CN203267351U - Heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate - Google Patents
Heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate Download PDFInfo
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- CN203267351U CN203267351U CN 201320181352 CN201320181352U CN203267351U CN 203267351 U CN203267351 U CN 203267351U CN 201320181352 CN201320181352 CN 201320181352 CN 201320181352 U CN201320181352 U CN 201320181352U CN 203267351 U CN203267351 U CN 203267351U
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Abstract
The utility model relates to a heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate. The heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate is characterized by being formed by composite copper foil I (1), alkali-free glass fiber cloth I (2), wood fiber paper I (3), alkali-free glass fiber cloth II (4), wood fiber paper II (5), alkali-free glass fiber cloth III (6) and a copper coil II (7) mounted in sequence from top to bottom. The heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate disclosed by the utility model has small possibility of foaming, is good in anti-ageing performance and strong in heat-resisting performance, has small possibility of deformation when being used under a high-temperature environment, is high in mechanical strength and is suitable for large-space and complicated conditions.
Description
Technical field
The utility model relates to a kind of copper-clad plate, relates in particular to the glass cloth coated Copper Foil double face copper of the bisphenol A modified paper substrate of a kind of heat resistant type.Be mainly used in the substrate of printed circuit board.
Background technology
Copper-clad laminate is the extremely important basic material of printed circuit board, the printed circuit board of various multi-form, difference in functionalitys, be all process selectively on copper-clad laminate, the operation such as etching, boring and copper facing, make different printed circuits.Baseplate material during copper-clad laminate is made as printed circuit board, printed circuit board is mainly played interconnection, insulation and support, transmission speed, energy loss and characteristic impedance etc. to signal in circuit have a great impact, therefore, the processability in the performance of printed circuit board, quality, manufacturing, manufacture level, manufacturing cost and long-term reliability and stability depend on copper-clad laminate to a great extent.
The glass cloth coated copper-clad laminate of existing paper substrate, it is composited by top one deck Copper Foil, middle 3-8 layer wood-fibred insulating paper and following one deck Copper Foil, and described wood-fibred insulating paper is impregnated with tung oil-modified or Cardanol Modified PF Resin, consists of the phenolic aldehyde paper substrate.Due to its bad adhesion, the easy layering of product, foaming, heat resistance is poor, uses under hot environment, easily produce distortion, and intensity is low, when the large space of a whole page uses, easy fracture.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provide the bisphenol A modified paper substrate of a kind of heat resistant type glass cloth coated Copper Foil double face copper, it is not easy to foaming, ageing-resistant performance good, heat resistance is strong, use under hot environment, be difficult for producing distortion, and mechanical strength is high, is fit to the large space of a whole page, complex condition use.
The purpose of this utility model is achieved in that the glass cloth coated Copper Foil double face copper of the bisphenol A modified paper substrate of a kind of heat resistant type, and it is composited by Copper Foil I, alkali-free glass fiber cloth I, wood-fibred ply of paper I, alkali-free glass fiber cloth II, wood-fibred ply of paper II, alkali-free glass fiber cloth III and Copper Foil II from top to bottom successively; Described alkali-free glass fiber cloth I, alkali-free glass fiber cloth II and alkali-free glass fiber cloth III are impregnated with epoxy phenolics, and described wood-fibred ply of paper I and wood-fibred ply of paper II are impregnated with bisphenol A modified phenolic resin.
Described wood-fibred ply of paper I has the 2-8 layer, and wood-fibred ply of paper II has the 2-8 layer.
Characteristics of the present utility model are:
The glass cloth coated Copper Foil double face copper of the bisphenol A modified paper substrate of the utility model heat resistant type adopts three layers of alkali-free glass fiber cloth, strengthens heat resistance strong, uses under hot environment, is difficult for producing distortion; Strengthen its intensity, mechanical strength is high, peel resistant strength good, is fit to the large space of a whole page, complex condition uses, and wood-fibred ply of paper I and wood-fibred ply of paper II dipping bisphenol A modified phenolic resin are easy to foaming, ageing-resistant performance good, can extend the life-span that makes of circuit board.
Description of drawings
Fig. 1 is the section structure schematic diagram of the glass cloth coated Copper Foil double face copper of the bisphenol A modified paper substrate of the utility model heat resistant type.
