out deflection and three-dimensional assembling, be easier to make more the features such as high density, fine pitch and micro hole product with it, be widely used in the fields such as Computers and Communication, consumer electronics, automobile, military affairs and space flight, medical treatment, the stability of existing flex circuit application is very poor, easily damages circuit board.
Utility model content
For above problems of the prior art, the utility model provides the printed board of a kind of high stable multi-layer flexible, so just makes product more stable, has avoided the damage of product, more high temperature resistant.
The utility model is achieved through the following technical solutions:
The printed board of a kind of high stable multi-layer flexible, comprises the copper foil layer, adhesive layer, semi-solid preparation layer, adhesive layer, flex plate, adhesive layer, semi-solid preparation layer, adhesive layer and the copper foil layer that stack gradually.
Described flex plate is the epoxy resin layer of two-sided copper foil covered.
Bonding sheet is polyflon bonding sheet.
The beneficial effects of the utility model are: for the bad problem of existing technical products stability, adopt the mode that is equipped with prepreg in product, therefore just avoided the damage of product, and more high temperature resistant.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
In figure: 1 is copper foil layer; 2 is semi-solid preparation layer; 3 is flex plate; 4 is adhesive layer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further details.
The utility model provides the printed board of a kind of high stable multi-layer flexible, comprise the copper foil layer, adhesive layer, semi-solid preparation layer, adhesive layer, flex plate, adhesive layer, semi-solid preparation layer, adhesive layer and the copper foil layer that stack gradually, described flex plate is the epoxy resin layer of two-sided copper foil covered, and bonding sheet is polyflon bonding sheet.
Top copper foil layer in and flex plate between and between flex plate and low side copper foil layer, be equipped with semi-solid preparation layer, make product more stable, flex plate is the epoxy resin layer of two-sided copper foil covered, bonding sheet is polyflon bonding sheet, make insulation property and the electric conductivity of product better, therefore reduce production cost, avoided the damage of product, improved the resistance to elevated temperatures of product.
The utility model, for the bad problem of existing technical products stability, adopts the mode that is equipped with prepreg in product, has therefore just avoided the damage of product, more high temperature resistant.
Claims (3)
1. high stable multi-layer flexible printed board, it is characterized in that: comprise the copper foil layer, adhesive layer, semi-solid preparation layer, adhesive layer, flex plate, adhesive layer, semi-solid preparation layer, adhesive layer and the copper foil layer that stack gradually, described flex plate is the epoxy resin layer of two-sided copper foil covered, and bonding sheet is polyflon bonding sheet.
2. high stable multi-layer flexible according to claim 1 printed board, is characterized in that: the epoxy resin layer that described flex plate is two-sided copper foil covered.
3. high stable multi-layer flexible according to claim 1 printed board, is characterized in that: bonding sheet is polyflon bonding sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320697108.1U CN203675439U (en) | 2013-11-06 | 2013-11-06 | High-stability multilayer flexible printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320697108.1U CN203675439U (en) | 2013-11-06 | 2013-11-06 | High-stability multilayer flexible printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203675439U true CN203675439U (en) | 2014-06-25 |
Family
ID=50971681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320697108.1U Expired - Fee Related CN203675439U (en) | 2013-11-06 | 2013-11-06 | High-stability multilayer flexible printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203675439U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990320A (en) * | 2018-08-02 | 2018-12-11 | 瑞声光电科技（苏州）有限公司 | Flexible circuit board and preparation method thereof |
-
2013
- 2013-11-06 CN CN201320697108.1U patent/CN203675439U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990320A (en) * | 2018-08-02 | 2018-12-11 | 瑞声光电科技（苏州）有限公司 | Flexible circuit board and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140625 Termination date: 20181106 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |