JP2008182184A5 - - Google Patents

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Publication number
JP2008182184A5
JP2008182184A5 JP2007227937A JP2007227937A JP2008182184A5 JP 2008182184 A5 JP2008182184 A5 JP 2008182184A5 JP 2007227937 A JP2007227937 A JP 2007227937A JP 2007227937 A JP2007227937 A JP 2007227937A JP 2008182184 A5 JP2008182184 A5 JP 2008182184A5
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JP
Japan
Prior art keywords
circuit board
multilayer circuit
board according
conductor layer
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007227937A
Other languages
Japanese (ja)
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JP2008182184A (en
JP4962228B2 (en
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2007227937A external-priority patent/JP4962228B2/en
Priority to JP2007227937A priority Critical patent/JP4962228B2/en
Priority to AT07860057T priority patent/ATE546034T1/en
Priority to PCT/JP2007/074828 priority patent/WO2008078739A1/en
Priority to CN2007800483965A priority patent/CN101606446B/en
Priority to EP07860057A priority patent/EP2104408B1/en
Publication of JP2008182184A publication Critical patent/JP2008182184A/en
Publication of JP2008182184A5 publication Critical patent/JP2008182184A5/ja
Priority to US12/492,429 priority patent/US20090260858A1/en
Publication of JP4962228B2 publication Critical patent/JP4962228B2/en
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Claims (8)

導体層と樹脂製の絶縁層とを交互に積層してなる積層回路部と、
最下層の絶縁層に接して設けられた金属基板と、
電子部品が載置される最上層の導体層と前記最下層の絶縁層とを内面に形成された導体層で接続する放熱ビアとを備えた、多層回路基板。 A laminated circuit portion in which conductor layers and resin insulating layers are alternately laminated;
A metal substrate provided in contact with the lowermost insulating layer;
A multilayer circuit board comprising: a heat dissipation via for connecting an uppermost conductor layer on which an electronic component is placed and the lowermost insulating layer with a conductor layer formed on an inner surface thereof. 前記放熱ビアの内部に樹脂が充填されていることを特徴とする、請求項１に記載の多層回路基板。   The multilayer circuit board according to claim 1, wherein the heat radiating via is filled with a resin. 前記積層回路部は導体層と樹脂製の絶縁層とを熱圧着してなることを特徴とする、請求項１に記載の多層回路基板。   The multilayer circuit board according to claim 1, wherein the multilayer circuit portion is formed by thermocompression bonding of a conductor layer and a resin insulating layer. 前記最下層の絶縁層と前記金属基板とは熱圧着されていることを特徴とする、請求項１に記載の多層回路基板。   The multilayer circuit board according to claim 1, wherein the lowermost insulating layer and the metal substrate are thermocompression bonded. 前記積層回路部を構成する導体層と前記放熱ビアの内面に形成される導体層は銅製であることを特徴とする、請求項１に記載の多層回路基板。   2. The multilayer circuit board according to claim 1, wherein the conductor layer forming the multilayer circuit portion and the conductor layer formed on the inner surface of the heat radiating via are made of copper. 前記最上層の導体層にはニッケルメッキを下地とした金メッキが施されていることを特徴とする、請求項５に記載の多層回路基板。   6. The multilayer circuit board according to claim 5, wherein the uppermost conductor layer is gold plated with nickel plating as a base. 前記最下層の絶縁層として、前記樹脂製の絶縁層の代わりにダイヤモンドライクカーボン層を備えることを特徴とする、請求項１に記載の多層回路基板。The multilayer circuit board according to claim 1, wherein a diamond-like carbon layer is provided as the lowermost insulating layer instead of the resin insulating layer. 電動パワーステアリングシステム用のモータ駆動回路基板であって、
請求項１から請求項７までのいずれか１項に記載の多層回路基板と、
前記最上層の導体層に載置された電子部品とを備えた、モータ駆動回路基板。 A motor drive circuit board for an electric power steering system,
A multilayer circuit board according to any one of claims 1 to 7,
A motor drive circuit board comprising an electronic component placed on the uppermost conductor layer.
JP2007227937A 2006-12-26 2007-09-03 Multi-layer circuit board and motor drive circuit board Active JP4962228B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2007227937A JP4962228B2 (en) 2006-12-26 2007-09-03 Multi-layer circuit board and motor drive circuit board
EP07860057A EP2104408B1 (en) 2006-12-26 2007-12-25 Multilayer circuit board and motor drive circuit board
PCT/JP2007/074828 WO2008078739A1 (en) 2006-12-26 2007-12-25 Multilayer circuit board and motor drive circuit board
CN2007800483965A CN101606446B (en) 2006-12-26 2007-12-25 Multilayer circuit board and motor drive circuit board
AT07860057T ATE546034T1 (en) 2006-12-26 2007-12-25 MULTI-LAYER CIRCUIT BOARD AND MOTOR DRIVE BOARD
US12/492,429 US20090260858A1 (en) 2006-12-26 2009-06-26 Multi-layer circuit substrate and motor drive circuit substrate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2006348738 2006-12-26
JP2006348738 2006-12-26
JP2007227937A JP4962228B2 (en) 2006-12-26 2007-09-03 Multi-layer circuit board and motor drive circuit board

Publications (3)

Publication Number Publication Date
JP2008182184A JP2008182184A (en) 2008-08-07
JP2008182184A5 true JP2008182184A5 (en) 2009-03-19
JP4962228B2 JP4962228B2 (en) 2012-06-27

Family

ID=39562528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007227937A Active JP4962228B2 (en) 2006-12-26 2007-09-03 Multi-layer circuit board and motor drive circuit board

Country Status (6)

Country Link
US (1) US20090260858A1 (en)
EP (1) EP2104408B1 (en)
JP (1) JP4962228B2 (en)
CN (1) CN101606446B (en)
AT (1) ATE546034T1 (en)
WO (1) WO2008078739A1 (en)

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