CN105500738A - Backing board for drilling and production method thereof - Google Patents
Backing board for drilling and production method thereof Download PDFInfo
- Publication number
- CN105500738A CN105500738A CN201610033317.4A CN201610033317A CN105500738A CN 105500738 A CN105500738 A CN 105500738A CN 201610033317 A CN201610033317 A CN 201610033317A CN 105500738 A CN105500738 A CN 105500738A
- Authority
- CN
- China
- Prior art keywords
- backing plate
- gummed paper
- boring
- graphite powder
- drilling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D7/00—Producing flat articles, e.g. films or sheets
- B29D7/01—Films or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q3/00—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine
- B23Q3/02—Devices holding, supporting, or positioning work or tools, of a kind normally removable from the machine for mounting on a work-table, tool-slide, or analogous part
- B23Q3/10—Auxiliary devices, e.g. bolsters, extension members
- B23Q3/105—Auxiliary supporting devices independent of the machine tool
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
The invention discloses a backing board for drilling and a production method thereof. The production method comprises the following steps: after thermosetting resins mixed with graphite powder are soaked into plant fibers, the soaked thermosetting resins are baked to form gummed paper; the gummed paper is glued on the upper surface and the lower surface of a support structure, so as to obtain the backing board after heating and pressing. Through adding the graphite powder in a certain proportion, a certain mesh number and a certain grain size into the backing board, the backing board has the properties of lubrication, heat dissipation and electric conduction, thereby improving the production efficiency of drilling of a printed wiring board, improving the drilling quality, enhancing the product reliability and reducing the drilling cost.
Description
Technical field
The present invention relates to printed circuit board field, particularly relate to a kind of boring backing plate and preparation method thereof.
Background technology
Printed circuit board drill hole normally by 1 to several dual platens or multi-layer sheet, is piled up the through hole getting out various diameter with Digit Control Machine Tool, forms loop to be communicated with by each for printed wiring board sandwich circuit.In Digit Control Machine Tool boring procedure, each folded printed wiring board bottom needs, with a backing plate, to be used for guaranteeing that wiring board is drilled, not injure Digit Control Machine Tool table top again.This backing plate is exactly printed circuit board drill hole backing plate.
Current printed circuit board drill hole backing plate mainly mixes the compacting of various wood-fibred with thermosetting resin and forms, existing backing plate due to drill point high temperature hot melt backing plate resin, can be formed and bore dirt when holing, and hinders drilling cuttings to discharge, hole wall quality is declined, finally causes printed wiring board reliability to decline; In addition backing plate thermal conductivity is bad, and temperature of diamond bit also can be made to continue to increase, and aggravation bit grinding undermines and bores dirty generation.Bore dirt and affect subsequent technique the via hole when being brought into printed wiring board, cannot electro-coppering, need with special liquid medicine Drill dirt cleaning.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of boring backing plate and preparation method thereof, be intended to solve the formation when holing of existing backing plate and bore dirt, hinder drilling cuttings to discharge, make hole wall quality decline and bore the problem affecting subsequent technique when dirt is brought into printed wiring board.
Technical scheme of the present invention is as follows:
A preparation method for boring backing plate, wherein, comprises the following steps:
A, the thermosetting resin being mixed with graphite powder be impregnated in string after, through baking make gummed paper;
B, the gummed paper made is fitted in the upper and lower surface of supporting construction, be pressed into backing plate through heating.
Described boring backing plate, wherein, described thermosetting resin is a kind of in phenolic resins, Lauxite, melmac.
Described boring backing plate, wherein, the order number of described graphite powder is 200 ~ 3000 orders.
Described boring backing plate, wherein, the mean particle dia of described graphite powder is 30 ~ 100 μm.
Described boring backing plate, wherein, the volume ratio that described graphite powder accounts for gummed paper is 0.5% ~ 30%.
Described boring backing plate, wherein, described supporting construction floods thermosetting resin by string to make through hot pressing.
Described boring backing plate, wherein, the thickness of described gummed paper is 0.3 ~ 0.6mm.
Described boring backing plate, wherein, the thickness of described backing plate is 1 ~ 3mm.
A kind of boring backing plate, wherein, adopts as above arbitrary described preparation method to be prepared from.
Beneficial effect: the present invention adds graphite powder in backing plate, makes backing plate have lubricates drill bit, the function of high-termal conductivity and high conductivity.
Accompanying drawing explanation
Fig. 1 is the structural representation of the preferred embodiment of a kind of boring backing plate of the present invention.
Detailed description of the invention
The invention provides a kind of boring backing plate and preparation method thereof, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The invention provides a kind of preparation method's preferred embodiment of boring backing plate, it comprises the following steps:
A, the thermosetting resin being mixed with graphite powder be impregnated in string after, through baking make gummed paper;
B, the gummed paper made is fitted in the upper and lower surface of supporting construction, be pressed into backing plate through heating.
