CN109496117B - Graphite heat conduction radiating fin - Google Patents
Graphite heat conduction radiating fin Download PDFInfo
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- CN109496117B CN109496117B CN201910000311.0A CN201910000311A CN109496117B CN 109496117 B CN109496117 B CN 109496117B CN 201910000311 A CN201910000311 A CN 201910000311A CN 109496117 B CN109496117 B CN 109496117B
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- heat
- heat dissipation
- heat conduction
- graphite
- metal layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a graphite heat-conducting radiating fin in the technical field of graphite radiating fins, which comprises radiating foam, wherein graphite fins are nested at the top of the radiating foam, an upper metal layer is bonded at the top of the radiating foam, a lower metal layer is bonded at the bottom of the radiating foam, a release paper layer is bonded at the bottom of the lower metal layer, a heat-conducting adhesive layer is bonded at the top of the upper metal layer, a partition plate is bonded at the top of the heat-conducting adhesive layer, a heat-conducting channel which is longitudinally communicated is formed in an inner cavity of the partition plate, a heat-radiating cavity which is communicated with the heat-conducting channel is formed in the bottom of the heat-radiating plate, a heat-conducting column is longitudinally nested in the heat-radiating cavity, a polyester film is bonded at the top of the heat-radiating plate, an antistatic coating is bonded at the top of the polyester film, the heat retention time of heat can be shortened while the protection is provided for the graphite fins, and the heat dissipation efficiency is improved.
Description
Technical Field
The invention relates to the technical field of graphite radiating fins, in particular to a graphite heat conduction radiating fin.
Background
At present, graphite radiating fins are the preferred materials for solving the problem of mobile phone radiating, but in the prior art, the efficiency of the graphite radiating fins in radiating is limited, and if the graphite radiating fins warp, the graphite radiating fins are not adhered to the surfaces of part of components, so that the heat of the part of components cannot be timely and effectively led out and radiated by the graphite radiating fins, and the continuous accumulation of the heat can influence the usability of the mobile phone components.
Disclosure of Invention
The present invention is directed to a graphite heat-conducting fin to solve the above-mentioned problems.
In order to achieve the above purpose, the present invention provides the following technical solutions: the utility model provides a graphite heat conduction fin, includes the heat dissipation bubble is cotton, the nested graphite flake that is provided with in heat dissipation bubble top, the top bonding of heat dissipation bubble is gone up the metal level, the bottom bonding of heat dissipation bubble is gone up there is the lower metal level, the bottom bonding of lower metal level has from the type ply, the top bonding of going up the metal level has the heat conduction glue film, the top bonding of heat conduction glue film has the baffle, the heat conduction passageway that vertically link up has been seted up to the inner chamber of baffle, the top bonding of baffle has the heating panel, the heat dissipation cavity with the heat conduction passageway intercommunication has been seted up to the bottom of heating panel, the vertical nested heat conduction post that is provided with in the heat dissipation cavity, the top bonding of heating panel has the polyester film, the top bonding of polyester film has antistatic coating.
Preferably, the top of the heat dissipation foam is provided with a containing groove matched with the graphite sheet, the top of the graphite sheet is provided with a round boss, the top of the boss is propped against the bottom of the upper metal layer, and a cavity between the boss and the containing groove is provided as a heat collection cavity.
Preferably, the heat conducting channels are uniformly arranged along the length direction of the partition board, and a solder resist green oil layer is sprayed on the inner wall of the heat conducting channels.
Preferably, the heat dissipation cavities are uniformly formed along the length direction of the bottom of the heat dissipation plate, and the single heat dissipation cavity is communicated with the two heat conduction channels.
Preferably, the top end of the heat conducting column is abutted against the top of the inner cavity of the heat dissipation cavity, and the bottom of the heat conducting column is abutted against the top of the partition plate.
Preferably, the partition board and the heat dissipation board are both copper graphene material boards, and the upper metal layer and the lower metal layer are both copper heat conduction sheets.
Compared with the prior art, the invention has the beneficial effects that: the heat dissipation device is reasonable in structural design, the graphite sheets are nested on the heat dissipation foam, graphite powder and graphite particles of the graphite sheets can be prevented from falling off, so that circuit short circuit and electrical influence on a circuit board are avoided, heat conduction can be carried out through the heat dissipation foam, in addition, the upper metal layer and the lower metal layer can play a role in conducting heat while protecting the graphite sheets, the heat conducting performance is improved, heat can be quickly transferred through the heat conducting channel, absorption and transfer are carried out through the heat conducting column in the heat dissipation cavity, finally, heat retention time can be shortened, and heat dissipation efficiency is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present invention.
