CN214324429U - Aluminum-based copper-clad plate containing ceramic film structure - Google Patents
Aluminum-based copper-clad plate containing ceramic film structure Download PDFInfo
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- CN214324429U CN214324429U CN202022694614.8U CN202022694614U CN214324429U CN 214324429 U CN214324429 U CN 214324429U CN 202022694614 U CN202022694614 U CN 202022694614U CN 214324429 U CN214324429 U CN 214324429U
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- layer
- clad plate
- heat
- aluminium base
- fixedly connected
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- 229910052782 aluminium Inorganic materials 0.000 title claims abstract description 58
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminum Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title claims abstract description 58
- 239000000919 ceramic Substances 0.000 title claims abstract description 34
- 239000004411 aluminium Substances 0.000 claims abstract description 39
- 230000017525 heat dissipation Effects 0.000 claims abstract description 19
- 239000011889 copper foil Substances 0.000 claims abstract description 17
- 239000010410 layer Substances 0.000 claims description 110
- 239000010408 film Substances 0.000 claims description 30
- 239000000463 material Substances 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 8
- 239000011241 protective layer Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 5
- 239000004698 Polyethylene (PE) Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000003365 glass fiber Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- -1 polyethylene Polymers 0.000 claims description 5
- 229920000573 polyethylene Polymers 0.000 claims description 5
- 238000007731 hot pressing Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000004519 grease Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 claims 5
- 230000000694 effects Effects 0.000 abstract description 20
- 239000011248 coating agent Substances 0.000 abstract description 8
- 238000000576 coating method Methods 0.000 abstract description 8
- 238000007669 thermal treatment Methods 0.000 abstract description 3
- 230000003014 reinforcing Effects 0.000 description 6
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 150000001398 aluminium Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses an aluminium base copper-clad plate that contains ceramic film structure, including aluminium base board, the top fixedly connected with copper foil of aluminium base board, the top fixedly connected with ceramic film of copper foil, ceramic film's top is provided with the inoxidizing coating, the top of inoxidizing coating is provided with the thermal treatment layer, the inoxidizing coating includes insulating layer, enhancement layer and dampproof course, the thermal treatment layer includes high temperature resistant layer, heat-conducting layer and heat dissipation layer, the bottom of insulating layer and ceramic film's top fixed connection, the top at the insulating layer is smeared to the enhancement layer. The utility model discloses a cooperation that sets up insulating layer, enhancement layer, dampproof course, high temperature resistant layer, heat-conducting layer and heat dissipation layer is used, possesses the advantage that the radiating effect is good, and it is relatively poor to have solved current aluminium base copper-clad plate radiating effect, is not convenient for spill the heat that aluminium base copper-clad plate produced, and the heat is too high to cause the damage to aluminium base copper-clad plate, reduces aluminium base copper-clad plate life's problem.
Description
Technical Field
The utility model relates to an aluminium base copper-clad plate technical field specifically is an aluminium base copper-clad plate that contains ceramic film structure.
Background
An aluminum-based copper-clad plate, namely an aluminum-based plate, is one of raw materials, and is a plate-shaped material which is prepared by soaking electronic glass fiber cloth or other reinforcing materials in resin, single resin and the like as an insulating bonding layer and coating copper foil on one surface or two surfaces of the plate-shaped material by hot pressing, namely a copper-clad laminated aluminum substrate, namely the aluminum-based copper-clad plate for short.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an aluminium base copper-clad plate that contains ceramic film structure possesses the good advantage of radiating effect, and it is relatively poor to have solved current aluminium base copper-clad plate radiating effect, is not convenient for spill the heat that aluminium base copper-clad plate produced, and the heat is too high to cause the damage to aluminium base copper-clad plate, reduces aluminium base copper-clad plate life's problem.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an aluminium base copper-clad plate that contains ceramic film structure, includes aluminium base board, the top fixedly connected with copper foil of aluminium base board, the top fixedly connected with ceramic film of copper foil, ceramic film's top is provided with the inoxidizing coating, the top of inoxidizing coating is provided with heat treatment layer, the inoxidizing coating includes insulating layer, enhancement layer and dampproof course, heat treatment layer includes high temperature resistant layer, heat-conducting layer and heat dissipation layer, the bottom of insulating layer and ceramic film's top fixed connection, the top at the insulating layer is paintd to the enhancement layer, the bottom and the enhancement layer fixed connection of dampproof course.
Preferably, the aluminum substrate and the copper foil are fixedly connected in a hot pressing mode, and the bottom of the ceramic film is fixedly connected with the copper foil through glue.
Preferably, the bottom of the insulating layer is fixedly connected with the ceramic film through glue, and the insulating layer is made of glass fiber.
