CN201586772U - Lower padding plate used in hole-drilling process of printed circuit board - Google Patents
Lower padding plate used in hole-drilling process of printed circuit board Download PDFInfo
- Publication number
- CN201586772U CN201586772U CN2009202601322U CN200920260132U CN201586772U CN 201586772 U CN201586772 U CN 201586772U CN 2009202601322 U CN2009202601322 U CN 2009202601322U CN 200920260132 U CN200920260132 U CN 200920260132U CN 201586772 U CN201586772 U CN 201586772U
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- surface layer
- dissipating layer
- heat
- layer
- lower bolster
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- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
The utility model discloses a lower padding plate used in the hole-drilling process of a printed circuit board (PCB). The lower padding plate is applied to assist a drilling bit to drill a small hole on the printed circuit board. The lower padding plate comprises a heat-dissipating layer and a first surface layer and a second surface layer which are arranged on the two surfaces of the heat-dissipating layer respectively, wherein the heat-dissipating layer is an aluminum oxide trihydrate water-soluble phenolic resin plate and used for reducing the temperature of the drilling bit during the hole-drilling process, and the first surface layer and the second surface layer are both an adhesive coating and used for preventing the moisture absorption and deformation of the heat-dissipating layer. The aluminum oxide trihydrate water-soluble phenolic resin plate with moderate price is adopted as the heat-dissipating layer of the lower padding plate, and the aluminum oxide trihydrate has high thermal conductivity and the characteristics of endothermic decomposition of the crystal water contained in aluminum oxide trihydrate under high temperature, so that excellent heat-dissipating effect is achieved and the temperature of the drilling bit is reduced. In addition, the adhesive coatings are arranged on the two surfaces of the heat-dissipating layer, so as to effectively prevent the moisture absorption and deformation of the water-soluble phenolic resin plate in the storage process.
Description
Technical field
The utility model relates to the subsidiary products field of using in the printed wiring board boring procedure, and in particular, what improvement related to is a kind of lower bolster that uses in the printed wiring board boring procedure.
Background technology
To PCB (Printed Circuit Board) when printed wiring board is holed, for the quality that can improve boring and prolong drilling life of bit, as shown in Figure 1, through regular meeting use a lower bolster 101 be arranged on pcb board below; And in the auxilliary material industry of PCB boring, this lower bolster 101 all uses wood-fiber board or paper-based laminated board to make usually, also uses sheet metal making lower bolsters 101 such as aluminium sheet sometimes; But, as far back as twentieth century the 80s and 90s, the American just once used the middle Metal Substrate heat radiation backing plate as the corrugation type of a kind of cladded aluminum foil at two-sides, though it has good heat radiation and chip removal effect, because the production process of corrugation type Metal Substrate is very complicated, add expensive two sides aluminium foil, make the sheet material price of this lower bolster also seem very expensive thus, the reflection according to using producer almost accounts for 1/3rd of its production cost, so, also withdrawed from market at last gradually.
Yet, although wood-fiber board and paper-based laminated board low price do not possess heat sinking function substantially; Though the aluminium sheet heat radiation is good but price is too expensive again, lacks practicality; Up at present, still also can not find a not only had heat sinking function but also moderate lower bolster on the market.
Therefore, prior art still haves much room for improvement and develops.
The utility model content
The purpose of this utility model is, is to provide a kind of lower bolster that uses in the printed wiring board boring procedure, both had the function of heat radiation, and is moderate again, can satisfy the demand in current market.
The technical solution of the utility model is as follows:
A kind of lower bolster that in the printed wiring board boring procedure, uses, be used for auxiliary drill bit and on printed substrate, get out aperture, wherein, described lower bolster comprises a heat dissipating layer and is separately positioned on a first surface layer and a second surface layer on the described heat dissipating layer two sides; Described heat dissipating layer is the water soluble phenol resin plate of alumina trihydrate, is used for reducing at boring procedure the temperature of described drill bit; Described first surface layer and described second surface layer are an adhesive coating, are used to prevent described heat dissipating layer moisture absorption and deformation.
Described lower bolster, wherein, described first surface layer is positioned at the edge of described heat dissipating layer ringwise.
Described lower bolster, wherein, described second surface layer is positioned at the edge of described heat dissipating layer ringwise.
Described lower bolster, wherein, described adhesive coating is the water-soluble resin gel coating.
A kind of lower bolster that in the printed wiring board boring procedure, uses provided by the utility model, owing to adopted the heat dissipating layer of the water soluble phenol resin plate of moderate salic trihydrate as lower bolster, utilized the high thermal conductivity coefficient of described alumina trihydrate, but and the characteristic of having utilized the crystallization water endothermic decomposition in the at high temperature described alumina trihydrate, play good thermolysis, reduced the temperature of drill bit; Simultaneously, because of the easy moisture absorption and deformation of water soluble phenol resin plate is difficult to deposit,, prevented the distortion of making moist of water soluble phenol resin plate in put procedure effectively so also adopted adhesive coating on described heat dissipating layer two sides.
Description of drawings
Fig. 1 is a lower bolster structural representation of the prior art;
Fig. 2 is the lower bolster structural representation in the utility model.
The specific embodiment
Below with reference to accompanying drawing, the device specific embodiment of the present utility model and embodiment are described in detail.
A kind of lower bolster that in the printed wiring board boring procedure, uses of the present utility model, be used for auxiliary drill bit and on printed substrate, get out aperture, one of its specific embodiment, as shown in Figure 2, described lower bolster comprises a heat dissipating layer 201, described heat dissipating layer 201 is used for reducing described temperature of diamond bit at boring procedure for containing the water soluble phenol resin plate of alumina trihydrate; And being included in a first surface layer 202 and a second surface layer 203 that is provided with respectively on the described heat dissipating layer two sides, described first surface layer 202 and described second surface layer 203 are an adhesive coating, are used to prevent described heat dissipating layer moisture absorption and deformation.
Why the utility model selects for use the water soluble phenol resin plate of described alumina trihydrate as lower bolster, mainly be to consider when PCB holes to be difficult to get rid of because of drill bit rotates a large amount of heat of generation at a high speed, if can find a kind of not only had thermolysis but also moderate sheet material, to improve greatly the service life of drill bit undoubtedly, and avoid Yin Wendu too high and cause the resin generation fusion of PCB substrate and sticking hole wall, sticking drill bit or cause the generation of phenomenons such as drill bit broken needle effectively.
A large amount of experiments and research have been carried out for this reason, off the beaten track at last, the water soluble phenol resin plate of selected a kind of salic trihydrate, it is not only moderate, can satisfy the current market demand, fill up the blank of Chinese domestic market, and find that alumina trihydrate has higher thermal conductivity factor, and at high temperature wherein the crystallization water is heated to and absorbs a large amount of heats Celsius can the decomposition more than 200 ℃ the time, and the temperature rise that the heat that is produced during PCB boring causes can reach 210-330 Celsius ℃; Find in addition to adopt the water soluble phenol resin plate of this alumina trihydrate to make lower bolster, in boring procedure, also can play fire-retardant, as to press down cigarette effect.
As for water soluble phenol resin plate how to produce described alumina trihydrate, cause is not an improvement of the present utility model, so be not described in detail in this, but compare, also easy moisture absorption and deformation of water soluble phenol resin plate or layering crimping with traditional paper substrate or plank base pressing plate.
Be preferably, described first surface layer 202 is positioned at the edge of described heat dissipating layer 201 ringwise; And/or described second surface layer 203 ringwise, is positioned at the edge of described heat dissipating layer 201.Because the water soluble phenol resin plate is easy moisture absorption and deformation or layering crimping in the process of depositing, so edge on the water soluble phenol resin plate two sides of described alumina trihydrate, apply one deck adhesive by the mode that sprays or smear, can play dampproof effect, because sheet material can be stacked, can be so be positioned at the centre of sheet material without adhesive coating.
