CN210537020U - Special FPC device of wireless charger of cell-phone - Google Patents
Special FPC device of wireless charger of cell-phone Download PDFInfo
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- CN210537020U CN210537020U CN201921206774.4U CN201921206774U CN210537020U CN 210537020 U CN210537020 U CN 210537020U CN 201921206774 U CN201921206774 U CN 201921206774U CN 210537020 U CN210537020 U CN 210537020U
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Abstract
The utility model discloses a special FPC device of wireless charger of cell-phone technical field, including the circuit board body, the fixed aluminium base board that is provided with of bottom of circuit board body, the fixed heat-conducting layer that is provided with in bottom of the aluminium base board of heat conduction, the fixed heat dissipation layer that is provided with in bottom of heat-conducting layer, the heat conduction passageway has evenly been seted up on the aluminium base board of heat conduction, the fixed heat conduction copper bar that is provided with on the heat conduction passageway inner wall, set up the heat dissipation cavity with the heat conduction passageway intercommunication in the heat conduction layer, the heat dissipation cavity internal fixation has the heat conduction post of vertical setting, fixed parcel has the metal conducting strip on the outer wall of heat conduction post, and the heat of being convenient for discharges fast, is favorable to improving the radiating effect of transformer circuit board body.
Description
Technical Field
The utility model relates to a special FPC device technical field of wireless charger of cell-phone specifically is a special FPC device of wireless charger of cell-phone.
Background
The flexible circuit board is a flexible printed circuit board which is made of polyimide or polyester film serving as a base material and has high reliability and excellent flexibility, and some high-end mobile phones have a wireless charging function, so that the charger must be provided with the circuit board to enable the wireless charger to be matched with the mobile phone.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a special FPC device of wireless charger of cell-phone to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a special FPC device of wireless charger of cell-phone, includes the circuit board body, the fixed aluminium base board that is provided with of bottom of circuit board body, the fixed heat-conducting layer that is provided with in bottom of heat-conducting aluminium base board, the fixed heat dissipation layer that is provided with in bottom of heat-conducting layer, the heat conduction passageway has evenly been seted up on the aluminium base board of heat conduction, the fixed heat conduction copper bar that is provided with on the heat conduction passageway inner wall, set up the heat dissipation cavity with heat conduction passageway intercommunication in the heat conduction layer, the heat dissipation cavity internal fixation has the heat conduction post of vertical setting, the fixed parcel has the metal.
Preferably, the heat dissipation layer comprises a semiconductor heat dissipation plate fixed to the bottom of the heat conduction layer, a metal foil is fixedly bonded to the bottom of the semiconductor heat dissipation plate, a heat conduction silica gel layer is fixedly bonded to the bottom of the metal foil, a protection ring is fixedly bonded to the bottom of the heat conduction silica gel layer, heat dissipation fins are uniformly and fixedly arranged at the bottom of the protection ring, and heat conduction holes are uniformly formed in the semiconductor heat dissipation plate.
Preferably, the semiconductor heat dissipation plate is communicated with the heat dissipation cavity, and the bottom end of the heat conduction column is fixed to the top of the semiconductor heat dissipation plate.
Preferably, the heat conduction column is arranged between the two groups of heat conduction channels, the metal heat conduction sheet is wrapped on the outer wall of the heat conduction column, and the metal heat conduction sheet is a heat conduction copper sheet.
Preferably, the length of the heat conduction copper bar is matched with the height of the heat conduction channel, and the top end of the heat conduction copper bar is fixed at the bottom of the circuit board body.
Preferably, the inner wall of the heat dissipation cavity is sprayed with a solder resist green oil layer.