Preferably, the material of the enhancement layer is an epoxy resin material, and the material of the moisture-proof layer is a polyethylene film.
Preferably, the bottom of the high temperature resistant layer is fixedly connected with the moisture-proof layer, and the heat conduction layer is coated on the top of the high temperature resistant layer.
Preferably, the material of high temperature resistant layer is the PET film, the material of heat-conducting layer is the silicone grease, the material of heat dissipation layer is nanometer carbon heat dissipation membrane.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a cooperation that sets up insulating layer, enhancement layer, dampproof course, high temperature resistant layer, heat-conducting layer and heat dissipation layer is used, possesses the advantage that the radiating effect is good, and it is relatively poor to have solved current aluminium base copper-clad plate radiating effect, is not convenient for spill the heat that aluminium base copper-clad plate produced, and the heat is too high to cause the damage to aluminium base copper-clad plate, reduces aluminium base copper-clad plate life's problem.
2. The utility model discloses a material that sets up the insulating layer is the glass fiber material, can play insulating effect, can effectively prevent the electric leakage situation, be the epoxy resin material through setting up the enhancement layer, can play the effect of reinforcing to aluminium base copper-clad plate, can increase the toughness of aluminium base copper-clad plate, be the polyethylene film through setting up the dampproof course, can play damp-proofing effect, can effectively prevent because of the damage that wets, be the PET film through setting up high temperature resistant layer, can play high temperature resistant effect, can effectively prevent that the dampproof course is because of high temperature deformation.
Drawings
FIG. 1 is a schematic view of the aluminum-based copper-clad section of the structure of the present invention;
FIG. 2 is a schematic cross-sectional view of a protective layer according to the present invention;
FIG. 3 is a schematic cross-sectional view of a thermal treatment layer according to the present invention.
In the figure: the heat-conducting plate comprises an aluminum substrate 1, a copper foil 2, a ceramic film 3, a protective layer 4, a heat treatment layer 5, an insulating layer 6, an enhancement layer 7, a moisture-proof layer 8, a high-temperature-resistant layer 9, a heat-conducting layer 10 and a heat-radiating layer 11.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model discloses an aluminium base board 1, copper foil 2, ceramic film 3, inoxidizing coating 4, heat treatment layer 5, insulating layer 6, enhancement layer 7, dampproof course 8, high temperature resistant layer 9, heat-conducting layer 10 and heat dissipation layer 11 part are the parts that general standard spare or field technical personnel know, and its structure and principle all are that this technical personnel all can learn through the technical manual or learn through conventional experimental approach.
Referring to fig. 1-3, an aluminum-based copper clad laminate containing a ceramic film structure comprises an aluminum substrate 1, a copper foil 2 is fixedly connected to the top of the aluminum substrate 1, a ceramic film 3 is fixedly connected to the top of the copper foil 2, the aluminum substrate 1 and the copper foil 2 are fixedly connected through a hot pressing mode, the bottom of the ceramic film 3 is fixedly connected with the copper foil 2 through glue, a protective layer 4 is arranged on the top of the ceramic film 3, a heat treatment layer 5 is arranged on the top of the protective layer 4, the protective layer 4 comprises an insulating layer 6, a reinforcing layer 7 and a moisture-proof layer 8, the bottom of the insulating layer 6 is fixedly connected with the ceramic film 3 through glue, the insulating layer 6 is made of glass fiber, the insulating effect can be achieved, the electric leakage condition can be effectively prevented, the reinforcing layer 7 is made of epoxy resin, and the reinforcing layer 7 is made of epoxy resin, can play the reinforcing effect to aluminium base copper-clad plate, can increase the toughness of aluminium base copper-clad plate, the material of dampproof course 8 is polyethylene film, through setting up dampproof course 8 to be polyethylene film, can play damp-proofing effect, can effectively prevent to damage because of weing, heat treatment layer 5 includes high temperature resistant layer 9, heat-conducting layer 10 and heat dissipation layer 11, the bottom and the dampproof course 8 fixed connection of high temperature resistant layer 9, heat-conducting layer 10 scribbles the top at high temperature resistant layer 9, the material of high temperature resistant layer 9 is PET film, through setting up high temperature resistant layer 9 to be PET film, can play the effect of high temperature resistance, can effectively prevent dampproof course 8 because of high temperature deformation, the material of heat-conducting layer 10 is the silicone grease, the material of heat dissipation layer 11 is the nanometer carbon heat dissipation film, the bottom and the top fixed connection of ceramic film 3 of insulating layer 6, enhancement layer 7 is scribbled at the top of insulating layer 6, the bottom and enhancement layer 7 fixed connection of dampproof course 8, through the cooperation that sets up insulating layer 6, enhancement layer 7, dampproof course 8, high temperature resistant layer 9, heat-conducting layer 10 and heat dissipation layer 11 and use, possess the advantage that the radiating effect is good, it is relatively poor to have solved current aluminium base copper-clad plate radiating effect, is not convenient for to spill the heat that aluminium base copper-clad plate produced, and the heat is too high to cause the damage to aluminium base copper-clad plate, reduces aluminium base copper-clad plate life's problem.