In the figure: 1 heat dissipation foam, 2 graphite sheets, 3 upper metal layers, 4 lower metal layers, 5 release paper layers, 6 heat collection cavities, 7 heat conduction adhesive layers, 8 partition plates, 9 heat conduction channels, 10 heat dissipation plates, 11 heat dissipation cavities, 12 heat conduction columns, 13 polyester films and 14 antistatic coatings.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1, the present invention provides a technical solution: the utility model provides a graphite heat conduction fin, including heat dissipation bubble cotton 1, heat dissipation bubble cotton 1 top nestification is provided with graphite flake 2, heat dissipation bubble cotton 1's top bonds and has upper metal layer 3, heat dissipation bubble cotton 1's bottom bonds and has lower metal layer 4, lower metal layer 4's bottom bonds and has from type ply 5, upper metal layer 3's top bonds and has heat conduction glue film 7, heat conduction glue film 7's top bonds and has baffle 8, the heat conduction passageway 9 of vertically lining up has been seted up to baffle 8's inner chamber, baffle 8's top bonds and has heating panel 10, the heat dissipation cavity 11 with heat conduction passageway 9 intercommunication has been seted up to heating panel 10's bottom, heat dissipation cavity 11 is inside vertically nested to be provided with heat conduction post 12, heat dissipation panel 10's top bonds and has polyester film 13, polyester film 13's top bonds and has antistatic coating 14.
Wherein, the top of the heat dissipation foam 1 is provided with a containing groove matched with the graphite flake 2, the top of the graphite flake 2 is provided with a round boss, the top of the boss is propped against the bottom of the upper metal layer 3, a cavity between the boss and the containing groove is provided with a heat collection cavity 6, and the graphite flake 2 can be nested on the heat dissipation foam 1 through the arrangement, so that graphite powder and graphite particles of the graphite flake 2 can be prevented from falling off, and circuit short circuit and electric influence on a circuit board are avoided;
the heat conducting channels 9 are uniformly formed along the length direction of the partition plate 8, and a solder mask green oil layer is sprayed on the inner wall of the heat conducting channels 9, so that the heat conducting efficiency of the heat conducting channels 9 can be improved, and meanwhile, the inner wall of the heat conducting channels 9 can be protected from high temperature;
the heat dissipation cavities 11 are uniformly formed along the length direction of the bottom of the heat dissipation plate 10, and the single heat dissipation cavity 11 is communicated with the two groups of heat conduction channels 9, so that the heat dissipation cavities 11 can be matched with the heat conduction channels 9 for use, heat can be quickly transferred into the heat dissipation cavities 11 through the heat conduction channels 9, and heat conduction and timely dissipation are facilitated;
the top end of the heat conducting column 12 is abutted against the top of the inner cavity of the heat dissipation cavity 11, and the bottom of the heat conducting column 12 is abutted against the top of the partition plate 8, so that heat in the heat dissipation cavity 11 can be conducted rapidly through the heat conducting column 12, and rapid dissipation of heat can be realized conveniently;
the baffle 8 and the heat dissipation plate 10 are both copper graphene material plates, and the upper metal layer 3 and the lower metal layer 4 are both copper heat conduction sheets, so that heat conduction efficiency can be improved and heat conduction time can be shortened through the arrangement.
Examples: through with graphite flake 2 nestification on heat dissipation bubble cotton 1, can prevent graphite powder and graphite granule of graphite flake 2 from droing, thereby avoid circuit short circuit and the electrical property influence to the circuit board, can carry out heat conduction through heat dissipation bubble cotton 1 simultaneously, in addition, upper metal layer 3 and lower metal layer 4 can play the effect of conduction heat when protecting graphite flake 2, improved heat conductivility, and carry out the heat buffering through heat collection chamber 6, again conduct for heat conduction glue film 7 through upper metal layer 3, then can carry out the heat transfer to heat dissipation cavity 11 fast through heat conduction passageway 9 on baffle 8, absorb the transfer through the heat conduction post 12 in the heat dissipation cavity 11, finally discharge through heating panel 10, can shorten the detention time of heat, the efficiency of heat dissipation has been improved, can provide the protection through the integral structure simultaneously through polyester film 13, and can reduce the probability of adsorbing dust and impurity through antistatic coating 14.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (4)
1. A graphite heat conduction radiating fin is characterized in that: including heat dissipation bubble cotton (1), heat dissipation bubble cotton (1) top nestification is provided with graphite flake (2), heat dissipation bubble cotton (1) top bonding has upper metal layer (3), heat dissipation bubble cotton (1) bottom bonding has lower metal layer (4), heat dissipation bubble cotton (4) bottom bonding has release paper layer (5), upper metal layer (3) top bonding has heat conduction glue film (7), heat conduction glue film (7) top bonding has baffle (8), heat conduction channel (9) that vertically link up have been seted up to the inner chamber of baffle (8), heat dissipation cavity (11) with heat conduction channel (9) intercommunication have been seted up at the top of baffle (8), heat dissipation cavity (11) inside longitudinal nesting is provided with heat conduction post (12), heat dissipation plate (10) top bonding has polyester film (13), polyester film (13) top bonding has antistatic coating (14). The top of the heat dissipation foam (1) is provided with a containing groove matched with the graphite sheet (2), the top of the graphite sheet (2) is provided with a round boss, the top of the boss is abutted against the bottom of the upper metal layer (3), and a cavity between the boss and the containing groove is provided with a heat collection cavity (6); the heat conduction channels (9) are uniformly formed along the length direction of the partition plate (8), and a solder resist green oil layer is sprayed on the inner wall of the heat conduction channels (9).
