CN214313190U - Embedded chip packaging structure - Google Patents
Embedded chip packaging structure Download PDFInfo
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- CN214313190U CN214313190U CN202023025661.XU CN202023025661U CN214313190U CN 214313190 U CN214313190 U CN 214313190U CN 202023025661 U CN202023025661 U CN 202023025661U CN 214313190 U CN214313190 U CN 214313190U
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Abstract
The utility model discloses an embedded chip package structure, consolidate frame, main part and second base plate including assembly piece, metal, the edge of main part is fixed with the metal and consolidates the frame, and the inside top of main part is provided with first base plate. The utility model discloses an install the support, a main body, the heat conduction copper sheet, first base plate, second base plate and third base plate, make the device optimize the performance of self, during the use, set up the support through the installation face at the device on the one hand, make and leave the gap between main part installation face and the casing, the circulation of gas of both being convenient for promotes the radiating effect, can be according to user's demand again, it promotes the radiating effect to fill heat conduction silicone grease, on the other hand is through the first base plate at the embedding electronic component, the two sides of second base plate and third base plate all evenly are fixed with the heat conduction copper sheet that is equidistant range, utilize the good heat conductivility of copper, the heat conduction radiating effect of device to electronic component has been promoted, the heat loss has been alleviateed.
Description
Technical Field
The utility model relates to a semiconductor package technical field specifically is an embedded chip package structure.
Background
With the development of microelectronic technology, chip packaging technology is also continuously advancing, embedded chip packaging structures are popular with manufacturers because of the advantages that the embedded chip packaging structures can release space in a system and meet miniaturization requirements, but the existing chip packaging structures still have the following problems in practical use:
1. the common chip packaging structure often has the problem of poor heat conduction and heat dissipation effects, which causes serious heat loss of the device and is not beneficial to the long-term popularization of the device;
2. the existing chip packaging structure in the market also has the defects of low structural strength and poor safety performance, which causes poor use effect of the device;
3. the existing chip packaging structure also generally has the defects of single assembling formula and difficulty in positioning and laminating the substrate structure, which leads to poor functionality of the device.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an embedded chip package structure to the heat conduction radiating effect who proposes among the above-mentioned background art is poor, structural strength is low and the security performance is poor and the assembly methods is single, be difficult for carrying out the problem of location pressfitting with the substrate structure.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides an embedded chip packaging structure, consolidates frame, main part and second base plate including assembly piece, metal, the edge of main part is fixed with the metal and consolidates the frame, and the inside top of main part is provided with first base plate, the inside bottom of main part is provided with the third base plate, evenly is provided with the second base plate in the main part between third base plate and the first base plate, the bottom of main part evenly is fixed with the support, and the one end welding of support bottom has the assembly piece, all evenly be provided with the through-hole that is equidistant range on first base plate, second base plate and the third base plate, and the inside wall of through-hole is provided with the copper-plated layer.
Preferably, the number of the assembling blocks is 4, and an integrated welding structure is formed between the assembling blocks and the support, so that the structure of the device is optimized, and the firmness of the assembling structure is enhanced through welding.
Preferably, the assembly block is provided with a mounting hole, and the inner side wall of the mounting hole is provided with internal threads, so that the device can be fixedly mounted through screws.
Preferably, the metal reinforcing frame is connected with the main body through adhesive, the metal reinforcing frame is made of aluminum alloy, the first substrate, the second substrate and the third substrate form a laminated structure, the overall structural strength of the device is enhanced, and the device is not prone to deformation.
Preferably, the top ends and the bottom ends of the first substrate, the second substrate and the third substrate are uniformly fixed with heat conduction copper sheets arranged at equal intervals, so that the heat conduction and heat dissipation effects of the device on electronic elements are improved, and the heat loss is reduced.
Preferably, the top of first base plate, second base plate and third base plate all is provided with first high pressure resistant insulating paint layer, and the bottom of first base plate, second base plate and third base plate all is provided with the high pressure resistant insulating paint layer of second, makes it promote the coverage protective effect, has strengthened the security performance when the device uses.
Preferably, four corners on the top ends of the second substrate and the third substrate are provided with positioning clamping grooves, and four corners of the bottom ends of the first substrate and the second substrate are provided with positioning clamping blocks matched with the positioning clamping grooves, so that the accuracy of the positions of the substrates during assembly is improved.
Preferably, be connected through the viscose between support and the main part, and the bottom of support is provided with the tin solder layer, makes its convenient to use person with the device weld the equipment in suitable casing is inside.