The present invention adds graphite powder in backing plate, makes backing plate have following functions:
(1), utilizing the lubricity of graphite powder, making when entering to bore backing plate have the performance of lubricates drill bit, thus promote chip removal effect, reduce bit wear;
(2), utilize the thermal conductivity of graphite powder, backing plate thermal conductivity is promoted, reduce temperature of diamond bit, reduce and bore dirty generation, reduce bit wear;
(3), utilize the electric conductivity of graphite powder, in printed circuit board drill hole metapore metallization processes, hole wall has electric conductivity, more heavy copper during plating.
Compared with existing printed circuit board drill hole backing plate, backing plate of the present invention is promoted to functional material by expendable material, improves printed circuit board drill hole production efficiency, reduces costs, and promotes printed wiring board production reliability.
Preferably, described thermosetting resin can be but be not limited in phenolic resins, Lauxite, melmac a kind of.
Preferably, the order number of described graphite powder is 200 ~ 3000 orders, backing plate lubrication obtained under this order number scope and excellent in heat dissipation effect.More preferably, the order number of described graphite powder is 1000 ~ 1500 orders, to promote lubrication and the radiating effect of backing plate further.
Preferably, the mean particle dia of described graphite powder is 30 ~ 100 μm, to guarantee the lubrication of backing plate, heat radiation and conductive effect.
Preferably, the volume ratio that described graphite powder accounts for gummed paper is 0.5% ~ 30%, to guarantee the lubrication of backing plate, heat radiation and heat-conducting effect.More preferably, the volume ratio that described graphite powder accounts for gummed paper is 10% ~ 15%, and in this volume range, the lubrication of backing plate, heat radiation and conductive effect are better.
Preferably, described supporting construction floods thermosetting resin by string to make through hot pressing.Certainly the invention is not restricted to string, metal, plastics, timber can also be adopted to substitute.
Preferably, the thickness of described gummed paper is 0.3 ~ 0.6mm.The effect of thickness on boring of gummed paper has larger impact, and when gummed paper is too thick, the bits produced during its boring are more, easily get lodged in the groove of drill point, affect chip removal function; And when gummed paper is too thin, the Pulvis Emolliens thermal effect of gummed paper to drill bit is poor.Employing thickness is that the gummed paper of 0.3 ~ 0.6mm can be guaranteed drill bit and lubricate the gummed paper dispelled the heat fully to contact, and at utmost plays lubrication and thermolysis.Preferably, adopt thickness to be that the gummed paper of 0.4 ~ 0.5mm and supporting construction are fitted, the performance of gummed paper can be improved further.
Preferably, the thickness of described backing plate is 1 ~ 3mm, good at the lubrication of this thickness lower bolster, heat radiation and conductive effect.The present invention also can select the gummed paper of more than two or two to fit in the upper and lower surface of supporting construction, to form the suitable backing plate of desired thickness, lubrication, heat radiation and conductive effect.After supporting construction posts gummed paper, under 140-160 DEG C of high temperature 20-30MPa high pressure, suppress 50-100min, the backing plate that lubrication, heat radiation and electric conductivity are good can be obtained.
Based on above-mentioned preparation method, the present invention also provides a kind of boring backing plate, and it adopts as above arbitrary described preparation method to be prepared from.By adding graphite powder in backing plate, make backing plate of the present invention have excellent lubrication, heat radiation and electric conductivity, thus improve printed circuit board drill hole production efficiency, boring quality and printed wiring board production reliability.
Fig. 1 is the structural representation of the preferred embodiment of a kind of boring backing plate of the present invention, as shown in Figure 1, described boring backing plate comprises supporting construction 2, gummed paper 1 in supporting construction 2 upper surface is suppressed in laminating and the gummed paper 3 suppressed in supporting construction 2 lower surface of fitting, described gummed paper 1 and gummed paper 3 are identical materials, make after gummed paper 1 and gummed paper 3 impregnated in string by the thermosetting resin being mixed with graphite powder through baking.Certainly the invention is not restricted to the structure that above-mentioned gummed paper is in surface, also can by having lubrication, the gummed paper of heat dispersion is in non-superficial layer, bit contact can play the effects such as lubrication, heat radiation equally to during gummed paper layer.
In sum, boring backing plate of one provided by the invention and preparation method thereof, by adding the graphite powder of certain proportion, order number, particle diameter in backing plate, make the performance that backing plate of the present invention has lubrication, heat radiation and conducts electricity, thus improve printed circuit board drill hole production efficiency, improve boring quality, improve production reliability, and reduce boring cost.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection domain that all should belong to claims of the present invention.
Claims (9)
1. a preparation method for boring backing plate, is characterized in that, comprises the following steps:
A, the thermosetting resin being mixed with graphite powder be impregnated in string after, through baking make gummed paper;
B, the gummed paper made is fitted in the upper and lower surface of supporting construction, be pressed into backing plate through heating.
