CN209314200U - A kind of transparent heat-transfer device of electromagnetic wave - Google Patents
A kind of transparent heat-transfer device of electromagnetic wave Download PDFInfo
- Publication number
- CN209314200U CN209314200U CN201821727716.1U CN201821727716U CN209314200U CN 209314200 U CN209314200 U CN 209314200U CN 201821727716 U CN201821727716 U CN 201821727716U CN 209314200 U CN209314200 U CN 209314200U
- Authority
- CN
- China
- Prior art keywords
- chip body
- electromagnetic wave
- sheet
- heat
- connection sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of transparent heat-transfer devices of electromagnetic wave, including chip body, two groups of auxiliary-radiating structures and two groups of cleaning mechanisms, chip body is arranged between two groups of auxiliary-radiating structures, and Liang Zu auxiliary heat dissipation mechanism is arranged between two groups of cleaning mechanisms, the inner wall of chip body intensively offers several the first micropores, by adhesive sheet and two assembly module compositions, adhesive sheet is arranged between two assembly modules chip body.The transparent heat-transfer device of the utility model electromagnetic wave, it is arranged by the ultrathin of chip body and specific micropore, certifiable electromagnetic wave penetrates easily, so that the finished product is not influenced by electromagnetic environment, itself good heating conduction simultaneously, the heat of product is conducted and is discharged in a short time when device can be made to work, while cooperating external radiator structure that can accelerate the heat conduction and heat radiation rate of device, and is torn adhesive boards outward and can be played the role of Adsorption to dust.
Description
Technical field
The utility model relates to the heat conduction and heat radiation field of consumer electronics, wireless charging device, specially a kind of electromagnetic wave can
The heat-transfer device penetrated.
Background technique
Consumer electronics market is gradually expanded at present, such as wireless charging device, in order to avoid electromagnetic wave is shielded and is interfered,
Non-conductive material is used, while between the transmitting terminal and receiving end of wireless charging for heat conduction and heat radiation, in the devices usually
Use heat conductive silica gel, heat conductive phase change material or other non-conductor heat sink materials.
Currently, being limited to the limitation of Heat Conduction Material thermal coefficient, cause the power of wireless fill device that can not be made high, usually
For 7.5W, also in that identical reason, heat dissipation not in time in the case where there is also the problem of mixing down to 5W, finally make to fill
Electric speed and efficiency are all very poor, in addition, the heat dissipation problem on smart phone is also to fail thoroughly to solve always, interfere hand in mode
What the radiator used under the premise of machine signal generally used is also heat conductive silica gel class or heat pipe etc., can not accomplish that whole face dissipates
Heat, and structure is simple, and practical function is poor.Therefore we make improvement to this, propose that a kind of electromagnetic wave is transparent thermally conductive
Device.
Utility model content
To solve defect of the existing technology, the utility model provides a kind of transparent heat-transfer device of electromagnetic wave.
In order to solve the above-mentioned technical problem, the utility model provides the following technical solution:
A kind of transparent heat-transfer device of electromagnetic wave of the utility model, including chip body, two groups of auxiliary-radiating structures with
Two groups of cleaning mechanisms, the chip body are arranged between two groups of auxiliary-radiating structures, and Liang Zu auxiliary heat dissipation mechanism is arranged
Between two groups of cleaning mechanisms, the inner wall of the chip body intensively offers several the first micropores, the chip body
By adhesive sheet and two assembly module compositions, the adhesive sheet is arranged between two assembly modules.
As a kind of optimal technical scheme of the utility model, assembling module described in two groups is by several assembled plate structures
At.
As a kind of optimal technical scheme of the utility model, the auxiliary heat dissipation mechanism includes help sheet, and is assisted
The side of chip body is arranged in thin plate, and the outer surface of the help sheet is covered with carbon dust layer, and help sheet and carbon dust layer
Inner wall intensively offer several the second micropores corresponding with the first micropore.
As a kind of optimal technical scheme of the utility model, be oppositely arranged in the middle part of the both ends of the help sheet there are two
First elongated strap, and the top of help sheet and bottom end are oppositely arranged that there are four heat-conducting metal silks.
As a kind of optimal technical scheme of the utility model, the cleaning mechanism is by the first connection sheet and the second connection sheet
It constitutes, and side of the help sheet far from chip body, first connection sheet is arranged in the first connection sheet and the second connection sheet
The top of second connection sheet is set, and the outer surface of the first connection sheet and the second connection sheet be respectively arranged with the first adhesive boards and
Second adhesive boards.