Need to prove, although in the water soluble phenol resin plate, contain the alumina trihydrate that can decomposite moisture, but exist, so can not make the water soluble phenol resin plate influenced by this crystallization water and deform because this moisture is form with the crystallization water at normal temperatures and pressures.
In the preferred embodiment of lower bolster described in the utility model, described adhesive coating is the water-soluble resin gel coating.Because be on the water soluble phenol resin plate, to apply, so adopt the water-soluble resin adhesive of same possess hydrophilic property can have better moisture effect and more smooth table plane.
Should be understood that, for those of ordinary skills, can be improved according to the above description or conversion, and all these improvement and conversion all should belong to the protection domain of the utility model claims.
Claims (4)
1. lower bolster that in the printed wiring board boring procedure, uses, be used for auxiliary drill bit and on printed substrate, get out aperture, it is characterized in that described lower bolster comprises a heat dissipating layer and is separately positioned on a first surface layer and a second surface layer on the described heat dissipating layer two sides; Described heat dissipating layer is the water soluble phenol resin plate of alumina trihydrate, is used for reducing at boring procedure the temperature of described drill bit; Described first surface layer and described second surface layer are an adhesive coating, are used to prevent described heat dissipating layer moisture absorption and deformation.
2. lower bolster according to claim 1 is characterized in that, described first surface layer is positioned at the edge of described heat dissipating layer ringwise.
3. lower bolster according to claim 1 is characterized in that, described second surface layer is positioned at the edge of described heat dissipating layer ringwise.
4. lower bolster according to claim 1 is characterized in that, described adhesive coating is the water-soluble resin gel coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202601322U CN201586772U (en) | 2009-11-04 | 2009-11-04 | Lower padding plate used in hole-drilling process of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009202601322U CN201586772U (en) | 2009-11-04 | 2009-11-04 | Lower padding plate used in hole-drilling process of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201586772U true CN201586772U (en) | 2010-09-22 |
Family
ID=42746540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009202601322U Expired - Fee Related CN201586772U (en) | 2009-11-04 | 2009-11-04 | Lower padding plate used in hole-drilling process of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201586772U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103085428A (en) * | 2012-12-12 | 2013-05-08 | 湖南柳鑫电子新材料有限公司 | Melamine board for printed circuit board (PCB) drilling and preparation method thereof |
| CN103950247A (en) * | 2014-04-22 | 2014-07-30 | 深圳市柳鑫实业有限公司 | Laminated paper base plate used in drilling of PCB (Printed Circuit Board) and manufacturing method of laminated paper base plate |
| CN105057726A (en) * | 2015-07-17 | 2015-11-18 | 大连崇达电路有限公司 | Superhard PCB (Printed Circuit Board) processing method capable of effectively prolonging service life of cutting tool |
-
2009
- 2009-11-04 CN CN2009202601322U patent/CN201586772U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103085428A (en) * | 2012-12-12 | 2013-05-08 | 湖南柳鑫电子新材料有限公司 | Melamine board for printed circuit board (PCB) drilling and preparation method thereof |
| CN103085428B (en) * | 2012-12-12 | 2015-05-20 | 湖南柳鑫电子新材料有限公司 | Melamine board for printed circuit board (PCB) drilling and preparation method thereof |
| CN103950247A (en) * | 2014-04-22 | 2014-07-30 | 深圳市柳鑫实业有限公司 | Laminated paper base plate used in drilling of PCB (Printed Circuit Board) and manufacturing method of laminated paper base plate |
| CN105057726A (en) * | 2015-07-17 | 2015-11-18 | 大连崇达电路有限公司 | Superhard PCB (Printed Circuit Board) processing method capable of effectively prolonging service life of cutting tool |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Xintang Whitehead Industrial Park building C3 Patentee after: SHENZHEN NEWCCESS INDUSTRIAL CO., LTD. Address before: 518000 Guangdong city of Shenzhen province Baoan District Fuyong Xintang Whitehead Industrial Park building C3 Patentee before: Shenzhen Newccess Industrial Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100922 Termination date: 20171104 |