2. boring backing plate according to claim 1, is characterized in that, described thermosetting resin is a kind of in phenolic resins, Lauxite, melmac.
3. boring backing plate according to claim 1, is characterized in that, the order number of described graphite powder is 200 ~ 3000 orders.
4. boring backing plate according to claim 1, is characterized in that, the mean particle dia of described graphite powder is 30 ~ 100 μm.
5. boring backing plate according to claim 1, is characterized in that, the volume ratio that described graphite powder accounts for gummed paper is 0.5% ~ 30%.
6. boring backing plate according to claim 1, is characterized in that, described supporting construction floods thermosetting resin by string to make through hot pressing.
7. boring backing plate according to claim 1, is characterized in that, the thickness of described gummed paper is 0.3 ~ 0.6mm.
8. boring backing plate according to claim 1, is characterized in that, the thickness of described backing plate is 1 ~ 3mm.
9. a boring backing plate, is characterized in that, adopt as arbitrary in claim 1 to 8 as described in preparation method be prepared from.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610033317.4A CN105500738A (en) | 2016-01-19 | 2016-01-19 | Backing board for drilling and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610033317.4A CN105500738A (en) | 2016-01-19 | 2016-01-19 | Backing board for drilling and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105500738A true CN105500738A (en) | 2016-04-20 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610033317.4A Pending CN105500738A (en) | 2016-01-19 | 2016-01-19 | Backing board for drilling and production method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105500738A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028657A (en) * | 2016-07-12 | 2016-10-12 | 奥士康科技股份有限公司 | PCB fast drill point retracting tool |
| CN109334179A (en) * | 2018-08-14 | 2019-02-15 | 烟台柳鑫新材料科技有限公司 | A kind of antistatic self-lubricating type PCB cover plate for drilling hole and preparation method thereof |
| CN110202902A (en) * | 2019-05-24 | 2019-09-06 | 烟台柳鑫新材料科技有限公司 | A kind of PCB back drill cover board and preparation method thereof |
| CN111805663A (en) * | 2020-06-02 | 2020-10-23 | 烟台柳鑫新材料科技有限公司 | Backing plate and preparation method thereof |
| CN114986726A (en) * | 2022-05-30 | 2022-09-02 | 宁夏盾源聚芯半导体科技股份有限公司 | Polysilicon cylinder processing device and polysilicon cylinder processing method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3700341A (en) * | 1970-07-27 | 1972-10-24 | Lcoa Laminating Co Of America | Laminated board and method of making same |
| CN103009762A (en) * | 2012-12-12 | 2013-04-03 | 湖南柳鑫电子新材料有限公司 | Melamine plate for drilling PCB (Printed Circuit Board), and preparation method thereof |
| CN103113546A (en) * | 2013-01-28 | 2013-05-22 | 宜昌武星材料科技有限责任公司 | Self-lubricating multi-element copolymerized thermosetting resin and preparation method and application thereof |
-
2016
- 2016-01-19 CN CN201610033317.4A patent/CN105500738A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3700341A (en) * | 1970-07-27 | 1972-10-24 | Lcoa Laminating Co Of America | Laminated board and method of making same |
| CN103009762A (en) * | 2012-12-12 | 2013-04-03 | 湖南柳鑫电子新材料有限公司 | Melamine plate for drilling PCB (Printed Circuit Board), and preparation method thereof |
| CN103113546A (en) * | 2013-01-28 | 2013-05-22 | 宜昌武星材料科技有限责任公司 | Self-lubricating multi-element copolymerized thermosetting resin and preparation method and application thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106028657A (en) * | 2016-07-12 | 2016-10-12 | 奥士康科技股份有限公司 | PCB fast drill point retracting tool |
| CN106028657B (en) * | 2016-07-12 | 2018-10-09 | 奥士康科技股份有限公司 | A kind of PCB quickly moves back the jig of drill point |
| CN109334179A (en) * | 2018-08-14 | 2019-02-15 | 烟台柳鑫新材料科技有限公司 | A kind of antistatic self-lubricating type PCB cover plate for drilling hole and preparation method thereof |
| CN110202902A (en) * | 2019-05-24 | 2019-09-06 | 烟台柳鑫新材料科技有限公司 | A kind of PCB back drill cover board and preparation method thereof |
| CN111805663A (en) * | 2020-06-02 | 2020-10-23 | 烟台柳鑫新材料科技有限公司 | Backing plate and preparation method thereof |
| CN114986726A (en) * | 2022-05-30 | 2022-09-02 | 宁夏盾源聚芯半导体科技股份有限公司 | Polysilicon cylinder processing device and polysilicon cylinder processing method |
| CN114986726B (en) * | 2022-05-30 | 2024-04-30 | 宁夏盾源聚芯半导体科技股份有限公司 | Polysilicon barrel processing device and polysilicon barrel processing method |
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| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20160420 |
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| RJ01 | Rejection of invention patent application after publication |