CN203951682U - High-performance coating lubricates cover plate - Google Patents
High-performance coating lubricates cover plate Download PDFInfo
- Publication number
- CN203951682U CN203951682U CN201420383854.8U CN201420383854U CN203951682U CN 203951682 U CN203951682 U CN 203951682U CN 201420383854 U CN201420383854 U CN 201420383854U CN 203951682 U CN203951682 U CN 203951682U
- Authority
- CN
- China
- Prior art keywords
- hole
- glue layer
- drill point
- resin bed
- element body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011248 coating agent Substances 0.000 title claims abstract description 10
- 238000000576 coating method Methods 0.000 title claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000000463 material Substances 0.000 claims abstract description 10
- 241001074085 Scophthalmus aquosus Species 0.000 claims abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000005030 aluminium foil Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 11
- 238000005520 cutting process Methods 0.000 abstract description 5
- 230000003670 easy-to-clean Effects 0.000 abstract description 4
- 235000013312 flour Nutrition 0.000 abstract description 4
- 239000000314 lubricant Substances 0.000 abstract description 4
- 238000005461 lubrication Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Drilling And Boring (AREA)
Abstract
The utility model discloses the lubricated cover plate of a kind of high-performance coating, processing aspect, position, hole for wiring board one brill or back drill, it comprises element body, because being provided with glue layer above described element body, when this glue layer can reduce drill point and rotates and the cutting break flour producing and the friction between the chip removal flute wall surface of drill point, play lubricant effect, increase smooth degree, thereby promote the effect of drill point useful life and drill point easy to clean.Meanwhile, also can act on hole wall and drill point, play lubrication, reduce the roughness of hole wall, thereby reach raising hole wall quality.Above described glue layer, be provided with resin bed, between this resin bed and glue layer, be provided with adhered layer.Described resin bed can prevent from skidding and being offset or crossing the unable support skew of soft generation because of material generation really up to the mark, effectively increases the locating effect of drill bit contact, thereby reaches position, the hole precision that improves location hole.
Description
[Ji Intraoperative field]
The utility model relates to a kind of lubricated cover plate of high-performance coating that uses consumptive material aspect for processing wiring board.
[Bei Jing Ji Intraoperative]
Along with constantly progressive and development forward of society, follow the demand for development of the high precision int of electronic product more and more higher.The high precision development of electronic product directly proposes high-precision requirement to wiring board processing, meanwhile, also makes the requirement of quality in position, the hole precision of drilling holes on circuit board and hole also more and more higher.Be aperture to small trend development, be accompanied by pitch of holes and also relatively start highdensity concentrating, therefore, corresponding cover plate for quality in Wei He hole, hole also starts development in pluralism, yet, existing traditional upper cover plate product occurs for quality in Wei He hole, hole and respectively, often can solve position, hole technical problem and cause again quality decline hole in, in hole quality-improving and cannot take into account the positioning precision of position, hole.
[utility model content]
Technical purpose of the present utility model is to provide a kind of positioning precision that both can improve position, hole in order to solve the problem of above-mentioned prior art existence, can improve again the lubricated cover plate of high-performance coating of quality in hole.
In order to realize above-mentioned technical problem, the utility model provides a kind of high-performance coating to lubricate cover plate, processing aspect, position, hole for wiring board one brill or back drill, it comprises element body, above described element body, be provided with for improving the glue layer of position, the hole quality of processed location hole, this is provided with above glue layer for improving the resin bed of position, the hole positioning precision of processed location, between this resin bed and glue layer, is provided with adhered layer; Described element body consists of metal aluminium flake or aluminium foil; Described glue layer is to consist of water soluble glue or thermosetting resin glue; The diameter of position, described hole is 0.1 millimeter to 6.35 millimeters.
According to described technical characteristics, described element body comprises aluminium flake and is pasted on material layer and the resin bed on aluminium flake.
The beneficial effects of the utility model: because being provided with glue layer above described element body, when this glue layer can reduce drill point and rotates and the cutting break flour producing and the friction between the chip removal flute wall surface of drill point, play lubricant effect, increase smooth degree, thereby promote the effect of drill point useful life and drill point easy to clean.Meanwhile, also can act on hole wall and drill point, play lubrication, reduce the roughness of hole wall, thereby reach raising hole wall quality.Above described glue layer, be provided with resin bed, between this resin bed and glue layer, be provided with adhered layer.Described resin bed can prevent from skidding and being offset or crossing the unable support skew of soft generation because of material generation really up to the mark, effectively increases the locating effect of drill bit contact, thereby reaches position, the hole precision that improves location hole.