In figure:
1--Copper Foil I;
2--alkali-free glass fiber cloth I;
3--wood-fibred paper I;
4--alkali-free glass fiber cloth II;
5--wood-fibred paper II;
6--alkali-free glass fiber cloth III;
7--Copper Foil II.
The specific embodiment
Referring to Fig. 1, the glass cloth coated Copper Foil double face copper of the bisphenol A modified paper substrate of the heat resistant type that the utility model relates to, it is composited by Copper Foil I 1, alkali-free glass fiber cloth I 2, wood-fibred paper I 3, alkali-free glass fiber cloth II 4, wood-fibred paper II 5, alkali-free glass fiber cloth III 6 and Copper Foil II 7 from top to bottom successively.
Described alkali-free glass fiber cloth I 2, alkali-free glass fiber cloth II 4 and alkali-free glass fiber cloth III 6 are impregnated with epoxy phenolics, and described wood-fibred ply of paper I 3 and wood-fibred ply of paper II 5 are impregnated with bisphenol A modified phenolic resin.
Described wood-fibred ply of paper I 3 has the 2-8 layer, and wood-fibred ply of paper II 5 has the 2-8 layer, and the number of plies of described wood-fibred ply of paper I 3 and wood-fibred ply of paper II 5 can be the same or different, and is decided according to the actual requirements.
The glass cloth coated copper-clad laminate of bisphenol A modified paper substrate of the present invention's preparation, the key technical indexes and economic indicator are as follows:
1, product can be done in 260 ℃ of tin cylinders in the test of bubbling, keep 40 seconds not stratified, non-foaming.
2, peel strength is high: through 260 ℃, after 20s immersed solder, can reach 1.7 N/mm.
3, good electrical property:
Sheet resistance: after constant humid heat treatment is recovered, (40 ± 2 ℃, RH:90 ~ 95%, 96 ± 1h controls the recovery condition, recovers 90 ± 15min), can reach 220000 M Ω, in the time of 100 ℃ (60min), can reach 350000M Ω.
Volume resistance: after constant humid heat treatment is recovered, (40 ± 2 ℃, RH:90 ~ 95%, 96 ± 1h controls the recovery condition, recovers 90 ± 15min), can reach 610000 M Ω m, in the time of 100 ℃ (60min), can reach 800000M Ω m.
Claims (3)
1. glass cloth coated Copper Foil double face copper of the bisphenol A modified paper substrate of heat resistant type, it is characterized in that: it is composited by Copper Foil I (1), alkali-free glass fiber cloth I (2), wood-fibred paper I (3), alkali-free glass fiber cloth II (4), wood-fibred paper II (5), alkali-free glass fiber cloth III (6) and Copper Foil II (7) from top to bottom successively.
2. the glass cloth coated Copper Foil double face copper of the bisphenol A modified paper substrate of heat resistant type according to claim 1, it is characterized in that: described alkali-free glass fiber cloth I (2), alkali-free glass fiber cloth II (4) and alkali-free glass fiber cloth III (6) are impregnated with epoxy phenolics, and described wood-fibred ply of paper I (3) and wood-fibred ply of paper II (5) are impregnated with bisphenol A modified phenolic resin.
3. the glass cloth coated Copper Foil double face copper of the bisphenol A modified paper substrate of heat resistant type according to claim 1 and 2, it is characterized in that: described wood-fibred ply of paper I (3) has the 2-8 layer, and wood-fibred ply of paper II (5) has the 2-8 layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320181352 CN203267351U (en) | 2013-04-12 | 2013-04-12 | Heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320181352 CN203267351U (en) | 2013-04-12 | 2013-04-12 | Heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203267351U true CN203267351U (en) | 2013-11-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320181352 Expired - Fee Related CN203267351U (en) | 2013-04-12 | 2013-04-12 | Heat-resisting type bisphenol A modified paper-base glass cloth copper-foil-clad double-sided copper-clad plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN203267351U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110406203A (en) * | 2019-08-16 | 2019-11-05 | 南亚电子材料(惠州)有限公司 | A kind of heat-resisting composite-based copper clad plate |
-
2013
- 2013-04-12 CN CN 201320181352 patent/CN203267351U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110406203A (en) * | 2019-08-16 | 2019-11-05 | 南亚电子材料(惠州)有限公司 | A kind of heat-resisting composite-based copper clad plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20140412 |