Compared with the prior art, the beneficial effects of the utility model are that: the utility model has the advantages of reasonable design, can carry out effectual transmission to the heat of circuit board body through the aluminium base board of heat conduction, improve the radiating rate, be favorable to electronic component's heat dissipation, increase of service life, the heat of conduction is led into in the heat dissipation cavity through the heat conduction passageway, the heat conduction copper bar in the heat conduction passageway can increase thermal conduction area simultaneously, thermal conduction efficiency has been improved, metal conducting strip on the heat conduction post outer wall can be with the heat fast transfer to the heat dissipation layer in the heat dissipation cavity, realize thermal transmission, the heat of being convenient for discharges fast, be favorable to improving the radiating effect of transformer circuit board body, the radiating ability of circuit board body has been improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
fig. 2 is a schematic view of the structure of the heat dissipation layer of the present invention.
In the figure: the circuit board comprises a circuit board body 1, a heat-conducting aluminum substrate 2, a heat-conducting layer 3, a heat-radiating layer 4, a semiconductor heat-radiating plate 41, a metal foil 42, a heat-conducting silica gel layer 43, a protective ring 44, heat-radiating fins 45, heat-conducting holes 46, heat-conducting channels 5, heat-conducting copper strips 6, heat-radiating cavities 7, heat-conducting columns 8 and metal heat-conducting fins 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, the present invention provides a technical solution: a special FPC device for a wireless charger of a mobile phone comprises a circuit board body 1, a heat-conducting aluminum substrate 2 is fixedly arranged at the bottom of the circuit board body 1, a heat-conducting layer 3 is fixedly arranged at the bottom of the heat-conducting layer 3, a heat-radiating layer 4 is fixedly arranged at the bottom of the heat-conducting layer 3, heat-conducting channels 5 are uniformly arranged on the heat-conducting aluminum substrate 2, heat-conducting copper strips 6 are fixedly arranged on the inner walls of the heat-conducting channels 5, a heat-radiating cavity 7 communicated with the heat-conducting channels 5 is formed in the heat-conducting layer 3, heat-conducting columns 8 which are longitudinally arranged are fixedly arranged in the heat-radiating cavity 7, metal heat-conducting fins 9 are fixedly wrapped on the outer walls of the heat-conducting columns 8, the heat of the circuit board body 1 can be effectively transferred through the heat-conducting aluminum substrate 2, the heat, meanwhile, the heat conducting copper strips 6 in the heat conducting channel 5 can increase the heat conducting area and improve the heat conducting efficiency, the metal heat conducting fins 9 on the outer wall of the heat conducting columns 8 in the heat radiating cavity 7 can rapidly transfer heat to the heat radiating layer 4, so that the heat is transferred, the heat is conveniently and rapidly discharged, the heat radiating effect of the transformer circuit board body 1 is favorably improved, and the heat radiating capacity of the circuit board body 1 is improved.
Referring to fig. 2, the heat dissipation layer 4 includes a semiconductor heat dissipation plate 41 fixed at the bottom of the heat conduction layer 3, a metal foil 42 is fixedly bonded at the bottom of the semiconductor heat dissipation plate 41, a heat conduction silica gel layer 43 is fixedly bonded at the bottom of the metal foil 42, a protection ring 44 is fixedly bonded at the bottom of the heat conduction silica gel layer 43, heat dissipation fins 45 are uniformly and fixedly arranged at the bottom of the protection ring 44, heat conduction holes 46 are uniformly formed in the semiconductor heat dissipation plate 41, rapid heat conduction is realized through the semiconductor heat dissipation plate 41, the metal foil 42 can increase the heat transfer area and improve the heat transfer effect, the heat conduction silica gel layer 43 increases the heat transfer efficiency, and the heat dissipation fins 45 improve the heat dissipation effect;
the semiconductor heat dissipation plate 41 is communicated with the heat dissipation cavity 7, and the bottom end of the heat conduction column 8 is fixed at the top of the semiconductor heat dissipation plate 41, so that the semiconductor heat dissipation plate 41 can conduct heat in the heat dissipation cavity 7, and the heat conduction efficiency is improved;
