CN203449672U - High thermal conductivity copper-clad plate with good flexibility - Google Patents
High thermal conductivity copper-clad plate with good flexibility Download PDFInfo
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- CN203449672U CN203449672U CN201320449919.XU CN201320449919U CN203449672U CN 203449672 U CN203449672 U CN 203449672U CN 201320449919 U CN201320449919 U CN 201320449919U CN 203449672 U CN203449672 U CN 203449672U
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- clad plate
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Abstract
The utility model relates to a high thermal conductivity copper-clad plate with good flexibility. The high thermal conductivity copper-clad plate comprises a high thermal conductivity adhesive layer, a prepreg layer, a thermoplastic resin layer and an electrolytic copper foil layer, wherein the prepreg layer is divided into an upper prepreg and a lower prepreg which are bonded with each other by the high thermal conductivity adhesive layer; the thermoplastic resin layer and the electrolytic copper foil layer are sequentially bonded on the outer surfaces of the upper prepreg and the lower prepreg; the high thermal conductivity adhesive layer is a resin layer formed by compounding epoxy resin and high thermal conductivity filler aluminium nitride; the thermoplastic resin layer is a polyimide resin layer and has the thickness of 10-30mu m; the prepregs have the thicknesses of 0.2-0.3mm, and respectively have a layered structure formed by compounding glass fiber cloth, benzoxazine resin, phenolic resin and multi-functional group epoxy resin. The copper-clad plate has the advantages of being excellent in flexibility, good in thermal conductivity, low in dielectric coefficient and the like, thus being accordance with the technical requirement of miniaturization of the current electronic products.
Description
Technical field
The utility model relates to a kind of electronic material, more specifically, relates to the highly heat-conductive copper-clad plate that a kind of pliability is good.
Background technology
Develop rapidly along with electronic industry, the upgrading speed of each electronic product is also accelerated thereupon, requirement to the performance of product is also more and more higher, copper-clad plate is as the carrier of each class component in electronic product, the whether superior quality that also affects the performance of electronic product of its performance, the current miniaturization due to each electronic product volume, the dense degree of electronic component is also more and more higher, to the heat resistance of copper-clad plate and thermal diffusivity, with and flexible requirement also more and more higher, and due to the requirement of high frequency, how people also reduce dielectric loss in constantly research, to meet high frequency requirement, and at present cannot be by heat resistance by the modification of epoxy resin, thermal diffusivity, pliability is comprehensively united.
Summary of the invention
For overcoming the above problems, the utility model provides the highly heat-conductive copper-clad plate that a kind of pliability is good, and it is low that this copper-clad plate has dielectric loss, good heat resistance, the feature such as thermal conductivity factor is high, and pliability is good.
For realizing above object, the technical solution of the utility model is:
The highly heat-conductive copper-clad plate that a kind of pliability is good, comprise high-heat-conductivity glue layer, layer of prepreg, thermoplastic resin and electrodeposited copper foil layer, described layer of prepreg is divided into prepreg and lower prepreg, bonding by high-heat-conductivity glue layer between upper prepreg and lower prepreg, the outer surface of the outer surface of upper prepreg and lower prepreg is all bonded with thermoplastic resin and electrodeposited copper foil layer successively.
The resin bed of described high-heat-conductivity glue layer for adding high heat filling aluminium nitride to be composited by epoxy resin.
Described thermoplastic resin is polyimide resin layer, and thickness is 10-30 μ m.
The thickness of described prepreg is 0.2mm-0.3mm, the layer structure being composited for glass fabric and benzoxazine colophony, phenolic resins, polyfunctional epoxy resin.
The beneficial effects of the utility model: the highly heat-conductive copper-clad plate that pliability of the present utility model is good, by adopting high-heat-conductivity glue layer can improve the thermal conductivity of copper-clad plate, reduce the gathering of heat, adopt thermoplastic resin to make copper-clad plate there is good pliability simultaneously, improved fragility and the following process of copper-clad plate.Adopt the benzoxazine colophony of low-k simultaneously, be conducive to reduce the dielectric loss of copper-clad plate, meet high complexity and to signal transfer rate and the loss multi-layer sheet technology that has certain requirements.
Accompanying drawing explanation
Fig. 1 is the highly heat-conductive copper-clad plate structural representation that a kind of pliability is good.
