CN105960138B - A kind of guide rail with high heat dispersion - Google Patents

A kind of guide rail with high heat dispersion Download PDF

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Publication number
CN105960138B
CN105960138B CN201610466919.9A CN201610466919A CN105960138B CN 105960138 B CN105960138 B CN 105960138B CN 201610466919 A CN201610466919 A CN 201610466919A CN 105960138 B CN105960138 B CN 105960138B
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CN
China
Prior art keywords
heat
guide rail
conducting plate
wall
dissipating pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201610466919.9A
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Chinese (zh)
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CN105960138A (en
Inventor
徐雪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHUZHOU OUBOTE ELECTRONIC MANUFACTURING Co Ltd
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CHUZHOU OUBOTE ELECTRONIC MANUFACTURING Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority to CN201610466919.9A priority Critical patent/CN105960138B/en
Publication of CN105960138A publication Critical patent/CN105960138A/en
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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/18Construction of rack or frame
    • H05K7/186Construction of rack or frame for supporting telecommunication equipment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Abstract

The invention discloses a kind of guide rails with high heat dispersion,Including guide rail,The guide rail includes the first heat-conducting plate,Heat-dissipating pipe and the second heat-conducting plate,And heat-dissipating pipe is between the first heat-conducting plate and the second heat-conducting plate,The inside of the guide rail is equipped with elastic shock attenuation layer,The planar inner wall of the elastic shock attenuation layer is close to limited block setting,The damping outer wall of the elastic shock attenuation layer is close to the inside setting of guide rail,The heat-dissipating pipe is equipped with outer tube and inner tube,The outer tube interts into the outer wall for being close to guide rail inside the second heat-conducting plate,Said inner tube is interted into being close to the setting of damping outer wall inside the first heat-conducting plate,Coolant liquid is housed in the heat-dissipating pipe,When guide rail of the present invention can make equipment with guide rail contact by the elastic shock attenuation layer of setting,It is seamless,Air thermal resistance is not will produce thus,Heat transfer is faster,The heat-dissipating pipe for being equipped with coolant liquid simultaneously can be very good the heat of guide rail inner wall to absorption,On conduction to guide rail outer wall,Accelerate radiating rate.

