CN202111928U - Double-face polyimides circuit board - Google Patents
Double-face polyimides circuit board Download PDFInfo
- Publication number
- CN202111928U CN202111928U CN2011202384116U CN201120238411U CN202111928U CN 202111928 U CN202111928 U CN 202111928U CN 2011202384116 U CN2011202384116 U CN 2011202384116U CN 201120238411 U CN201120238411 U CN 201120238411U CN 202111928 U CN202111928 U CN 202111928U
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- China
- Prior art keywords
- polyimides
- double
- face
- circuit board
- layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a double-face polyimides circuit board, mainly comprising a polyimides substrate and circuit layers, wherein both sides of the polyimides substrate are provided with the circuit layers, a three-layer structure is provided with through holes, on the polyimides substrate on the inner wall of the through hole there is provided a plasma processing layer, and the through holes of the three-layer structure are respectively provided with a metal layer connected with the circuit layers therebelow and thereabove. The arrangement of circuit layers at both sides of the polyimides substrate enables the double-face using of the circuit board, avoids the condition that when a double-face luminous circuit board is needed in the LED industry, two single face circuit boards are combined back-to-back for using, and enables the manufacture and usage cost to be reduced, and the practicality and safety to be further increased. The plasma processing technology is applied to the joint of the polyimides substrate and the metal layer to perform activation modification processing on polyimides, thereby better enabling the connection of the plasma processing layer and the metal layer to be firmer, and avoiding the phenomenon of metal layer shedding and hole wall cavity generation.
Description
Technical field
The utility model relates to the wiring board field, especially a kind of double-sided polyimide wiring board of using simultaneously on the two sides realized.
Background technology
At present on the market metal base circuit board has excellent heat dispersion and capability of electromagnetic shielding, but its high-frequency dielectric performance and high temperature resistant, radiation resistance is relatively poor relatively.And wiring board on the market all is the single face wiring board; At the LED lighting field, when needing the two sides simultaneously luminous, all adopt the wiring board of two single faces to use with back-to-back combining form like large-scale colored curtain wall, LED; Increased use cost, and security reliability is low.
The utility model content
The purpose of the utility model is for the deficiency that solves above-mentioned technology a kind of high temperature resistant radioresistance to be provided, but and the double-sided polyimide wiring board that uses simultaneously of two sides.
In order to achieve the above object; The double-sided polyimide wiring board that the utility model designed; It mainly comprises polyimide matrix and line layer, is respectively equipped with line layer in the both sides of polyimide matrix, on three-decker, is provided with through hole; On the polyimide matrix of through-hole wall, be provided with the Cement Composite Treated by Plasma layer, on the through hole of three-decker is, be equipped with metal level and be connected with up and down line layer.This design feature is: the both sides at polyimide matrix are respectively equipped with line layer, and connect through metal level, have realized the two-sided use of wiring board, and practicality is high.And at polyimide matrix and metal level junction using plasma treatment technology; Polyimides is carried out activation modification to be handled; Generate the Cement Composite Treated by Plasma layer; It is more firm that the Cement Composite Treated by Plasma layer is connected with metal level, avoided metal level to come off or produce the phenomenon of hole void.
The resulting double-sided polyimide wiring board of the utility model; Both sides at polyimide matrix are respectively equipped with line layer; And, realized the two-sided use of wiring board through the metal level connection, adopt two single face wiring boards to make up the situation of use back-to-back when avoiding in the LED industry, needing lighting at two sides; Reduced the production use cost, practicality and security performance further improve.And at polyimide matrix and metal level junction using plasma treatment technology; Polyimides is carried out activation modification to be handled; Generate the Cement Composite Treated by Plasma layer; It is more firm that the Cement Composite Treated by Plasma layer is connected with metal level, avoided metal level to come off or produce the phenomenon of hole void.In addition, the matrix adopting polyimide resin, it is good that it is high temperature resistant, and radiation resistance and high-frequency dielectric performance are all good simultaneously.
Description of drawings
Fig. 1 is the structural representation of the utility model.
Embodiment
Combine accompanying drawing that the utility model is done further to describe through embodiment below.
Embodiment 1:
As shown in Figure 1; The double-sided polyimide wiring board that present embodiment is described; It mainly comprises polyimide matrix 1 and line layer 2, is respectively equipped with line layer 2 in the both sides of polyimide matrix 1, on three-decker, is provided with through hole 3; On the polyimide matrix 1 of through hole 3 inwalls, be provided with Cement Composite Treated by Plasma layer 4, on the through hole 3 of three-decker is, be equipped with metal level 5 and be connected with up and down line layer 2.
Claims (1)
1. double-sided polyimide wiring board; It mainly comprises polyimide matrix and line layer; It is characterized in that being respectively equipped with line layer in the both sides of polyimide matrix; On three-decker, be provided with through hole, on the polyimide matrix of through-hole wall, be provided with the Cement Composite Treated by Plasma layer, on the through hole of three-decker is, be equipped with metal level and be connected with up and down line layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202384116U CN202111928U (en) | 2011-07-07 | 2011-07-07 | Double-face polyimides circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202384116U CN202111928U (en) | 2011-07-07 | 2011-07-07 | Double-face polyimides circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202111928U true CN202111928U (en) | 2012-01-11 |
Family
ID=45437378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202384116U Expired - Fee Related CN202111928U (en) | 2011-07-07 | 2011-07-07 | Double-face polyimides circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202111928U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113991004A (en) * | 2021-10-26 | 2022-01-28 | 东莞市中麒光电技术有限公司 | LED substrate manufacturing method, LED substrate, LED device manufacturing method and LED device |
-
2011
- 2011-07-07 CN CN2011202384116U patent/CN202111928U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113991004A (en) * | 2021-10-26 | 2022-01-28 | 东莞市中麒光电技术有限公司 | LED substrate manufacturing method, LED substrate, LED device manufacturing method and LED device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120111 Termination date: 20160707 |