As a kind of optimal technical scheme of the utility model, the inner wall of first adhesive boards and the second adhesive boards is intensive
Offer several third micropores corresponding with the first micropore and the second micropore, the top middle portion of first connection sheet and the
The center bottom of two connection sheets is provided with the second elongated strap.
As a kind of optimal technical scheme of the utility model, the material of the chip body be metal, alloy, graphite,
Composition metal and composite polymer material at least one therein.
The beneficial effects of the utility model are: the transparent heat-transfer device of this kind of electromagnetic wave, passes through the ultrathin of thin slice
And specific micropore arrangement, it is ensured that electromagnetic wave penetrates easily, so that the finished product is not influenced by electromagnetic environment, while its
The good heating conduction of body, the heat of product is conducted and is discharged in a short time when device can be made to work, and is realized to setting
Standby high power and ultra high power demand, while assembled plate on chip body can be adjusted according to mounting location and operational requirements
Quantity, and it is connected with adhesive sheet and carries out absorption installation, the flexibility in device use is increased, and want according to mounting location
It is auxiliary can to adsorb stickup help sheet, carbon dust layer, the second micropore and heat-conducting metal silk etc. outside chip body for summation field condition
Radiator structure is helped, and then improves the heat conduction and heat radiation effect of device, finally increases the first connection sheet and the second connection sheet outside it,
The first adhesive boards and the second adhesive boards above can adsorb the dust that installation place is saved bit by bit, and tearing the second elongated strap outward will
It is separated with apparatus main body, can be reached and be facilitated later period clean effect, more various structures and practical.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is a kind of structural schematic diagram of the transparent heat-transfer device of electromagnetic wave of the utility model；
Fig. 2 is a kind of chip body decomposition texture schematic diagram of the transparent heat-transfer device of electromagnetic wave of the utility model；
Fig. 3 is a kind of chip body structural schematic diagram of the transparent heat-transfer device of electromagnetic wave of the utility model；
Fig. 4 is a kind of cleaning mechanism structural schematic diagram of the transparent heat-transfer device of electromagnetic wave of the utility model.
In figure: 1, chip body；2, the first micropore；3, adhesive sheet；4, assembled plate；5, help sheet；6, carbon dust layer；7,
Two micropores；8, the first elongated strap；9, heat-conducting metal silk；10, the first connection sheet；11, the second connection sheet；12, the first adhesive boards；
13, the second adhesive boards；14, third micropore；15, the second elongated strap.
Specific embodiment
It is illustrated below in conjunction with preferred embodiment of the attached drawing to the utility model, it should be understood that described herein excellent
It selects embodiment to be only used for describing and explaining the present invention, is not used to limit the utility model.
Embodiment: as shown in Figure 1, Figure 2, Figure 3 and Figure 4, a kind of transparent heat-transfer device of electromagnetic wave of the utility model, packet
It includes 1, two group of auxiliary-radiating structure of chip body and two groups of auxiliary-radiating structures is arranged in two groups of cleaning mechanisms, chip body 1
Between, and Liang Zu auxiliary heat dissipation mechanism is arranged between two groups of cleaning mechanisms, the inner wall of chip body 1 intensively offers several
A first micropore 2, for chip body 1 by adhesive sheet 3 and two assembly module compositions, two assembly modules are arranged in adhesive sheet 3
Between, between be interconnected and fixed, together constitute the main body of device, the hole shape of the first micropore 2 is relative to previous hole
Shape, it is easier to processing and efficiency highest, while when other conditions are all the same, electromagnetic wave is in transmission, the circle of identical size
Micropore and gap micropore are essentially identical to the loss of electromagnetic wave, but in the propagation direction, round micropore is to Electromagnetic Wave Propagation direction
It influences smaller.
Wherein, two assembly modules are made of several assembled plates 4, and spelling is adjusted according to mounting location and operational requirements
The quantity of loading board 4, and itself and the connection of adhesive sheet 3 are subjected to absorption installation, increase the flexibility in device use.
Wherein, auxiliary heat dissipation mechanism includes help sheet 5, and the side of chip body 1 is arranged in help sheet 5, auxiliary
The outer surface of thin plate 5 is covered with carbon dust layer 6, and the inner wall of help sheet 5 and carbon dust layer 6 intensively offer several with it is first micro-
Corresponding second micropore 7 in hole 2, using carbon dust layer 6 heat conduction and heat radiation and be combined with chip body 1, apparatus main body can be accelerated
Heat conduction and heat radiation rate, while the second micropore 7 cooperate the first micropore 1 can guarantee that electromagnetic wave penetrates easily.