Description

A kind of guide rail with high heat dispersion
Technical field
The present invention relates to fixed communications to install equipment technical field, specially a kind of guide rail with high heat dispersion.
Background technology
Now, the power consumption of wireless telecom equipment is increasing, meanwhile, the volume of wireless telecom equipment continues to send out to miniaturization Exhibition, it is contemplated that next-generation wireless base station uses the double-deck optical module stacked by more.Stack optical module has that account for plate suqare small The advantages of, to more and more apply in minimizing communication equipment, but the use of stack optical module is that optical module is arranged It is difficult to distribute heat in this way on guide rail.
Invention content
The purpose of the present invention is to provide a kind of guide rails with high heat dispersion, to solve to propose in above-mentioned background technology The problem of.
To achieve the above object, the present invention provides the following technical solutions:A kind of guide rail with high heat dispersion, including lead Rail, the guide rail includes the first heat-conducting plate, heat-dissipating pipe and the second heat-conducting plate, and heat-dissipating pipe is located at the first heat-conducting plate and the second heat conduction Between plate, the inside of the guide rail is equipped with elastic shock attenuation layer, and the planar inner wall of the elastic shock attenuation layer is close to limited block setting, institute The damping outer wall for stating elastic shock attenuation layer is close to the inside setting of guide rail, and the heat-dissipating pipe is equipped with outer tube and inner tube, the outer tube Intert into the outer wall for being close to guide rail inside the second heat-conducting plate, said inner tube, which is interted, to be set into being close to damping outer wall inside the first heat-conducting plate It sets, coolant liquid is housed in the heat-dissipating pipe.
Preferably, the heat-dissipating pipe is an integral molding structure, and the quantity of outer tube is less than the quantity of inner tube, the outer tube Aperture is more than the aperture of inner tube.
Preferably, the amount of elastic deformation of the elastic shock attenuation layer is between five to ten millimeters, and the shape of damping outer wall is Triangle or semicircle.
Preferably, the thickness of first heat-conducting plate is less than the thickness of the second heat-conducting plate.
Compared with prior art, the beneficial effects of the invention are as follows:Guide rail of the present invention can be with by the elastic shock attenuation layer of setting It is seamless when making equipment with guide rail contact, it not will produce air thermal resistance thus, heat transfer faster, while being equipped with coolant liquid Heat-dissipating pipe can be very good the heat of guide rail inner wall to absorbing, conduction accelerates radiating rate on guide rail outer wall.
Description of the drawings
Fig. 1 is schematic structural view of the invention;
Fig. 2 is radiation tube structure with heat schematic diagram of the present invention;
Fig. 3 is elastic shock attenuation schematic diagram of a layer structure of the present invention.
In figure:1 guide rail, 2 first heat-conducting plates, 3 second heat-conducting plates, 4 heat-dissipating pipes, 41 outer tubes, 42 inner tubes, 5 elastic shock attenuation layers, 51 damping outer walls, 52 planar inner walls, 6 limited blocks, 7 coolant liquids.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the present invention provides a kind of technical solution:A kind of guide rail with high heat dispersion, including guide rail 1, the guide rail 1 includes the first heat-conducting plate 2, heat-dissipating pipe 4 and the second heat-conducting plate 3, and heat-dissipating pipe 4 is located at the first heat-conducting plate 2 and the Between two heat-conducting plates 3, the thickness of first heat-conducting plate 2 is less than the thickness of the second heat-conducting plate 3, and the inside of the guide rail 1 is equipped with The planar inner wall 52 of elastic shock attenuation layer 5, the elastic shock attenuation layer 5 is close to the setting of limited block 6, the damping of the elastic shock attenuation layer 5 Outer wall 51 is close to the inside setting of guide rail 1, and the amount of elastic deformation of the elastic shock attenuation layer 5 is between five to ten millimeters, and damping The shape of outer wall 51 is triangle or semicircle, and the heat-dissipating pipe 4 is equipped with outer tube 41 and inner tube 42, and the heat-dissipating pipe 4 is Integrated formed structure, and the quantity of outer tube 41 is less than the quantity of inner tube 42, the aperture of the outer tube 41 is more than the aperture of inner tube 42, The outer tube 41 interts into the outer wall for being close to guide rail 1 inside the second heat-conducting plate 3, and said inner tube 42 is interted into the first heat-conducting plate 2 The setting of damping outer wall 51 is close in portion, and coolant liquid 7 is housed in the heat-dissipating pipe 4, and full 4 inner cavity of heat-dissipating pipe of the filling of coolant liquid 7 utilizes bullet Property buffer layer 5 heat is quickly conducted to guide rail 1, accelerate heat-transfer rate, the staggeredly heat-dissipating pipe 4 for utilizing the inside of guide rail 1 to be arranged Temperature can be lowered quickly.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace And modification, the scope of the present invention is defined by the appended.

Claims (4)