2. A graphite heat conducting and dissipating fin as set forth in claim 1 wherein: the heat dissipation cavities (11) are uniformly formed along the length direction of the bottom of the heat dissipation plate (10), and the single heat dissipation cavity (11) is communicated with the two heat conduction channels (9).
3. A graphite heat conducting and dissipating fin as set forth in claim 1 wherein: the top end of the heat conduction column (12) is abutted against the top of the inner cavity of the heat dissipation cavity (11), and the bottom of the heat conduction column (12) is abutted against the top of the partition plate (8).
4. A graphite heat conducting and dissipating fin as set forth in claim 1 wherein: the partition plate (8) and the heat dissipation plate (10) are copper graphene material plates, and the upper metal layer (3) and the lower metal layer (4) are copper heat conduction sheets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910000311.0A CN109496117B (en) | 2019-01-02 | 2019-01-02 | Graphite heat conduction radiating fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910000311.0A CN109496117B (en) | 2019-01-02 | 2019-01-02 | Graphite heat conduction radiating fin |
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| Publication Number | Publication Date |
|---|---|
| CN109496117A CN109496117A (en) | 2019-03-19 |
| CN109496117B true CN109496117B (en) | 2023-05-26 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201910000311.0A Active CN109496117B (en) | 2019-01-02 | 2019-01-02 | Graphite heat conduction radiating fin |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204022739U (en) * | 2014-07-01 | 2014-12-17 | 斯迪克新型材料（江苏）有限公司 | Anti-electrostatic heat radiation Pressuresensitive Tape |
| CN204031701U (en) * | 2014-07-01 | 2014-12-17 | 斯迪克新型材料（江苏）有限公司 | Composite graphite heat conducting radiation fins |
| CN208127195U (en) * | 2018-04-11 | 2018-11-20 | 东莞市速传电子材料有限公司 | A kind of thermally conductive phase transformation gasket of high intensity |
| CN208308773U (en) * | 2018-04-11 | 2019-01-01 | 东莞市速传电子材料有限公司 | A kind of high performance heat conductive isolation sheet |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN209659847U (en) * | 2019-01-02 | 2019-11-19 | 苏州沛德导热材料有限公司 | A kind of graphite heat conducting and heat radiating fin |
-
2019
- 2019-01-02 CN CN201910000311.0A patent/CN109496117B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204022739U (en) * | 2014-07-01 | 2014-12-17 | 斯迪克新型材料（江苏）有限公司 | Anti-electrostatic heat radiation Pressuresensitive Tape |
| CN204031701U (en) * | 2014-07-01 | 2014-12-17 | 斯迪克新型材料（江苏）有限公司 | Composite graphite heat conducting radiation fins |
| CN208127195U (en) * | 2018-04-11 | 2018-11-20 | 东莞市速传电子材料有限公司 | A kind of thermally conductive phase transformation gasket of high intensity |
| CN208308773U (en) * | 2018-04-11 | 2019-01-01 | 东莞市速传电子材料有限公司 | A kind of high performance heat conductive isolation sheet |
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| Publication number | Publication date |
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| CN109496117A (en) | 2019-03-19 |
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Effective date of registration: 20220322 Address after: 414000 Innovation Industrial Park, Dongxing North Road, Tianyue new area, Pingjiang County, Yueyang City, Hunan Province Applicant after: Hunan Peide New Material Co.,Ltd. Address before: 215000 units 301 and 302, building B, No. 5, Xinghan street, Suzhou Industrial Park, Suzhou City, Jiangsu Province Applicant before: SUZHOU PADNIC THERMAL CONDUCTIVE MATERIAL Co.,Ltd. |
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