Wherein, be oppositely arranged in the middle part of the both ends of help sheet 5 there are two the first elongated strap 8, and the top of help sheet 5 with
Bottom end is oppositely arranged there are four heat-conducting metal silk 9, can be facilitated by tearing the first elongated strap 8 and easily be removed help sheet 5,
Heat-conducting metal silk 9 can accelerate the export of heat simultaneously.
Wherein, cleaning mechanism is made of the first connection sheet 10 and the second connection sheet 11, and the first connection sheet 10 and second connects
Side of the help sheet 5 far from chip body 1 is arranged in contact pin 11, and the top of the second connection sheet 11 is arranged in the first connection sheet 10
End, and the outer surface of the first connection sheet 10 and the second connection sheet 11 is respectively arranged with the first adhesive boards 12 and the second adhesive boards 13,
By the way that the first connection sheet 10 and the second connection sheet 11 to be arranged in the outer wall of apparatus main body, 12 He of the first adhesive boards above is utilized
Second adhesive boards 13, which play dust, saves bit by bit collecting action, facilitates the cleaning in later period.
Wherein, the inner wall of the first adhesive boards 12 and the second adhesive boards 13 intensively offers several and the first micropore 2 and
The corresponding third micropore 14 of two micropore 7, the top middle portion of the first connection sheet 10 and the center bottom of the second connection sheet 11 are all provided with
It is equipped with the second elongated strap 15, third micropore 14 cooperates the first micropore 2 and the second micropore 7 to can guarantee that electromagnetic wave penetrates easily.
Wherein, the material of chip body 1 is that metal, alloy, graphite, composition metal and composite polymer material are therein
At least one facilitates thermally conductive.
When work, according to the frequency of electromagnetic wave when work, the material with good heat conductive electric conductivity is made into specific thickness
Ultra-thin chip body 1 is spent, while forming the first micropore 2 of specific aligned transfer, specific dimensions on chip body 1, is obtained
Finished product, which, which can attach, can also attach on the coil for being perhaps covered on and generating electromagnetic wave or be covered in radio frequency
On the chip of function, while not influencing electromagnetic signal propagation, very good conductive force is played, and realize to equipment
High power and ultra high power demand, while assembled plate 4 can be adjusted on chip body 1 according to mounting location and operational requirements
Quantity, and itself and the connection of adhesive sheet 3 are subjected to absorption installation, the flexibility in device use is increased, and according to mounting location
It is required that and field condition, can be adsorbed outside chip body 1 and paste help sheet 5, carbon dust layer 6, the second micropore 7 and heat-conducting metal
The auxiliary-radiating structures such as silk 9, and then the heat conduction and heat radiation effect of device is improved, it can facilitate and will assist by tearing the first elongated strap 8
Thin plate 5 is easily removed, and finally increases the first connection sheet 10 and the second connection sheet 11 outside it, the first adhesive boards 12 above
The dust that installation place is saved bit by bit can be adsorbed with the second adhesive boards 13, tear the second elongated strap 15 outward for itself and apparatus main body
Between mutually separate, can reach and facilitate later period clean effect, more various structures and practical.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (7)
1. a kind of transparent heat-transfer device of electromagnetic wave, which is characterized in that including chip body (1), two groups of auxiliary-radiating structures
With two groups of cleaning mechanisms, the chip body (1) is arranged between two groups of auxiliary-radiating structures, and Liang Zu auxiliary heat dissipation mechanism
It is arranged between two groups of cleaning mechanisms, the inner wall of the chip body (1) intensively offers several the first micropores (2), institute
Chip body (1) is stated by adhesive sheet (3) and two assembly module compositions, two assembly modules are arranged in the adhesive sheet (3)
Between.
2. the transparent heat-transfer device of a kind of electromagnetic wave according to claim 1, which is characterized in that assembly mould described in two groups
Block is made of several assembled plates (4).
3. the transparent heat-transfer device of a kind of electromagnetic wave according to claim 1, which is characterized in that the auxiliary heat dissipation machine
Structure includes help sheet (5), and help sheet (5) is arranged in the side of chip body (1), the appearance of the help sheet (5)
Face is covered with carbon dust layer (6), and the inner wall of help sheet (5) and carbon dust layer (6) intensively offers several and the first micropore (2)
Corresponding second micropore (7).
