A kind of guide rail with high heat dispersion
Technical field
The present invention relates to fixed communications to install equipment technical field, specially a kind of guide rail with high heat dispersion.
Background technology
Now, the power consumption of wireless telecom equipment is increasing, meanwhile, the volume of wireless telecom equipment continues to send out to miniaturization
Exhibition, it is contemplated that next-generation wireless base station uses the double-deck optical module stacked by more.Stack optical module has that account for plate suqare small
The advantages of, to more and more apply in minimizing communication equipment, but the use of stack optical module is that optical module is arranged
It is difficult to distribute heat in this way on guide rail.
Invention content
The purpose of the present invention is to provide a kind of guide rails with high heat dispersion, to solve to propose in above-mentioned background technology
The problem of.
To achieve the above object, the present invention provides the following technical solutions:A kind of guide rail with high heat dispersion, including lead
Rail, the guide rail includes the first heat-conducting plate, heat-dissipating pipe and the second heat-conducting plate, and heat-dissipating pipe is located at the first heat-conducting plate and the second heat conduction
Between plate, the inside of the guide rail is equipped with elastic shock attenuation layer, and the planar inner wall of the elastic shock attenuation layer is close to limited block setting, institute
The damping outer wall for stating elastic shock attenuation layer is close to the inside setting of guide rail, and the heat-dissipating pipe is equipped with outer tube and inner tube, the outer tube
Intert into the outer wall for being close to guide rail inside the second heat-conducting plate, said inner tube, which is interted, to be set into being close to damping outer wall inside the first heat-conducting plate
It sets, coolant liquid is housed in the heat-dissipating pipe.
Preferably, the heat-dissipating pipe is an integral molding structure, and the quantity of outer tube is less than the quantity of inner tube, the outer tube
Aperture is more than the aperture of inner tube.
Preferably, the amount of elastic deformation of the elastic shock attenuation layer is between five to ten millimeters, and the shape of damping outer wall is
Triangle or semicircle.
Preferably, the thickness of first heat-conducting plate is less than the thickness of the second heat-conducting plate.
Compared with prior art, the beneficial effects of the invention are as follows:Guide rail of the present invention can be with by the elastic shock attenuation layer of setting
It is seamless when making equipment with guide rail contact, it not will produce air thermal resistance thus, heat transfer faster, while being equipped with coolant liquid
Heat-dissipating pipe can be very good the heat of guide rail inner wall to absorbing, conduction accelerates radiating rate on guide rail outer wall.
Description of the drawings
Fig. 1 is schematic structural view of the invention;
Fig. 2 is radiation tube structure with heat schematic diagram of the present invention;
Fig. 3 is elastic shock attenuation schematic diagram of a layer structure of the present invention.
In figure:1 guide rail, 2 first heat-conducting plates, 3 second heat-conducting plates, 4 heat-dissipating pipes, 41 outer tubes, 42 inner tubes, 5 elastic shock attenuation layers,
51 damping outer walls, 52 planar inner walls, 6 limited blocks, 7 coolant liquids.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the present invention provides a kind of technical solution:A kind of guide rail with high heat dispersion, including guide rail
1, the guide rail 1 includes the first heat-conducting plate 2, heat-dissipating pipe 4 and the second heat-conducting plate 3, and heat-dissipating pipe 4 is located at the first heat-conducting plate 2 and the
Between two heat-conducting plates 3, the thickness of first heat-conducting plate 2 is less than the thickness of the second heat-conducting plate 3, and the inside of the guide rail 1 is equipped with
The planar inner wall 52 of elastic shock attenuation layer 5, the elastic shock attenuation layer 5 is close to the setting of limited block 6, the damping of the elastic shock attenuation layer 5
Outer wall 51 is close to the inside setting of guide rail 1, and the amount of elastic deformation of the elastic shock attenuation layer 5 is between five to ten millimeters, and damping
The shape of outer wall 51 is triangle or semicircle, and the heat-dissipating pipe 4 is equipped with outer tube 41 and inner tube 42, and the heat-dissipating pipe 4 is
Integrated formed structure, and the quantity of outer tube 41 is less than the quantity of inner tube 42, the aperture of the outer tube 41 is more than the aperture of inner tube 42,
The outer tube 41 interts into the outer wall for being close to guide rail 1 inside the second heat-conducting plate 3, and said inner tube 42 is interted into the first heat-conducting plate 2
The setting of damping outer wall 51 is close in portion, and coolant liquid 7 is housed in the heat-dissipating pipe 4, and full 4 inner cavity of heat-dissipating pipe of the filling of coolant liquid 7 utilizes bullet
Property buffer layer 5 heat is quickly conducted to guide rail 1, accelerate heat-transfer rate, the staggeredly heat-dissipating pipe 4 for utilizing the inside of guide rail 1 to be arranged
Temperature can be lowered quickly.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.