Below in conjunction with drawings and Examples, the technical solution of the utility model is described in further detail.
[accompanying drawing explanation]
Fig. 1 is the schematic diagram of the lubricated cover plate of high-performance coating in the utility model.
[specific embodiment]
Please refer to shown in Fig. 1, below in conjunction with a kind of embodiment, illustrate that a kind of high-performance coating lubricates cover plate, comprise element body 1, glue layer 2, resin bed 3 and adhered layer 4.
Described element body 1 is to consist of metal aluminium flake or aluminium foil.Described glue layer 2 is to consist of water soluble glue or thermosetting resin glue.Described adhered layer 4 is to consist of special material.Described location hole diameter is 0.1 millimeter to 6.35 millimeters.
In the present embodiment, glue layer 2 is pasted on aluminium flake upper surface, and described adhered layer 4 laminating glue layer 2 upper surfaces, described resin bed 3 is coated on adhered layer 4 upper surfaces, then, and through extruding and moulding.Described resin bed 3 can prevent because of the material generation really up to the mark skew of skidding, or crosses soft generations and support skew without putting forth effort, and effectively increases the locating effect that drill point 5 contacts, and improves position, the hole precision of processed location hole.
Described glue layer 2 can be followed the rotation of drill point 5, and is attached to the chip removal flute wall surface of drill point 5, reduces the friction of break flour and furrow bank, plays lubricant effect, increases the smooth degree of chip removal, thereby promotes 5 life-spans of drill point and drill point easy to clean 5; Main Function, in hole wall and drill point 5, plays lubrication simultaneously, reduces the roughness of hole wall.After boring, become fine-powder and can effectively clean drill groove 6.Therefore, thus reach the hole wall quality that improves processed location hole.Described aluminium flake can effectively reduce the heat in metal cutting that drill point 5 produces in boring procedure, cooling drill point 5.
This kind of processing mode, is mainly applicable to being used in 0.1 millimeter to pcb board or the FPC plate of 6.35 mm dia scope borings.This kind of processing mode carries out customized according to the different product structure of client and demand, realize the requirement of client's diversification.In addition, affected by humiture smaller, temperature is controlled below 40 degree Celsius, and humidity is controlled at below 80%, horizontal positioned.This kind of processing mode, also tool has the following advantages, and effectively promotes position, the hole precision of the borings such as plate of PEB special material or BGA or HDI or soft board or soft or hard combination.Effectively reduce the Hole Wall Roughness of boring, abrasion protection pcb board face, prevents rig pressure foot to the scratch of plate face and reduces burr.Effectively reduce the broken needle rate in the boring procedures such as thick copper coin or halogen or B7 plate or aluminium base or ceramic infill panel, promote general material and lamination quantity, improving production efficiency, increases the output value.Reduce heat in metal cutting, reduce the clean difficulty of groove on drill point 5, increase the life-span of drill point 5, reduce the quantity consumed of drill point 5, improve the stability of the integral body boring quality of product, reduce the quality related cost of boring.Can suitably promote the machined parameters of rig, increase the effective rate of utilization of rig, increase the output value.
During use, resin bed 3, the large pcb board such as covers upward under aluminium flake face, and U.S. line gummed paper or mechanical means are used in four limits.
In sum, because described element body 1 is provided with glue layer 2 above, when this glue layer 2 can reduce drill point 5 and rotates and the cutting break flour producing and the friction between the chip removal flute wall surface of drill point 5, play lubricant effect, increase smooth degree, thereby promote the effect of 5 useful lifes of drill point and drill point easy to clean 5.Meanwhile, also can act on hole wall and drill point 5, play lubrication, reduce the roughness of hole wall, thereby reach raising hole wall quality.Described glue layer 2 is provided with resin bed 3 above, between this resin bed 3 and glue layer 2, is provided with adhered layer 4.Described resin bed 3 can prevent because of the material generation really up to the mark skew of skidding, or crosses the unable support skew of soft generation, effectively increases the locating effect of drill bit contact, thereby reaches the positioning precision that improves location hole.
Claims (2)
1. a high-performance coating lubricates cover plate, processing aspect, position, hole for wiring board one brill or back drill, it comprises element body, it is characterized in that: above described element body, be provided with for improving the glue layer of position, the hole quality of processed location hole, this is provided with above glue layer for improving the resin bed of position, the hole positioning precision of processed location, between this resin bed and glue layer, is provided with adhered layer; Described element body consists of metal aluminium flake or aluminium foil; Described glue layer is to consist of water soluble glue or thermosetting resin glue; The diameter of position, described hole is 0.1 millimeter to 6.35 millimeters.