Preferably, the first substrate, the second substrate and the third substrate on the inner side of the second high-voltage-resistant insulating paint layer are all provided with polysulfone rigid layers, so that the strength of each substrate structure is improved, and the practicability of the device is enhanced.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the embedded chip packaging structure enables the device to optimize the performance of the device by installing the support, the main body, the heat conduction copper sheets, the first substrate, the second substrate and the third substrate, when in use, on one hand, the support is arranged on the installation surface of the device, so that a gap is reserved between the installation surface of the main body and the shell, the heat dissipation effect is convenient to circulate air, and the heat dissipation effect can be improved by filling heat conduction silicone grease according to the requirements of users;
(2) the embedded chip packaging structure is provided with the first high-voltage-resistant insulating paint layer, the second high-voltage-resistant insulating paint layer, the metal reinforcing frame, the polysulfone rigid layer, the first substrate, the second substrate and the third substrate, so that when the device is used, on one hand, the first substrate, the second substrate and the third substrate which are used as electronic element carriers can be completely wrapped by the first high-voltage-resistant insulating paint layer and the second high-voltage-resistant insulating paint layer, the covering protection effect is improved, the phenomena of flash and breakdown caused by high voltage can be comprehensively avoided, the high-voltage resistance and the safety performance of the device are enhanced, on the other hand, the metal reinforcing frame made of aluminum alloy is additionally arranged on the outer wall of the main body, the integral structural strength of the device is enhanced, the device is not easy to deform, and the polysulfone rigid layers are additionally arranged on the first substrate, the second substrate and the third substrate, the strength of each substrate structure is improved, and the service life of the device is prolonged;
(3) the embedded chip packaging structure enables the device to optimize the structure of the device by installing the support, the assembling block, the mounting hole, the positioning clamping block and the positioning clamping groove, when in use, on one hand, a user can utilize the effects of four supports and the tin welding layer arranged at the bottom end of the four supports to weld and assemble the device in a proper shell, and the user can utilize the effects of the assembling block arranged on the supports and the mounting hole with the internal thread arranged on the assembling block to realize the fixed installation of the device through screws, thereby further leading the device to realize various assembling modes and being convenient to fully meet the installation requirements of the user, on the other hand, the user utilizes the clamping connection structure between the positioning clamping block and the positioning clamping groove to facilitate the positioning and assembling of the first substrate, the second substrate and the third substrate, and improving the accuracy of the position when the substrate structure is assembled, and the fastening structure improves the connection firmness between the adjacent substrate structures.
Drawings
Fig. 1 is a schematic top view of the present invention;
FIG. 2 is a schematic view of the front cross-sectional structure of the present invention;
fig. 3 is a schematic top view of the second substrate of the present invention;
FIG. 4 is an enlarged schematic view of the structure at A in FIG. 2 according to the present invention;
fig. 5 is a schematic view of a cross-sectional structure of a second substrate sidewall according to the present invention.
In the figure: 1. assembling the block; 2. a metal reinforcing frame; 3. a through hole; 4. a thermally conductive copper sheet; 5. a main body; 6. mounting holes; 7. a first substrate; 8. a second substrate; 9. a third substrate; 10. a support; 11. a tin solder layer; 12. positioning the clamping groove; 13. plating a copper layer; 14. positioning a fixture block; 15. a first high voltage resistant insulating paint layer; 16. a second high-voltage resistant insulating paint layer; 17. a polysulfone rigid layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides an embodiment: an embedded chip packaging structure comprises an assembly block 1, a metal reinforcing frame 2, a main body 5 and a second substrate 8, wherein the metal reinforcing frame 2 is fixed at the edge of the main body 5, the first substrate 7 is arranged at the top end inside the main body 5, the third substrate 9 is arranged at the bottom end inside the main body 5, the second substrate 8 is uniformly arranged on the main body 5 between the third substrate 9 and the first substrate 7, a support 10 is uniformly fixed at the bottom end of the main body 5, the assembly block 1 is welded at one end of the bottom of the support 10, through holes 3 which are arranged at equal intervals are uniformly arranged on the first substrate 7, the second substrate 8 and the third substrate 9, copper plating layers 13 are arranged on the inner side walls of the through holes 3, the number of the assembly blocks 1 is 4, and an integrated welding structure is formed between the assembly block 1 and the support 10;