referring to fig. 1, the heat conducting column 8 is disposed between the two sets of heat conducting channels 5, the metal heat conducting strip 9 is wrapped on the outer wall of the heat conducting column 8, the metal heat conducting strip 9 is a heat conducting copper strip, and the metal heat conducting strip 9 is wrapped on the outer wall of the heat conducting column 8, so that the contact area between the metal heat conducting strip 9 and heat is increased, and the heat transfer effect is improved;
the length of the heat conducting copper strip 6 is matched with the height of the heat conducting channel 5, the top end of the heat conducting copper strip 6 is fixed at the bottom of the circuit board body 1, the heat conducting copper strip 6 in the heat conducting channel 5 can increase the heat conducting area, and the heat conducting efficiency is improved;
the inner wall of the heat dissipation cavity 7 is sprayed with the solder resist green oil layer, so that the protection of the inner wall of the heat dissipation cavity 7 is improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a special FPC device of wireless charger of cell-phone, includes circuit board body (1), its characterized in that: the heat dissipation circuit board comprises a circuit board body (1), wherein a heat conduction aluminum substrate (2) is fixedly arranged at the bottom of the circuit board body (1), a heat conduction layer (3) is fixedly arranged at the bottom of the heat conduction aluminum substrate (2), a heat dissipation layer (4) is fixedly arranged at the bottom of the heat conduction layer (3), heat conduction channels (5) are uniformly formed in the heat conduction aluminum substrate (2), heat conduction copper strips (6) are fixedly arranged on the inner walls of the heat conduction channels (5), a heat dissipation cavity (7) communicated with the heat conduction channels (5) is formed in the heat conduction layer (3), heat conduction columns (8) which are longitudinally arranged are fixedly arranged in the heat dissipation cavity (7), and metal heat conduction sheets (9) are fixedly wrapped on the.
2. The FPC device special for the wireless charger of the mobile phone according to claim 1, wherein: the heat dissipation layer (4) is including fixing semiconductor heating panel (41) in heat-conducting layer (3) bottom, the bottom of semiconductor heating panel (41) is fixed to bond has metal foil (42), the bottom of metal foil (42) is fixed to bond has heat conduction silica gel layer (43), the bottom of heat conduction silica gel layer (43) is fixed to bond has guard ring (44), the bottom of guard ring (44) is evenly fixed and is provided with heat radiation fins (45), heat conduction hole (46) have evenly been seted up on semiconductor heating panel (41).
3. The FPC device special for the wireless charger of the mobile phone according to claim 2, wherein: the semiconductor heat dissipation plate (41) is communicated with the heat dissipation cavity (7), and the bottom end of the heat conduction column (8) is fixed to the top of the semiconductor heat dissipation plate (41).
4. The FPC device special for the wireless charger of the mobile phone according to claim 1, wherein: the heat conducting column (8) is arranged between the two groups of heat conducting channels (5), the metal heat conducting sheet (9) wraps the outer wall of the heat conducting column (8), and the metal heat conducting sheet (9) is a heat conducting copper sheet.
5. The FPC device special for the wireless charger of the mobile phone according to claim 1, wherein: the length of the heat conduction copper bar (6) is matched with the height of the heat conduction channel (5), and the top end of the heat conduction copper bar (6) is fixed at the bottom of the circuit board body (1).
6. The FPC device special for the wireless charger of the mobile phone according to claim 1, wherein: and a solder resist green oil layer is sprayed on the inner wall of the heat dissipation cavity (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921206774.4U CN210537020U (en) | 2019-07-30 | 2019-07-30 | Special FPC device of wireless charger of cell-phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921206774.4U CN210537020U (en) | 2019-07-30 | 2019-07-30 | Special FPC device of wireless charger of cell-phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210537020U true CN210537020U (en) | 2020-05-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921206774.4U Active CN210537020U (en) | 2019-07-30 | 2019-07-30 | Special FPC device of wireless charger of cell-phone |
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| Country | Link |
|---|---|
| CN (1) | CN210537020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111342531A (en) * | 2020-05-18 | 2020-06-26 | 广东电网有限责任公司东莞供电局 | Wireless charger |
-
2019
- 2019-07-30 CN CN201921206774.4U patent/CN210537020U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111342531A (en) * | 2020-05-18 | 2020-06-26 | 广东电网有限责任公司东莞供电局 | Wireless charger |
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