Wherein, 1-high-heat-conductivity glue layer, 2-layer of prepreg, 3-thermoplastic resin, 4-electrodeposited copper foil layer.
The specific embodiment
Embodiment: as shown in Figure 1, the highly heat-conductive copper-clad plate that a kind of pliability is good, comprise high-heat-conductivity glue layer 1, layer of prepreg 2, thermoplastic resin 3 and electrodeposited copper foil layer 4, layer of prepreg 2 is divided into prepreg and lower prepreg, the thickness of two prepregs is 0.2mm-0.3mm, for glass fabric and benzoxazine colophony, phenolic resins, the layer structure that polyfunctional epoxy resin is composited, bonding by high-heat-conductivity glue layer 1 between upper prepreg and lower prepreg, the resin bed of described high-heat-conductivity glue layer 1 for adding high heat filling aluminium nitride to be composited by epoxy resin, the outer surface of the outer surface of upper prepreg and lower prepreg is all bonded with thermoplastic resin 3 and electrodeposited copper foil layer 4 successively.Described thermoplastic resin 3 is polyimide resin layer, thickness is 10-30 μ m, because polyimide resin has higher heat resistance and a pliability than epoxy resin is obvious, therefore can effectively improve the pliability of copper-clad plate, and epoxy resin itself has certain rigidity, therefore can realize the rigid-flexible combination of this copper-clad plate.The copper-clad plate of phase specific rigidity, structure for covering copper plate of the present utility model has better pliability, and the copper-clad plate made from flexible-epoxy is compared, and has better dimensional stability.
Claims (4)
1. the highly heat-conductive copper-clad plate that pliability is good, comprise high-heat-conductivity glue layer, layer of prepreg, thermoplastic resin and electrodeposited copper foil layer, it is characterized in that: described prepreg is divided into prepreg and lower prepreg, bonding by high-heat-conductivity glue layer between upper prepreg and lower prepreg, the outer surface of the outer surface of upper prepreg and lower prepreg is all bonded with thermoplastic resin and electrodeposited copper foil layer successively.
2. highly heat-conductive copper-clad plate according to claim 1, is characterized in that: the resin bed of described high-heat-conductivity glue layer for adding high heat filling aluminium nitride to be composited by epoxy resin.
3. highly heat-conductive copper-clad plate according to claim 1, is characterized in that: described thermoplastic resin is polyimide resin layer, and thickness is 10-30 μ m.
4. highly heat-conductive copper-clad plate according to claim 1, is characterized in that: the thickness of described prepreg is 0.2mm-0.3mm, the layer structure being composited for glass fabric and benzoxazine colophony, phenolic resins, polyfunctional epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320449919.XU CN203449672U (en) | 2013-07-26 | 2013-07-26 | High thermal conductivity copper-clad plate with good flexibility |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320449919.XU CN203449672U (en) | 2013-07-26 | 2013-07-26 | High thermal conductivity copper-clad plate with good flexibility |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203449672U true CN203449672U (en) | 2014-02-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320449919.XU Expired - Fee Related CN203449672U (en) | 2013-07-26 | 2013-07-26 | High thermal conductivity copper-clad plate with good flexibility |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203449672U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108189516A (en) * | 2017-12-06 | 2018-06-22 | 常州市宝平不绣钢制品有限公司 | A kind of preparation method of copper-clad plate |
| CN108297508A (en) * | 2018-01-26 | 2018-07-20 | 东莞市兆科电子材料科技有限公司 | Heat-conducting plate and its preparation method and application |
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
-
2013
- 2013-07-26 CN CN201320449919.XU patent/CN203449672U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108990253A (en) * | 2017-06-05 | 2018-12-11 | 北京小米移动软件有限公司 | Copper-clad plate, printed wiring board and electronic equipment |
| CN108189516A (en) * | 2017-12-06 | 2018-06-22 | 常州市宝平不绣钢制品有限公司 | A kind of preparation method of copper-clad plate |
| CN108297508A (en) * | 2018-01-26 | 2018-07-20 | 东莞市兆科电子材料科技有限公司 | Heat-conducting plate and its preparation method and application |
| CN108297508B (en) * | 2018-01-26 | 2021-04-02 | 东莞市兆科电子材料科技有限公司 | Heat conducting plate and preparation method and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhou Peifeng Inventor before: Mo Zhanxiong |
|
| COR | Change of bibliographic data | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140226 Termination date: 20200726 |