the structure of the device is optimized, and the firmness of the assembly structure is enhanced through welding;
the assembling block 1 is provided with a mounting hole 6, and the inner side wall of the mounting hole 6 is provided with internal threads;
when the device is used, a user can utilize the effects of the four assembling blocks 1 and the mounting holes 6 with internal threads arranged on the assembling blocks to realize the fixed mounting of the device through screws, so that the practicability of the device is enhanced;
the metal reinforcing frame 2 is connected with the main body 5 through adhesive, the metal reinforcing frame 2 is made of aluminum alloy, and the first substrate 7, the second substrate 8 and the third substrate 9 form a laminated structure;
when the device is used, the metal reinforcing frame 2 made of aluminum alloy is additionally arranged on the outer wall of the main body 5, so that the overall structural strength of the device is enhanced, and the device is not easy to deform;
the top ends and the bottom ends of the first substrate 7, the second substrate 8 and the third substrate 9 are uniformly fixed with heat conducting copper sheets 4 which are arranged at equal intervals;
when the heat conduction device is used, the heat conduction copper sheets 4 which are arranged at equal intervals are uniformly fixed on the two surfaces of the first substrate 7, the second substrate 8 and the third substrate 9 which are embedded with electronic elements, so that the heat conduction and heat dissipation effects of the heat conduction device on the electronic elements are improved and the heat loss is reduced by utilizing the excellent heat conduction performance of copper;
the top ends of the first substrate 7, the second substrate 8 and the third substrate 9 are all provided with a first high-pressure-resistant insulating paint layer 15, and the bottom ends of the first substrate 7, the second substrate 8 and the third substrate 9 are all provided with a second high-pressure-resistant insulating paint layer 16;
when the device is used, the first substrate 7, the second substrate 8 and the third substrate 9 which are used as electronic element carriers can be completely wrapped by the first high-voltage-resistant insulating paint layer 15 and the second high-voltage-resistant insulating paint layer 16, so that the covering protection effect is improved, the phenomena of arcing and breakdown caused by high voltage can be comprehensively avoided, and the high-voltage resistance and the safety performance of the device are enhanced;
positioning clamping grooves 12 are formed in four corners of the top ends of the second substrate 8 and the third substrate 9, and positioning clamping blocks 14 matched with the positioning clamping grooves 12 are formed in four corners of the bottom ends of the first substrate 7 and the second substrate 8;
when the positioning fixture is used, a user can conveniently position and assemble the first substrate 7, the second substrate 8 and the third substrate 9 by using the clamping connection structure between the positioning fixture block 14 and the positioning fixture groove 12, so that the accuracy of the positions of the substrates during the assembling process is improved, and the connection firmness between the adjacent substrate structures is improved by using the clamping structure;
the support 10 is connected with the main body 5 through adhesive, and a tin welding layer 11 is arranged at the bottom end of the support 10;
when the device is used, on one hand, a user can weld and assemble the device in a proper shell by using the effects of the four supports 10 and the tin soldering layer 11 arranged at the bottom end of the supports, on the other hand, the supports 10 are arranged on the mounting surface of the device, so that a gap is reserved between the mounting surface of the main body 5 and the shell, the gas circulation is facilitated, the heat dissipation effect is improved, and the heat conduction silicone grease can be filled according to the requirements of the user to improve the heat dissipation effect, so that the functionality of the device is enhanced;
a polysulfone rigid layer 17 is arranged on the first substrate 7, the second substrate 8 and the third substrate 9 at the inner side of the second high-voltage-resistant insulating paint layer 16;
the polysulfone rigid layer 17 is additionally arranged on the first substrate 7, the second substrate 8 and the third substrate 9, so that the strength of each substrate structure is improved, and the practicability of the device is enhanced.