During the use, install aluminium base copper-clad plate on equipment, aluminium base copper-clad plate is seted up the during operation and can is produced heat, high temperature resistant layer 9 can play heat-resisting effect, can play the effect of protection to dampproof course 8, can prevent effectively that dampproof course 8 from taking place deformation when toasting by high temperature, the heat transmits to heat dissipation layer 11 through heat-conducting layer 10, dispel through heat dissipation layer 11, heat-conducting layer 10 is paintd between heat dissipation layer 11 and high temperature resistant layer 9, can play the effect that increases heat dissipation layer 11 and high temperature resistant layer 9 contact compactness, the thermal transmission of being convenient for, the thermal effluvium of being convenient for.
In summary, the following steps: this aluminium base copper-clad plate that contains ceramic film structure through setting up insulating layer 6, enhancement layer 7, dampproof course 8, high temperature resistant layer 9, heat-conducting layer 10 and heat dissipation layer 11, has solved current aluminium base copper-clad plate radiating effect relatively poor, is not convenient for to give off the heat that aluminium base copper-clad plate produced, and the heat is too high to cause the damage to aluminium base copper-clad plate, reduces aluminium base copper-clad plate life's problem.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides an aluminium base copper-clad plate that contains ceramic film structure, includes aluminium base board (1), its characterized in that: the aluminum-plated heat-insulating plate is characterized in that a copper foil (2) is fixedly connected to the top of the aluminum substrate (1), a ceramic film (3) is fixedly connected to the top of the copper foil (2), an protective layer (4) is arranged at the top of the ceramic film (3), a heat treatment layer (5) is arranged at the top of the protective layer (4), the protective layer (4) comprises an insulating layer (6), an enhancement layer (7) and a moisture-proof layer (8), the heat treatment layer (5) comprises a high-temperature-resistant layer (9), a heat conduction layer (10) and a heat dissipation layer (11), the bottom of the insulating layer (6) is fixedly connected with the top of the ceramic film (3), the enhancement layer (7) is smeared at the top of the insulating layer (6), and the bottom of the moisture-proof layer (8) is fixedly connected with the enhancement layer (7).
2. The aluminum-based copper-clad plate containing the ceramic thin film structure according to claim 1, wherein: the aluminum substrate (1) and the copper foil (2) are fixedly connected in a hot-pressing mode, and the bottom of the ceramic film (3) is fixedly connected with the copper foil (2) through glue.
3. The aluminum-based copper-clad plate containing the ceramic thin film structure according to claim 1, wherein: the bottom of the insulating layer (6) is fixedly connected with the ceramic film (3) through glue, and the insulating layer (6) is made of glass fiber.
4. The aluminum-based copper-clad plate containing the ceramic thin film structure according to claim 1, wherein: the material of enhancement layer (7) is the epoxy resin material, the material of dampproof course (8) is the polyethylene film.
5. The aluminum-based copper-clad plate containing the ceramic thin film structure according to claim 1, wherein: the bottom of the high-temperature-resistant layer (9) is fixedly connected with the moisture-proof layer (8), and the heat conduction layer (10) is coated on the top of the high-temperature-resistant layer (9).
6. The aluminum-based copper-clad plate containing the ceramic thin film structure according to claim 1, wherein: the material of high temperature resistant layer (9) is the PET film, the material of heat-conducting layer (10) is the silicone grease, the material of heat dissipation layer (11) is the nanometer carbon heat dissipation membrane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022694614.8U CN214324429U (en) | 2020-11-19 | 2020-11-19 | Aluminum-based copper-clad plate containing ceramic film structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022694614.8U CN214324429U (en) | 2020-11-19 | 2020-11-19 | Aluminum-based copper-clad plate containing ceramic film structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214324429U true CN214324429U (en) | 2021-10-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022694614.8U Active CN214324429U (en) | 2020-11-19 | 2020-11-19 | Aluminum-based copper-clad plate containing ceramic film structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214324429U (en) |
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2020
- 2020-11-19 CN CN202022694614.8U patent/CN214324429U/en active Active
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