CN203267355U - Enhanced-type bisphenol A modified paper-based glass cloth copper foil-clad single-sided copper-clad laminate - Google Patents
Enhanced-type bisphenol A modified paper-based glass cloth copper foil-clad single-sided copper-clad laminate Download PDFInfo
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- CN203267355U CN203267355U CN 201320181460 CN201320181460U CN203267355U CN 203267355 U CN203267355 U CN 203267355U CN 201320181460 CN201320181460 CN 201320181460 CN 201320181460 U CN201320181460 U CN 201320181460U CN 203267355 U CN203267355 U CN 203267355U
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- copper foil
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- clad
- cloth
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Abstract
The utility model relates to an enhanced-type bisphenol A modified paper-based glass cloth copper foil-clad single-sided copper-clad laminate which is characterized in that the glass cloth copper foil-clad single-sided copper-clad laminate is formed by composite copper foil (1), alkali-free glass fiber cloth I (2), wood fiber paper I (3), alkali-free glass fiber cloth II (4), wood fiber paper II (5) and alkali-free glass fiber cloth III (6) disposed sequentially from top to bottom. According to the enhanced type bisphenol A modified paper-based glass cloth copper foil-clad single-sided copper-clad laminate, the strength is enhanced through three layers of alkali-free glass fiber cloth; the enhanced type bisphenol A modified paper-based glass cloth copper foil-clad single-sided copper-clad laminate is high in mechanical strength, good in peeling strength and suitable for large-layout and complicated conditions; and the wood fiber paper layer I and the wood fiber paper layer II are soaked with bisphenol-A-modified phenolic resin, so that the enhanced type bisphenol A modified paper-based glass cloth copper foil-clad single-sided copper-clad laminate is not easy to generate blister, and good in anti-aging property, and the service life of a circuit board can be prolonged.
Description
Technical field
The utility model relates to a kind of copper-clad plate, relates in particular to the glass cloth coated Copper Foil single-side coated copper plate of the bisphenol A modified paper substrate of a kind of enhancement mode.Be mainly used in the substrate of printed circuit board.
Background technology
Copper-clad laminate is the extremely important basic material of printed circuit board, the printed circuit board of various multi-form, difference in functionalitys, be all process selectively on copper-clad laminate, the operation such as etching, boring and copper facing, make different printed circuits.Baseplate material during copper-clad laminate is made as printed circuit board, printed circuit board is mainly played interconnection, insulation and support, transmission speed, energy loss and characteristic impedance etc. to signal in circuit have a great impact, therefore, the processability in the performance of printed circuit board, quality, manufacturing, manufacture level, manufacturing cost and long-term reliability and stability depend on copper-clad laminate to a great extent.
The glass cloth coated copper-clad laminate of existing paper substrate, it is composited by top one deck Copper Foil, middle 3-8 layer wood-fibred insulating paper and following one deck Copper Foil, and described wood-fibred insulating paper is impregnated with tung oil-modified or Cardanol Modified PF Resin, consists of the phenolic aldehyde paper substrate.Due to its bad adhesion, the easy layering of product, foaming; And intensity is low, when the large space of a whole page uses, and easy fracture.
Summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides the bisphenol A modified paper substrate of a kind of enhancement mode glass cloth coated Copper Foil single-side coated copper plate, and it is not easy to foaming, ageing-resistant performance good, and mechanical strength is high, is fit to the large space of a whole page, complex condition use.
The purpose of this utility model is achieved in that the glass cloth coated Copper Foil single-side coated copper plate of the bisphenol A modified paper substrate of a kind of enhancement mode, and it is composited by Copper Foil, alkali-free glass fiber cloth I, wood-fibred ply of paper I, alkali-free glass fiber cloth II, wood-fibred ply of paper II and alkali-free glass fiber cloth III from top to bottom successively; Described alkali-free glass fiber cloth I, alkali-free glass fiber cloth II and alkali-free glass fiber cloth III are impregnated with epoxy phenolics, and described wood-fibred ply of paper I and wood-fibred ply of paper II are impregnated with bisphenol A modified phenolic resin.
Described wood-fibred ply of paper I has the 2-8 layer, and wood-fibred ply of paper II has the 2-8 layer.
Characteristics of the present utility model are:
The glass cloth coated Copper Foil single-side coated copper plate of the bisphenol A modified paper substrate of the utility model enhancement mode, adopt three layers of alkali-free glass fiber cloth, strengthen its intensity, mechanical strength is high, peel resistant strength good, be fit to the large space of a whole page, complex condition use, wood-fibred ply of paper I and wood-fibred ply of paper II dipping bisphenol A modified phenolic resin, not easy to foaming, ageing-resistant performance good, can extend the life-span that makes of circuit board.
Description of drawings
Fig. 1 is the section structure schematic diagram of the glass cloth coated Copper Foil single-side coated copper plate of the bisphenol A modified paper substrate of the utility model enhancement mode.
In figure:
The 1--Copper Foil;
2--alkali-free glass fiber cloth I;
3--wood-fibred paper I;
4--alkali-free glass fiber cloth II;
5--wood-fibred paper II;
6--alkali-free glass fiber cloth III.
The specific embodiment
Referring to Fig. 1, the glass cloth coated Copper Foil single-side coated copper plate of the bisphenol A modified paper substrate of the enhancement mode that the utility model relates to, it is composited by Copper Foil 1, alkali-free glass fiber cloth I 2, wood-fibred paper I 3, alkali-free glass fiber cloth II 4, wood-fibred paper II 5 and alkali-free glass fiber cloth III 6 from top to bottom successively.
Described alkali-free glass fiber cloth I 2, alkali-free glass fiber cloth II 4 and alkali-free glass fiber cloth III 6 are impregnated with epoxy phenolics, and described wood-fibred ply of paper I 3 and wood-fibred ply of paper II 5 are impregnated with bisphenol A modified phenolic resin.
Described wood-fibred ply of paper I 3 has the 2-8 layer, and wood-fibred ply of paper II 5 has the 2-8 layer, and the number of plies of described wood-fibred ply of paper I 3 and wood-fibred ply of paper II 5 can be the same or different, and is decided according to the actual requirements.
The glass cloth coated copper-clad laminate of bisphenol A modified paper substrate of the present invention's preparation, the key technical indexes and economic indicator are as follows:
1, product can be done in 260 ℃ of tin cylinders in the test of bubbling, keep 40 seconds not stratified, non-foaming.
2, peel strength is high: through 260 ℃, after 20s immersed solder, can reach 1.7 N/mm.
3, good electrical property:
Sheet resistance: after constant humid heat treatment is recovered, (40 ± 2 ℃, RH:90 ~ 95%, 96 ± 1h controls the recovery condition, recovers 90 ± 15min), can reach 220000 M Ω, in the time of 100 ℃ (60min), can reach 350000M Ω.
Volume resistance: after constant humid heat treatment is recovered, (40 ± 2 ℃, RH:90 ~ 95%, 96 ± 1h controls the recovery condition, recovers 90 ± 15min), can reach 610000 M Ω m, in the time of 100 ℃ (60min), can reach 800000M Ω m.
Claims (3)
1. glass cloth coated Copper Foil single-side coated copper plate of the bisphenol A modified paper substrate of enhancement mode, it is characterized in that: it is composited by Copper Foil (1), alkali-free glass fiber cloth I (2), wood-fibred paper I (3), alkali-free glass fiber cloth II (4), wood-fibred paper II (5) and alkali-free glass fiber cloth III (6) from top to bottom successively.
2. the glass cloth coated Copper Foil single-side coated copper plate of the bisphenol A modified paper substrate of enhancement mode according to claim 1, it is characterized in that: described alkali-free glass fiber cloth I (2), alkali-free glass fiber cloth II (4) and alkali-free glass fiber cloth III (6) are impregnated with epoxy phenolics, and described wood-fibred ply of paper I (3) and wood-fibred ply of paper II (5) are impregnated with bisphenol A modified phenolic resin.
3. the glass cloth coated Copper Foil single-side coated copper plate of the bisphenol A modified paper substrate of enhancement mode according to claim 1 and 2, it is characterized in that: described wood-fibred ply of paper I (3) has the 2-8 layer, and wood-fibred ply of paper II (5) has the 2-8 layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320181460 CN203267355U (en) | 2013-04-12 | 2013-04-12 | Enhanced-type bisphenol A modified paper-based glass cloth copper foil-clad single-sided copper-clad laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320181460 CN203267355U (en) | 2013-04-12 | 2013-04-12 | Enhanced-type bisphenol A modified paper-based glass cloth copper foil-clad single-sided copper-clad laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203267355U true CN203267355U (en) | 2013-11-06 |
Family
ID=49497832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320181460 Expired - Fee Related CN203267355U (en) | 2013-04-12 | 2013-04-12 | Enhanced-type bisphenol A modified paper-based glass cloth copper foil-clad single-sided copper-clad laminate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203267355U (en) |
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2013
- 2013-04-12 CN CN 201320181460 patent/CN203267355U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20150412 |
|
| EXPY | Termination of patent right or utility model |