4. the transparent heat-transfer device of a kind of electromagnetic wave according to claim 3, which is characterized in that the help sheet
(5) there are two being oppositely arranged in the middle part of both ends the first elongated strap (8), and the top of help sheet (5) is relatively set with bottom end
Four heat-conducting metal silks (9).
5. the transparent heat-transfer device of a kind of electromagnetic wave according to claim 1, which is characterized in that the cleaning mechanism by
First connection sheet (10) and the second connection sheet (11) are constituted, and the first connection sheet (10) and the second connection sheet (11) setting are assisting
Side of the thin plate (5) far from chip body (1), first connection sheet (10) are arranged on the top of the second connection sheet (11), and
The outer surface of first connection sheet (10) and the second connection sheet (11) is respectively arranged with the first adhesive boards (12) and the second adhesive boards
(13).
6. the transparent heat-transfer device of a kind of electromagnetic wave according to claim 5, which is characterized in that first adhesive boards
(12) and the inner wall of the second adhesive boards (13) intensively to offer several corresponding with the first micropore (2) and the second micropore (7)
Third micropore (14), the top middle portion of first connection sheet (10) and the center bottom of the second connection sheet (11) are provided with the
Two elongated strap (15).
7. the transparent heat-transfer device of a kind of electromagnetic wave according to claim 1, which is characterized in that the chip body
(1) material is metal, alloy, graphite, composition metal and composite polymer material at least one therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821727716.1U CN209314200U (en) | 2018-10-24 | 2018-10-24 | A kind of transparent heat-transfer device of electromagnetic wave |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821727716.1U CN209314200U (en) | 2018-10-24 | 2018-10-24 | A kind of transparent heat-transfer device of electromagnetic wave |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209314200U true CN209314200U (en) | 2019-08-27 |
Family
ID=67671498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821727716.1U Active CN209314200U (en) | 2018-10-24 | 2018-10-24 | A kind of transparent heat-transfer device of electromagnetic wave |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209314200U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110636746A (en) * | 2019-09-17 | 2019-12-31 | 华为技术有限公司 | Heat dissipation device and terminal equipment |
-
2018
- 2018-10-24 CN CN201821727716.1U patent/CN209314200U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110636746A (en) * | 2019-09-17 | 2019-12-31 | 华为技术有限公司 | Heat dissipation device and terminal equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204130659U (en) | A kind of Li-ion batteries piles | |
| CN202979570U (en) | Shielding case and electronic product thereof | |
| CN108400420B (en) | Antenna communication equipment based on LTE technology | |
| CN209314200U (en) | A kind of transparent heat-transfer device of electromagnetic wave | |
| CN210959211U (en) | Heat radiation assembly for mobile terminal equipment | |
| CN210325766U (en) | Packaging structure of integrated circuit for Bluetooth sound box | |
| CN205179142U (en) | Modified heat dissipation type mobile phone motherboard | |
| CN206629268U (en) | Loudspeaker module and the electronic installation using the loudspeaker module | |
| CN108377611A (en) | A kind of PCB circuit board | |
| CN210840545U (en) | Wave-absorbing shielding film with heat dissipation and conduction functions | |
| CN209448982U (en) | A kind of light and thin type SMT side back light source wiring board | |
| CN208016188U (en) | A kind of high-frequency converter | |
| CN217824943U (en) | Broadband high-performance receiver | |
| CN204887004U (en) | Router with wireless module of charging | |
| CN219437147U (en) | Centering support piece, sounding device and electronic equipment | |
| CN207852747U (en) | A kind of Prospect of EVS Powered with Batteries | |
| CN206210971U (en) | For the protection board structure of lithium battery | |
| CN209462475U (en) | A kind of transmitting end device for wireless image transmission | |
| CN206136564U (en) | Graphite covers copper thermal film based on addition process | |
| CN208209706U (en) | A kind of structure of motor housing damping noise reduction | |
| CN205985194U (en) | Electron cigarette electricity core | |
| CN216872965U (en) | Motor condensation preventing device | |
| CN216357507U (en) | Heat radiation structure of electric power-assisted bicycle controller and controller | |
| CN213578903U (en) | Radiator for cylindrical device | |
| CN220822133U (en) | Integrated circuit modularization transmission control device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |