CN210444553U - High wiring density printed circuit board - Google Patents
High wiring density printed circuit board Download PDFInfo
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- CN210444553U CN210444553U CN201920788688.2U CN201920788688U CN210444553U CN 210444553 U CN210444553 U CN 210444553U CN 201920788688 U CN201920788688 U CN 201920788688U CN 210444553 U CN210444553 U CN 210444553U
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- printed circuit
- circuit board
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Abstract
The utility model discloses a high wiring density printed circuit board, which comprises a printed circuit board main body and a through hole system; the printed circuit board main body comprises at least three double-sided printed circuit boards which are aligned from top to bottom, and a rubber insulating layer is arranged between every two adjacent double-sided printed circuit boards; the via hole system is the hole that has electroplated copper on the inner peripheral face, the via hole system includes the through-hole, buries hole and blind hole, and the printed circuit of terminal surface is connected through the through-hole under the printed circuit of the double-sided printed circuit board of the top and the double-sided printed circuit board of bottom, the utility model discloses add the mode of bonding on the basis of pressfitting to effectively avoid the circuit board to take place the possibility of layering at the in-process that uses, guarantee the normal life of circuit board, possess corresponding insulating buffer structure, effectively improve the shock resistance of circuit board, avoid the circuit board because of receiving the fracture of strikeing, guarantee the normal work of circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a high wiring density printed circuit board.
Background
The printed circuit board is a provider of electrical connection of electronic components, and is mainly designed in a domain layout; the circuit board has the main advantages that wiring and assembly errors are greatly reduced, the automation level and the production labor rate are improved, the circuit board can be divided into a single-sided board, a double-sided board and the like according to the number of layers of the circuit board, at present, in order to ensure the high wiring density of the printed circuit board, the number of layers of the multilayer circuit board is usually pressed together, but the method has certain defects, on one hand, the connection between the circuit boards is realized in a direct pressing mode, in the using process, the layering phenomenon easily occurs, the normal use of the printed circuit board is influenced, on the other hand, the existing circuit board has the defects of large area, small thickness and impact resistance, and the defects easily occur.
SUMMERY OF THE UTILITY MODEL
The to-be-solved technical problem of the utility model is to overcome current defect, provide a high wiring density printed circuit board, add the mode of bonding on the basis of pressfitting, possess corresponding insulating buffer structure, effectively improve the shock resistance of circuit board, can effectively solve the problem in the background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high wiring density printed circuit board includes a printed circuit board main body and a via system;
printed wiring board main part: the printed circuit board main body comprises at least three double-sided printed circuit boards which are aligned from top to bottom, and a rubber insulating layer is arranged between every two adjacent double-sided printed circuit boards;
via hole system: the through hole system is a hole with copper plated on the inner circumferential surface, the through hole system comprises a through hole, a buried hole and a blind hole, and the impact resistance of the circuit board is improved by adding a rubber insulating layer between circuit boards of the circuit board.
Further, still include the glue film, the glue film is located between two-sided printed wiring board and the rubber insulation layer, two-sided printed wiring board and rubber insulation layer are connected, and the glue film guarantees that joint strength between each part of printed circuit board avoids the layering.
Furthermore, the printed circuit on the upper end face of the double-sided printed circuit board at the uppermost end is connected with the printed circuit on the lower end face of the double-sided printed circuit board at the lowermost end through a through hole, and the through hole is convenient for realizing the connection between the printed circuit on the uppermost layer and the printed circuit on the lowermost layer of the circuit board.
Furthermore, the printed circuit on the lower end face of the uppermost double-sided printed circuit board is connected with the printed circuit on the middle double-sided printed circuit board through the buried holes, the printed circuit on the lower end face of the uppermost double-sided printed circuit board is connected with the printed circuit on the upper end face of the lowermost double-sided printed circuit board through the buried holes, and the buried holes are convenient for realizing the connection between the printed circuits on the middle layers.
Furthermore, the printed circuit on the upper end face of the uppermost double-sided printed circuit board is connected with the printed circuit on the middle double-sided printed circuit board through the blind hole, the printed circuit on the upper end face of the uppermost double-sided printed circuit board is connected with the printed circuit on the upper end face of the lowermost double-sided printed circuit board through the blind hole, the printed circuit on the lower end face of the lowermost double-sided printed circuit board is connected with the printed circuit on the middle double-sided printed circuit board through the blind hole, the printed circuit on the lower end face of the lowermost double-sided printed circuit board is connected with the printed circuit on the lower end face of the uppermost double-sided printed circuit board through the blind hole, and the connection between the printed circuit on the uppermost layer and the middle printed circuit, and the connection between the.
Compared with the prior art, the beneficial effects of the utility model are that: the high wiring density printed circuit board has the following advantages:
simple structure, convenient to use add the mode of bonding on the basis of pressfitting to effectively avoid the circuit board to take place the possibility of layering at the in-process that uses, guarantee the normal life of circuit board, possess corresponding insulating buffer structure, effectively improve the shock resistance of circuit board, avoid the circuit board because of receiving the fracture of strikeing, guarantee the normal work of circuit board.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic view of the cross-sectional structure of the present invention.
In the figure: 1 printed circuit board main body, 11 double-sided printed circuit board, 12 rubber insulation layer, 2 glue layer, 3 through hole system, 31 through hole, 32 buried hole, 33 blind hole.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: a high wiring density printed circuit board includes a printed wiring board main body 1 and a via hole system 3;
printed wiring board main body 1: the printed circuit board main body 1 comprises at least three double-sided printed circuit boards 11 which are aligned from top to bottom, and a rubber insulating layer 12 is arranged between every two adjacent double-sided printed circuit boards 11;
via system 3: the via hole system 3 is a hole having an inner circumferential surface plated with copper, the via hole system 3 includes a through hole 31, a buried hole 32 and a blind hole 33, a printed circuit on the upper end surface of the uppermost double-sided printed wiring board 11 and a printed circuit on the lower end surface of the lowermost double-sided printed wiring board 11 are connected through the through hole 31, the through hole 31 facilitates connection between the uppermost printed circuit and the lowermost printed circuit of the boards, a printed circuit on the lower end surface of the uppermost double-sided printed wiring board 11 and a printed circuit on the middle double-sided printed wiring board 11 are connected through the buried hole 32, a printed circuit on the lower end surface of the uppermost double-sided printed wiring board 11 and a printed circuit on the upper end surface of the lowermost double-sided printed wiring board 11 are connected through the buried hole 32, the buried hole 32 facilitates connection between the printed circuits of the middle layers, a printed circuit on the upper end surface of the uppermost double-sided printed wiring board 11 and a printed circuit, the printed circuit on the upper end face of the double-sided printed circuit board 11 at the uppermost end is connected with the printed circuit on the upper end face of the double-sided printed circuit board 11 at the lowermost end through a blind hole 33, the printed circuit on the lower end face of the double-sided printed circuit board 11 at the lowermost end is connected with the printed circuit on the middle double-sided printed circuit board 11 through a blind hole 33, the printed circuit on the lower end face of the double-sided printed circuit board 11 at the lowermost end is connected with the printed circuit on the lower end face of the double-sided printed circuit board 11 at the uppermost end through a blind hole 33, the connection between the printed circuit and the middle printed circuit at the uppermost layer and the connection between the printed circuit and the middle printed circuit at the lowermost layer are facilitated through.
The double-sided printed circuit board comprises a double-sided printed circuit board 11 and a rubber insulating layer 12, and the glue layer 2 is arranged between the double-sided printed circuit board 11 and the rubber insulating layer 12, and the double-sided printed circuit board 11 is connected with the rubber insulating layer 12 through a blind hole 33, so that connection between the printed circuit on the uppermost layer and the printed circuit on the middle layer and connection between the printed circuit on the lowermost layer and the printed circuit on the.
When in use: the connection between the printed circuit boards of the circuit board is realized through the glue layer 2, the impact resistance of the circuit board is improved through the rubber insulating layer 12, the connection between the printed circuit boards of the uppermost layer and the lowest layer is realized through the through hole 31, the connection between the printed circuit boards of the middle layer is realized through the buried hole 32, and the connection between the printed circuit boards of the uppermost layer and the middle printed circuit boards and the connection between the printed circuit boards of the lowest layer and the middle printed circuit boards are realized through the blind hole 33.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A high wiring density printed circuit board characterized by: comprises a printed circuit board main body (1) and a through hole system (3);
printed wiring board main body (1): the printed circuit board main body (1) comprises at least three double-sided printed circuit boards (11) which are aligned and distributed from top to bottom, and a rubber insulating layer (12) is arranged between every two adjacent double-sided printed circuit boards (11);
via system (3): the through hole system (3) is a hole with copper plated on the inner circumferential surface, and the through hole system (3) comprises a through hole (31), a buried hole (32) and a blind hole (33).
2. A high wiring density printed circuit board according to claim 1, characterized in that: the rubber layer (2) is located between the double-sided printed circuit board (11) and the rubber insulating layer (12), and the double-sided printed circuit board (11) is connected with the rubber insulating layer (12).
3. A high wiring density printed circuit board according to claim 1, characterized in that: the printed circuit on the upper end face of the double-sided printed wiring board (11) at the uppermost end and the printed circuit on the lower end face of the double-sided printed wiring board (11) at the lowermost end are connected by a through hole (31).
4. A high wiring density printed circuit board according to claim 1, characterized in that: the printed circuit on the lower end face of the double-sided printed circuit board (11) at the uppermost end is connected with the printed circuit on the double-sided printed circuit board (11) at the middle through the buried holes (32), and the printed circuit on the lower end face of the double-sided printed circuit board (11) at the uppermost end is connected with the printed circuit on the upper end face of the double-sided printed circuit board (11) at the lowermost end through the buried holes (32).
5. A high wiring density printed circuit board according to claim 1, characterized in that: the printed circuit on the upper end face of the uppermost double-sided printed circuit board (11) is connected with the printed circuit on the middle double-sided printed circuit board (11) through blind holes (33), the printed circuit on the upper end face of the uppermost double-sided printed circuit board (11) is connected with the printed circuit on the upper end face of the lowermost double-sided printed circuit board (11) through blind holes (33), the printed circuit on the lower end face of the lowermost double-sided printed circuit board (11) is connected with the printed circuit on the middle double-sided printed circuit board (11) through blind holes (33), and the printed circuit on the lower end face of the lowermost double-sided printed circuit board (11) is connected with the printed circuit on the lower end face of the uppermost double-sided printed circuit board (11) through blind holes (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920788688.2U CN210444553U (en) | 2019-05-29 | 2019-05-29 | High wiring density printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920788688.2U CN210444553U (en) | 2019-05-29 | 2019-05-29 | High wiring density printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210444553U true CN210444553U (en) | 2020-05-01 |
Family
ID=70402237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920788688.2U Active CN210444553U (en) | 2019-05-29 | 2019-05-29 | High wiring density printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210444553U (en) |
-
2019
- 2019-05-29 CN CN201920788688.2U patent/CN210444553U/en active Active
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