1. a kind of guide rail with high heat dispersion, including guide rail(1), it is characterised in that:The guide rail(1)Including the first heat conduction Plate(2), heat-dissipating pipe(4)With the second heat-conducting plate(3), and heat-dissipating pipe(4)Positioned at the first heat-conducting plate(2)With the second heat-conducting plate(3)It Between, the guide rail(1)Inside be equipped with elastic shock attenuation layer(5), the elastic shock attenuation layer(5)Planar inner wall(52)It is close to limit Block(6)Setting, the elastic shock attenuation layer(5)Damping outer wall(51)It is close to guide rail(1)Inside setting, the heat-dissipating pipe(4) It is equipped with outer tube(41)And inner tube(42), the outer tube(41)Intert into the second heat-conducting plate(3)It is close to guide rail in inside(1)It is outer Wall, said inner tube(42)Intert into the first heat-conducting plate(2)It is close to damping outer wall in inside(51)Setting, the heat-dissipating pipe(4)It is built-in There is coolant liquid(7).
2. a kind of guide rail with high heat dispersion according to claim 1, it is characterised in that:The heat-dissipating pipe(4)For Integrated formed structure, and outer tube(41)Quantity be less than inner tube(42)Quantity, the outer tube(41)Aperture be more than inner tube (42)Aperture.
3. a kind of guide rail with high heat dispersion according to claim 1, it is characterised in that:The elastic shock attenuation layer (5)Amount of elastic deformation between five to ten millimeters, and damping outer wall(51)Shape be triangle or semicircle.
4. a kind of guide rail with high heat dispersion according to claim 1, it is characterised in that:First heat-conducting plate (2)Thickness be less than the second heat-conducting plate(3)Thickness.
CN201610466919.9A 2016-06-24 2016-06-24 A kind of guide rail with high heat dispersion Active CN105960138B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610466919.9A CN105960138B (en) 2016-06-24 2016-06-24 A kind of guide rail with high heat dispersion

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610466919.9A CN105960138B (en) 2016-06-24 2016-06-24 A kind of guide rail with high heat dispersion

Publications (2)

Publication Number Publication Date
CN105960138A CN105960138A (en) 2016-09-21
CN105960138B true CN105960138B (en) 2018-09-07

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Application Number Title Priority Date Filing Date
CN201610466919.9A Active CN105960138B (en) 2016-06-24 2016-06-24 A kind of guide rail with high heat dispersion

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114620388A (en) * 2022-03-05 2022-06-14 苏州仕泰得智能科技有限公司 Shuttle bears shock-absorbing structure with intelligent vertical warehouse guide rail

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202979542U (en) * 2012-10-31 2013-06-05 中兴通讯股份有限公司 Heat radiation guide rail
CN103332557A (en) * 2013-06-24 2013-10-02 张家港市香山电梯导轨制造有限公司 Noise and vibration reduction guide shoe
CN204390746U (en) * 2015-01-29 2015-06-10 成都华跃科技有限公司 The hard disc shock-absorbing structure that a kind of damping effect is excellent

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102423783B1 (en) * 2014-05-29 2022-07-21 패프코 인코포레이티드 Fluid cooled integrated photovoltaic module

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202979542U (en) * 2012-10-31 2013-06-05 中兴通讯股份有限公司 Heat radiation guide rail
CN103332557A (en) * 2013-06-24 2013-10-02 张家港市香山电梯导轨制造有限公司 Noise and vibration reduction guide shoe
CN204390746U (en) * 2015-01-29 2015-06-10 成都华跃科技有限公司 The hard disc shock-absorbing structure that a kind of damping effect is excellent

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C10 Entry into substantive examination
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PE01 Entry into force of the registration of the contract for pledge of patent right
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Denomination of invention: Guide rail with high heat dissipation performance

Effective date of registration: 20211227

Granted publication date: 20180907

Pledgee: Chuzhou Wandong Rural Commercial Bank Co.,Ltd. Yangzi sub branch

Pledgor: CHUZHOU OUBOTE ELECTRONIC MANUFACTURING Co.,Ltd.

Registration number: Y2021980016370

PC01 Cancellation of the registration of the contract for pledge of patent right
PC01 Cancellation of the registration of the contract for pledge of patent right

Date of cancellation: 20220628

Granted publication date: 20180907

Pledgee: Chuzhou Wandong Rural Commercial Bank Co.,Ltd. Yangzi sub branch

Pledgor: CHUZHOU OUBOTE ELECTRONIC MANUFACTURING Co.,Ltd.

Registration number: Y2021980016370