2. the lubricated cover plate of high-performance coating according to claim 1, is characterized in that: described element body comprises aluminium flake and is pasted on material layer and the resin bed on aluminium flake.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420383854.8U CN203951682U (en) | 2014-07-11 | 2014-07-11 | High-performance coating lubricates cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420383854.8U CN203951682U (en) | 2014-07-11 | 2014-07-11 | High-performance coating lubricates cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203951682U true CN203951682U (en) | 2014-11-19 |
Family
ID=51893695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420383854.8U Expired - Lifetime CN203951682U (en) | 2014-07-11 | 2014-07-11 | High-performance coating lubricates cover plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203951682U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552415A (en) * | 2014-12-31 | 2015-04-29 | 广东工业大学 | Multi-layer structured cover plate for improving drilling position precision of flexible PCB (printed circuit board) |
| CN105945326A (en) * | 2016-07-18 | 2016-09-21 | 苏州工业园区杰智汇电子材料有限公司 | Circuit board drilling cover plate for deep drilling control and control method |
| CN110626019A (en) * | 2019-09-02 | 2019-12-31 | 深圳市宏宇辉科技有限公司 | Back-drilling aluminum foil cover plate |
| CN111002679A (en) * | 2019-12-02 | 2020-04-14 | 深圳市宏宇辉科技有限公司 | Back-drilling composite cover plate and machining process thereof |
| CN112873404A (en) * | 2021-01-12 | 2021-06-01 | 深圳市宏宇辉科技有限公司 | Lubricating cold punching plate |
-
2014
- 2014-07-11 CN CN201420383854.8U patent/CN203951682U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104552415A (en) * | 2014-12-31 | 2015-04-29 | 广东工业大学 | Multi-layer structured cover plate for improving drilling position precision of flexible PCB (printed circuit board) |
| CN104552415B (en) * | 2014-12-31 | 2017-07-14 | 广东工业大学 | A kind of sandwich construction cover plate for improving flexible print wiring board drilling hole position precision |
| CN105945326A (en) * | 2016-07-18 | 2016-09-21 | 苏州工业园区杰智汇电子材料有限公司 | Circuit board drilling cover plate for deep drilling control and control method |
| CN110626019A (en) * | 2019-09-02 | 2019-12-31 | 深圳市宏宇辉科技有限公司 | Back-drilling aluminum foil cover plate |
| CN111002679A (en) * | 2019-12-02 | 2020-04-14 | 深圳市宏宇辉科技有限公司 | Back-drilling composite cover plate and machining process thereof |
| CN112873404A (en) * | 2021-01-12 | 2021-06-01 | 深圳市宏宇辉科技有限公司 | Lubricating cold punching plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN HONGYUHUI TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: ZHU SANYUN Effective date: 20150410 Free format text: FORMER OWNER: XIE YAO Effective date: 20150410 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| CB03 | Change of inventor or designer information |
Inventor after: Zhu Sanyun Inventor after: Zhu Dasheng Inventor before: Zhu Sanyun |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 422000 SHAOYANG, HUNAN PROVINCE TO: 518104 SHENZHEN, GUANGDONG PROVINCE Free format text: CORRECT: INVENTOR; FROM: ZHU SANYUN TO: ZHU SANYUN ZHU DASHENG |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150410 Address after: 518104, No. 1, No. fourth, building B, No.1 Industrial Zone, Gonghe first industrial district, Baoan District, Shenzhen, Guangdong Patentee after: SHENZHEN HONGYUHUI TECHNOLOGY CO.,LTD. Address before: 422000 Shaoyang province Hunan city Daxiang District Tan Jiang Xiang Shuangjiang village 6 Group No. 255 of No. 2 Patentee before: Zhu Sanyun Patentee before: Xie Yao |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20230907 Address after: No. 606, Unit 2, Building 28, Taoyuanju District 10, Qianjin Second Road, Bao'an District, Shenzhen City, Guangdong Province, 518000 Patentee after: Song Yuqi Address before: No. 1, 1st Floor, Building 4, Zone B, Gonghe First Industrial Zone, Shajing Street, Bao'an District, Shenzhen City, Guangdong Province, 518104 Patentee before: SHENZHEN HONGYUHUI TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right |