The working principle is as follows: when in use, a user firstly embeds electronic elements into the first substrate 7, the second substrate 8 and the third substrate 9 in sequence, then the electronic elements are electrically connected by utilizing the functions of the through holes 3 and the copper plating layers 13 arranged in the through holes to realize the embedded encapsulation of the chip, during the actual operation, on one hand, the user can utilize the functions of the four supports 10 and the tin soldering layers 11 arranged at the bottom ends of the four supports to weld and assemble the device in a proper machine shell, and the user can utilize the functions of the assembly blocks 1 arranged on the supports 10 and the mounting holes 6 with internal threads arranged on the assembly blocks 1 to realize the fixed installation of the device through screws, thereby further realizing various assembly modes of the device, being convenient for fully meeting the installation requirements of the user, on the other hand, the supports 10 are arranged on the installation surface of the device to ensure that a gap is reserved between the installation surface of the main body 5 and the machine shell, not only be convenient for the gas circulation promote the radiating effect, but also can be according to user's demand, it promotes the radiating effect to fill heat conduction silicone grease, and then the functionality of device has been strengthened, simultaneously, through the first base plate 7 that has inlayed electronic component, the both sides of second base plate 8 and third base plate 9 all evenly are fixed with the heat conduction copper sheet 4 that is equidistant range, utilize the good heat conductivility of copper, the heat conduction radiating effect to electronic component has been promoted to the device, the heat loss has been alleviateed, furthermore, when the device was used, on the one hand, the user utilizes the block connection structure between positioning fixture block 14 and positioning fixture groove 12, both be convenient for carry out the location equipment with first base plate 7, second base plate 8 and third base plate 9, the accuracy of position when having promoted the base plate structure equipment, again through this block structure, the firm performance of connecting between the adjacent base plate structure has been promoted, on the other hand utilize first high pressure resistant insulating paint layer 15 and second high pressure resistant insulating paint layer 16 can will regard as electronic component carrier First base plate 7, second base plate 8 and third base plate 9 wrap up completely, the coverage protection effect has been promoted, can comparatively avoid the flashover because of the high pressure produces comprehensively, breakdown phenomenon, the high pressure resistance and the security performance of device have been strengthened, and through adding the metal reinforcement frame 2 that the material is the aluminum alloy at the outer wall of main part 5, the holistic structural strength of device has been strengthened, make its non-deformable, and through at first base plate 7, polysulfone rigid layer 17 has all been set up on second base plate 8 and the third base plate 9, and then the intensity of every base plate structure has been promoted, be favorable to extension means's life.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (9)
1. The utility model provides an embedded chip package structure, includes assembly piece (1), metal reinforcement frame (2), main part (5) and second base plate (8), its characterized in that: the edge of main part (5) is fixed with metal reinforcement frame (2), and the inside top of main part (5) is provided with first base plate (7), the inside bottom of main part (5) is provided with third base plate (9), evenly is provided with second base plate (8) on main part (5) between third base plate (9) and first base plate (7), the bottom of main part (5) evenly is fixed with support (10), and the one end welding of support (10) bottom has assembly piece (1), all evenly be provided with through-hole (3) that are the equidistant range on first base plate (7), second base plate (8) and third base plate (9), and the inside wall of through-hole (3) is provided with copper-plated layer (13).
2. The embedded chip package structure of claim 1, wherein: the number of the assembling blocks (1) is 4, and an integrated welding structure is formed between the assembling blocks (1) and the support (10).
3. The embedded chip package structure of claim 1, wherein: the assembling block (1) is provided with a mounting hole (6), and the inner side wall of the mounting hole (6) is provided with an internal thread.
4. The embedded chip package structure of claim 1, wherein: the metal reinforcing frame (2) is connected with the main body (5) through adhesive, the metal reinforcing frame (2) is made of aluminum alloy, and the first substrate (7), the second substrate (8) and the third substrate (9) form a laminated structure.
5. The embedded chip package structure of claim 1, wherein: and heat conduction copper sheets (4) which are arranged at equal intervals are uniformly fixed at the top ends and the bottom ends of the first substrate (7), the second substrate (8) and the third substrate (9).
6. The embedded chip package structure of claim 1, wherein: the top ends of the first substrate (7), the second substrate (8) and the third substrate (9) are all provided with a first high-pressure-resistant insulating paint layer (15), and the bottom ends of the first substrate (7), the second substrate (8) and the third substrate (9) are all provided with a second high-pressure-resistant insulating paint layer (16).
7. The embedded chip package structure of claim 1, wherein: four corners on the top ends of the second substrate (8) and the third substrate (9) are provided with positioning clamping grooves (12), and four corners at the bottom ends of the first substrate (7) and the second substrate (8) are provided with positioning clamping blocks (14) matched with the positioning clamping grooves (12).
8. The embedded chip package structure of claim 1, wherein: the support (10) is connected with the main body (5) through adhesive, and a tin welding layer (11) is arranged at the bottom end of the support (10).
9. The embedded chip package structure of claim 6, wherein: and a polysulfone rigid layer (17) is arranged on the first substrate (7), the second substrate (8) and the third substrate (9) at the inner side of the second high-voltage-resistant insulating paint layer (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023025661.XU CN214313190U (en) | 2020-12-15 | 2020-12-15 | Embedded chip packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023025661.XU CN214313190U (en) | 2020-12-15 | 2020-12-15 | Embedded chip packaging structure |
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| Publication Number | Publication Date |
|---|---|
| CN214313190U true CN214313190U (en) | 2021-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202023025661.XU Active CN214313190U (en) | 2020-12-15 | 2020-12-15 | Embedded chip packaging structure |
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|---|---|
| CN (1) | CN214313190U (en) |
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- 2020-12-15 CN CN202023025661.XU patent/CN214313190U/en active Active
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